JP5555743B2 - 基板を化学的処理する処理システムおよび方法 - Google Patents
基板を化学的処理する処理システムおよび方法 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
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- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/026—Anodisation with spark discharge
Description
Claims (15)
- 基板をエッチングするための処理システムであって、
温度制御される化学的処理チャンバと、
前記温度制御される化学的処理チャンバに組み合わされた壁加熱部材に接続され、化学的処理チャンバ温度を10℃〜200℃の範囲に制御するように構成された壁温度コントロールユニットと、
前記化学的処理チャンバ内にマウントされ、1つ以上のさらされた表面層を有する前記基板を支持するように構成された温度制御される基板ホルダと、
前記温度制御される基板ホルダに接続された温度制御コンポーネントと、
前記化学的処理チャンバに組み合わされた真空排気システムと、
前記化学的処理チャンバに接続され、前記基板上の前記さらされた表面層を化学的に変更するために前記化学的処理チャンバに1つ以上のプロセスガスを導入するように構成されたガス分配システムと、を具備し、
前記化学的処理チャンバは、基板上の化学的に変更されたさらされた表面層を脱離または蒸発するように昇温される熱処理チャンバに組み合わされるように構成され、
前記ガス分配システムは、前記化学的処理チャンバ内の前記1つ以上のプロセスガスにさらされかつ温度制御される部分を備え、
前記温度制御される部分は、少なくとも1つのガス分配プレートを備え、
前記ガス分配プレートは、1つ以上のガス注入オリフィスを備えており、
前記温度制御される部分に組み合わされたガス分配加熱部材に接続され、ガス分配システム温度を40℃〜60℃の範囲に制御するように構成されたガス分配システム温度コントロールユニットを更に具備する、処理システム。 - 前記1つ以上のプロセスガスは、HFもしくはNH3、または、HFおよびNH3の両方を含んでいる請求項1に記載の処理システム。
- 前記温度制御コンポーネントは、抵抗加熱部材を更に備えている請求項1に記載の処理システム。
- 前記温度制御される基板ホルダは、この温度制御される基板ホルダに前記基板をクランプするように構成された静電クランプを更に備えている請求項1に記載の処理システム。
- 前記温度制御される基板ホルダは、前記基板の裏面に熱伝達ガスを供給するように構成された裏面ガス供給システムを更に備えている請求項1に記載の処理システム。
- 前記壁加熱部材は、抵抗加熱部材を備えている請求項1に記載の処理システム。
- 前記ガス分配加熱部材は、抵抗加熱部材を備えている請求項1に記載の処理システム。
- 前記化学的処理チャンバの1つ以上の表面は、防護壁で被覆され、
前記防護壁は、ポリテトラフルオロエチレンを備えている請求項1に記載の処理システム。 - 前記1つ以上のプロセスガスは、HFおよびNH3を含んでおり、
前記ガス分配システムは、互いに独立して前記HFガス、および、前記NH3ガスを導入するように構成されている請求項1に記載の処理システム。 - 前記温度制御される基板ホルダに接続された前記温度制御コンポーネントは、基板ホルダ温度を10℃〜50℃の範囲に制御するように構成されている請求項1に記載の処理システム。
- 前記温度制御コンポーネントは、流体流れのための冷却チャンネルもしくは流体流れのための加熱チャンネル、または、冷却チャンネルおよび加熱チャンネルの両方を備えている請求項1に記載の処理システム。
- 基板をエッチングする方法であって:
温度制御される化学的処理チャンバの温度制御される基板ホルダに基板を配置することと、
前記基板の表面層を化学的に変更するために、前記化学的処理チャンバ内で化学的処理プロセスを前記基板上に実行することと、を具備し、
前記化学的処理チャンバは、基板上の化学的に変更されたさらされた表面層を脱離または蒸発するように昇温される熱処理チャンバに組み合わされるように構成され、
前記化学的処理プロセスは、
前記基板の温度を制御することと、
前記化学的処理チャンバの温度を10℃〜200℃の範囲内に制御することと、
前記化学的処理チャンバ内の前記1つ以上のプロセスガスにさらされる温度制御される部分を備えているガス分配システムを介して、前記化学的処理チャンバに1つ以上のプロセスガスを導入することと、
前記温度制御される部分の温度を40℃〜60℃の範囲内に制御することとを備えている、方法。 - 前記1つ以上のプロセスガスは、HFもしくはNH3、または、HFおよびNH3の両方を含んでいる請求項12に記載の方法。
- 前記化学的処理チャンバから前記熱処理チャンバへと前記基板を移送することと、
前記化学的に変更された表面層を取り除くために前記熱処理チャンバ内で熱処理プロセスを実行することとを更に具備し、
前記熱処理プロセスは、前記基板の温度を100℃上回る温度に上昇させることを備えている、請求項12に記載の方法。 - 前記基板の前記温度を10℃〜50℃の範囲内に制御することを更に具備する請求項12に記載の方法。
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JP5290250B2 (ja) | 2013-09-18 |
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