JP5531163B2 - 誘電体薄膜、誘電体薄膜素子および薄膜コンデンサ - Google Patents
誘電体薄膜、誘電体薄膜素子および薄膜コンデンサ Download PDFInfo
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- JP5531163B2 JP5531163B2 JP2013522504A JP2013522504A JP5531163B2 JP 5531163 B2 JP5531163 B2 JP 5531163B2 JP 2013522504 A JP2013522504 A JP 2013522504A JP 2013522504 A JP2013522504 A JP 2013522504A JP 5531163 B2 JP5531163 B2 JP 5531163B2
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- 239000010409 thin film Substances 0.000 title claims description 115
- 239000003990 capacitor Substances 0.000 title claims description 38
- 239000002135 nanosheet Substances 0.000 claims description 43
- 229920000620 organic polymer Polymers 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 29
- 238000006116 polymerization reaction Methods 0.000 claims description 11
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 8
- 229920000128 polypyrrole Polymers 0.000 claims description 6
- 229920000767 polyaniline Polymers 0.000 claims description 5
- 239000010408 film Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 11
- 239000000084 colloidal system Substances 0.000 description 10
- 238000009413 insulation Methods 0.000 description 7
- 239000011800 void material Substances 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 229910052809 inorganic oxide Inorganic materials 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 3
- -1 silane compound Chemical class 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- VIQBABDKNOOCQD-UHFFFAOYSA-N 1,4-bis(dibromomethyl)benzene Chemical group BrC(Br)C1=CC=C(C(Br)Br)C=C1 VIQBABDKNOOCQD-UHFFFAOYSA-N 0.000 description 1
- YMMGRPLNZPTZBS-UHFFFAOYSA-N 2,3-dihydrothieno[2,3-b][1,4]dioxine Chemical compound O1CCOC2=C1C=CS2 YMMGRPLNZPTZBS-UHFFFAOYSA-N 0.000 description 1
- GCTFDMFLLBCLPF-UHFFFAOYSA-N 2,5-dichloropyridine Chemical compound ClC1=CC=C(Cl)N=C1 GCTFDMFLLBCLPF-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229910013063 LiBF 4 Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- KVCGISUBCHHTDD-UHFFFAOYSA-M sodium;4-methylbenzenesulfonate Chemical compound [Na+].CC1=CC=C(S([O-])(=O)=O)C=C1 KVCGISUBCHHTDD-UHFFFAOYSA-M 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
- H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors with potential-jump barrier or surface barrier
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/20—Organic diodes
- H10K10/23—Schottky diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
Description
誘電体薄膜の空隙部にp型導電性有機高分子が電解重合反応により充填されることで、前記ナノシートと前記p型導電性有機高分子とが複合化されていること、を特徴とする、誘電体薄膜である。ここで、ナノシートは、層状の結晶構造を有する化合物の層剥離反応によって得られる厚さ数nmの膜を意味する。
2 Si板
4 SiO2膜
6 Ti膜
8 下部電極
10 基板
12 誘電体薄膜
14 上部電極
16 誘電体薄膜素子
図1は、本発明に係る薄膜コンデンサの一実施形態を示す概略構成図である。薄膜コンデンサ1は、基板10と、基板10上に形成された誘電体薄膜素子16と、を備えている。基板10は、Si板2と、Si板2上に形成されたSiO2膜4と、SiO2膜4上に形成されたTi膜6と、で形成されている。
次に、薄膜コンデンサ1の製造方法の一例を説明する。図2は、図1に示した薄膜コンデンサの製造方法の一例を示すフローチャートである。
このようにして得られた薄膜コンデンサ1の絶縁抵抗を、ケイスレイ(Keithley)社製半導体パラメーターアナライザーを用いて測定した。表1は評価結果を示す。ここで、印加直流電圧が0.1Vのとき、絶縁抵抗が107Ω以下のものを、ショート(NG)と判定した。
Claims (4)
- ナノシートにより構成される誘電体薄膜であって、
前記誘電体薄膜の空隙部にp型導電性有機高分子が電解重合反応により充填されることで、前記ナノシートと前記p型導電性有機高分子とが複合化されていること、を特徴とする、誘電体薄膜。 - 前記p型導電性有機高分子が、ポリピロール、ポリアニリンおよびポリエチレンジオキシチオフェンのいずれか1つであること、を特徴とする、請求項1に記載の誘電体薄膜。
- 請求項1もしくは請求項2に記載の誘電体薄膜と、前記誘電体薄膜を間に挟んで配設された少なくとも一対の電極と、を備えたこと、を特徴とする、誘電体薄膜素子。
- 請求項3に記載の誘電体薄膜素子と、前記誘電体薄膜素子を設けるための基板と、を備えたこと、を特徴とする、薄膜コンデンサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013522504A JP5531163B2 (ja) | 2011-07-05 | 2012-04-20 | 誘電体薄膜、誘電体薄膜素子および薄膜コンデンサ |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011149486 | 2011-07-05 | ||
JP2011149486 | 2011-07-05 | ||
JP2013522504A JP5531163B2 (ja) | 2011-07-05 | 2012-04-20 | 誘電体薄膜、誘電体薄膜素子および薄膜コンデンサ |
PCT/JP2012/060691 WO2013005468A1 (ja) | 2011-07-05 | 2012-04-20 | 誘電体薄膜、誘電体薄膜素子および薄膜コンデンサ |
Publications (2)
Publication Number | Publication Date |
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JP5531163B2 true JP5531163B2 (ja) | 2014-06-25 |
JPWO2013005468A1 JPWO2013005468A1 (ja) | 2015-02-23 |
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JP2013522504A Expired - Fee Related JP5531163B2 (ja) | 2011-07-05 | 2012-04-20 | 誘電体薄膜、誘電体薄膜素子および薄膜コンデンサ |
Country Status (4)
Country | Link |
---|---|
US (1) | US9324497B2 (ja) |
JP (1) | JP5531163B2 (ja) |
KR (1) | KR101517532B1 (ja) |
WO (1) | WO2013005468A1 (ja) |
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US10340082B2 (en) | 2015-05-12 | 2019-07-02 | Capacitor Sciences Incorporated | Capacitor and method of production thereof |
US20170301477A1 (en) | 2016-04-04 | 2017-10-19 | Capacitor Sciences Incorporated | Electro-polarizable compound and capacitor |
KR20170005821A (ko) * | 2014-05-12 | 2017-01-16 | 캐패시터 사이언시스 인코포레이티드 | 커패시터 및 이의 생산 방법 |
US10347423B2 (en) | 2014-05-12 | 2019-07-09 | Capacitor Sciences Incorporated | Solid multilayer structure as semiproduct for meta-capacitor |
US10319523B2 (en) | 2014-05-12 | 2019-06-11 | Capacitor Sciences Incorporated | Yanli dielectric materials and capacitor thereof |
MX2017005427A (es) | 2014-11-04 | 2017-06-21 | Capacitor Sciences Inc | Dispositivos de almacenamiento de energia y metodos de produccion de los mismos. |
BR112017018189A2 (pt) | 2015-02-26 | 2018-04-17 | Capacitor Sciences Inc | capacitor autorregenerativo e métodos de produção do mesmo |
US9932358B2 (en) | 2015-05-21 | 2018-04-03 | Capacitor Science Incorporated | Energy storage molecular material, crystal dielectric layer and capacitor |
US9941051B2 (en) | 2015-06-26 | 2018-04-10 | Capactor Sciences Incorporated | Coiled capacitor |
US10448453B2 (en) * | 2015-09-25 | 2019-10-15 | Intel Corporation | Virtual sensor system |
US10026553B2 (en) | 2015-10-21 | 2018-07-17 | Capacitor Sciences Incorporated | Organic compound, crystal dielectric layer and capacitor |
US10636575B2 (en) | 2016-02-12 | 2020-04-28 | Capacitor Sciences Incorporated | Furuta and para-Furuta polymer formulations and capacitors |
US10305295B2 (en) | 2016-02-12 | 2019-05-28 | Capacitor Sciences Incorporated | Energy storage cell, capacitive energy storage module, and capacitive energy storage system |
US9978517B2 (en) | 2016-04-04 | 2018-05-22 | Capacitor Sciences Incorporated | Electro-polarizable compound and capacitor |
US10153087B2 (en) | 2016-04-04 | 2018-12-11 | Capacitor Sciences Incorporated | Electro-polarizable compound and capacitor |
US10566138B2 (en) | 2016-04-04 | 2020-02-18 | Capacitor Sciences Incorporated | Hein electro-polarizable compound and capacitor thereof |
US9685499B1 (en) | 2016-09-21 | 2017-06-20 | International Business Machines Corporation | Nanosheet capacitor |
US10395841B2 (en) | 2016-12-02 | 2019-08-27 | Capacitor Sciences Incorporated | Multilayered electrode and film energy storage device |
US10032856B1 (en) | 2017-01-24 | 2018-07-24 | International Business Machines Corporation | Nanosheet capacitor |
US10991798B2 (en) | 2019-01-21 | 2021-04-27 | International Business Machines Corporation | Replacement sacrificial nanosheets having improved etch selectivity |
KR20220051280A (ko) | 2020-10-18 | 2022-04-26 | 양용철 | 패턴의 위치를 지정하는 숫자와 패턴으로 혼용된 인증번호 장치 및 방법 |
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JP2010126735A (ja) | 2008-11-25 | 2010-06-10 | Fukuoka Prefecture | ナノ粒子薄膜の製造方法、ナノ粒子薄膜及びそれを用いた電子デバイス |
JP2010215470A (ja) | 2009-03-18 | 2010-09-30 | Murata Mfg Co Ltd | ナノシート堆積膜の製造方法 |
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2012
- 2012-04-20 KR KR1020137025432A patent/KR101517532B1/ko active IP Right Grant
- 2012-04-20 WO PCT/JP2012/060691 patent/WO2013005468A1/ja active Application Filing
- 2012-04-20 JP JP2013522504A patent/JP5531163B2/ja not_active Expired - Fee Related
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2013
- 2013-10-10 US US14/051,147 patent/US9324497B2/en active Active
Patent Citations (6)
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JPH08203792A (ja) * | 1995-01-25 | 1996-08-09 | Marcon Electron Co Ltd | ヒューズ付き固体電解コンデンサ及びその製造方法 |
JPH09115767A (ja) * | 1995-10-20 | 1997-05-02 | Matsushita Electric Ind Co Ltd | コンデンサおよびその製造方法 |
JP2001006973A (ja) * | 1999-06-25 | 2001-01-12 | Matsushita Electric Ind Co Ltd | コンデンサおよびその製造方法 |
JP2002185148A (ja) * | 2000-12-11 | 2002-06-28 | Hitachi Ltd | 多層配線基板の層間短絡防止方法および多層配線基板および多層配線基板の製造方法およびこれらを用いた電子機器 |
JP2007115986A (ja) * | 2005-10-21 | 2007-05-10 | Sharp Corp | 薄膜デバイス及びその製造方法 |
JP2008160040A (ja) * | 2006-12-26 | 2008-07-10 | Tdk Corp | キャパシタの製造方法 |
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KR20130135927A (ko) | 2013-12-11 |
US20140036410A1 (en) | 2014-02-06 |
WO2013005468A1 (ja) | 2013-01-10 |
JPWO2013005468A1 (ja) | 2015-02-23 |
US9324497B2 (en) | 2016-04-26 |
KR101517532B1 (ko) | 2015-05-04 |
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