JP5447537B2 - Antenna device - Google Patents

Antenna device Download PDF

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Publication number
JP5447537B2
JP5447537B2 JP2011550917A JP2011550917A JP5447537B2 JP 5447537 B2 JP5447537 B2 JP 5447537B2 JP 2011550917 A JP2011550917 A JP 2011550917A JP 2011550917 A JP2011550917 A JP 2011550917A JP 5447537 B2 JP5447537 B2 JP 5447537B2
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circuit
radiator
reactance
element
reactance element
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JPWO2011090050A1 (en
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紀行 植木
登 加藤
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株式会社村田製作所
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Priority to PCT/JP2011/050819 priority patent/WO2011090050A1/en
Priority to JP2011550917A priority patent/JP5447537B2/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/213Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2135Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/30Combinations of separate antenna units operating in different wavebands and connected to a common feeder system

Description

  The present invention relates to an antenna device, and more particularly to an antenna device mounted on a mobile communication terminal such as a mobile phone.

  In recent years, as an antenna device mounted on a mobile communication terminal, as described in Patent Documents 1, 2, and 3, a metal body (such as a ground plate of a printed wiring board) disposed inside a terminal housing is a radiating element. A dipole antenna has been proposed for use as an antenna. This type of chassis dipole antenna is equivalent to a dipole antenna by supplying differential power to the two chassis ground plates (the ground plate of the main unit housing and the ground plate of the lid unit housing) in a folding or sliding portable communication terminal. Performance can be obtained. Further, since the ground plate provided in the housing is used as a radiating element, it is not necessary to provide a separate radiating element, and the mobile communication terminal can be downsized.

  However, in the case of the housing dipole antenna, the shape of the ground plate used as the radiating element, the shape of the housing, and the arrangement state of adjacent metal bodies (such as electronic parts and hinge parts that are arranged close to each other) Impedance changes. Therefore, it is necessary to design an impedance matching circuit for each model in order to minimize the energy loss of the high-frequency signal. In the case of a foldable or slide type mobile communication terminal, a ground plate or impedance matching is performed depending on the positional relationship between the main body housing and the lid body housing (for example, the lid body is closed and opened in the folding type). The impedance of the circuit will change. Therefore, a control circuit or the like may be required to control the impedance.

JP 2004-172919 A JP 2005-6096 A JP 2008-118359 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide an antenna device that can stabilize the frequency of a high-frequency signal without being affected by the shape of a radiator or housing, the arrangement of adjacent components, and the like.

An antenna device according to one embodiment of the present invention is
A first radiator provided on the first housing;
A second radiator provided in a second housing connected to the first housing;
A feed circuit connected to each of the first radiator and the second radiator;
Provided between the feeding circuit and the first radiator, and stabilizes the frequency of the high-frequency signal transmitted from the first radiator and the second radiator and / or received by the first radiator and the second radiator. A frequency stabilization circuit for
It is provided with.

  According to the present invention, since the frequency stabilizing circuit provided between the feeding circuit and the first radiator stabilizes the frequency of the transmission / reception signal, the shape of the first radiator and the second radiator, The frequency of the high-frequency signal is stabilized without being affected by the shape of the first housing or the second housing, the arrangement state of adjacent components, and the like.

It is explanatory drawing which shows typically the portable communication terminal provided with the antenna apparatus. The antenna apparatus which is 1st Example is shown, (A) is an equivalent circuit schematic, (B) is an operation principle figure, (C) is the circuit diagram drawn from the viewpoint as a filter. (A)-(D) are each a graph which shows the passage characteristic of the antenna apparatus which is 1st Example. The frequency stabilization circuit comprised as a laminated body is shown, (A) is a perspective view of the surface side, (B) is a perspective view of the back surface side. It is a perspective view which decomposes | disassembles and shows the 1st example of the frequency stabilization circuit comprised as a laminated body. FIG. 6 is an explanatory diagram showing an operation principle of the frequency stabilization circuit shown in FIG. 5. It is a perspective view which decomposes | disassembles and shows the 2nd example of the frequency stabilization circuit comprised as a laminated body. It is an equivalent circuit diagram which shows the antenna apparatus which is 2nd Example. It is a perspective view which decomposes | disassembles and shows the 3rd example of the frequency stabilization circuit comprised as a laminated body. It is a perspective view which decomposes | disassembles and shows the 4th example of the frequency stabilization circuit comprised as a laminated body. It is an equivalent circuit diagram which shows the antenna apparatus which is 3rd Example. It is an equivalent circuit diagram which shows the antenna apparatus which is 4th Example.

  Hereinafter, embodiments of an antenna device according to the present invention will be described with reference to the accompanying drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same member and part, and the overlapping description is abbreviate | omitted.

(Mobile communication terminal, see FIG. 1)
A mobile communication terminal 1 equipped with an antenna device according to the present invention is a one-seg reception (470 to 770 MHz) terminal, and as shown in FIG. The first housing 10 is connected to the second housing 20 in a foldable or sliding manner. The first casing 10 is provided with a first radiator 11 that also functions as a ground plate, and the second casing 20 is provided with a second radiator 21 that also functions as a ground plate. The first and second radiators 11 and 21 are formed of a conductive film made of a thin film such as a metal foil or a thick film such as a conductive paste. The first and second radiators 11 and 21 obtain a performance almost equivalent to that of a dipole antenna by being differentially fed from the feeding circuit 30. The power feeding circuit 30 has a signal processing circuit such as an RF circuit or a BB circuit. Note that the second radiator 21 does not necessarily function sufficiently as a radiator, and the first radiator 11 may behave like a so-called monopole antenna.

  The power feeding circuit 30 has one end connected to the second radiator 21 and the other end connected to the first radiator 11 via the frequency stabilization circuit 35. The first and second radiators 11 and 21 are connected to each other by a connection line 33. This connection line 33 functions as a connection line for electronic components (not shown) mounted on each of the first and second casings 10 and 20, and acts as an inductance element for high-frequency signals, but the performance of the antenna. It does not act directly.

  The frequency stabilization circuit 35 is provided between the power feeding circuit 30 and the first radiator 11, and is a high-frequency signal transmitted from the first and second radiators 11 and 21, or the first and second radiators 11. , 21 to stabilize the frequency characteristics of the high-frequency signal received. Therefore, the frequency characteristics of the high-frequency signal are stabilized without being affected by the shape of the first radiator 11 or the second radiator 21, the shape of the first housing 10 or the second housing 20, the arrangement state of adjacent components, and the like. To do. In particular, in a foldable or slide-type mobile communication terminal, the first and second radiators 11, 11, and 11, according to the open / closed state of the second casing 20 that is the main body of the first casing 10 that is the lid. 21 is easy to change, but by providing the frequency stabilization circuit 35, the frequency characteristics of the high-frequency signal can be stabilized. Details of the frequency stabilization circuit 35 will be described below as first to fourth embodiments.

(Refer to the first embodiment, FIGS. 2 to 8)
A frequency stabilizing circuit (also referred to as a stabilizer circuit) 35 used in the antenna device according to the first embodiment includes a primary reactance circuit connected to a power feeding circuit 30 as shown in FIG. The primary side reactance circuit and a secondary side reactance circuit coupled via an electric field or a magnetic field. The primary-side reactance circuit is configured by a primary-side series circuit 36 including a first reactance element and a second reactance element connected in series to the first reactance element. The secondary-side reactance circuit is a secondary-side series circuit 37 including a third reactance element coupled to the first reactance element and a fourth reactance element connected in series to the third reactance element and coupled to the second reactance element. It is configured. Specifically, the first reactance element is composed of a first inductance element L1, the second reactance element is composed of a second inductance element L2, and the third reactance element is composed of a third inductance element L3. The fourth reactance element is composed of a fourth inductance element L4.

  One end of the primary side series circuit 36 (one end of the first inductance element L1) is connected to the power feeding circuit 30, and one end of the secondary side series circuit 37 (one end of the third inductance element L3) is connected to the first radiator 11. It is connected. The other end of the primary side series circuit 36 (the other end of the second inductance element L2) and the other end of the secondary side series circuit 37 (the other end of the fourth inductance element L4) are connected to the second radiator 21. .

  As shown in FIG. 2B, the first inductance element L1 and the second inductance element L2 are coupled in opposite phases, and the third inductance element L3 and the fourth inductance element L4 are coupled in opposite phases. doing. That is, the first and second inductance elements L1 and L2 and the third and fourth inductance elements L3 and L4 form a closed magnetic circuit, respectively, and are coupled mainly through an electromagnetic field. Further, the first inductance element L1 and the third inductance element L3 are coupled in opposite phases, and the second inductance element L2 and the fourth inductance element L4 are coupled in opposite phases. That is, the first and third inductance elements L1 and L3 and the second and fourth inductance elements L2 and L4 form a closed magnetic circuit, and the closed magnetic circuits are connected to each other, that is, the primary side series circuit 36 and the secondary side. The series circuit 37 is coupled mainly via an electromagnetic field. “Coupling via an electromagnetic field” means coupling via an electric field, coupling via a magnetic field, or coupling via both an electric field and a magnetic field.

  In the frequency stabilization circuit 35 configured as described above, the high-frequency signal current flowing from the power supply circuit 30 to the primary side series circuit 36 is guided to the first inductance element L1, and each inductance element is formed in a coil pattern. In this case, the secondary current is guided to the third inductance element L3 via the induction magnetic field. In addition, the high-frequency signal current guided to the second inductance element L2 is guided to the fourth inductance element L4 as a secondary current via the induction magnetic field. As a result, the high-frequency signal current flows in the direction indicated by the arrow in FIG.

  In the frequency stabilization circuit 35, impedance matching with the feeder circuit 30 side is mainly achieved by the primary side series circuit 36, and impedance matching with the first radiator 11 side is mainly achieved by the secondary side series circuit 37. In other words, since the impedance of the primary side series circuit 36 and the impedance of the secondary side series circuit 37 can be designed independently, impedance matching is easy.

  Drawing the equivalent circuit shown in FIG. 2B from the viewpoint of a filter results in FIG. 2C. The capacitance element C1 is a line capacitance formed by the first and second inductance elements L1 and L2, and the capacitance element C2 is a line capacitance formed by the third and fourth inductance elements L3 and L4. The capacitance element C3 is a line capacitance (parasitic capacitance) formed by the primary side series circuit 36 and the secondary side series circuit 37. That is, the LC parallel resonance circuit R1 is formed by the primary side series circuit 36, and the LC parallel resonance circuit R2 is formed by the secondary side series circuit 37.

  When the resonance frequency in the LC parallel resonance circuit R1 is F1 and the resonance frequency in the LC parallel resonance circuit R2 is F2, the high-frequency signal from the power supply circuit 30 has the pass characteristic shown in FIG. 3A when F1 = F2. Show. Since the first and second inductance elements L1 and L2, the third and fourth inductance elements L3 and L4 are coupled in opposite phases, the inductance values of the respective inductance elements L1 to L4 can be increased. Pass characteristics can be obtained. The high-frequency signal from the first radiator 11 has a broadband pass characteristic indicated by a curve A as shown in FIG. Although this mechanism is not necessarily clear, it seems that degeneration can be solved because the LC parallel resonance circuits R1 and R2 are coupled, and ΔF is determined by the degree of coupling between the resonance circuits R1 and R2. That is, it is possible to increase the bandwidth in proportion to the degree of coupling.

  On the other hand, in the case of F1 ≠ F2, the high frequency signal from the power feeding circuit 30 shows the pass characteristic shown in FIG. The high-frequency signal from the first radiator 11 has a broadband pass characteristic indicated by a curve B as shown in FIG. This is also because the LC parallel resonance circuits R1 and R2 are coupled, so that the degeneracy can be solved. If the coupling degree of the resonance circuits R1 and R2 is large, a broad and wide band pass characteristic is obtained.

  As described above, since the frequency characteristic is determined by using the resonance characteristic of the frequency stabilization circuit 35 itself, a frequency shift hardly occurs. Further, by obtaining a wide band pass characteristic, it is possible to secure a pass band even if the impedance slightly changes. That is, it is possible to stabilize the frequency characteristics of the high-frequency signal transmitted and received regardless of the size and shape of the radiator and the environment of the radiator.

  The frequency stabilization circuit 35 can be configured as a chip-type laminate 40 shown in FIG. The laminated body 40 is formed by laminating a plurality of base material layers made of a dielectric material or a magnetic material, and has a power supply terminal 41 connected to the power supply circuit 30 and a ground terminal 42 connected to the second radiator 21 on the back surface. An antenna terminal 43 connected to the first radiator 11 is provided. In addition, an NC terminal 44 used for mounting is also provided on the back surface.

  Here, a first example of the frequency stabilization circuit 35 built in the laminate 40 will be described with reference to FIG. In this first example, the conductor 61 is formed on the uppermost base material layer 51a, and the conductor 62 to be the first and second inductance elements L1 and L2 is formed on the second base material layer 51b. Two conductors 63 and 64 to be the first and second inductance elements L1 and L2 are formed on the base material layer 51c. Two conductors 65 and 66 to be the third and fourth inductance elements L3 and L4 are formed on the fourth base layer 51d, and the third and fourth inductance elements L3 and L4 are formed on the fifth base layer 51e. A conductor 67 is formed. Further, a ground conductor 68 is formed on the sixth base layer 51f, and a power supply terminal 41, a ground terminal 42, and an antenna terminal 43 are formed on the back surface of the seventh base layer 51g. A plain base material layer (not shown) is laminated on the uppermost base material layer 51a.

  The conductors 61 to 68 can be formed using a conductive material such as silver or copper as a main component. As the base material layers 51a to 51g, a glass ceramic material, an epoxy resin material, or the like can be used as long as it is a dielectric, and a ferrite ceramic material or a resin material containing ferrite can be used as a magnetic material. . As a material for the base material layer, it is preferable to use a dielectric material particularly when a frequency stabilizing circuit for the UHF band is manufactured. When a frequency stabilizing circuit for the HF band is manufactured, a magnetic material is preferably used. It is preferable to use it.

  By laminating the base material layers 51a to 51g, the conductors 61 to 68 and the terminals 41, 42, and 43 are connected via the interlayer connection conductor (via hole conductor), and the equivalent circuit shown in FIG. Form.

  That is, the power supply terminal 41 is connected to one end of the coil pattern 63 via the via-hole conductor 45a, the conductor 61, and the via-hole conductor 45b, and the other end of the coil pattern 63 is connected to one end of the coil pattern 62a via the via-hole conductor 45c. It is connected. The other end of the coil pattern 62a is connected to one end of the coil pattern 62b, and the other end of the coil pattern 62b is connected to one end of the coil pattern 64 via the via-hole conductor 45d. The other end of the coil pattern 64 is connected to the ground conductor 68 via the via-hole conductor 45e, and the ground conductor 68 is connected to the ground terminal 42 via the via-hole conductor 45f. That is, the coil pattern 63 and the coil pattern 62a constitute the first coil pattern, that is, the inductance element L1, and the coil pattern 62b and the coil pattern 64 constitute the second coil pattern, that is, the inductance element L2.

  The antenna terminal 43 is connected to one end of the coil pattern 65 via the via-hole conductor 45g, and the other end of the coil pattern 65 is connected to one end of the coil pattern 67a via the via-hole conductor 45h. The other end of the coil pattern 67a is connected to one end of the coil pattern 67b, and the other end of the coil pattern 67b is connected to one end of the coil pattern 66 via the via-hole conductor 45i. The other end of the coil pattern 66 is connected to the ground conductor 68 via the via-hole conductor 45j, and the ground conductor 68 is connected to the ground terminal 42 via the via-hole conductor 45f. That is, the coil pattern 65 and the coil pattern 67a constitute the third coil pattern, that is, the inductance element L3, and the coil pattern 67b and the coil pattern 66 constitute the fourth coil pattern, that is, the inductance element L4.

  As shown in FIG. 5, the first and second coil patterns are adjacently arranged so that the winding axis of the first coil pattern and the winding axis of the second coil pattern are parallel to each other. And the 4th coil pattern is adjacently arranged so that the winding axis of the 3rd coil pattern and the winding axis of the 4th coil pattern may become parallel. Furthermore, the first and third coil patterns are arranged so that the winding axis of the first coil pattern and the winding axis of the third coil pattern are substantially collinear, and the second and fourth coil patterns are The winding axis of the second coil pattern and the winding axis of the fourth coil pattern are arranged so as to be substantially on the same straight line.

  Each coil pattern is composed of a one-turn loop conductor, but may be composed of a plurality of turns of a loop conductor. Further, the first and third coil patterns do not have to be arranged so that the winding axes of the respective coil patterns are exactly the same straight line. It suffices that the windings are wound so that the openings overlap each other, that is, the magnetic flux common to each coil pattern passes. Similarly, the second and fourth coil patterns need not be arranged so that the winding axis of each coil pattern is exactly the same straight line, and when viewed in plan, the second and fourth coil patterns It is only necessary for the coil openings to be wound so that the coil openings overlap each other, that is, so that a common magnetic flux passes through each coil pattern.

  As described above, the inductance elements L <b> 1 to L <b> 4 are built in the multilayer body 40 made of a dielectric material or a magnetic body, and in particular, a region serving as a coupling portion between the primary side series circuit 36 and the secondary side series circuit 37 is laminated body 40. The element values of the elements constituting the frequency stabilization circuit 35 and the degree of coupling between the primary side series circuit 36 and the secondary side series circuit 37 are arranged adjacent to the laminate 40. It becomes difficult to be affected by the electronic elements. As a result, the frequency characteristics can be further stabilized.

  Incidentally, various wirings are provided on a printed wiring board (not shown) on which the laminate 40 is mounted, and these wirings and the frequency stabilization circuit 35 may interfere with each other. As in the present embodiment, the ground conductor 68 is provided at the bottom of the laminated body 40 so as to cover the opening of the coil pattern formed by the conductors 61 to 67, so that the magnetic field generated in the coil pattern can be varied on the printed wiring board. Less susceptible to magnetic fields from wiring. In other words, the L values of the inductance elements L1 to L4 are less likely to vary.

  In the frequency stabilization circuit 35 as the first example, as shown in FIG. 6, the high-frequency signal current input from the power supply terminal 41 flows as indicated by arrows a and b, and the first inductance element L1 (conductor 62, 63) as indicated by arrows c and d, and further as indicated by arrows e and f to the second inductance element L2 (conductors 62 and 64). The magnetic field C generated by the primary current (arrows c and d) excites a high-frequency signal current in the third inductance element L3 (conductors 65 and 67) as indicated by arrows g and h, and an induced current (secondary current) is generated. Flowing. Similarly, the magnetic field C generated by the primary current (arrows e and f) excites a high-frequency signal current in the fourth inductance element L4 (conductors 66 and 67) as indicated by arrows i and j, and induces an induced current (secondary Current) flows. As a result, a high-frequency signal current indicated by an arrow k flows through the antenna terminal 43, and a high-frequency signal current indicated by an arrow l flows through the ground terminal 42. In addition, if the current (arrow a) flowing through the power supply terminal 41 is in the reverse direction, other currents also flow in the reverse direction.

  In the primary side series circuit 36, the first and second inductance elements L1, L2 are coupled in opposite phases, and in the secondary side series circuit 37, the third and fourth inductance elements L3, L4 are coupled in opposite phases. , Each of which forms a closed magnetic circuit. Therefore, the energy loss between the first inductance element L1 and the second inductance element L2 and between the third inductance element L3 and the fourth inductance element L4 can be reduced. If the inductance values of the first and second inductance elements L1 and L2 and the inductance values of the third and fourth inductance elements L3 and L4 are set to substantially the same element value, the leakage magnetic field of the closed magnetic circuit is reduced, and the energy is reduced. Loss can be further reduced.

  In addition, the magnetic field C excited by the primary current in the primary side series circuit 36 and the magnetic field D excited by the secondary current in the secondary side series circuit 37 are generated so as to cancel each other's magnetic field by the induced current. By using the induced current, energy loss is reduced, and the first and third inductance elements L1 and L3 and the second and fourth inductance elements L2 and L4 are coupled with a high degree of coupling. That is, the primary side series circuit 36 and the secondary side series circuit 37 are coupled with a high degree of coupling.

  The inductance value of the frequency stabilization circuit 35 is preferably smaller than the inductance value of the connection line 33 that connects the two radiators. This is because the influence of the inductance value of the connection line 33 on the frequency characteristics can be reduced. By coupling the first and second inductance elements L1, L2 and the third and fourth inductance elements L3, L4 in opposite phases, the inductance value of the frequency stabilizing circuit 35 can be reduced.

  As described above, according to the present embodiment, the primary side series circuit 36 and the secondary side series circuit 37 utilize the coupling (electromagnetic field coupling) between the closed magnetic circuit and the closed magnetic circuit, and therefore the primary side series circuit. Impedance matching with the power feeding circuit 30 side is performed by the circuit 36, and impedance matching with the first radiator 11 side is performed by the secondary side series circuit 37, so that the impedance is independent on the primary side and the secondary side. Can be matched. In addition, since the transmission efficiency of the high-frequency signal energy is improved, the frequency characteristics of the high-frequency signal are stabilized in a wide band without being greatly affected by the shapes of the radiators 11 and 21 and the housings 10 and 20 and the open / closed state. be able to.

  Next, a second example of the frequency stabilization circuit 35 will be described with reference to FIG. The second example has basically the same configuration as the first example. The first example is different from the first example in that the conductor 61 is formed on the substrate layer 51b by omitting the substrate layer 51a, and the ground conductor. The difference is that 68 is omitted and a connection conductor 69 is formed on the base material layer 51h. In the second example, since the ground conductor 68 is omitted, it is preferable to provide a shield conductor corresponding to the ground conductor 68 on the printed wiring board on which the multilayer body 40 is mounted.

(Refer 2nd Example and FIGS. 8-10)
An antenna apparatus according to the second embodiment is shown in FIG. The frequency stabilization circuit 35 used here is provided with a secondary side series circuit 38 (secondary side reactance circuit) in addition to the primary side series circuit 36 and the secondary side series circuit 37 described above. It is. The fifth inductance element L5 and the sixth inductance element L6 constituting the secondary side series circuit 38 are coupled in opposite phases. The fifth inductance element L5 is coupled with the first inductance element L1 in reverse phase, and the sixth inductance element L6 is coupled with the second inductance element L2 in reverse phase. One end of the fifth inductance element L5 is connected to the first radiator 11, and one end of the sixth inductance element L6 is connected to the second radiator 21.

  A third example in which the frequency stabilization circuit 35 is configured as a laminate 40 will be described with reference to FIG. In the third example, conductors 71, 72, and 73 that form the fifth and sixth inductance elements L5 and L6 of the secondary series circuit 38 are further formed on the multilayer body 40 shown in the first example. The material layers 51i and 51j are laminated. That is, similarly to the first to fourth reactance elements described above, the fifth and sixth reactance elements are configured by the fifth and sixth inductance elements L5 and L6, respectively, and these fifth and sixth inductance elements L5 and L6 are formed. Can be wound so that the magnetic field generated in these inductance elements L5 and L6 forms a closed magnetic circuit.

  The operations of the second example and the third example of the laminate 40 are basically the same as those of the first example and the first example. In the second embodiment, the primary-side series circuit 36 is sandwiched between two secondary-side series circuits 37, 38, whereby the energy transmission of the high-frequency signal from the primary-side series circuit 36 to the secondary-side series circuits 37, 38 is performed. Loss is reduced.

  Next, a fourth example in which the frequency stabilization circuit 35 is configured as a laminated body 40 will be described with reference to FIG. In this fourth example, a base material layer 51k provided with a ground conductor 74 is further laminated on the laminate 40 of the third example. The ground conductor 74 has an area covering the opening of the coil formed by the conductors 71, 72, and 73, similarly to the ground conductor 68 provided at the bottom. Therefore, in the fourth example, by providing the ground conductor 74, the magnetic field formed by the coil is less affected by the magnetic fields from various wirings arranged immediately above the multilayer body 40. In this way, even if the first and third inductance elements L1, L3, the second and fourth inductance elements L2, L4 are coupled in phase, the primary side series circuit 36 and the secondary side series circuit 37 are coupled. Can do.

(Refer to the third embodiment, FIG. 11)
An antenna device according to the third embodiment is shown in FIG. The frequency stabilization circuit 35 used here basically has the same configuration as that of the first embodiment. The difference is that the first inductance element L1 and the third inductance element L3 are coupled in phase with each other, and the second inductance element L2 and the fourth inductance element L4 are coupled in phase with each other. That is, the first and third inductance elements L1 and L3 are coupled mainly through a magnetic field, and the second and fourth inductance elements L2 and L4 are coupled mainly through a magnetic field. The operational effects of the third embodiment are basically the same as those of the first embodiment.

  By winding the coil pattern constituting each of the inductance elements L1 to L4 in this manner, a closed magnetic circuit (first closed magnetic circuit) formed between the inductance element L1 and the inductance element L2, an inductance element L3, and the inductance element Since a closed magnetic circuit (second closed magnetic circuit) formed with L4 and a closed magnetic circuit (third closed magnetic circuit) formed with the first closed magnetic path and the second closed magnetic circuit are formed, each inductance element L1 is formed. The loss of the high frequency signal in ~ L4 can be minimized.

(Refer to the fourth embodiment, FIG. 12)
An antenna device according to the fourth embodiment is shown in FIG. The frequency stabilizing circuit 35 used here is the same as that of the first embodiment, and the function and effect thereof are the same as those of the first embodiment. The difference from the first embodiment is that a capacitance element C4 is arranged between the frequency stabilization circuit 35 and the second radiator 21. The capacitance element C4 functions as a bias cut for cutting a direct current component and a low frequency component, and also functions as an ESD countermeasure element.

(Other examples)
The antenna device according to the present invention is not limited to the above-described embodiments, and can be variously modified within the scope of the gist.

  For example, the present invention is not only for one-segment broadcasting, but also for mobile radio communication systems such as GSM and CDMA (800 MHz band, 900 MHz band, 1800 MHz band, 1900 MHz band, etc.), short-range wireless systems such as Bluetooth and W-LAN ( 2.4 GHz band), GPS system (1.5 GHz band), and other various communication systems.

  The frequency stabilization circuit can be configured as a chip-type laminate, a module integrated with other elements such as a strip line, or a module mounted or built in a printed wiring board provided with a radiator. It can also be configured. Further, the frequency stabilization circuit may be multistaged by combining a plurality of sets in addition to providing one set of the primary side series circuit and the secondary side series circuit. As shown in the second embodiment, the structure in which the primary side series circuit is sandwiched between the secondary side series circuits may be multistaged as one set. By using multiple stages, energy transmission loss of high-frequency signals can be reduced, and return loss attenuation becomes steep.

  The feeding method is a balanced feeding type when the first radiator and the second radiator are regarded as radiating elements, respectively, and is unbalanced when the first radiator is regarded as a radiating element and the second radiator is regarded as a ground. It is a power supply type.

  As described above, the present invention is useful for an antenna device, and is particularly excellent in terms of stabilizing the frequency of a high-frequency signal.

DESCRIPTION OF SYMBOLS 1 ... Mobile communication terminal 10 ... 1st housing 11 ... 1st radiator 20 ... 2nd housing 21 ... 2nd radiator 30 ... Power feeding circuit 35 ... Frequency stabilization circuit 36 ... Primary side series circuit 37, 38 ... Secondary side Series circuit 40 ... Laminated body L1, L2, L3, L4, L5, L6 ... Inductance element

Claims (10)

  1. A first radiator provided on the first housing;
    A second radiator provided in a second housing connected to the first housing;
    A feed circuit connected to each of the first radiator and the second radiator;
    Provided between the feeding circuit and the first radiator, and stabilizes the frequency of the high-frequency signal transmitted from the first radiator and the second radiator and / or received by the first radiator and the second radiator. A frequency stabilization circuit for
    An antenna device comprising:
  2.   2. The antenna device according to claim 1, wherein the frequency stabilization circuit includes a plurality of passive elements, and the passive elements are integrally formed on an element body made of a dielectric material or a magnetic material.
  3.   The element body is constituted by a laminated body formed by laminating a plurality of base material layers made of a dielectric material or a magnetic material, and the passive element is built in the laminated body. The antenna device described.
  4.   The first radiator and the second radiator are connected via a connection line, and the power feeding circuit and the frequency stabilization circuit are arranged in parallel with the connection line between the first radiator and the second radiator. The antenna device according to any one of claims 1 to 3, wherein the antenna device is disposed on the antenna device.
  5.   The frequency stabilization circuit includes a primary side reactance circuit connected to the power feeding circuit, and a secondary side reactance circuit coupled to the primary side reactance circuit via an electric field or a magnetic field. The antenna device according to any one of claims 1 to 4.
  6. The primary side reactance circuit is configured by a primary side series circuit including a first reactance element and a second reactance element connected in series to the first reactance element.
    The secondary-side reactance circuit is configured by a secondary-side series circuit including a third reactance element coupled to the first reactance element and a fourth reactance element coupled in series to the third reactance element and coupled to the second reactance element. is being done,
    The antenna device according to claim 5.
  7.   The first reactance element and the second reactance element are coupled with each other in opposite phases, and the third reactance element and the fourth reactance element are coupled with each other in opposite phases. Antenna device.
  8.   The first reactance element and the third reactance element are coupled with each other in opposite phases, and the second reactance element and the fourth reactance element are coupled with each other in opposite phases. Item 8. The antenna device according to Item 7.
  9.   8. The first reactance element and the third reactance element are coupled in phase with each other, and the second reactance element and the fourth reactance element are coupled in phase with each other. The antenna device according to 1.
  10.   10. The antenna device according to claim 6, wherein each of the first, second, third, and fourth reactance elements is an inductance element.
JP2011550917A 2010-01-19 2011-01-19 Antenna device Active JP5447537B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010009514 2010-01-19
JP2010009514 2010-01-19
PCT/JP2011/050819 WO2011090050A1 (en) 2010-01-19 2011-01-19 Antenna device
JP2011550917A JP5447537B2 (en) 2010-01-19 2011-01-19 Antenna device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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JP5630566B2 (en) * 2011-03-08 2014-11-26 株式会社村田製作所 Antenna device and communication terminal device

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JP5582158B2 (en) * 2012-03-28 2014-09-03 株式会社村田製作所 Multiband antenna device

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JP2000244273A (en) * 1999-02-18 2000-09-08 Toko Inc Hybrid circuit and transformer therefor
JP2004304615A (en) * 2003-03-31 2004-10-28 Tdk Corp High frequency composite part
JP4295660B2 (en) * 2004-05-10 2009-07-15 京セラ株式会社 Balun transformer
WO2009020025A1 (en) * 2007-08-09 2009-02-12 Murata Manufacturing Co., Ltd. Stacked transformer, impedance converter, equal distributor, impedance conversion method and equal distribution method
JP2009246624A (en) * 2008-03-31 2009-10-22 Hitachi Metals Ltd Layered balun transformer, and high frequency switch module using the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5630566B2 (en) * 2011-03-08 2014-11-26 株式会社村田製作所 Antenna device and communication terminal device

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