JP5426319B2 - Diamond cutting tool and manufacturing method thereof - Google Patents
Diamond cutting tool and manufacturing method thereof Download PDFInfo
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- JP5426319B2 JP5426319B2 JP2009245407A JP2009245407A JP5426319B2 JP 5426319 B2 JP5426319 B2 JP 5426319B2 JP 2009245407 A JP2009245407 A JP 2009245407A JP 2009245407 A JP2009245407 A JP 2009245407A JP 5426319 B2 JP5426319 B2 JP 5426319B2
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- 229910003460 diamond Inorganic materials 0.000 title claims description 112
- 239000010432 diamond Substances 0.000 title claims description 112
- 238000005520 cutting process Methods 0.000 title claims description 80
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000000227 grinding Methods 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 21
- 230000003746 surface roughness Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 238000009837 dry grinding Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000001238 wet grinding Methods 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000003054 catalyst Substances 0.000 claims description 4
- 238000007730 finishing process Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000005323 electroforming Methods 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 description 10
- 238000005498 polishing Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011806 microball Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000000634 powder X-ray diffraction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007518 final polishing process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
Description
本発明は、切削加工に利用されるダイヤモンド工具に関するものであり、主にアルミニウム合金、銅合金、無電解ニッケルメッキ、複合強化樹脂やガラス、カーボン、ＭＭＣ、超硬などの硬質脆性材料や難削材料を精密加工するための精密切削工具及びその製造方法に関する。 The present invention relates to a diamond tool used for cutting, mainly aluminum alloy, copper alloy, electroless nickel plating, composite reinforced resin, glass, carbon, MMC, carbide and other hard brittle materials and difficult to cut. The present invention relates to a precision cutting tool for precisely machining a material and a method for manufacturing the same.
市販されている切削工具用の多結晶ダイヤモンド工具は、焼結助剤あるいは結合材として１０ｖｏｌ％前後のＣｏ、Ｎｉなどの鉄系金属やＳｉＣなどのセラミックスを含むために高精度な刃先や作用面が得られず精密加工用工具には適用されない。
これを解決する為に近年バインダや焼結助剤を含まないバインダレス多結晶ダイヤモンドが開発され、本用途への適用が検討されている（特許文献１）。
特許文献１では、従来の多結晶ダイヤでは得られない高い刃先精度を持つ工具を作成し、アルミ合金やカーボンの切削に於いて精密切削に適用することができ、単結晶ダイヤバイトよりも高い耐摩耗性が確認された。
しかしながら、耐欠損性については当初期待された十分な効果が得られず、超硬合金やセラミックスなどの硬質脆性材料の加工は困難であった（非特許文献１）。
Commercially available polycrystalline diamond tools for cutting tools contain high-precision cutting edges and working surfaces because they contain iron-based metals such as Co and Ni and ceramics such as SiC as sintering aids or binders. Is not applicable to precision machining tools.
In order to solve this problem, binderless polycrystalline diamond containing no binder or sintering aid has been developed in recent years, and its application to this application has been studied (Patent Document 1).
In Patent Document 1, a tool having high cutting edge accuracy that cannot be obtained by a conventional polycrystalline diamond can be created, and can be applied to precision cutting in the cutting of an aluminum alloy or carbon. Abrasion was confirmed.
However, sufficient effects expected at the beginning were not obtained with respect to fracture resistance, and it was difficult to process hard brittle materials such as cemented carbide and ceramics (Non-Patent Document 1).
本発明は、多結晶ダイヤモンド本来の耐欠損性を十分発揮し、硬質脆性材料や難削材料の精密加工に適用可能な工具及びその作製方法を提供することを目的とする。 An object of the present invention is to provide a tool that can sufficiently exhibit the fracture resistance inherent in polycrystalline diamond and can be applied to precision machining of hard brittle materials and difficult-to-cut materials, and a method for producing the same.
本発明者らは、ダイヤモンド単相の多結晶ダイヤモンドであっても刃先のチッピング精度を５０ｎｍ以下に抑制することで、硬質材料であっても切削中に工具刃先に微小欠損を生じることなく精密切削加工を行なうことができることを見出して本発明を完成した。
すなわち、本発明は以下に記載する通りのダイヤモンド切削工具及びその製造方法に係るものである。
By suppressing the chipping accuracy of the cutting edge to 50 nm or less even for single-phase diamond diamond, the present inventors have made precision cutting without causing micro-defects in the cutting edge of the tool even if it is a hard material. The present invention has been completed by finding that it can be processed.
That is, the present invention relates to a diamond cutting tool and a manufacturing method thereof as described below.
（１）ダイヤモンド単相の多結晶ダイヤモンドを切れ刃とする切削工具を製造する方法であって、ダイヤモンド単相の多結晶ダイヤモンドの切れ刃の外形をレーザ加工により形状作製した後、前記切れ刃を形成するすくい面及び逃げ面の仕上げ加工を金属バインダを含むダイヤモンド焼結体を研削盤として用いる研削加工により行なう工程を含み、前記ダイヤモンド焼結体からなる研削盤は、前記仕上加工を行う加工機上で回転軸との垂直度と平坦度を出す成形加工をダイヤモンド電鋳工具を電極として用いる放電加工により行った後、更に当該ダイヤモンド電鋳工具を用いて、ダイヤモンドスラリを研削液として用いる湿式研削と乾式研削とを併せて行い面粗さを調節した研削盤であることを特徴とする多結晶ダイヤモンド切削工具の加工方法。
（２）前記のダイヤモンド焼結体からなる研削盤の回転軸に対する垂直度が１／１０００°以下かつ平坦度が２０ｎｍ／ｍｍ以下であることを特徴とする（１）に記載の多結晶ダイヤモンド切削工具の製造方法。
（３）前記研削盤として使用するダイヤモンド燒結体の面粗さ（Ｒｚ：最大高さ粗さ）が３０ｎｍ以下であることを特徴とする（１）又は（２）に記載の多結晶ダイヤモンド切削工具の製造方法。
（４）前記ダイヤモンド単相の多結晶ダイヤモンドは、グラファイトを超高圧高温下で焼結助剤や触媒の添加無しに直接的にダイヤモンドに変換された多結晶ダイヤモンド焼結体であることを特徴とする（１）〜（３）のいずれかに記載の多結晶ダイヤモンド切削工具の製造方法。
（５）（１）〜（３）のいずれかに記載の方法によって製造したことを特徴とする多結晶ダイヤモンド切削工具。
（６）刃先のチッピングが５０ｎｍ以下であることを特徴とする（５）に記載の多結晶ダイヤモンド切削工具。
（７）前記切れ刃を形成する逃げ面及びすくい面の被削材及び切り子が接触する領域の面粗さ（Ｒｚ：最大高さ粗さ）が１０ｎｍ未満であることを特徴とする（５）又は（６）に記載の多結晶ダイヤモンド切削工具。
(1) A method of manufacturing a cutting tool having a diamond single-phase polycrystalline diamond as a cutting edge, the outer shape of the diamond single-phase polycrystalline diamond cutting edge being formed by laser processing, A grinding machine including a step of performing finish processing of the rake face and flank to be formed by grinding using a diamond sintered body including a metal binder as a grinding machine, the grinding machine comprising the diamond sintered body is a processing machine that performs the finishing process After performing the forming process to obtain the perpendicularity and flatness with respect to the rotating shaft by electric discharge machining using a diamond electroformed tool as an electrode, wet grinding using the diamond slurry as a grinding liquid is further performed using the diamond electroformed tool. Of polycrystalline diamond cutting tools characterized by the fact that the surface roughness is adjusted by combining dry grinding and dry grinding Law.
(2) The polycrystalline diamond cutting according to (1), wherein the grinding machine made of the diamond sintered body has a perpendicularity to a rotation axis of 1/1000 ° or less and a flatness of 20 nm / mm or less. Tool manufacturing method.
(3) The polycrystalline diamond cutting tool according to (1) or (2), wherein the diamond sintered body used as the grinding machine has a surface roughness (Rz: maximum height roughness) of 30 nm or less. Manufacturing method.
(4) The diamond single-phase polycrystalline diamond is a polycrystalline diamond sintered body obtained by converting graphite directly to diamond without adding a sintering aid or a catalyst under an ultra-high pressure and high temperature. A method for producing a polycrystalline diamond cutting tool according to any one of (1) to (3).
(5) A polycrystalline diamond cutting tool manufactured by the method according to any one of (1) to (3).
(6) The polycrystalline diamond cutting tool according to (5), wherein chipping of the blade edge is 50 nm or less.
(7) The surface roughness (Rz: maximum height roughness) of the area where the work material and the face of the flank and rake face that form the cutting edge come into contact with each other is less than 10 nm (5) Or the polycrystalline diamond cutting tool as described in (6).
本発明の多結晶ダイヤモンド切削工具の製造方法によれば、ダイヤモンド単相の多結晶体からなる刃先稜線のチッピングを５０ｎｍ以下とすることができ、また面粗さ（Ｒｚ：最大高さ粗さ）を１０ｎｍ以下と非常に小さくすることができる。
また、本発明の多結晶ダイヤモンド切削工具は刃先稜線のチッピング及び面粗さ（Ｒｚ：最大高さ粗さ）が非常に小さいため切削抵抗が低く、耐欠損性が高いため、従来の切削工具では加工できなかった硬質材料の切削が可能となる。
According to the method for manufacturing a polycrystalline diamond cutting tool of the present invention, chipping of a cutting edge ridge line made of a polycrystalline single-phase diamond can be made 50 nm or less, and surface roughness (Rz: maximum height roughness). Can be as small as 10 nm or less.
In addition, since the polycrystalline diamond cutting tool of the present invention has very low chipping and surface roughness (Rz: maximum height roughness) of the edge of the cutting edge, the cutting resistance is low and the fracture resistance is high. The hard material that could not be processed can be cut.
単結晶ダイヤモンド製の工具刃先の仕上げ研磨は、ダイヤモンド砥粒をオリーブオイルや機械油などでスラリ状にして塗布した鋳鉄製の研磨盤を高速回転させて、ダイヤモンドを押し付けて加工するスカイフ研磨と呼ばれる方法であり、研磨特性は結晶方位に大きく依存する。 Finishing polishing of a single-crystal diamond tool edge is called Skyf polishing, which is performed by rotating a cast iron polishing machine in which diamond abrasive grains are applied in a slurry form with olive oil or machine oil, and pressing the diamond for processing. This is a method, and the polishing characteristics depend greatly on the crystal orientation.
一般に、工具を加工する場合は、比較的研磨速度が速い結晶面を加工することで刃先が得られるような工具形状を設計して加工することが行われている。
ダイヤモンドは硬質脆性材料であるため、工具とした場合に刃先稜線にチッピングが存在すると、微小チッピングであっても切削時にチッピング部に応力が集中して微小欠損が生じ、欠損や巨視的な摩耗の進行起点となってしまう。ダイヤモンド単相の多結晶体ではチッピングを起点とした欠損が伝播してしまい、従来の研磨技術では材質本来の高い耐欠損性を生かすことができなかった。
In general, when a tool is processed, a tool shape is designed and processed so that a cutting edge can be obtained by processing a crystal surface having a relatively high polishing rate.
Since diamond is a hard and brittle material, if there is chipping at the edge of the cutting edge when it is used as a tool, stress will concentrate on the chipping part during cutting even if it is micro chipping, resulting in micro defects and macroscopic wear. It becomes a starting point. In a single-phase polycrystalline diamond, defects originating from chipping propagated, and conventional polishing techniques could not take advantage of the high defect resistance inherent in the material.
また、多結晶ダイヤモンドは、耐摩耗性が高く研磨速度が遅い結晶面方位も多く現れる為、研削抵抗が安定せず微小チッピングが発生してしまい、５０ｎｍ以下の刃先稜線精度を達成することができなかった。特に曲面を有する刃先の研削には、回転砥石面に工具を押し付けながら所望の形状になるように工具を回転させるため、一定荷重での研削が困難で、刃先稜線精度は０．２μｍ以下程度に留まっていた。 In addition, since polycrystalline diamond has many crystal face orientations with high wear resistance and slow polishing speed, the grinding resistance is not stable and micro-chipping occurs, and the edge edge line accuracy of 50 nm or less can be achieved. There wasn't. Especially for grinding a cutting edge having a curved surface, the tool is rotated to a desired shape while pressing the tool against the surface of the rotating grindstone. Therefore, grinding with a constant load is difficult, and the edge line accuracy is about 0.2 μm or less. I stayed.
上記スカイフ研磨以外に、多結晶ダイヤモンドの研削加工には比較的粒度の高い砥粒を用いた砥石による加工が一般的に行なわれている。しかしながら、硬質材料をボンドに用いた砥石でも工具刃先など高精度の形状加工の場合には加工時間が長くなり、このために砥粒の脱落や加工中の砥石面の変形が起こりやすくなる。これらは研削抵抗の増加を招いてしまう為に、刃先稜線に微小チッピングを生じてしまう。 In addition to the skiff polishing, a polycrystalline diamond is generally ground by a grindstone using a relatively high grain size. However, even with a grindstone using a hard material as a bond, the machining time becomes long in the case of high-precision shape machining such as a tool blade edge, and this makes it easy for the abrasive grains to fall off or to deform the grinding wheel surface during machining. Since these cause an increase in grinding resistance, minute chipping occurs in the edge line of the cutting edge.
また刃先加工に際しては、刃先加工時に刃先に導入される欠陥などの機械的ダメージを抑制することが重要である。仕上げの研磨加工に至る前段階となる形状成形加工において、粗粒の砥石で加工するなどして、欠陥などの加工機械的ダメージを残すと、工具刃先に大きな欠損を生じやすくなる。 In cutting edge processing, it is important to suppress mechanical damage such as defects introduced into the cutting edge during cutting edge processing. In the shape forming process, which is a stage before the final polishing process, if a machining mechanical damage such as a defect is left by processing with a coarse grindstone or the like, a large chipping is likely to occur in the tool blade edge.
本発明の製造方法におけるように、工具切れ刃の外形をレーザ加工により形状作製した後、前記切れ刃を形成するすくい面及び、逃げ面の仕上げ加工を金属バインダでダイヤモンド砥粒を焼結させて得られるダイヤモンド焼結体を研削盤として用い、研削加工を行なうことで、刃先のチッピング精度を向上させることが可能となった。 As in the manufacturing method of the present invention, after the outer shape of the tool cutting edge is formed by laser processing, the finish of the rake face and flank forming the cutting edge is sintered with a metal binder to sinter diamond abrasive grains. By using the obtained diamond sintered body as a grinding machine and grinding, it became possible to improve the chipping accuracy of the cutting edge.
上記研削盤に用いられるダイヤモンド焼結体はダイヤモンド含有量が９０％以上と通常の砥石に比べて非常に高く、研削盤とした場合に盤面の変形量が少ない。ダイヤ砥粒同士が結合し一体化している為、砥粒の脱粒も殆ど生じない。このため高精度の研削盤として適している。 The diamond sintered body used in the above grinding machine has a diamond content of 90% or more, which is very high compared to a normal grindstone, and the amount of deformation of the board surface is small when a grinding machine is used. Since the diamond abrasive grains are bonded and integrated, the abrasive grains are hardly shed. Therefore, it is suitable as a high precision grinding machine.
本発明の研削加工において、チッピング抑制に重要となるのは、研削盤の研削回転軸との垂直度、平坦度及び、面粗さ（Ｒｚ：最大高さ粗さ）であり、切削工具の仕上げ研削を行う加工機上で回転軸との垂直度と平坦度を出す成形加工をダイヤモンド電鋳工具を電極として用いる放電加工により行うことで軸との垂直度を高め、更にダイヤモンド電鋳工具を用いてダイヤモンドスラリを研削液とした湿式研削と乾式研削を併せて行い、所定の面粗さの研削盤として使用することで、研削抵抗一定で工具刃先の仕上げ研削に適用することができ、チッピングの極めて少ない工具の作製が可能である。 In the grinding process of the present invention, what is important for suppressing chipping is the perpendicularity, flatness and surface roughness (Rz: maximum height roughness) to the grinding rotation axis of the grinding machine, and the finishing of the cutting tool. On the processing machine that performs grinding, the verticality and the flatness with the rotating shaft are formed by electric discharge machining using a diamond electroformed tool as an electrode to increase the perpendicularity to the shaft, and the diamond electroformed tool is used. In combination with wet grinding and dry grinding using diamond slurry as a grinding liquid, and using it as a grinding machine with a specified surface roughness, it can be applied to finish grinding of tool edges with constant grinding resistance. Very few tools can be produced.
前記研削盤として使用するダイヤモンド焼結体の回転軸に対する垂直度が１／１０００°以下、平坦度が２０ｎｍ／ｍｍ以下かつ、面粗さ（Ｒｚ：最大高さ粗さ）が３０ｎｍ以下であることが好ましい。このような精度に焼結ダイヤモンド製研削盤を仕上げることで研削盤の面ブレを抑制し、刃先稜線精度５０ｎｍ以下、逃げ面及びすくい面の面粗さが１０ｎｍ以下の高精度工具を作製することが可能となる。 The perpendicularity to the rotation axis of the diamond sintered body used as the grinding machine is 1/1000 ° or less, the flatness is 20 nm / mm or less, and the surface roughness (Rz: maximum height roughness) is 30 nm or less. Is preferred. Finishing a sintered diamond grinder with such accuracy suppresses surface blurring of the grinder and produces a high-precision tool with a cutting edge ridge line accuracy of 50 nm or less and a flank and rake surface roughness of 10 nm or less. Is possible.
逃げ面及びすくい面の面粗さ（Ｒｚ：最大高さ粗さ）が大きいと被削材が刃先に溶着し、寿命が低下することは一般的に知られている。
硬質材料を切削する際には工具逃げ面及びすくい面の面粗さは切削抵抗に緊密に関係する。面粗さが１０ｎｍよりも大きいと切削抵抗が増し、硬質材料の切削面の性状が劣り、精密仕上げとならない。
It is generally known that when the surface roughness (Rz: maximum height roughness) of the flank and rake face is large, the work material is welded to the cutting edge and the life is shortened.
When cutting a hard material, the surface roughness of the tool flank and rake face is closely related to the cutting resistance. If the surface roughness is larger than 10 nm, the cutting resistance increases, the properties of the hard material cutting surface are inferior, and the precision finish is not achieved.
さらに工具刃先として使用される多結晶ダイヤモンドは、グラファイトを超高圧高温下で焼結助剤や触媒の添加無しに直接的にダイヤモンドに変換された多結晶ダイヤモンド焼結体であることが好ましい。前記の多結晶ダイヤモンドは結晶異方性がなく、劈開による欠損が生じない上、多結晶体であるために耐摩耗性が高く、硬質材料の切削に適している。このほか、ダイヤモンド単相の多結晶ダイヤモンドとしてはＣＶＤ法により合成されたダイヤモンドなどがあり、このような多結晶ダイヤモンドも本発明の工具に適用できる。 Furthermore, it is preferable that the polycrystalline diamond used as the tool cutting edge is a polycrystalline diamond sintered body obtained by converting graphite into diamond directly under an ultrahigh pressure and high temperature without adding a sintering aid or a catalyst. The polycrystalline diamond has no crystal anisotropy, is free from defects due to cleavage, and is polycrystalline, so it has high wear resistance and is suitable for cutting hard materials. In addition, diamond single-phase polycrystalline diamond includes diamond synthesized by a CVD method, and such polycrystalline diamond can also be applied to the tool of the present invention.
切削工具は金属製、超硬合金製又は、セラミックス製の台金及びシャンクに接合された多結晶ダイヤモンドからなり、多結晶ダイヤモンドは粉末Ｘ線回折による組成同定では、ダイヤモンド以外の相は確認されないものを使用する。
予め、台金及びシャンクに接合した状態とした多結晶ダイヤモンドを作製する工具の粗形状にレーザ加工により形状を整え、超精密立型マシニングセンタの主軸にセットし、φ２０ｍｍ程度に切断して金属シャンクに接合した研削盤として使用する金属バインダで焼結させたダイヤモンド多結晶体を超精密立型マシニングセンタ内に旋回軸、Ｘ軸、Ｙ軸、θ軸を組み合わせた４軸ステージを設けてセットし、２０００〜３０００ｒｐｍで高速回転させて工具逃げ面及びすくい面に押し当てて研磨する。
The cutting tool is made of polycrystalline diamond bonded to a metal base, cemented carbide or ceramic base metal and shank. Polycrystalline diamond has no composition other than diamond by composition identification by powder X-ray diffraction. Is used.
Prepare the polycrystalline diamond that has been joined to the base metal and the shank in advance by laser processing to adjust the rough shape of the tool, set it on the spindle of the ultra-precision vertical machining center, cut it to about φ20mm, and cut it into a metal shank A diamond polycrystal sintered with a metal binder used as a bonded grinding machine is set in a super-precision vertical machining center with a 4-axis stage that combines the swivel, X, Y, and θ axes. Rotate at a high speed of ˜3000 rpm and press against the tool flank and rake face for polishing.
この研削盤として使用する多結晶ダイヤモンドは、超精密立型マシニングセンタの主軸にダイヤモンド電鋳工具をセットして、研削盤として使用する多結晶ダイヤモンド板と電鋳工具の双方を自転させながら擦り合わせて放電加工を行ない、超精密立型マシニングセンタの主軸に対して平坦度と垂直度を出す加工を行なった後に、ダイヤモンド電鋳工具を用いて、０〜１／２μｍの粒度のダイヤモンドパウダーを切削油に分散させたスラリを塗布して高速回転させて湿式研・乾式研削を併せて行い、所定の面粗さに整えたものを用いる。 The polycrystalline diamond used as this grinding machine is set with a diamond electroformed tool on the spindle of the ultra-precision vertical machining center and rubbed while rotating both the polycrystalline diamond plate used as the grinding machine and the electroformed tool. After performing electrical discharge machining and processing to obtain flatness and perpendicularity to the spindle of the ultra-precision vertical machining center, diamond powder with a particle size of 0 to 1/2 μm is used as cutting oil using a diamond electroforming tool. A dispersed slurry is applied, rotated at a high speed, and subjected to wet grinding and dry grinding, and adjusted to a predetermined surface roughness.
工具刃先として用いる多結晶ダイヤモンドにグラファイトを超高圧高温下で焼結助剤や触媒の添加無しに直接的にダイヤモンドに変換された多結晶ダイヤモンド焼結体を用いると、より効果的であるが、ＣＶＤ法により合成されたダイヤモンド単相の多結晶体なども適用できる。 It is more effective to use a polycrystalline diamond sintered body in which graphite is converted into diamond directly without adding a sintering aid or catalyst under high pressure and high temperature to polycrystalline diamond used as a tool edge. A diamond single-phase polycrystal synthesized by a CVD method can also be applied.
［実施例１］
＜工具形状＞
マイクロボールエンドミルの形状とした。
＜工具材質＞
高純度グラファイトを１５ＧＰａ−２３００℃にて直接変換焼結させた多結晶ダイヤモンドを用いた。この多結晶ダイヤモンドはＣｕ−Ｋα線による粉末Ｘ線回折法によりダイヤモンド単相であることを確認した。
＜工具の刃先形状＞
図１に示す通りの形状とした。
[Example 1]
<Tool shape>
The shape was a microball end mill.
<Tool material>
Polycrystalline diamond obtained by directly converting and sintering high-purity graphite at 15 GPa-2300 ° C. was used. This polycrystalline diamond was confirmed to be a single phase of diamond by powder X-ray diffraction using Cu—Kα rays.
<Tool edge shape>
The shape was as shown in FIG.
＜工具作製方法＞
（粗形状加工−レーザ粗形状加工）
粗形状加工をレーザ加工によって行った。
レーザとしては、波長が１０６１ｎｍ、周波数が８０ＫＨｚ、出力が６Ｗのパルスファイバーレーザを使用した。
図２に示した装置を用いて、Ｙ軸と工具軸とを一致させた後、自転運動している工具に対してレーザ光をＸ−Ｙ平面内で円弧と直線の軌跡に沿って走査させ、多結晶ダイヤモンドに対する刃先の輪郭加工を行った。Ｙ軸方向に切り込みを与えた後、レーザ光を同じ軌跡に沿って往復運動させるといった方式で輪郭加工を繰り返して行い、工具の先端を半径が４０μｍの半球状に成形した。
<Tool preparation method>
(Rough shape processing-Laser rough shape processing)
Coarse shape processing was performed by laser processing.
As the laser, a pulse fiber laser having a wavelength of 1061 nm, a frequency of 80 KHz, and an output of 6 W was used.
After making the Y axis and the tool axis coincide with each other using the apparatus shown in FIG. 2, the laser beam is scanned along the locus of the arc and the straight line in the XY plane with respect to the rotating tool. The edge of the polycrystalline diamond was machined. After cutting in the Y-axis direction, contour processing was repeatedly performed by reciprocating the laser beam along the same locus, and the tip of the tool was formed into a hemisphere with a radius of 40 μm.
半球成形の後、図３に示したようにレーザ光をＸ−Ｙ平面内で直線の軌跡に沿って走査させ、ミーリング加工を行うことによってすくい面や第２逃げ面を成形した。第２逃げ面の成形時には、Ｙ軸の回りに工具を２５度公転させた上で工具を自転させ、３方向から第２逃げ面を成形した。すくい面の成形時には、５μｍ前後の仕上げ代を残して成形した。 After forming the hemisphere, the rake face and the second flank face were formed by scanning the laser beam along a linear locus in the XY plane as shown in FIG. 3 and performing milling. At the time of forming the second flank, the tool revolved around the Y axis by 25 degrees, and then the tool was rotated to form the second flank from three directions. When molding the rake face, it was molded leaving a finishing allowance of around 5 μm.
次に、図４に示すように工具を自転運動させないでレーザビームを走査させて輪郭加工を行うことにより、工具半径を４５μｍに成形すると同時に第１逃げ面を成形した。また、切れ刃と反対側の円弧をＸ−Ｙ平面で４５度傾斜した平面でカットすることにより、工具の回転中心を除去した。 Next, as shown in FIG. 4, the tool radius was formed to 45 μm by simultaneously scanning the laser beam without rotating the tool, thereby forming the first flank. Further, the center of rotation of the tool was removed by cutting an arc on the side opposite to the cutting edge with a plane inclined by 45 degrees on the XY plane.
Ｙ−Ｚ平面内で５度傾斜させたツルーアをＹ軸の回りに公転運動させ、円弧状の切れ刃に対する刃直角逃げ角が５度の第１逃げ面を成形した。
輪郭加工時にはファイバーレーザを１０倍の対物レンズで集光させて２〜５ｍｍ／ｍｉｎの速度で走査させ、ミリング加工時には×２０倍の対物レンズを集光させて２０ｍｍ／ｍｉｎの速度で走査させた。
A truer inclined at 5 degrees in the YZ plane was revolved around the Y axis to form a first flank with a blade perpendicular clearance angle of 5 degrees with respect to the arcuate cutting edge.
At the time of contour processing, the fiber laser was condensed with a 10 × objective lens and scanned at a speed of 2 to 5 mm / min. At the time of milling processing, the × 20 × objective lens was condensed and scanned at a speed of 20 mm / min. .
（研削盤の成形加工）
工具刃先を研削加工するための研削盤には、直径が１５ｍｍで焼結前のダイヤンモンドの一次粒子径が１μｍの焼結ダイヤモンドを使用した。
焼結ダイヤモンド製研削盤を成形する方法を図６に示す。
ツルーアの面ぶれを除去するため、メッシュサイズが＃６００のダイヤモンド電鋳工具を陰極に、ツルーアを陽極にそれぞれ接続して、放電エネルギー５μＪ、１０００ｐＦ、１００Ｖとして機上放電を行った。
そこで、ツルーアの砥石作用面を平坦化するため、陰極に使用したメッシュサイズが＃６００のダイヤモンド電着工具を用いてツルーアに対する湿式研削及び、乾式研削を行なった。湿式研削時には、サイズが０−１／２μｍと０−１／５μｍのダイヤモンドスラリを研削液として使用する。湿式研削を行った後、乾式研削を行った。
このようにして成形した研削盤のマシニングセンタ主軸に対する平坦度、垂直度、及び面粗さ（Ｒｚ）を測定した結果を以下に示す。
平坦度 ： ２０ｎｍ／ｍｍ
垂直度 ： １／１０００°
面粗さ ： ２０ｎｍ
(Grinding machine forming)
As a grinding machine for grinding the tool edge, sintered diamond having a diameter of 15 mm and a primary particle diameter of 1 μm of diamond before sintering was used.
A method for forming a sintered diamond grinder is shown in FIG.
In order to remove the surface blur of the truer, a diamond electroformed tool having a mesh size of # 600 was connected to the cathode, and the truer was connected to the anode, and discharge was performed on-machine at discharge energy of 5 μJ, 1000 pF, 100V.
Therefore, in order to flatten the working surface of the truer's grindstone, wet grinding and dry grinding of the truer were performed using a diamond electrodeposition tool having a mesh size of # 600 used for the cathode. At the time of wet grinding, a diamond slurry having a size of 0-1 / 2 μm and 0-1 / 5 μm is used as a grinding fluid. After wet grinding, dry grinding was performed.
The results of measuring the flatness, perpendicularity, and surface roughness (Rz) of the grinding machine thus formed with respect to the machining center spindle are shown below.
Flatness: 20 nm / mm
Verticality: 1/1000 °
Surface roughness: 20nm
（仕上げ研削）
工具は真鍮製の芯ぶれ防止治具を介してブラシレスモータ、ブラシレスモータはくさび角が５度のスペーサとＸ−Ｙテーブルを介して回転テーブルに取付けた。
Ｙ−Ｚ平面内で５度傾斜したツルーアをＹ軸の回りに公転運動させることにより、円弧状の切れ刃に対する刃直角逃げ角が５度の第１逃げ面を仕上げ成形した。すくい面や第２逃げ面の成形時には、図５に示した装置からくさび状のスペーサを取外し、工具を装着しているマシニングセンタ主軸の自転角と研削盤の公転角を制御することにより、これらの面を研削加工した。
すくい面や第２逃げ面の成形時には、図５に示した装置からくさび状のスペーサを除去し、工具を装着しているマシニングセンタ主軸の自転角θｚと研削盤の公転角θｘを制御することにより、これらの面を研削加工した。
(Finishing grinding)
The tool was attached to the rotary table via a spacer having a wedge angle of 5 degrees and an XY table via a brass coreless jig and a brushless motor.
A truer having a blade perpendicular clearance angle of 5 degrees with respect to the arcuate cutting edge was finish-molded by revolving the truer inclined by 5 degrees in the YZ plane around the Y axis. When forming the rake face or the second flank face, remove the wedge-shaped spacer from the device shown in FIG. 5 and control the rotation angle of the machining center spindle on which the tool is mounted and the revolution angle of the grinding machine. The surface was ground.
When forming the rake face or the second flank face, the wedge-shaped spacer is removed from the apparatus shown in FIG. 5, and the rotation angle θz of the machining center spindle on which the tool is mounted and the revolution angle θx of the grinding machine are controlled. These surfaces were ground.
＜評価＞
（工具精度評価）
このようにして得られた多結晶ダイヤモンド製の工具（マイクロボールエンドミル）の形状精度を高倍率のＳＥＭ観察し、エッジの欠損サイズを確認した。また、すくい面の面粗さをＳＰＭ（走査型プローブ顕微鏡）にて測定した。
（切削性能評価）
作製した工具の性能を硬さが１３．５ＧＰａＨｖの超硬合金に対する断続切削により評価した。被削材の超硬合金は立て型マシニングセンタのテーブルに対して４５度傾斜させて保持し、半径方向切込み量切を０．５μｍ、送り速度を０．５μｍ／ｒｅｖ、ならびに横送り量を１μｍ、実切削距離を１ｍに設定した。
切削後の工具刃先を高倍率ＳＥＭ観察し、刃先欠損状況を確認、加工後の被削材表面状態は、ＳＰＭにより評価した。
評価結果を表１に示す。
<Evaluation>
(Tool accuracy evaluation)
The shape accuracy of the polycrystalline diamond tool (microball end mill) thus obtained was observed with a high-magnification SEM, and the edge defect size was confirmed. Further, the surface roughness of the rake face was measured by SPM (scanning probe microscope).
(Cutting performance evaluation)
The performance of the produced tool was evaluated by intermittent cutting on a cemented carbide having a hardness of 13.5 GPaHv. The cemented carbide material to be cut is held at an angle of 45 degrees with respect to the table of the vertical machining center, the cutting amount in the radial direction is 0.5 μm, the feed rate is 0.5 μm / rev, and the lateral feed amount is 1 μm. The actual cutting distance was set to 1 m.
The cutting edge of the tool after cutting was observed with a high-magnification SEM, the cutting edge defect state was confirmed, and the surface condition of the work material after processing was evaluated by SPM.
The evaluation results are shown in Table 1.
本発明の多結晶ダイヤモンド切削工具は、ダイヤモンド単相の多結晶体からなる刃先稜線の微小チッピングが５０ｎｍ以下と極めて小さく、面粗さ（Ｒｚ：最大高さ粗さ）も１０ｎｍ以下と非常に精密な面を有する為に切削抵抗が低く、耐欠損性が高いため、アルミニウム合金、銅合金、無電解ニッケルメッキ、複合強化樹脂やガラス、カーボン、ＭＭＣ、超硬などの硬質脆性材料や難削材料を精密加工するための精密切削工具として好適に使用することができる。 The polycrystalline diamond cutting tool of the present invention has extremely small chipping of the edge of the cutting edge made of a single-phase polycrystalline diamond of 50 nm or less and a very precise surface roughness (Rz: maximum height roughness) of 10 nm or less. Because it has a smooth surface, it has low cutting resistance and high fracture resistance, so it is a hard brittle material such as aluminum alloy, copper alloy, electroless nickel plating, composite reinforced resin, glass, carbon, MMC, and carbide, and difficult-to-cut materials. Can be suitably used as a precision cutting tool for precision machining.
Claims (7)
ダイヤモンド単相の多結晶ダイヤモンドの切れ刃の外形をレーザ加工により形状作製した後、前記切れ刃を形成するすくい面及び逃げ面の仕上げ加工を金属バインダを含むダイヤモンド焼結体を研削盤として用いる研削加工により行なう工程を含み、
前記ダイヤモンド焼結体からなる研削盤は、前記仕上加工を行う加工機上で回転軸との垂直度と平坦度を出す成形加工をダイヤモンド電鋳工具を電極として用いる放電加工により行った後、更に当該ダイヤモンド電鋳工具を用いて、ダイヤモンドスラリを研削液として用いる湿式研削と乾式研削とを併せて行い面粗さを調節した研削盤である
ことを特徴とする多結晶ダイヤモンド切削工具の加工方法。 A method of manufacturing a cutting tool having a diamond single-phase polycrystalline diamond as a cutting edge,
Grinding using a diamond sintered body containing a metal binder as a grinder for finishing the rake face and flank face forming the cutting edge after laser cutting the outer shape of the cutting edge of polycrystalline diamond of single-phase diamond Including processes to be performed by processing,
The grinding machine made of the diamond sintered body is further subjected to a forming process for obtaining a perpendicularity and a flatness with respect to the rotation axis on the processing machine for performing the finishing process by an electric discharge process using a diamond electroformed tool as an electrode. A processing method for a polycrystalline diamond cutting tool, characterized by using a diamond electroforming tool, which is a grinding machine in which wet grinding using a diamond slurry as a grinding liquid and dry grinding are combined to adjust surface roughness.
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