JP5391329B2 - 配線板の製造方法 - Google Patents
配線板の製造方法 Download PDFInfo
- Publication number
- JP5391329B2 JP5391329B2 JP2012508171A JP2012508171A JP5391329B2 JP 5391329 B2 JP5391329 B2 JP 5391329B2 JP 2012508171 A JP2012508171 A JP 2012508171A JP 2012508171 A JP2012508171 A JP 2012508171A JP 5391329 B2 JP5391329 B2 JP 5391329B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- plating film
- conductor
- insulating layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
絶縁層10の第2面は、粗化されている。そして、その絶縁層10の第2面(粗化面)上には、導体層20が形成される。
図6の例における配線板100は、基板200(コア基板)と、絶縁層101〜104(層間絶縁層)と、ソルダーレジスト105、106と、導体層113〜116と、を有する。基板200は、絶縁層100aと、導体層111、112と、を有する。配線板100の片面又は両面に他の配線板や電子部品等が実装されることで、配線板100は、例えば携帯電話等の回路基板として使用することができる。
10a フィラー
10b 樹脂
11 第1層(樹脂層)
12 第2層(フィラー層)
20 導体層
20a、20b 導体部
21 無電解めっき膜
22 電解めっき膜
23 金属箔
30 上層絶縁層
100 配線板
100a 絶縁層
101〜104 絶縁層
105、106 ソルダーレジスト
111〜116 導体層
200 基板
1001 無電解めっき膜
1001a 金属箔
1002 めっきレジスト
1002a 開口部
1003 電解めっき膜
1004 遮光マスク
1004a 開口部
Claims (5)
- シリカ系フィラーを含み、少なくとも一方の面が粗化された絶縁層を準備することと、
前記粗化された面上に、金属箔を介して又は介さずに、無電解めっき膜を形成することと、
前記無電解めっき膜上に、部分的に電解めっき膜を形成することと、
前記電解めっき膜が形成されなかった領域に露出する前記無電解めっき膜に、前記シリカ系フィラーがストッパとなるレーザ照射を行って、前記露出する無電解めっき膜を除去することと、
を含む配線板の製造方法。 - 前記レーザ照射は、被照射体の全面に行う、
ことを特徴とする請求項1に記載の配線板の製造方法。 - 前記金属箔、前記無電解めっき膜、及び前記電解めっき膜は、銅からなり、
前記レーザ照射では、350〜600nmの範囲にある波長を有するレーザ光を照射する、
ことを特徴とする請求項1又は2に記載の配線板の製造方法。 - 前記レーザ照射では、500〜560nmの範囲にある波長を有するレーザ光を照射する、
ことを特徴とする請求項3に記載の配線板の製造方法。 - 前記金属箔、前記無電解めっき膜、及び前記電解めっき膜は、銅からなり、
前記レーザ照射では、YAGレーザ、YVO4レーザ、アルゴンイオンレーザ、及び銅蒸気レーザのいずれかを光源とする、
ことを特徴とする請求項1乃至4のいずれか一項に記載の配線板の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31953310P | 2010-03-31 | 2010-03-31 | |
US61/319,533 | 2010-03-31 | ||
US12/981,709 | 2010-12-30 | ||
US12/981,709 US8581104B2 (en) | 2010-03-31 | 2010-12-30 | Wiring board and method for manufacturing the same |
PCT/JP2011/055122 WO2011122244A1 (ja) | 2010-03-31 | 2011-03-04 | 配線板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2011122244A1 JPWO2011122244A1 (ja) | 2013-07-08 |
JP5391329B2 true JP5391329B2 (ja) | 2014-01-15 |
Family
ID=44708300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012508171A Expired - Fee Related JP5391329B2 (ja) | 2010-03-31 | 2011-03-04 | 配線板の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8581104B2 (ja) |
JP (1) | JP5391329B2 (ja) |
KR (1) | KR101393892B1 (ja) |
CN (1) | CN102918935A (ja) |
TW (1) | TW201212739A (ja) |
WO (1) | WO2011122244A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101823660B1 (ko) * | 2013-08-09 | 2018-01-30 | 주식회사 엘지화학 | 전자기파의 직접 조사에 의한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
JP2015041729A (ja) * | 2013-08-23 | 2015-03-02 | イビデン株式会社 | プリント配線板 |
US10602622B2 (en) | 2017-10-27 | 2020-03-24 | Kyocera Corporation | Wiring board |
KR20200055424A (ko) * | 2018-11-13 | 2020-05-21 | 삼성전기주식회사 | 인쇄회로기판 |
WO2020188923A1 (ja) * | 2019-03-15 | 2020-09-24 | 京セラ株式会社 | 配線基板およびその製造方法 |
US20230094806A1 (en) * | 2019-10-25 | 2023-03-30 | Panasonic Intellectual Property Management Co., Ltd. | Metal-clad laminate, wiring board, resin-including metal foil, and resin composition |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007165634A (ja) * | 2005-12-14 | 2007-06-28 | Fujitsu Ltd | 配線基板の製造方法 |
JP2009200500A (ja) * | 2009-03-06 | 2009-09-03 | Hitachi Chem Co Ltd | 多層配線板の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0952762B1 (en) * | 1996-12-19 | 2011-10-12 | Ibiden Co, Ltd. | Printed wiring board and method for manufacturing the same |
JPH11214828A (ja) | 1998-01-28 | 1999-08-06 | Ibiden Co Ltd | プリント配線板およびその製造方法 |
EP1915041A1 (en) | 2001-09-28 | 2008-04-23 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
JP2003188496A (ja) | 2001-12-17 | 2003-07-04 | Nec Corp | 配線基板の製造方法 |
JP4300890B2 (ja) | 2003-06-11 | 2009-07-22 | 日立化成工業株式会社 | 多層配線板の製造方法 |
CN101027431B (zh) | 2004-09-24 | 2011-04-13 | 揖斐电株式会社 | 电镀方法及电镀装置 |
JP4955263B2 (ja) | 2004-12-15 | 2012-06-20 | イビデン株式会社 | プリント配線板 |
US8314348B2 (en) | 2008-03-03 | 2012-11-20 | Ibiden Co., Ltd. | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
US8132321B2 (en) * | 2008-08-13 | 2012-03-13 | Unimicron Technology Corp. | Method for making embedded circuit structure |
-
2010
- 2010-12-30 US US12/981,709 patent/US8581104B2/en active Active
-
2011
- 2011-03-04 WO PCT/JP2011/055122 patent/WO2011122244A1/ja active Application Filing
- 2011-03-04 CN CN2011800272087A patent/CN102918935A/zh active Pending
- 2011-03-04 KR KR1020127028319A patent/KR101393892B1/ko not_active IP Right Cessation
- 2011-03-04 JP JP2012508171A patent/JP5391329B2/ja not_active Expired - Fee Related
- 2011-03-30 TW TW100111091A patent/TW201212739A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007165634A (ja) * | 2005-12-14 | 2007-06-28 | Fujitsu Ltd | 配線基板の製造方法 |
JP2009200500A (ja) * | 2009-03-06 | 2009-09-03 | Hitachi Chem Co Ltd | 多層配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2011122244A1 (ja) | 2011-10-06 |
TW201212739A (en) | 2012-03-16 |
JPWO2011122244A1 (ja) | 2013-07-08 |
KR20130018819A (ko) | 2013-02-25 |
CN102918935A (zh) | 2013-02-06 |
US8581104B2 (en) | 2013-11-12 |
US20110240358A1 (en) | 2011-10-06 |
KR101393892B1 (ko) | 2014-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20110300307A1 (en) | Method for manufacturing wiring board | |
JP5391329B2 (ja) | 配線板の製造方法 | |
US8756803B2 (en) | Method for manufacturing printed wiring board | |
TWI345940B (ja) | ||
US9711440B2 (en) | Wiring board and method for manufacturing the same | |
TW201909265A (zh) | 用於印刷電路板的半加成方法 | |
JP5580135B2 (ja) | プリント配線板の製造方法及びプリント配線板 | |
WO2015151935A1 (ja) | キャリア箔付銅箔、銅張積層板及びプリント配線板 | |
EP2644010B1 (en) | Printed circuit board and method for manufacturing the same | |
CN1758829A (zh) | 印刷电路板和其制造方法 | |
TW201838491A (zh) | 印刷電路板之製造方法 | |
JP2017011010A (ja) | 配線基板の製造方法、配線基板及び配線基板製造装置 | |
EP2656702B1 (en) | Printed circuit board and method for manufacturing the same | |
JP4192946B2 (ja) | コンデンサを内蔵した多層配線板用材料、多層配線板用基板および多層配線板とこれらの製造方法 | |
KR20150024692A (ko) | 다층인쇄회로기판의 제조방법 | |
JP4862682B2 (ja) | プリント配線基板及びその製造方法 | |
TW201436682A (zh) | 印刷電路板之製造方法與印刷電路板 | |
US20120211370A1 (en) | Method for manufacturing wiring board | |
WO2020066074A1 (ja) | 多層配線板の製造方法 | |
JP2002134918A (ja) | 多層プリント配線板の製造方法 | |
JP6622444B1 (ja) | 多層配線板の製造方法 | |
US20230069980A1 (en) | Method for manufacturing wiring substrate | |
JP2004356232A (ja) | 多層プリント配線板の製造方法 | |
JP2001177248A (ja) | 配線基板及びその製造方法並びに電子機器 | |
TW202219319A (zh) | 鍍銅積層體及其製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130716 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130828 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130924 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131011 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |