JP5364242B2 - Method for manufacturing semiconductor device - Google Patents

Method for manufacturing semiconductor device Download PDF

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JP5364242B2
JP5364242B2 JP2007113778A JP2007113778A JP5364242B2 JP 5364242 B2 JP5364242 B2 JP 5364242B2 JP 2007113778 A JP2007113778 A JP 2007113778A JP 2007113778 A JP2007113778 A JP 2007113778A JP 5364242 B2 JP5364242 B2 JP 5364242B2
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film
substrate
formed
insulating film
molybdenum
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JP2007318105A (en
JP2007318105A5 (en
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純矢 丸山
安弘 神保
博信 小路
秀明 桑原
舜平 山崎
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株式会社半導体エネルギー研究所
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for peeling an element manufactured at a process in which temperature is relatively low (less than 500&deg;C) off from a substrate and transposing it onto a flexible substrate (typically a plastic film). <P>SOLUTION: A molybdenum film (an Mo film) is formed on a glass substrate, an oxide film is formed on the surface of the molybdenum film, and an element manufactured at a process in which temperature is relatively low (less than 500&deg;C) is formed on the molybdenum film and its surface, using an apparatus for manufacturing an existing large glass substrate. Then, the element is peeled off from the glass substrate and transposed onto a flexible substrate. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a semiconductor device having a circuit formed of a thin film transistor (hereinafter referred to as TFT) and a manufacturing method thereof. For example, the present invention relates to an electronic apparatus in which an electro-optical device typified by a liquid crystal display panel or a light-emitting display device having an organic light-emitting element is mounted as a component.

  Note that in this specification, a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics, and an electro-optical device, a semiconductor circuit, and an electronic device are all semiconductor devices.

  In recent years, a technique for forming a thin film transistor (TFT) using a semiconductor thin film (having a thickness of about several to several hundred nm) formed on a substrate having an insulating surface has attracted attention. Thin film transistors are widely applied to electronic devices such as ICs and electro-optical devices, and development of switching devices for image display devices is urgently required.

  Various applications using such an image display device have been devised, and in particular, the use for portable devices has attracted attention. Many glass substrates and quartz substrates are used, but have the disadvantage of being easily broken and heavy. Further, in mass production, it is difficult to increase the size of a glass substrate or a quartz substrate, which is not suitable. Therefore, attempts have been made to form TFT elements on a flexible substrate, typically a flexible plastic film.

  Therefore, a technique has been proposed in which an element formed on a glass substrate is peeled off from the substrate and transferred to another base material such as a plastic film.

The present applicant has proposed the peeling and transfer techniques described in Patent Document 1 and Patent Document 2. Patent Document 1 describes a technique for removing a silicon oxide film that becomes a peeling layer by wet etching. Patent Document 2 describes a technique for removing a silicon film to be a peeling layer by dry etching and peeling it.

  The present applicant has also proposed a peeling and transfer technique described in Patent Document 3. In Patent Document 3, a metal layer (Ti, Al, Ta, W, Mo, Cu, Cr, Nd, Fe, Ni, Co, Ru, Rh, Pd, Os, Ir) is formed on a substrate. A technique is described in which a metal oxide layer of the metal layer is formed at the interface between the metal layer and the oxide layer when the oxide layer is stacked, and peeling is performed in a later process using the metal oxide layer. Yes.

JP-A-8-288522

JP-A-8-250745

JP2003-174153

  The present invention relates to an element manufactured by a process at a relatively low temperature (less than 500 ° C.), typically a TFT using an amorphous silicon film, a TFT using an organic semiconductor film, a light emitting element or a passive element (sensor). A technique for separating (that is, peeling) an element, an antenna, a resistance element, a capacitor element, and the like from a glass substrate and arranging (that is, transposing) the substrate on a flexible substrate (typically, a plastic film) is disclosed.

A TFT using an amorphous silicon film or a TFT using an organic semiconductor film can be formed directly on a plastic film, but since the plastic film is soft, the manufacturing equipment to be handled must be a dedicated manufacturing equipment. is there. When mass production is performed, the plastic film becomes a manufacturing apparatus supplied in a roll-to-roll system.

  In addition, when a TFT using an amorphous silicon film or a TFT using an organic semiconductor film is directly formed on a plastic film, the plastic film itself is altered by exposure to solvents and etching gases used in the TFT manufacturing process. There is a fear. Further, when a TFT using ZnO is directly formed on a plastic film, the plastic film itself is deformed when the plasma generated by sputtering or the like is irradiated onto the plastic film. In addition, the plastic film may contaminate the device by absorbing or releasing moisture during the TFT manufacturing process. In addition, since the plastic film has lower heat resistance than the glass substrate and has a large expansion and contraction with respect to heat, it is difficult to finely control all the processing temperatures during the manufacturing process.

In the present invention, a molybdenum film (Mo film) is formed on a glass substrate, a molybdenum oxide film is formed on the molybdenum film, the surface of the molybdenum film, or above the molybdenum film, and the molybdenum oxide film is relatively low temperature (less than 500 ° C.). ) Formed by the process (TFT using amorphous silicon film, TFT using organic semiconductor film, light emitting element and passive element (sensor element, antenna, resistor element, capacitor element, etc.)) After that, the element is peeled from the glass substrate and transferred to a flexible substrate. Molybdenum has the disadvantage of being inferior in heat resistance compared to tungsten. For example, when a heat treatment at 500 ° C. or higher is performed on a molybdenum film, peeling occurs. Therefore, the temperature during the manufacturing process is preferably less than 500 ° C. In addition, a molybdenum film formed by sputtering is fragile, and the grain boundary is particularly fragile in a polycrystalline state. In the present invention, peeling is performed using a molybdenum film having such brittle characteristics. By performing separation using a molybdenum film having brittle characteristics, separation can be performed with a high yield even when a relatively large substrate is used.

In addition, when an element (such as a light-emitting element or an organic TFT) containing an organic compound formed on a metal layer provided on a glass substrate is peeled off, the organic compound has weak adhesion, so it is not peeled off in the vicinity of the metal layer. There is a possibility that the element containing the organic compound is peeled off in the layer containing the organic compound or at the interface between the layers, and the element containing the organic compound is destroyed. In addition, since the material layer formed by the printing method has low adhesion, there is a possibility that the material layer may be peeled off in the material layer or at the interface between the layers. However, when the peeling method of the present invention using a molybdenum film is used, the molybdenum film is brittle and can be peeled with a relatively weak force compared to other metals. Further, since heat treatment for peeling and laser light irradiation are not particularly necessary, the process is simplified.

Immediately after the silicon oxide film was formed on the molybdenum film, a tape peeling experiment was carried out in which the tape was attached and peeled, and it was confirmed that the silicon oxide film was peeled off. That is, peeling can be performed without performing heat treatment. In addition, the photograph which shows the result of this tape peeling test is shown to FIG. 4 (A). A schematic diagram of the photograph is shown in FIG. Note that in the sample shown in FIG. 4A, a 100 nm silicon oxynitride film is formed over a glass substrate, a molybdenum film (thickness: 50 nm) is formed thereon, and a silicon oxide film (200 nm) is formed by a sputtering method. A laminate is formed. As shown in FIG. 4B, an area 1002 peeled off with the tape 1003 was confirmed. Note that since the substrate 1001 has a molybdenum film formed on the entire surface and has a mirror surface, the state of the ceiling (such as a hose) at the time of photographing is shown in the photograph in FIG. In addition, it was confirmed that if the temperature was less than 500 ° C., peeling was possible even after heat treatment.

From these experimental results and the characteristics of the molybdenum film, it can be said that the molybdenum film is a material more suitable for peeling and transferring an element containing an organic compound than other metals.

Molybdenum has the advantages of lower vapor pressure and less outgassing than other metal elements. Therefore, it is possible to minimize contamination of elements formed on the molybdenum film.

Note that although a molybdenum film is formed over a glass substrate, the present invention is not limited to the glass substrate, and a quartz substrate, a ceramic substrate, a semiconductor substrate, or the like can also be used.

The present invention can be transferred to a flexible substrate after an element such as a TFT is formed using an existing large glass substrate manufacturing apparatus. Therefore, the equipment cost can be greatly reduced.

The structure of the invention disclosed in this specification is a manufacturing method in which an element such as an amorphous TFT is formed over a flexible substrate. A molybdenum film is formed over the substrate, and a molybdenum oxide film is formed over the molybdenum film. An insulating film is formed on the molybdenum oxide film, a semiconductor film having an amorphous structure is formed on the insulating film, and the insulating film and the semiconductor film having the amorphous structure are separated from the substrate. The insulating film and the semiconductor film having an amorphous structure are transferred over a flexible substrate.

An experiment was conducted as to whether or not a semiconductor film having an amorphous structure can be removed without heat treatment.

A 100 nm silicon oxynitride film is formed on a glass substrate, a molybdenum film (thickness 50 nm) is formed thereon, a silicon oxide film (200 nm) is formed by sputtering, and then 100 nm silicon oxynitride is formed by PCVD. A film was formed, and an amorphous silicon film (54 nm) was stacked thereon. When the tape was partially adhered to and peeled from the experimental substrate 1 formed in this way, it was peeled as shown in FIG. As shown in FIG. 15B, which is a schematic diagram of FIG. 15A, an area 1002 peeled off with the tape could be confirmed. Note that since the substrate 1001 has a molybdenum film formed on the entire surface and has a mirror surface, the state of the ceiling (such as a hose) at the time of photographing is shown in the photograph in FIG. Moreover, when the tape peeling experiment was similarly performed on the experimental substrate 2 subjected to the heat treatment, it was peeled off as shown in FIG. As shown in FIG. 16B, which is a schematic diagram of FIG. 16A, a region 1002 peeled off with the tape was confirmed.

  In the present invention, an amorphous TFT is not formed by sequentially laminating material layers on a flexible substrate, but an element such as an amorphous TFT formed on a glass substrate, a ceramic substrate, or a quartz substrate is peeled off from the substrate to be flexible. Fixed to the conductive substrate. Note that the treatment for fixing the element to the flexible substrate may be performed before or after peeling. Further, the element may be fixed by being sandwiched between two flexible substrates.

Another aspect of the invention is a manufacturing method in which an element such as an organic TFT is formed over a flexible substrate, a molybdenum film is formed over the substrate, a molybdenum oxide film is formed over the molybdenum film, An insulating film is formed over the molybdenum oxide film, a semiconductor film including an organic compound is formed over the insulating film, and the insulating film and the semiconductor film including the organic compound are separated from the substrate to be formed over the flexible substrate The insulating film and the semiconductor film containing the organic compound are transferred.

Another embodiment of the present invention is a manufacturing method in which a light-emitting element such as an organic light-emitting element or an inorganic light-emitting element is formed over a flexible substrate. A molybdenum film is formed over the substrate, and the molybdenum oxide is formed over the molybdenum film. Forming a film; forming an insulating film on the molybdenum oxide film; forming a first electrode on the insulating film; forming a light-emitting layer having an organic compound or an inorganic compound on the first electrode; A second electrode is formed on the layer, and the insulating film, the first electrode, the light emitting layer, and the second electrode are separated from the substrate to form the insulating film, the first electrode, The light emitting layer and the second electrode are transposed.

Another embodiment of the present invention is a manufacturing method in which a passive element such as an antenna is formed over a flexible substrate, a molybdenum film is formed over the substrate, a molybdenum oxide film is formed over the molybdenum film, An antenna is printed on the molybdenum oxide film by a printing method, the antenna is baked, an insulating film covering the antenna is formed, and the insulating film and the antenna are peeled off from the substrate to form a flexible substrate on the insulating film. , Transpose the antenna.

  In the above structure, the antenna is preferably formed in contact with the molybdenum oxide film. Molybdenum oxide exposed at the time of peeling is a semiconductor, so that electrical continuity can be achieved if the terminal portions of other element substrates overlap with part of the antenna. In this case, the molybdenum oxide film is preferably thin and is preferably formed as a natural oxide film.

  In each of the above structures, the substrate is preferably formed in contact with the molybdenum film because the process is simplified. However, when the adhesion between the substrate and the molybdenum film is low, a material film (eg, a silicon oxynitride film or a molybdenum nitride film) serving as a buffer layer may be formed between the substrate and the molybdenum film. In each of the above structures, molybdenum oxide is preferably formed in contact with the surface of the molybdenum film because the process is simplified.

  In each of the above structures, pretreatment for promoting peeling may be performed. For example, it is preferable to partially irradiate laser light before peeling. Specifically, a solid-state laser (pulse-excited Q-switch Nd: YAG laser) is used, the second harmonic (532 nm) or the third harmonic (355 nm) of the fundamental wave is used, and a relatively weak laser beam (laser light source) Irradiation energy may be irradiated from 1 mJ to 2 mJ).

  Further, the present invention can be applied regardless of an element structure, for example, a TFT structure. For example, a top gate type TFT, a bottom gate type (reverse stagger type) TFT, or a forward stagger type TFT can be used. It is. Further, the invention is not limited to a single-gate transistor, and may be a multi-gate transistor having a plurality of channel formation regions, for example, a double-gate transistor.

  In addition, according to the present invention, a large display device using a flexible substrate can be manufactured. The present invention is not limited to a passive matrix liquid crystal display device and a passive matrix light emitting device. An active matrix light-emitting device can also be manufactured.

Note that in this specification, the molybdenum film refers to a film containing molybdenum as a main component, and is not particularly limited as long as the composition ratio of molybdenum in the film is 50% or more. In order to increase the mechanical strength of the film, Co Or Sn may be added. Further, nitrogen may be included in the film in order to reduce the brittleness of the molybdenum film.

  The flexible substrate is a film-like plastic substrate such as polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), nylon, polyetheretherketone (PEEK). ), Polysulfone (PSF), polyetherimide (PEI), polyarylate (PAR), and polybutylene terephthalate (PBT).

  According to the present invention, the peeling process can be performed more smoothly even when a large area substrate having a diagonal exceeding 1 m is used.

  Embodiments of the present invention will be described below.

(Embodiment 1)
Here, an example of manufacturing a liquid crystal display device will be described with reference to FIGS.

First, the molybdenum film 102 is formed over the substrate 101. A glass substrate is used as the substrate 101. Further, as the molybdenum film 102, a molybdenum film of 30 nm to 200 nm obtained by a sputtering method is used. Since the substrate may be fixed in the sputtering method, the film thickness of the molybdenum film near the peripheral edge of the substrate tends to be nonuniform. Therefore, it is preferable to remove the peripheral molybdenum film by dry etching.

Next, the molybdenum oxide film 103 is formed by oxidizing the surface of the molybdenum film 102. The formation method of the molybdenum oxide film 103 may be formed by oxidizing the surface using pure water or ozone water, or may be formed by oxidizing with oxygen plasma. Alternatively, the molybdenum oxide film 103 may be formed by heating in an atmosphere containing oxygen. FIG. 1A shows a cross-sectional process diagram at the stage where the steps up to here are completed.

Next, a first conductive film is formed over the molybdenum oxide film 103, and a mask is formed over the first conductive film. The first conductive film is formed of an element selected from Ta, W, Ti, Al, Cu, Cr, Nd, or the like, or a single layer of an alloy material or a compound material containing the element as a main component, or a stacked layer thereof. To do. Further, as a method for forming the first conductive film, a sputtering method, a vapor deposition method, a CVD method, a coating method, or the like is appropriately used. Next, the first conductive film is etched using a mask to form the gate electrode 104.

Next, a first insulating film 105 functioning as a gate insulating film is formed over the gate electrode 104. As the first insulating film 105, an insulating film such as a silicon oxide film, a silicon nitride film, or a silicon oxynitride film is used. Further, as the first insulating film 105, a film obtained by applying and baking a solution containing polysilazane or a siloxane polymer, a photocurable organic resin film, a thermosetting organic resin film, or the like may be used.

Next, a semiconductor film 106 having an amorphous structure is formed over the first insulating film 105. The semiconductor film 106 having an amorphous structure is formed using an amorphous semiconductor film or a microcrystalline semiconductor film which is manufactured by a vapor deposition method, a sputtering method, or a thermal CVD method using a semiconductor material gas typified by silane or germane. To do. In this embodiment, an example in which an amorphous silicon film is used as a semiconductor film is described. Further, as the semiconductor film, an oxide of ZnO or zinc gallium indium manufactured by a sputtering method or a PLD (Pulse Laser Deposition) method may be used. In that case, the gate insulating film is an oxide containing aluminum or titanium. It is preferable that

Next, an amorphous semiconductor film 107 containing an impurity element imparting n-type conductivity is formed to a thickness of 20 to 80 nm as a semiconductor film containing an impurity element of one conductivity type. The amorphous semiconductor film 107 containing an impurity element imparting n-type is formed over the entire surface by a known method such as a plasma CVD method or a sputtering method. FIG. 1B shows a cross-sectional process diagram at the stage where the steps up to here are completed.

Next, patterning using a known photolithography technique is performed to obtain an island-shaped semiconductor layer and a conductive semiconductor layer. Note that a mask may be formed by using a droplet discharge method or a printing method (such as a relief plate, a planographic plate, an intaglio plate, or a screen) instead of the known photolithography technique, and etching may be performed selectively.

  Next, a composition containing a conductive material (Ag (silver), Au (gold), Cu (copper), W (tungsten), Al (aluminum), etc.)) is selectively discharged by a droplet discharge method, and the source An electrode 112 and a drain electrode 113 are formed. Note that instead of the droplet discharge method, a metal film (Ta, W, Ti, Al, Cu, Cr, Nd, or the like) is formed by sputtering, and patterning using a known photolithography technique is performed to form the source electrode 112, The drain electrode 113 may be formed.

Next, conductive semiconductor layers 110 and 111 are formed using the source electrode 112 and the drain electrode 113 as masks. Further, using the source electrode 112 and the drain electrode 113 as a mask, the upper part of the semiconductor layer is etched to expose a part of the semiconductor layer, and further, a part of the upper part is removed to form the semiconductor layer 109. The exposed portion of the semiconductor layer 109 is a portion that functions as a channel formation region of the TFT.

  Next, a protective film 114 for preventing the channel formation region of the semiconductor layer 109 from impurity contamination is formed. As the protective film 114, silicon nitride obtained by a sputtering method or a PCVD method, or a material mainly containing silicon nitride oxide is used. In this embodiment mode, hydrogenation is performed after the protective film is formed. In this way, the TFT 108 is manufactured.

  Next, an interlayer insulating film 115 is formed over the protective film 114. The interlayer insulating film 115 is made of a resin material such as an epoxy resin, an acrylic resin, a phenol resin, a novolac resin, a melamine resin, or a urethane resin. Also, it is possible to use organic materials such as benzocyclobutene, parylene, permeable polyimide, compound materials made by polymerization of siloxane polymers, composition materials containing water-soluble homopolymers and water-soluble copolymers, etc. it can. Further, as the interlayer insulating film 115, an insulating film such as a silicon oxide film, a silicon nitride film, or a silicon oxynitride film can be used, and these insulating films and a resin material may be stacked.

Next, patterning using a known photolithography technique is performed to selectively remove the protective film 114 and the interlayer insulating film 115 to form a contact hole reaching the drain electrode 113.

Next, a composition containing a conductive material (Ag (silver), Au (gold), Cu (copper), W (tungsten), Al (aluminum), etc.) is selectively discharged by a droplet discharge method, and then drained. A first electrode 116 that is electrically connected to the electrode 113 is formed. In addition, the second electrode 117 that forms an electric field in a direction parallel to the first electrode 116 and the substrate surface is also formed by a droplet discharge method. Note that the first electrode 116 and the second electrode 117 are preferably arranged at equal intervals, and the shape of the upper surface of the electrode may be a comb shape.

Next, an alignment film 118 that covers the first electrode 116 and the second electrode 117 is formed. FIG. 1C shows a cross-sectional process diagram at the stage where the steps up to here are completed.

Next, the flexible substrate 121 is fixed so as to face the substrate 101 using a liquid crystal material, here, a polymer dispersed liquid crystal. Polymer dispersed liquid crystals can be roughly classified into two types depending on the dispersion state of the liquid crystal and the polymer material. One is a type in which liquid crystal droplets are dispersed in a polymer material and the liquid crystal is discontinuous (called PDLC). The other is a polymer material that forms a network in the liquid crystal, and the liquid crystal is continuous. Type (called PNLC). In this embodiment, any type may be used, but PDLC is used here. In this embodiment mode, the polymer material 119 including the liquid crystal 120 fixes the flexible substrate 121. If necessary, a sealing material may be disposed so as to surround the polymer material 119. Further, if necessary, a gap material (bead spacer, column spacer, fiber, etc.) for controlling the thickness of the polymer material 119 may be used.

Next, the TFT 108 and the flexible substrate 121 are peeled from the molybdenum film 102 and the substrate 101. Since the molybdenum film is brittle, it can be peeled off with a relatively weak force compared to other metals. Although FIG. 1D illustrates a diagram in which separation is performed at the interface between the molybdenum oxide film 103 and the molybdenum film 102, the separation is not particularly limited as long as the separation is between the gate electrode 104 and the substrate 101 where the TFT is not destroyed. Alternatively, separation may be performed within the molybdenum film or the molybdenum oxide film, or may be performed at the interface between the substrate and the molybdenum film or at the interface between the gate electrode and the molybdenum oxide. However, in the case of manufacturing a transmissive liquid crystal display device, when the molybdenum film remains after separation at the interface between the substrate and the molybdenum film, the molybdenum film is preferably removed later.

Next, as shown in FIG. 1E, in order to increase the mechanical strength of the liquid crystal display device, the flexible substrate 123 is fixed to the peeled surface using the adhesive layer 122. Note that it is preferable to use a material having the same thermal expansion coefficient for the flexible substrate 121 and the flexible substrate 123 in order to maintain the substrate interval regardless of the temperature change. In addition, if the mechanical strength of the liquid crystal display device is sufficient, the flexible substrate 123 is not necessarily used.

  Through the above process, an active matrix liquid crystal display device using an amorphous silicon TFT can be manufactured. The conductive layer formed by the droplet discharge method has weak adhesion, but when the peeling method of the present invention using a molybdenum film is used, the conductive layer formed by the droplet discharge method is used for some wirings. Alternatively, separation can be performed in the vicinity of the molybdenum film (in this embodiment, the interface between the molybdenum oxide film 103 and the molybdenum film 102).

  In this embodiment, an example in which the gate electrode 104 is formed in contact with the molybdenum oxide film is shown. In the case where a terminal electrode of the same material is formed on the same layer as the gate electrode on the periphery of the pixel portion, it can be connected to an external terminal such as an FPC through a molybdenum oxide film that also functions as a semiconductor material. In this case, electrical connection can be achieved by disposing the FPC so as to overlap the terminal electrode after peeling. In this case, not only the gate electrode but also a terminal electrode of the same material is separately provided on the same layer as the gate electrode, and connected to the source wiring, the common wiring, and the capacitor wiring for external connection. Further, the driving IC may be connected to the terminal electrode through a molybdenum oxide film. In this manner, after the connection with the outside, sealing with another flexible substrate 123 may be performed. By sealing with the flexible substrate 123, the FPC or IC can be more firmly fixed.

Further, instead of the polymer dispersed liquid crystal, an electrophoretic display may be manufactured using electronic ink. In that case, after the first electrode 116 and the second electrode 117 are formed, electronic ink is applied by a printing method and then fired and fixed by the flexible substrate 121. Then, the substrate may be peeled off and sealed with another flexible substrate.

(Embodiment 2)
Here, an example of manufacturing an active matrix light-emitting device using an organic TFT will be described with reference to FIGS.

First, the molybdenum film 202 is formed over the substrate 201. A glass substrate is used as the substrate 201. As the molybdenum film 202, a molybdenum film of 30 nm to 200 nm obtained by a sputtering method is used.

Next, the surface of the molybdenum film 202 is oxidized to form a molybdenum oxide film 203. The formation method of the molybdenum oxide film 203 may be formed by oxidizing the surface with pure water or ozone water, or by oxidizing with oxygen plasma. Alternatively, the molybdenum oxide film 203 may be formed by heating in an atmosphere containing oxygen. Further, it may be formed in a later step of forming the insulating film. When a silicon oxide film or a silicon oxynitride film is formed as the insulating film by a plasma CVD method, the surface of the molybdenum film 202 is oxidized to form a molybdenum oxide film 203.

Next, an insulating film 204 is formed over the molybdenum oxide film 203. As the insulating film 204, an insulating film such as a silicon oxide film, a silicon nitride film, or a silicon oxynitride film (SiO x N y ) is used. As a typical example, the insulating film 204 has a two-layer structure, and a silicon nitride oxide film formed by a PCVD method using SiH 4 , NH 3 , and N 2 O as a reaction gas is 50 to 100 nm, SiH 4 , and N A structure in which a silicon oxynitride film formed using 2 O as a reaction gas is stacked to a thickness of 100 to 150 nm is employed. In addition, a silicon nitride film (SiN film) or a silicon nitride oxide film (SiN x O y film (X> Y)) with a thickness of 10 nm or less is preferably used as one layer of the insulating film 204. Alternatively, a three-layer structure in which a silicon nitride oxide film, a silicon oxynitride film, and a silicon nitride film are sequentially stacked may be used. Although an example in which the insulating film 204 is formed as the base insulating film is shown here, it is not necessary to provide it unless particularly necessary. FIG. 2A shows a cross-sectional process diagram at the stage where the steps up to here are completed.

Next, a conductive layer to be a gate electrode is formed over the insulating film 204. The material used for the conductive layer may be any metal that has an insulating property by nitriding and / or oxidizing, and tantalum, niobium, aluminum, copper, and titanium are particularly preferable. Other examples include tungsten, chromium, nickel, cobalt, and magnesium. There is no particular limitation on the method for forming the conductive layer, and the conductive layer may be formed into a desired shape by a method such as etching after being formed by a sputtering method or a vapor deposition method. Alternatively, a droplet including a conductive material may be used by an inkjet method or the like.

Next, the conductive layer is nitrided and / or oxidized to form the gate insulating film 212 made of the above metal nitride, oxide or oxynitride. Note that the conductive layer other than the insulated gate insulating film 212 functions as the gate electrode 211.

Next, a semiconductor layer 213 that covers the gate insulating film 212 is formed. The organic semiconductor material forming the semiconductor layer 213 can be either a low molecular weight polymer or a high molecular weight material as long as it has carrier transport properties and can modulate the carrier density due to the electric field effect. Non-limiting examples include polycyclic aromatic compounds, conjugated double bond compounds, metal phthalocyanine complexes, charge transfer complexes, condensed ring tetracarboxylic acid diimides, oligothiophenes, fullerenes, carbon nanotubes, and the like. . For example, polypyrrole, polythiophene, poly (3 alkylthiophene), polyphenylene vinylene, poly (p-phenylene vinylene), polyaniline, polydiacetylene, polyazulene, polypyrene, polycarbazole, polyselenophene, polyfuran, poly (p-phenylene), polyindole , Polypyridazine, naphthacene, hexacene, heptacene, pyrene, chrysene, perylene, coronene, terylene, ovalen, quaterylene, circumanthracene, triphenodioxazine, triphenodithiazine, hexacene-6, 15-quinone, polyvinylcarbazole, polyphenylene sulfide, Polyvinylene sulfide, polyvinyl pyridine, naphthalene tetracarboxylic acid diimide, anthracene tetracarboxylic acid diimide, C60, 70, C76, C78, C84 and can be used derivatives thereof. Specific examples thereof include tetracene, pentacene, sexithiophene (6T), copper phthalocyanine, bis- (1,2,5-thiadiazolo) -p-quinobis (1, 3, -Dithiol), rubrene, poly (2,5-thienylene vinylene) (PTV), poly (3-hexylthiophene-2,5-diyl) (P3HT), poly (9,9'-dioctyl-fluorene-co- Bithiophene) (F8T2), 7,7,8,8, -tetracyanoquinodimethane (TCNQ), 3,4,9,10-perylenetetracarboxylic dianhydride (PTCDA), which is generally regarded as an N-type semiconductor ), 1,4,5,8, -naphthalenetetracarboxylic dianhydride (NTCDA), N, N′-dioctyl-3,4,9,10-perylenetetracarboxylic acid diacid Bromide (PTCDI-C8H), copper hexadecafluorophthalocyanine (F 16 CuPc), N, N'-2,2,3,3,4,4,5,5,6,6,7,7,8,8 , 8-Pentadecafluorooctyl-1,4,5,8-naphthalenetetracarboxylic acid diimide (NTCDI-C8F), 3 ', 4'-dibutyl-5,5''-bis (dicyanomethylene) -5,5 '' -Dihydro-2,2 ′: 5 ′, 2 ″ -terthiophene) (DCMT), methanofullerene [6,6] -phenyl C 61 butyric acid methyl ester (PCBM) and the like. Note that P-type and N-type characteristics in organic semiconductors are not unique to the substance, and depending on the relationship with the electrode for injecting carriers and the strength of the electric field at the time of injection, they tend to be either. It can be used as a P-type semiconductor or an N-type semiconductor. In the present embodiment, a P-type semiconductor is more preferable.

  These organic semiconductor materials can be formed by a method such as an evaporation method, a spin coating method, or a droplet discharge method.

Next, a buffer layer 214 is formed on the semiconductor layer 213 in order to improve adhesion and chemical stability of the interface. As the buffer layer 214, an organic material having conductivity (an organic compound having an electron accepting property, such as 7,7,8,8-tetracyanoquinodimethane (TCNQ), 2,3,5,6-tetrafluoro-7) is used. , 7,8,8-tetracyanoquinodimethane (F 4 -TCNQ) or the like, or a composite material of an organic compound and a metal oxide may be used. Note that the buffer layer 214 is not necessarily required.

Next, a conductive layer 215 functioning as a source electrode or a drain electrode is formed over the buffer layer 214. The material used for the conductive layer 215 is not particularly limited, but may be a metal such as gold, platinum, aluminum, tungsten, titanium, copper, tantalum, niobium, chromium, nickel, cobalt, magnesium, and an alloy containing them. Can be used. Examples of other materials used for the conductive layer 215 include conductive polymer compounds such as polyaniline, polypyrrole, polythiophene, polyacetylene, and polydiacetylene. Note that there is no particular limitation on the method for forming the conductive layer 215 as long as the semiconductor layer 213 is not decomposed, and the conductive layer 215 is processed into a desired shape by a method such as etching after film formation by a sputtering method or an evaporation method. What is necessary is just to produce. Alternatively, the conductive layer 215 may be formed by an inkjet method or the like using droplets containing a conductive material. Through the above steps, the organic transistor 227 can be manufactured.

  Alternatively, an organic insulating material such as polyimide, polyamic acid, or polyvinyl phenyl may be formed in contact with the lower surface of the semiconductor layer 213. With such a structure, the orientation of the organic semiconductor material can be further increased, and the adhesion between the gate insulating film 212 and the semiconductor layer 213 can be further improved.

  Next, a method for manufacturing a light-emitting device using the organic transistor 227 will be described.

Next, an interlayer insulating film 228 that covers the organic transistor 227 is formed. Next, the interlayer insulating film 228 is selectively etched to form a contact hole reaching one conductive layer 215. Next, a first electrode 210 that is electrically connected to one conductive layer 215 is formed. Next, a partition wall 221 that covers an end portion of the first electrode 210 is formed. The partition wall 221 is formed using an insulating material and has a function of insulating between a plurality of adjacent first electrodes 210.

Next, the light-emitting layer 222 is formed over a region of the first electrode 210 that is not in contact with the partition wall 221. In many cases, the light-emitting layer 222 is a single layer or a stack of organic compounds or a single layer or a stack of inorganic compounds. In this specification, an inorganic compound is used for part of a film formed of an organic compound. The configuration is also included. The lamination method is not limited for each layer in the light emitting element. As long as lamination is possible, any method such as a vacuum deposition method, a spin coating method, an ink jet method, or a dip coating method may be selected.

Next, a second electrode 223 is formed over the light-emitting layer 222. A light-emitting element is formed at a place where the first electrode 210, the second electrode 223, and the light-emitting layer 222 overlap. Note that this light-emitting element has a layer containing an organic compound or a layer containing an inorganic compound (hereinafter referred to as an EL layer) from which luminescence (Electro Luminescence) generated by applying an electric field is obtained, an anode, and a cathode. doing. In particular, inorganic EL using an inorganic thin film of ZnS: Mn and organic EL using an organic vapor-deposited thin film are bright and exhibit high-efficiency EL light emission and are suitable for display applications. Note that there is no particular limitation on the structure of the light-emitting element.

Next, a protective film 224 is formed over the second electrode 223. Note that the protective film 224 is not necessarily provided if not necessary.

Next, the flexible substrate 225 is fixed on the protective film 224 with an adhesive layer 226. In order to strengthen the sealing, a sealing material may be disposed so as to surround the adhesive layer 226. FIG. 2B shows a cross-sectional process diagram at the stage where the steps up to here are completed.

Next, the organic transistor 227 and the flexible substrate 225 are separated from the molybdenum film 202, the molybdenum oxide film 203, and the substrate 201. FIG. 2C illustrates a separation at the interface between the molybdenum oxide film 203 and the insulating film 204.

Next, as shown in FIG. 2D, in order to increase the mechanical strength of the light-emitting device, the flexible substrate 206 is fixed to the peeled surface using the adhesive layer 205. In addition, if the mechanical strength of the light-emitting device is sufficient, the flexible substrate 206 is not necessarily used.

  Through the above steps, an active matrix light-emitting device using an organic transistor can be manufactured. For example, a light emitting layer formed by a vapor deposition method has low adhesion, but when the peeling method of the present invention using a molybdenum film is used, even if a light emitting layer formed by a vapor deposition method is used, In the embodiment mode, separation can be performed at an interface between the molybdenum oxide film 203 and the insulating film 204.

  The structure of the organic transistor illustrated in FIG. 2C is not limited, and the structure illustrated in FIG. 3A or 3B may be employed.

FIG. 3A shows a structure called a bottom contact type structure. Note that the same reference numerals are used for portions common to FIG. When the bottom contact type structure is used, a process such as photolithography can be easily used in order to finely process the source wiring and the drain wiring. Therefore, the structure of the organic transistor may be appropriately selected according to its advantages and disadvantages.

Over the substrate 201, a molybdenum film 202, a molybdenum oxide film 203, and an insulating film 204 are stacked. A gate electrode 331 is formed in the insulating film 204. The material used for the gate electrode 331 is not particularly limited. For example, a metal such as gold, platinum, aluminum, tungsten, titanium, copper, molybdenum, tantalum, niobium, chromium, nickel, cobalt, magnesium, and an alloy containing them, polyaniline , Conductive polymer compounds such as polypyrrole, polythiophene, polyacetylene, polydiacetylene, polysilicon doped with impurities, and the like. There is no particular limitation on the method for forming the gate electrode 331, and the gate electrode 331 may be formed by a method such as etching after forming a film by a sputtering method, an evaporation method, or the like. Alternatively, a droplet including a conductive material may be used by an inkjet method or the like.

  Next, an insulating film 332 that covers the gate electrode 331 is formed. The insulating film 332 is formed using an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. Note that these insulating films 332 can be formed by a coating method such as a dipping method, a spin coating method, or a droplet discharge method, a CVD method, a sputtering method, or the like. The insulating film 332 may be nitrided and / or oxidized using high-density plasma. It is also possible to obtain a silicon nitride film containing a higher concentration of nitrogen by performing high density plasma nitridation. The high density plasma is generated by using a high frequency microwave, for example 2.45 GHz. Using such high-density plasma, oxygen (or a gas containing oxygen), nitrogen (or a gas containing nitrogen), and the like are activated by plasma excitation, and these are reacted with the insulating film. Since high-density plasma characterized by low electron temperature has low kinetic energy of active species, it is possible to form a film with less plasma damage and fewer defects than conventional plasma treatment. In addition, when high-density plasma is used, the surface roughness of the insulating film 332 can be reduced, so that carrier mobility can be increased. Further, the orientation of the organic semiconductor material constituting the semiconductor layer formed over the insulating film 332 functioning as the gate insulating film is easily aligned.

  Next, the source electrode 314 and the drain electrode 315 are formed over the insulating film 332. Next, a semiconductor layer 313 is formed between the source electrode 314 and the drain electrode 315. The semiconductor layer 313 can be formed using the same material as the semiconductor layer 213 illustrated in FIG. After the organic transistor having such a structure is formed, it is peeled off and transferred to a flexible substrate.

The structure of FIG. 3B will be described. FIG. 3B illustrates a structure called a top gate structure. Note that the same reference numerals are used for portions common to FIG.

Over the substrate 201, a molybdenum film 202, a molybdenum oxide film 203, and an insulating film 204 are stacked. A source electrode 414 and a drain electrode 415 are formed over the insulating film 204. Next, a semiconductor layer 413 is formed between the source electrode 414 and the drain electrode 415. Next, an insulating film 442 covering the semiconductor layer 413, the source electrode 414, and the drain electrode 415 is formed. Next, a gate electrode 441 is formed over the insulating film 442. The gate electrode 441 overlaps with the semiconductor layer 413 with the insulating film 442 interposed therebetween. After the organic transistor having such a structure is formed, it is peeled off and transferred to a flexible substrate.

  As described above, even various organic transistor structures can be peeled and transferred to a flexible substrate according to the present invention. For example, a semiconductor layer formed by a coating method has low adhesion, but when the peeling method of the present invention using a molybdenum film is used, even if a semiconductor layer formed by a coating method is used, In the embodiment mode, separation can be performed at an interface between the molybdenum oxide film 203 and the insulating film 204.

Further, instead of the organic transistor, a transistor in which an oxide of ZnO or zinc gallium indium manufactured by a sputtering method or a PLD method is used for a semiconductor layer can also be used. In that case, the structure of FIG. 3A or FIG. 3B can be applied. In the case where an oxide of ZnO or zinc gallium indium is used for the semiconductor layer, the gate insulating film is preferably an oxide containing aluminum or titanium. Thus, the present invention is also useful in forming a transistor having a process in which plasma is irradiated onto a substrate. After forming a transistor on a substrate that can withstand plasma, peeling is performed, and the transistor is transferred to a flexible substrate. can do.

  Further, this embodiment mode can be freely combined with Embodiment Mode 1. For example, a liquid crystal display device can be manufactured using the organic transistor described in Embodiment 2 instead of the amorphous TFT described in Embodiment 1. In addition, a light-emitting device can be manufactured using the amorphous TFT described in Embodiment 1 instead of the organic transistor described in Embodiment 2.

(Embodiment 3)
Here, an example of manufacturing a passive matrix light-emitting device over a flexible substrate will be described with reference to FIGS. 5, 6, 7, 8, and 9.

A passive type (simple matrix type) light emitting device is provided such that a plurality of anodes arranged in stripes (bands) and a plurality of cathodes arranged in stripes are orthogonal to each other at the intersections. The light emitting layer or the fluorescent layer is sandwiched. Therefore, the pixel corresponding to the intersection between the selected anode (to which voltage is applied) and the selected cathode is turned on.

  5A is a diagram illustrating a top view of the pixel portion before sealing, and a cross-sectional view taken along the chain line AA ′ in FIG. 5A is FIG. FIG. 5C is a cross-sectional view taken along −B ′.

  A molybdenum film 502, a molybdenum oxide film 503, and an insulating film 504 are stacked over the first substrate 501 as in Embodiment Mode 2. On the insulating film 504, a plurality of first electrodes 513 are arranged in stripes at regular intervals. A partition 514 having an opening corresponding to each pixel is provided over the first electrode 513, and the partition 514 having an opening is formed using an insulating material (photosensitive or non-photosensitive organic material (polyimide, acrylic, Polyamide, polyimideamide, or benzocyclobutene), or SOG film (for example, SiOx film containing an alkyl group)). Note that an opening corresponding to each pixel is a light emitting region 521.

A plurality of reverse-tapered partition walls 522 that are parallel to each other and intersect with the first electrode 513 are provided over the partition wall 514 having an opening. The inversely tapered partition 522 is formed by using a positive photosensitive resin in which an unexposed portion remains as a pattern according to a photolithography method, and adjusting the exposure amount or the development time so that the lower portion of the pattern is etched more. .

  FIG. 6 is a perspective view immediately after forming a plurality of parallel reverse-tapered partition walls 522. In addition, the same code | symbol is used for the same part as FIG.

  The height of the inversely tapered partition 522 is set larger than the thickness of the stacked film including the light emitting layer and the conductive film. When a laminated film including a light emitting layer and a conductive film are stacked on the first substrate having the structure shown in FIG. 6, the light emitting layer is separated into a plurality of electrically independent regions as shown in FIG. A laminated film 515R, 515G, 515B including the second electrode 516 is formed. The second electrode 516 is a stripe-shaped electrode extending in a direction intersecting with the first electrode 513 and parallel to each other. Note that a stacked film and a conductive film including a light-emitting layer are also formed over the reverse-tapered partition wall 522, but the stacked films 515 R, 515 G, and 515 B including the light-emitting layer and the second electrode 516 are separated.

  Here, an example is shown in which a stacked film 515R, 515G, and 515B including a light emitting layer is selectively formed to form a light emitting device capable of full color display capable of obtaining three types (R, G, and B) of light emission. The stacked films 515R, 515G, and 515B including the light emitting layer are formed in stripe patterns parallel to each other.

  Alternatively, a stacked film including a light emitting layer that emits the same light emission color may be formed on the entire surface, and a monochromatic light emitting element may be provided. A light emitting device capable of monochrome display or a light emitting device capable of area color display may be used. Alternatively, a light-emitting device that can emit white light may be a light-emitting device capable of full-color display by being combined with a color filter.

  Next, FIG. 7 shows a top view of a light emitting module on which an FPC or the like is mounted.

Note that a light-emitting device in this specification refers to an image display device, a light-emitting device, or a light source (including a lighting device). In addition, a module in which a connector such as an FPC (Flexible Printed Circuit) or TAB (Tape Automated Bonding) tape or TCP (Tape Carrier Package) is attached to the light emitting device, or a printed wiring board provided on the end of the TAB tape or TCP Alternatively, all modules in which an IC (integrated circuit) is directly mounted on the light emitting device by a COG (Chip On Glass) method are included in the light emitting device.

As shown in FIG. 7, the pixel portions constituting the image display intersect so that the scanning line group and the data line group are orthogonal to each other.

  The first electrode 513 in FIG. 5 corresponds to the scanning line 603 in FIG. 7, the second electrode 516 corresponds to the data line 602, and the inversely tapered partition 522 corresponds to the partition 604. A light emitting layer is sandwiched between the data line 602 and the scanning line 603, and an intersection indicated by a region 605 corresponds to one pixel.

  Note that the scanning line 603 is electrically connected to the connection wiring 608 at a wiring end, and the connection wiring 608 is connected to the FPC 609 b through the input terminal 607. The data line is connected to the FPC 609a through the input terminal 606.

  Next, the first flexible substrate is fixed using the first adhesive layer.

  Next, the light-emitting element is peeled from the first substrate 601. Next, in order to more firmly seal the light emitting device, the second flexible substrate is fixed to the peeled surface using a second adhesive layer.

  Further, if necessary, an optical film such as a polarizing plate or a circular polarizing plate (including an elliptical polarizing plate), a retardation plate (λ / 4 plate, λ / 2 plate), a color filter, etc. is appropriately provided on the exit surface. Also good. Further, an antireflection film may be provided on the polarizing plate or the circularly polarizing plate. For example, anti-glare treatment can be performed that diffuses reflected light due to surface irregularities and reduces reflection.

  Through the above process, a flexible passive matrix light-emitting device can be manufactured. When the FPC is mounted, it is preferably performed on a hard substrate because thermocompression bonding is performed. According to the present invention, the FPC can be peeled off after being mounted and transferred to a flexible substrate.

7 illustrates an example in which the driver circuit is not provided over the substrate, an example of a method for manufacturing a light-emitting module in which an IC chip having a driver circuit is mounted is described below with reference to FIGS.

  First, a molybdenum film, a molybdenum oxide film, and an insulating film are stacked over the first substrate 701 as in Embodiment 2. On this insulating film, a data line 702 (also functioning as an anode) having a laminated structure in which the lower layer is a reflective metal film and the upper layer is a transparent oxide conductive film is formed. At the same time, connection wirings 708, 709a, 709b and input terminals are also formed.

  Next, a partition wall having an opening corresponding to each pixel 705 is provided. Next, a plurality of reverse-tapered partition walls 704 that are parallel to each other and intersect the data lines 702 are provided over the partition walls having openings. FIG. 8A shows a top view at the stage where the steps described above are completed.

  Next, when a stacked film including a light-emitting layer and a transparent conductive film are stacked, the stacked layers including the light-emitting layer and the transparent conductive layer are separated into a plurality of electrically independent regions as illustrated in FIG. A scanning line 703 made of a film is formed. The scanning line 703 made of a transparent conductive film is a stripe-shaped electrode extending in a direction intersecting with the data line 702 and parallel to each other.

  Next, the data line side IC 706 and the scanning line side IC 707 in which drive circuits for transmitting signals to the pixel portion are formed are mounted in the peripheral (outside) region of the pixel portion by a COG method. You may mount using TCP and a wire bonding system as mounting techniques other than a COG system. TCP is an IC mounted on a TAB tape, and the IC is mounted by connecting the TAB tape to a wiring on an element formation substrate. The data line side IC 706 and the scanning line side IC 707 may be those using a silicon substrate, or may be a glass substrate, a quartz substrate, or a plastic substrate in which a driving circuit is formed by a TFT. In addition, although an example in which one IC is provided on one side is shown, it may be divided into a plurality of parts on one side.

  Note that the scanning line 703 is electrically connected to the connection wiring 708 at a wiring end, and the connection wiring 708 is connected to the scanning line side IC 707. This is because it is difficult to provide the scanning line side IC 707 on the reverse tapered partition 704.

  The data line side IC 706 provided in the above configuration is connected to the FPC 711 through the connection wiring 709a and the input terminal 710. Further, the scanning line side IC 707 is connected to the FPC through the connection wiring 709b and the input terminal.

  Further, an IC chip 712 (a memory chip, a CPU chip, a power circuit chip, etc.) is mounted for integration.

  Next, the first flexible substrate is fixed using the first adhesive layer so as to cover the pixel portion.

  Next, the light-emitting element is peeled from the first substrate 701. Next, in order to more firmly seal the light emitting device, the second flexible substrate is fixed to the peeled surface using a second adhesive layer.

FIG. 9 shows an example of a cross-sectional structure taken along a chain line CD in FIG. 8B after fixing the second flexible substrate.

A base insulating film 811 is provided over the second flexible substrate 810 with a second adhesive layer 819. The lower layer 812 is a reflective metal film, and the upper layer 813 is a transparent oxide conductive film. The upper layer 813 is preferably formed using a conductive film having a high work function. In addition to indium tin oxide (ITO), for example, indium tin oxide containing Si element (ITSO) or indium oxide mixed with zinc oxide (ZnO). A film containing a transparent conductive material such as IZO (Indium Zinc Oxide) or a combination of these can be used. For the lower layer 812, Ag, Al, or an Al alloy film is used.

  A partition wall 814 for insulating adjacent data lines is made of resin, and a region surrounded by the partition wall has the same area corresponding to the light emitting region.

The scanning line 816 (cathode) is formed so as to intersect the data line (anode). As the scanning line 816 (cathode), a transparent conductive film such as ITO, indium tin oxide containing Si element (ITSO), or IZO in which indium oxide is mixed with zinc oxide (ZnO) is used. In this embodiment mode, it is important that the scanning line 816 be transparent because light emission is an example of a top emission type light-emitting device that passes through the first flexible substrate 820.

In addition, the pixel portion in which a plurality of light-emitting elements located at the intersections of the scanning lines and the data lines is sandwiched with the stacked film 815 having a light-emitting layer interposed therebetween is sealed with the first flexible substrate 820, and the first adhesive layer 817 is filled. As the first adhesive layer 817, an ultraviolet curable resin, a thermosetting resin, a silicone resin, an epoxy resin, an acrylic resin, a polyimide resin, a phenol resin, PVC (polyvinyl chloride), PVB (polyvinyl butyral), or EVA (ethylene vinyl acetate). ) Can be used.

  On the other hand, a terminal electrode is formed on an end portion of the second flexible substrate 810, and an FPC 832 (flexible printed wiring board) connected to an external circuit is bonded to this end portion. The terminal electrode includes a stacked layer of a reflective metal film 830, a transparent oxide conductive film 829, and an oxide conductive film extending from the second electrode, but is not particularly limited.

As a method for mounting the FPC 832, a connection method using an anisotropic conductive material or a metal bump or a wire bonding method can be adopted. In FIG. 9, an anisotropic conductive adhesive 831 is used for connection.

  Further, around the pixel portion, an IC chip 823 in which a driving circuit for transmitting each signal to the pixel portion is formed is electrically connected by anisotropic conductive materials 824 and 825. In order to form a pixel portion corresponding to color display, the number of data lines is 3072 in the XGA class, and 768 scanning lines are required. The data lines and scanning lines formed in such numbers are divided into several blocks at the end of the pixel portion to form lead lines, which are collected according to the pitch of the output terminals of the IC.

  Through the above process, a light-emitting module on which an IC chip sealed with the second flexible substrate 810 and the first flexible substrate 820 is mounted can be manufactured. When mounting an IC chip, it is preferably performed on a hard first substrate in order to perform thermocompression bonding. According to the present invention, the IC chip is mounted and then peeled off and transferred to a flexible substrate. it can.

(Embodiment 4)
In this embodiment, an example of manufacturing a semiconductor device functioning as a wireless chip is described. The semiconductor device described in this embodiment is characterized in that data can be read and written in a non-contact manner. A data transmission format is an electromagnetic which performs communication by mutual induction with a pair of coils arranged opposite to each other. There are roughly divided into a coupling system, an electromagnetic induction system that communicates using an induction electromagnetic field, and a radio system that communicates using radio waves, but any system may be used.

In addition, there are two types of antennas used for data transmission. When one antenna is provided on an element substrate on which a plurality of elements and storage elements are provided, the other has a plurality of elements and storage elements. In some cases, a terminal portion is provided over the provided element substrate, and an antenna provided over another substrate is connected to the terminal portion.

In this embodiment mode, a manufacturing method in the case where an antenna provided over another substrate is provided connected to a terminal portion of an element substrate is described below.

First, as in Embodiment Mode 1, a molybdenum film 902 and a molybdenum oxide film 903 are stacked over a heat-resistant substrate 901. FIG. 10A shows a cross-sectional view of the substrate that has been processed so far. A glass substrate is used as the heat resistant substrate 901. The heat-resistant substrate is not limited to a glass substrate, and may be any substrate that can withstand the firing temperature (about 300 ° C.) of a conductive layer formed by a coating method and that does not greatly deform its shape. However, if heat treatment is performed at 300 ° C. for 30 minutes, a plastic substrate with low heat resistance may be bent, which is inappropriate as the heat resistant substrate 901.

Next, as illustrated in FIG. 10B, a conductive layer 904 functioning as an antenna is formed over the molybdenum oxide film 903. The conductive layer 904 functioning as an antenna is formed by discharging droplets or paste having a conductor such as gold, silver, or copper by a droplet discharge method (such as an ink jet method or a dispense method), and drying and baking. By forming the conductive layer 904 by a droplet discharge method, the number of steps can be reduced, and the cost can be reduced accordingly. Alternatively, the conductive layer 904 may be formed by a screen printing method. When the screen printing method is used, the conductive layer 904 functioning as an antenna is selectively printed with a conductive paste in which conductive particles having a particle size of several nanometers to several tens of micrometers are dissolved or dispersed in an organic resin. To do. Conductor particles include silver (Ag), gold (Au), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), tantalum (Ta), molybdenum (Mo) and titanium (Ti). Any one or more metal particles, silver halide fine particles, or dispersible nanoparticles can be used. In addition, as the organic resin contained in the conductive paste, one or more selected from organic resins functioning as a binder of metal particles, a solvent, a dispersant, and a coating material can be used. Typically, an organic resin such as an epoxy resin or a silicone resin can be given. In forming the conductive layer, it is preferable to fire after extruding the conductive paste. Further, fine particles mainly composed of solder or lead-free solder may be used. In this case, it is preferable to use fine particles having a particle diameter of 20 μm or less. Solder and lead-free solder have the advantage of low cost. In addition to the materials described above, ceramic, ferrite, or the like may be applied to the antenna.

When an antenna is manufactured using a screen printing method or a droplet discharge method, firing is performed after the antenna is formed into a desired shape. This firing temperature is 200 ° C to 300 ° C. Firing is possible even at temperatures lower than 200 ° C., but if it is lower than 200 ° C., the conductivity of the antenna cannot be ensured, and the communication distance of the antenna may be shortened. Considering these points, it is preferable that the antenna be formed on another substrate, that is, a heat-resistant substrate, and then peeled and transferred to the element substrate. Further, in the case where a memory element using an organic material is used as a memory element provided on the element substrate, the memory element may be changed by the firing temperature of the antenna, which may affect data writing or the like. Also from this point, it is advantageous to provide an antenna provided on another substrate connected to the terminal portion of the element substrate.

  In addition to the screen printing method, the antenna may use gravure printing or the like, or may be formed of a conductive material using a plating method or the like. Depending on the plating material and plating conditions, an antenna formed by a plating method may have poor adhesion, so that it is effective to use the peeling method using the molybdenum film of the present invention.

Next, as shown in FIG. 10C, a flexible substrate 906 is bonded using a resin layer 905 to protect the conductive layer 904.

Next, separation is performed as illustrated in FIG. 10D, so that the heat-resistant substrate 901 and the molybdenum film 902 can be separated from the molybdenum oxide film 903, the conductive layer 904, the resin layer 905, and the flexible substrate 906. Note that separation may be performed within the layer of the molybdenum oxide film 903, or may be performed at the interface between the molybdenum oxide film 903 and the conductive layer 904, or at the interface between the molybdenum oxide film 903 and the resin layer 905. If the flexible substrate 906 is the resin layer 905 and has sufficient adhesion to the conductive layer 904, peeling can be performed by pulling the flexible substrate 906 after the resin layer 905 is fixed. Since the peeling method using the molybdenum film of the present invention can be peeled only by applying a relatively weak force, the yield is improved. Further, since the peeling method using the molybdenum film of the present invention only applies a relatively weak force, deformation of the flexible substrate 906 can be suppressed at the time of peeling, and damage to the conductive layer 904 can be reduced.

Next, as illustrated in FIG. 10E, the element substrate 907 is placed in contact with the surface over which the conductive layer 904 is provided. Since the molybdenum oxide film 903 also has characteristics of a semiconductor, electrical conduction can be obtained by arranging the terminal portion of the element substrate so as to overlap with the conductive layer 904. Needless to say, the terminal portion of the element substrate and the conductive layer 904 can be electrically connected by pressure bonding using an anisotropic conductive material.

  FIG. 10E illustrates an example in which the element substrate 907 having a smaller area than the flexible substrate 906 is provided; however, there is no particular limitation, and an element substrate having almost the same area as the flexible substrate 906 is used. Alternatively, an element substrate having a larger area than the flexible substrate 906 may be provided.

Lastly, if another flexible substrate is attached so as to cover the antenna and the element substrate 907 for protection, a semiconductor device functioning as a wireless chip is completed. Note that it is not necessary to attach another flexible substrate if it is not necessary.

Here, an electromagnetic coupling method or an electromagnetic induction method (for example, 13.56 MHz band) is applied as a signal transmission method in the semiconductor device. In FIG. 10E, the top surface of the conductive layer functioning as an antenna is formed in a ring shape (for example, a loop antenna) or a spiral shape (for example, a spiral antenna) in order to use electromagnetic induction due to a change in magnetic field density. However, the shape is not particularly limited.

As a signal transmission method in the semiconductor device, a microwave method (for example, a UHF band (860 to 960 MHz band), a 2.45 GHz band, or the like) can be applied. In that case, a shape such as the length of the conductive layer functioning as an antenna may be appropriately set in consideration of the wavelength of the electromagnetic wave used for signal transmission. FIGS. 11A to 11D illustrate examples of a conductive semiconductor layer 912 that functions as an antenna and a chip-shaped semiconductor device 913 that includes an integrated circuit, which are formed over a flexible substrate 911. FIGS. For example, the top surface shape of the conductive layer functioning as an antenna is linear (for example, a dipole antenna (see FIG. 11A)), a flat shape (for example, a patch antenna (see FIG. 11B)), or a ribbon type It can be formed in a shape (see FIGS. 11C and 11D). Further, the shape of the conductive layer functioning as an antenna is not limited to a linear shape, and may be provided in a curved shape, a meandering shape, or a combination thereof in consideration of the wavelength of electromagnetic waves.

  The structure of the semiconductor device obtained through the above steps will be described with reference to FIG. As shown in FIG. 12A, a semiconductor device 1120 obtained by the present invention has a function of communicating data without contact, and includes a power supply circuit 1111, a clock generation circuit 1112, a data demodulation or modulation circuit 1113, and the like. A control circuit 1114 for controlling the circuit, an interface circuit 1115, a memory circuit 1116, a data bus 1117, an antenna 1118, a sensor 1121, and a sensor circuit 1122 are provided.

The power supply circuit 1111 is a circuit that generates various power supplies to be supplied to each circuit inside the semiconductor device 1120 based on the AC signal input from the antenna 1118. The clock generation circuit 1112 is a circuit that generates various clock signals to be supplied to each circuit inside the semiconductor device 1120 based on the AC signal input from the antenna 1118. The data demodulation or modulation circuit 1113 has a function of demodulating or modulating data communicated with the reader / writer 1119. The control circuit 1114 has a function of controlling the memory circuit 1116. The antenna 1118 has a function of transmitting and receiving radio waves. The reader / writer 1119 controls communication with the semiconductor device, control, and processing related to the data. The semiconductor device is not limited to the above-described configuration, and may be a configuration in which other elements such as a power supply voltage limiter circuit and hardware dedicated to cryptographic processing are added.

The memory circuit 1116 includes a memory element in which an organic compound layer or a phase change layer is sandwiched between a pair of conductive layers. Note that the memory circuit 1116 may include only a memory element in which an organic compound layer or a phase change layer is interposed between a pair of conductive layers, or may include a memory circuit having another structure. The memory circuit having another configuration corresponds to, for example, one or more selected from DRAM, SRAM, FeRAM, mask ROM, PROM, EPROM, EEPROM, and flash memory.

The sensor 1121 is formed of a semiconductor element such as a resistance element, a capacitive coupling element, an inductive coupling element, a photovoltaic element, a photoelectric conversion element, a thermoelectric element, a transistor, a thermistor, or a diode. The sensor circuit 1122 detects a change in impedance, reactance, inductance, voltage or current, performs analog / digital conversion (A / D conversion), and outputs a signal to the control circuit 1114.

  This embodiment mode can be freely combined with Embodiment Mode 1 or Embodiment Mode 2. For example, an element circuit (flexible substrate) from which an integrated circuit is formed using the TFT obtained in Embodiment Mode 1 or Embodiment Mode 2 and peeled, and an antenna obtained in this embodiment mode are provided. The conductive substrate can be attached to the flexible substrate for electrical conduction.

  According to the present invention, a semiconductor device that functions as a chip having a processor circuit (hereinafter also referred to as a processor chip, a wireless chip, a wireless processor, a wireless memory, or a wireless tag) can be formed. The semiconductor device obtained in the present invention has a wide range of uses. For example, banknotes, coins, securities, certificates, bearer bonds, packaging containers, books, recording media, personal items, vehicles, foods, etc. It can be used in clothing, health supplies, daily necessities, medicines, electronic devices and the like.

  Banknotes and coins are money that circulates in the market, and include those that are used in the same way as money in a specific area (cash vouchers), commemorative coins, and the like. Securities refer to checks, securities, promissory notes, and the like, and can be provided with a chip 90 having a processor circuit (see FIG. 13A). The certificate refers to a driver's license, a resident's card, and the like, and can be provided with a chip 91 having a processor circuit (see FIG. 13B). Personal belongings refer to bags, glasses, and the like, and can be provided with a chip 97 including a processor circuit (see FIG. 13C). Bearer bonds refer to stamps, gift cards, and various gift certificates. Packaging containers refer to wrapping paper for lunch boxes, plastic bottles, and the like, and can be provided with a chip 93 having a processor circuit (see FIG. 13D). Books refer to books, books, and the like, and can be provided with a chip 94 including a processor circuit (see FIG. 13E). The recording media refer to DVD software, video tapes, and the like, and can be provided with a chip 95 including a processor circuit (see FIG. 13F). The vehicles refer to vehicles such as bicycles, ships, and the like, and can be provided with a chip 96 including a processor circuit (see FIG. 13G). Foods refer to food products, beverages, and the like. Clothing refers to clothing, footwear, and the like. Health supplies refer to medical equipment, health equipment, and the like. Livingware refers to furniture, lighting equipment, and the like. Chemicals refer to pharmaceuticals, agricultural chemicals, and the like. Electronic devices refer to liquid crystal display devices, EL display devices, television devices (TV receivers, flat-screen TV receivers), mobile phones, and the like.

The semiconductor device obtained by the present invention is fixed to an article by mounting on a printed board, pasting on a surface, or embedding. For example, in the case of a book, a semiconductor device is embedded in paper, or in the case of a package made of an organic resin, the semiconductor device is embedded in the organic resin. Since the semiconductor device of the present invention realizes a small size, a thin shape, and a light weight, the design of the article itself is not impaired even after being fixed to the article. In addition, by providing a semiconductor device obtained by the present invention in bills, coins, securities, bearer bonds, certificates, etc., an authentication function can be provided, and if this authentication function is utilized, counterfeiting can be prevented. be able to. In addition, by providing the semiconductor device obtained by the present invention in packaging containers, recording media, personal items, foods, clothing, daily necessities, electronic devices, etc., it is possible to improve the efficiency of systems such as inspection systems. it can.

Next, one mode of an electronic device in which the semiconductor device obtained by the present invention is mounted will be described with reference to the drawings. An electronic device illustrated here is a mobile phone, which includes housings 2700 and 2706, a panel 2701, a housing 2702, a printed wiring board 2703, operation buttons 2704, and a battery 2705 (see FIG. 12B). The panel 2701 is detachably incorporated in the housing 2702, and the housing 2702 is fitted on the printed wiring board 2703. The shape and dimensions of the housing 2702 are changed as appropriate in accordance with the electronic device in which the panel 2701 is incorporated. A plurality of packaged semiconductor devices are mounted on the printed wiring board 2703, and the semiconductor device obtained by the present invention can be used as one of them. The plurality of semiconductor devices mounted on the printed wiring board 2703 have any one function of a controller, a central processing unit (CPU), a memory, a power supply circuit, a sound processing circuit, a transmission / reception circuit, and the like.

The panel 2701 is connected to the printed wiring board 2703 through the connection film 2708. The panel 2701, the housing 2702, and the printed wiring board 2703 are housed in the housings 2700 and 2706 together with the operation buttons 2704 and the battery 2705. A pixel region 2709 included in the panel 2701 is arranged so as to be visible from an opening window provided in the housing 2700.

As described above, since the semiconductor device obtained by the present invention uses a flexible substrate, the semiconductor device is thin and lightweight. Due to the above characteristics, a limited space inside the casings 2700 and 2706 of the electronic device is limited. Can be used effectively.

In addition, since the semiconductor device of the present invention includes a memory element having a simple structure in which an organic compound layer is sandwiched between a pair of conductive layers, an electronic device using an inexpensive semiconductor device can be provided.

Note that the housings 2700 and 2706 are examples of the appearance of a mobile phone, and the electronic device according to this embodiment can be modified into various modes depending on functions and uses.

  The present invention having the above-described configuration will be described in more detail with the following examples.

The liquid crystal display device and the light emitting device obtained by the present invention can be used for various modules (active matrix liquid crystal module, active matrix EL module, active matrix EC module). That is, the present invention can be implemented in all electronic devices in which they are incorporated in the display portion.

  Such electronic devices include video cameras, digital cameras, head mounted displays (goggles type displays), car navigation systems, projectors, car stereos, personal computers, personal digital assistants (mobile computers, mobile phones, electronic books, etc.), etc. Can be mentioned. An example of them is shown in FIG.

14A and 14B illustrate a television device. In the display panel, only a pixel portion is formed, and a scanning line side driver circuit and a signal line side driver circuit are mounted by a TAB method, a case of being mounted by a COG method, a TFT, and a pixel. And the scanning line side driving circuit are integrally formed on the substrate and the signal line side driving circuit is separately mounted as a driver IC, and the pixel portion, the signal line side driving circuit, and the scanning line side driving circuit are integrally formed on the substrate. There are cases, but any form is acceptable.

    As other external circuit configurations, on the video signal input side, among the signals received by the tuner, the video signal amplification circuit that amplifies the video signal, and the signal output from it corresponds to each color of red, green, and blue And a control circuit for converting the video signal into the input specification of the driver IC. The control circuit outputs signals to the scanning line side and the signal line side, respectively. In the case of digital driving, a signal dividing circuit may be provided on the signal line side and an input digital signal may be divided and supplied.

    Of the signals received by the tuner, the audio signal is sent to the audio signal amplifier circuit, and the output is supplied to the speaker via the audio signal processing circuit. The control circuit receives control information of the receiving station (reception frequency) and volume from the input unit, and sends a signal to the tuner and the audio signal processing circuit.

    As shown in FIGS. 14A and 14B, the display module can be incorporated into a housing to complete the television device. A display panel attached to the FPC is also called a display module. A main screen 2003 is formed by the display module, and a speaker portion 2009, operation switches, and the like are provided as other accessory equipment. In this manner, a television device can be completed.

    As shown in FIG. 14A, a display panel 2002 using a display element is incorporated in a housing 2001, and the receiver 2005 starts reception of general television broadcasts and is wired or wirelessly via a modem 2004. By connecting to a communication network, information communication in one direction (from the sender to the receiver) or in both directions (between the sender and the receiver or between the receivers) can be performed. The television device can be operated by a switch incorporated in the housing or a separate remote controller 2006, and this remote controller is also provided with a display unit 2007 for displaying information to be output. Also good.

    In addition, the television device may have a configuration in which a sub screen 2008 is formed using the second display panel in addition to the main screen 2003 to display channels, volume, and the like. In this configuration, the main screen 2003 may be formed using an EL display panel with an excellent viewing angle, and the sub screen may be formed using a liquid crystal display panel that can display with low power consumption. In order to prioritize the reduction in power consumption, the main screen 2003 may be formed using a liquid crystal display panel, the sub screen may be formed using an EL display panel, and the sub screen may blink.

    FIG. 14B illustrates a television device having a large display portion of 20 to 80 inches, for example, which includes a housing 2010, a keyboard portion 2012 that is an operation portion, a display portion 2011, a speaker portion 2013, and the like. The present invention is applied to manufacture of the display portion 2011. Since the display portion in FIG. 14B uses a flexible substrate that can be bent, the television device has a bent display portion. Since the shape of the display portion can be freely designed as described above, a television device having a desired shape can be manufactured.

    According to the present invention, since a display device can be formed through a simple process, cost reduction can also be achieved. Therefore, a television device using the present invention can be formed at low cost even if it has a large screen display portion.

    Of course, the present invention is not limited to a television device, but can be applied to various applications such as personal computer monitors, information display boards at railway stations and airports, and advertisement display boards on streets. can do.

  FIG. 14C illustrates a portable information terminal (electronic book), which includes a main body 3001, display portions 3002 and 3003, a storage medium 3004, operation switches 3005, an antenna 3006, and the like. The peeling method of the present invention can be applied to the display portions 3002 and 3003. The weight of the portable information terminal can be reduced by using the flexible substrate. Further, in the case where the antenna is formed over a flat substrate instead of the antenna illustrated in FIG. 14C, the peeling method of the present invention can be used.

  This embodiment can be freely combined with any one of Embodiment Modes 1 to 3.

In this embodiment, an example in which an electrophoretic display device is used as the display portion described in Embodiment 1 will be described. Typically, the invention is applied to the display portion 3002 or the display portion 3003 of the portable book (electronic book) illustrated in FIG.

  An electrophoretic display device (electrophoretic display) is also called electronic paper, and has the same readability as paper, low power consumption compared to other display devices, and the advantage of being able to be thin and light in shape. ing.

  The electrophoretic display can be considered in various forms, and a plurality of microcapsules including first particles having a positive charge and second particles having a negative charge are dispersed in a solvent or a solute. In other words, by applying an electric field to the microcapsules, the particles in the microcapsules are moved in opposite directions to display only the color of the particles assembled on one side. Note that the first particle or the second particle contains a dye and does not move in the absence of an electric field. In addition, the color of the first particles and the color of the second particles are different (including colorless).

  As described above, the electrophoretic display is a display using a so-called dielectrophoretic effect in which a substance having a high dielectric constant moves to a high electric field region. In the electrophoretic display, the polarizing plate and the counter substrate necessary for the liquid crystal display device are not necessary for the electrophoretic display device, and the thickness and weight are reduced by half.

  A solution in which the above microcapsules are dispersed in a solvent is referred to as electronic ink. This electronic ink can be printed on a surface of glass, plastic, cloth, paper, or the like. Color display is also possible by using particles having color filters or pigments.

  In addition, a display device can be completed by arranging a plurality of the above microcapsules so as to be appropriately sandwiched between two electrodes on a substrate, and display can be performed by applying an electric field to the microcapsules. For example, the active matrix substrate obtained in Embodiment Mode 1 can be used. Although it is possible to print electronic ink directly on a plastic substrate, in the case of an active matrix type, the device and electronic ink are formed on a glass substrate rather than on a plastic substrate that is vulnerable to heat and organic solvents. After that, it is preferable to peel the glass substrate in accordance with Embodiment Mode 1 or Embodiment Mode 2 and attach the glass substrate to a plastic substrate that is a flexible substrate because the manufacturing process can be performed in a wide range of conditions.

  Note that the first particle and the second particle in the microcapsule are a conductor material, an insulator material, a semiconductor material, a magnetic material, a liquid crystal material, a ferroelectric material, an electroluminescent material, an electrochromic material, or a magnetophoresis. A kind of material selected from the materials or a composite material thereof may be used.

  This embodiment can be freely combined with any one of Embodiment Modes 1 to 3 and Embodiment 1.

According to the present invention, an element such as a TFT can be formed using an existing large glass substrate manufacturing apparatus and then transferred to a flexible substrate. Therefore, the equipment cost can be greatly reduced. In addition, since the peeling method of the present invention has almost no process limitation, various elements can be transferred to a flexible substrate.

Sectional drawing which shows the manufacturing process of a liquid crystal display device. (Embodiment 1) 10 is a cross-sectional view illustrating a manufacturing process of a light-emitting device. (Embodiment 2) The figure which shows an example of the cross-section of organic TFT. (Embodiment 2) The photograph and schematic diagram which show the result of a tape peeling test. The top view and sectional drawing of a passive matrix light-emitting device. (Embodiment 3) The perspective view of a passive matrix light-emitting device. (Embodiment 3) The top view of a passive matrix light-emitting device. (Embodiment 3) The top view of a passive matrix light-emitting device. (Embodiment 3) Sectional drawing of a passive matrix type light-emitting device. (Embodiment 3) FIGS. 9A to 9D are cross-sectional views illustrating a manufacturing process of an antenna, and FIG. 9E is a perspective view illustrating a manufacturing process of a semiconductor device. FIGS. FIG. 6 is a top view illustrating a semiconductor device that functions as a wireless chip. FIG. 6A is a block diagram illustrating a semiconductor device obtained by the present invention, and FIG. 4B is a diagram illustrating an example of an electronic device. FIG. 6 illustrates an example of a semiconductor device. FIG. 14 illustrates an example of an electronic device. The photograph and schematic diagram which show the result of a tape peeling experiment. The photograph and schematic diagram which show the result of a tape peeling test.

Explanation of symbols

90, 91, 93, 94, 95, 96, 97: chip 101: substrate 102: molybdenum film 103: molybdenum oxide film 104: gate electrode 105: first insulating film 106: semiconductor film 107 having an amorphous structure: Semiconductor film 108 containing impurity element of one conductivity type: TFT
109: Semiconductor layer 110: Conductive semiconductor layer 111: Conductive semiconductor layer 112: Source electrode 113: Drain electrode 114: Protective film 115: Interlayer insulating film 116: First electrode 117: Second electrode 118 : Alignment film 119: polymer material 120: liquid crystal 121: flexible substrate 122: adhesive layer 123: flexible substrate 201: substrate 202: molybdenum film 203: molybdenum oxide film 204: insulating film 205: adhesive layer 206: possible Flexible substrate 210: first electrode 211: gate electrode 212: gate insulating film 213: semiconductor layer 214: buffer layer 215: conductive layer 221: partition 222: light emitting layer 223: second electrode 224: protective film 225: possible Flexible substrate 227: Organic transistor 313: Semiconductor layer 314: Source electrode 315: Drain electrode 331: Gate electrode 332: Insulation 413: semiconductor layer 414: source electrode 415: drain electrode 441: gate electrode 442: insulating film 501: first substrate 502: molybdenum film 503: molybdenum oxide film 504: insulating film 513: first electrode 514: partition 515R, 515G, 515B: Laminated film including a light emitting layer 516: second electrode 521: light emitting region 522: reverse tapered partition 601: first substrate 602: data line 603: scanning line 604: partition 605: region 607: input Terminal 608: Connection wiring 609a, 609b: FPC
701: First substrate 702: Data line 703: Scan line 704: Reverse tapered partition 706: Data line side IC
707: Scan line side IC
708, 709a, 709b: connection wiring 710: input terminal 711: FPC
712: IC chip 810: second flexible substrate 811: base insulating film 812: upper layer 813: lower layer 814: partition 815: laminated film 816 having a light emitting layer: scanning line 819: second adhesive layer 820: first Flexible substrate 823: IC chips 824, 825: anisotropic conductive material 829: transparent oxide conductive film 830: reflective metal film 832: FPC
901: heat-resistant substrate 902: molybdenum film 903: molybdenum oxide film 904: conductive layer 905: resin layer 906: flexible substrate 907: element substrate 911: flexible substrate 912: conductive layer 913: chip shape with integrated circuit Semiconductor device 1001: Substrate 1002: Stripped region 1003: Tape 1111: Power supply circuit 1112: Clock generation circuit 1113: Data demodulation or modulation circuit 1114: Control circuit 1115: Interface circuit 1116: Storage circuit 1117: Data bus 1118: Antenna 1120 : Semiconductor device 1121: Sensor 1122: Sensor circuit 2001: Case 2003: Main screen 2004: Modem 2005: Receiver 2009: Speaker unit 2006: Remote controller 2007: Display unit 2008: Sub screen 2010: Case 2011: Display unit 201 : Keyboard part 2013: Speaker part 2700: Case 2701: Panel 2702: Housing 2703: Printed wiring board 2704: Operation button 2705: Battery 2706: Case 2708: Connection film 2709: Pixel area 3001: Main body 3002: Display part 3003: Display unit 3004: Storage medium 3005: Operation switch 3006: Antenna

Claims (8)

  1. Form a molybdenum film on the substrate,
    Forming a molybdenum oxide film on the molybdenum film;
    Forming an insulating film on the molybdenum oxide film;
    Forming a gate electrode on the insulating film;
    Forming a gate insulating film on the gate electrode;
    A semiconductor layer having an oxide of zinc gallium indium is formed on the gate insulating film by sputtering.
    Forming a source electrode and a drain electrode on the semiconductor layer;
    The insulating film, the gate electrode, the gate insulating film, the semiconductor layer, the source electrode, and the drain electrode are separated from the substrate, and the insulating film, the gate electrode, and the gate insulating film are formed on a flexible substrate. , Transposing the semiconductor layer, the source electrode, and the drain electrode ,
    The method for manufacturing a semiconductor device, wherein the molybdenum film contains tin .
  2. Form a molybdenum film on the substrate,
    Forming a molybdenum oxide film on the molybdenum film;
    Forming an insulating film on the molybdenum oxide film;
    Forming a gate electrode on the insulating film;
    Forming a gate insulating film on the gate electrode;
    Forming a source electrode and a drain electrode on the gate insulating film;
    A semiconductor layer having an oxide of zinc gallium indium is formed on the gate insulating film, the source electrode, and the drain electrode by sputtering.
    The insulating film, the gate electrode, the gate insulating film, the source electrode, the drain electrode, and the semiconductor layer are separated from the substrate, and the insulating film, the gate electrode, and the gate insulating film are formed on a flexible substrate. , Transposing the source electrode, the drain electrode, and the semiconductor layer ,
    The method for manufacturing a semiconductor device, wherein the molybdenum film contains tin .
  3. Form a molybdenum film on the substrate,
    Forming a molybdenum oxide film on the molybdenum film;
    Forming an insulating film on the molybdenum oxide film;
    Forming a source electrode and a drain electrode on the insulating film;
    A semiconductor layer having an oxide of zinc gallium indium is formed on the insulating film, the source electrode, and the drain electrode by sputtering.
    Forming a gate insulating film on the semiconductor layer;
    Forming a gate electrode overlying the semiconductor layer on the gate insulating film;
    The insulating film, the source electrode, the drain electrode, the semiconductor layer, the gate insulating film, and the gate electrode are peeled from the substrate, and the insulating film, the source electrode, the drain electrode, Transposing the semiconductor layer, the gate insulating film, and the gate electrode ;
    The method for manufacturing a semiconductor device, wherein the molybdenum film contains tin .
  4. In any one of Claims 1 thru | or 3,
    A method for manufacturing a semiconductor device, wherein an interface between the molybdenum oxide film and the insulating film is separated when being peeled from the substrate.
  5. In any one of Claims 1 thru | or 3,
    A method for manufacturing a semiconductor device, wherein an interface between the molybdenum film and the molybdenum oxide film is separated when being peeled from the substrate.
  6. In any one of Claims 1 thru | or 3,
    A method for manufacturing a semiconductor device, wherein the inside of the molybdenum film is separated when being peeled from the substrate.
  7. In any one of Claims 1 thru | or 3,
    The method for manufacturing a semiconductor device, wherein the molybdenum oxide film is separated when being peeled from the substrate.
  8. In any one of Claims 1 thru | or 7,
    A method for manufacturing a semiconductor device, wherein the semiconductor device is separated from the substrate without being subjected to heat treatment at 500 ° C. or higher.
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US8900970B2 (en) * 2006-04-28 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device using a flexible substrate
KR101394541B1 (en) 2008-06-05 2014-05-13 삼성디스플레이 주식회사 Organic Thin Film Transistor, The Fabricating Mathod Of The Same and Th OrganicLight Emitting Display DeviceComprising The Same
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KR101667909B1 (en) * 2008-10-24 2016-10-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for manufacturing semiconductor device
TWI567829B (en) 2008-10-31 2017-01-21 半導體能源研究所股份有限公司 Semiconductor device and method for manufacturing the same
JP5587591B2 (en) * 2008-11-07 2014-09-10 株式会社半導体エネルギー研究所 Semiconductor device
JP5587592B2 (en) * 2008-11-07 2014-09-10 株式会社半導体エネルギー研究所 Semiconductor device
TWI585955B (en) 2008-11-28 2017-06-01 半導體能源研究所股份有限公司 Photosensor and display device
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US8704216B2 (en) * 2009-02-27 2014-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8816425B2 (en) * 2010-11-30 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

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