JP5363898B2 - Recording head and recording apparatus - Google Patents

Recording head and recording apparatus Download PDF

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Publication number
JP5363898B2
JP5363898B2 JP2009176302A JP2009176302A JP5363898B2 JP 5363898 B2 JP5363898 B2 JP 5363898B2 JP 2009176302 A JP2009176302 A JP 2009176302A JP 2009176302 A JP2009176302 A JP 2009176302A JP 5363898 B2 JP5363898 B2 JP 5363898B2
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wiring
layer
electric
substrate
anisotropic conductive
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JP2011025633A (en
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洋一 元
裕二 香嶋
秀信 中川
高洋 中村
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京セラ株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of enhancing reliability, and a method for manufacturing the same, a recording head and a recorder. <P>SOLUTION: A head base body 20 includes a base substrate 30 and an electric pattern layer 50 provided on the base substrate 30, and the electric pattern layer 50 includes first to third conduction parts 51, 52 and 53 formed by containing metal material, and an insulating part 54 provided to adjoin the periphery of the first to third conduction parts 51, 52 and 53 and formed by containing metal oxide formed by oxidizing the metal material forming the first to third conduction parts 51, 52 and 53. The insulating part 54 projects to a thickness direction D6 in thickness directions D5 and D6 compared with the first to third conduction parts 51, 52 and 53. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a wiring board having a substrate, an electric wiring provided on the substrate, and an electric pad provided on the electric wiring, a manufacturing method thereof, a recording head, and a recording Relates to the device.

  As printers such as facsimiles and registers, thermal printers including a thermal head and a platen roller are used. As a thermal head mounted on such a thermal printer, a substrate, a plurality of heating elements arranged on the substrate, and an electric wiring electrically connected to the plurality of heating elements are provided. Some have a wiring board and an external wiring board mechanically and electrically connected to the wiring board. The platen roller has a function of pressing a recording medium such as thermal paper against the heating element. In the thermal printer having such a configuration, the heating element is caused to generate heat according to a desired image, and the recording medium is pressed almost uniformly on the heating element by a platen roller, whereby the heat generated by the heating element is applied to the recording medium. It communicates well. Desired printing on the recording medium is performed by repeating this process.

  Some thermal heads as described above perform mechanical and electrical connection between a wiring board and an external wiring board via an anisotropic conductive material (hereinafter referred to as “ACF”). For example, it is described in Patent Document 1.

Japanese Patent Laid-Open No. 3-152267

  However, in such a thermal head, if the density of the heating elements and the electrical wiring is increased in order to increase the definition of the image, the separation distance of the electrical wiring is shortened, and the resin component of the ACF is sufficient in the separation portion. There was a case where the connection between the wiring board and the external wiring board was peeled off without flowing in. Such peeling of the connecting portion is not limited to the thermal head, and may occur also in other devices in which the electrode wiring is formed.

  The present invention has been conceived under such circumstances, and it is an object of the present invention to provide a wiring board capable of improving reliability, a manufacturing method thereof, a recording head, and a recording apparatus. .

The recording head of the present invention includes a base substrate and an electric pattern layer provided on the base substrate, and the electric pattern layer includes a wiring portion formed including a metal material; An insulating portion provided in contact with the periphery of the wiring portion, including a metal oxide formed by oxidizing the metal material, and protruding in a thickness direction as compared with the wiring portion. A wiring board configured and an anisotropic conductive material electrically connected to the wiring board, and an electric pad is provided on the wiring portion, and the electric pad is arranged in the thickness direction. The diameter of the lower surface is smaller than the diameter of the upper surface, the side surface connecting the upper surface and the lower surface is inclined, and the anisotropic conductive material enters the region surrounded by the side surface and the wiring portion. It is characterized by that.

In the recording head according to the aspect of the invention, it is preferable that the insulating portion has a hole inside.

Recording head of the present invention, along a main scanning direction on the front SL base substrate is characterized by a plurality of heat generating elements are provided.

  In the recording head of the present invention, it is preferable that the plurality of heating elements are electrically connected to the conductive layer.

  A recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism that transports a recording medium to the recording head.

The recording head of the present invention includes a base substrate and an electric pattern layer provided on the base substrate, and the electric pattern layer includes a wiring portion formed including a metal material; An insulating portion provided in contact with the periphery of the wiring portion, including a metal oxide formed by oxidizing the metal material, and protruding in a thickness direction as compared with the wiring portion. A wiring board configured and an anisotropic conductive material electrically connected to the wiring board, and an electric pad is provided on the wiring portion, and the electric pad is arranged in the thickness direction. The diameter of the lower surface is smaller than the diameter of the upper surface, the side surface connecting the upper surface and the lower surface is inclined, and the anisotropic conductive material enters the region surrounded by the side surface and the wiring portion. . Therefore, the recording head of the present invention can reduce the amount of conductive particles constituting the anisotropic conductive material ( ACF ) from being distributed on the insulating portion, and can be increased on the wiring portion. Can do. Therefore, the recording head of the present invention, together with better performing mechanical connection on the insulation portion, electrically connected favorably can be virtually on the wiring portion, it is possible to improve the reliability. In addition, the anchor effect due to the difference in the diameter of the electric pad increases the strength of mechanical bonding, and the conductive effect of the ACF is strongly pressed against the electric pad by this anchor effect. It can be done well.

In the recording head of the present invention, when the insulating portion has a hole inside, when the wiring portion and another element are connected via the thermosetting ACF, the applied heat is stored well. can do. Therefore, with this recording head , manufacturing efficiency can be increased.

Recording head of the present invention, on the base substrate has a plurality of heating elements are provided along the main scanning direction. Therefore, the recording head of the present invention can increase the vapor and mechanical reliability collector.

  In the recording head of the present invention, even when the plurality of heating elements are electrically connected to the conductive layer, the electrical and mechanical reliability can be improved. The separation distance between the parts can be shortened. Therefore, in this recording head, the density of the plurality of heating elements can be increased.

The recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism that transports a recording medium to the recording head. Therefore, the recording apparatus of the present invention can increase the vapor and mechanical reliability collector.

FIG. 2 is a plan view showing a schematic configuration of a head substrate and a thermal head as an example of an embodiment of a recording head of the present invention, with a protective layer omitted. FIG. 2 is an enlarged plan view of the main part of the head substrate and the thermal head shown in FIG. 1. FIG. 2 is a plan view in which main parts of the head substrate and the thermal head shown in FIG. 1 are enlarged and a protective layer is omitted. FIG. 4 is a sectional view taken along line IV-IV shown in FIG. 2. (A) is sectional drawing along the Va-Va line shown in FIG. 2, (b) is sectional drawing along the Vb-Vb line shown in FIG. 2, (c) is shown in FIG. It is sectional drawing along line Vc-Vc. It is a disassembled perspective view which shows schematic structure of an external wiring board. (A)-(c) is explanatory drawing which shows the manufacturing process of the head base | substrate and thermal head which were shown in FIG. (A)-(c) is explanatory drawing which shows the continuation of the manufacturing process of the head base | substrate and thermal head which were shown in FIG. 1 is a diagram illustrating a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention.

<Wiring board and recording head>
A thermal head 10 which is an example of an embodiment of the recording head of the present invention shown in FIGS. 1 to 6 includes a head substrate 20 as a wiring board, a drive IC 21 and an external wiring board 22. In this thermal head 10, the electrical connection and mechanical connection between the head base 20, the drive IC 21 and the external wiring substrate 22 are made through an anisotropic conductive layer 23. The head substrate 20 is an example of an embodiment of a wiring board according to the present invention.

  1 to 5 includes a base substrate 30, a glaze layer 40, an electric pattern layer 50, an electric resistance layer 60, an electric pad 70, and a protective layer 80. .

  The base substrate 30 has a function of supporting the glaze layer 40, the electric pattern layer 50, the electric resistance layer 60, the electric pad 70, the protective layer 80, and the driving IC 21. The base substrate 30 is configured in a rectangular shape extending in the main scanning directions D1 and D2 in plan view. Here, the “plan view” means a view in the D6 direction in the thickness directions D5 and D6 of the base substrate 30. Examples of the material for forming the base substrate 30 include ceramics, glass, or insulating resin including epoxy resin.

The glaze layer 40 whose cross section is shown in FIGS. 4 and 5 has a function as a heat storage layer for temporarily storing a part of heat generated in a heat generating portion 60a described later of the electric resistance layer 60. That is, the glaze layer 40 plays a role of improving the thermal response characteristics of the thermal head 10 by shortening the time required to raise the temperature of the heat generating part 60a. The glaze layer 40 has a base portion 40a and a protruding portion 40b. As a material for forming the glaze layer 40, for example, thermal conductivity include insulating material 0.7W · m -1 · K -1 or more 1.0W · m -1 · K -1 or less. Here, “insulation” refers to the extent to which current does not substantially flow. For example, the electrical resistivity is 1.0 × 10 12 Ω · m or more. An example of such an insulating material is glass. In this example, the glaze layer 40 is provided, but the glaze layer 40 may not be provided. As a case where the glaze layer 40 is not provided, for example, a case where the substrate 20 is formed of glass can be mentioned.

  The base 40 a is provided in a substantially flat shape over the entire top surface of the base substrate 30.

  The protruding part 40b is a part that contributes to pressing the recording medium against the protective layer 80 positioned on the heat generating part 60a. The protrusion 40b protrudes from the base 40a in the direction D5 in the thickness directions D5 and D6. Further, the protruding portion 40b is formed in a strip shape extending in the main scanning directions D1 and D2. The protrusion 40b has a substantially semi-elliptical cross section in the sub-scanning directions D3 and D4 orthogonal to the main scanning directions D1 and D2.

  The electric pattern layer 50 is located on the glaze layer 40 and contributes to supplying electric power to the heat generating part 60a. Here, “contributes to supplying power” means that a current flows in accordance with power supply to the heat generating portion 60a or supply control of this power supply. The electrical pattern layer 50 is formed by integrating a wiring part through which a current flows and an insulating part that insulates each part of the wiring part. More specifically, it has the 1st wiring part 51, the 2nd wiring part 52, and the 3rd wiring part 53 as a wiring part, and the insulation part 54 as an insulation part. In the electrical pattern layer 50, the first wiring part 51, the second wiring part 52, and the third wiring part 53 function as power supply lines that contribute to supplying power to the heat generating part 60a. The electrical pattern layer 50 has a first wiring part 51, a second wiring part 52, a third wiring part 53, and an insulating part 54 facing the upper surface 50a on the arrow D5 direction side. It is configured as a layer.

  Examples of a material mainly forming the first wiring part 51, the second wiring part 52, and the third wiring part 53 include a conductive material, for example, any one of metals such as aluminum, gold, silver, and copper, or These alloys are mentioned. Here, “mainly composed” means one having the largest molar ratio of constituent atoms, and may contain, for example, an additive. The electric pattern layer 50 of this example is made of aluminum.

  In the first wiring part 51, the second wiring part 52, and the third wiring part 53, the upper and lower surfaces in the thickness directions D5 and D6 constitute a part of the upper and lower surfaces in the thickness directions D5 and D6 of the electric pattern layer 50. doing. That is, the first wiring part 51, the second wiring part 52, and the third wiring part 53 are configured to penetrate the electric pattern layer 50 in the arrow directions D5 and D6.

  The first wiring part 51 is provided separately in a plurality. Each first wiring part 51 is connected to one end part of the plurality of heat generating parts 60a in an electrically independent state. The first wiring part 51 is located on the D4 direction side in the sub-scanning directions D3 and D4 of the heat generating part 60a. In addition, each first wiring portion 51 has the other end portion electrically connected to the driving IC 21 via the electric pad 70 and the anisotropic conductive layer 23. The first wiring part 51 directly contributes to supplying power to the heat generating part 60a. The first wiring part 51 of this example is electrically connected to the reference potential via the drive IC 21.

  The second wiring part 52 is provided integrally. The second wiring part 52 is electrically connected to the other end part of the plurality of heat generating parts 60 a and the external wiring board 22 at the end part. The second wiring part 52 is located on the D3 direction side in the sub-scanning directions D3 and D4 of the heat generating part 60a. The second wiring part 52 directly contributes to supplying power to the heat generating part 60a in pairs with the first wiring part 51. The second wiring portion 52 of this example is electrically connected to a reference voltage source as a power source via the external wiring substrate 22. The second wiring portion 52 and the external wiring substrate 22 are electrically connected through the anisotropic conductive layer 23.

  The third wiring part 53 is divided into a plurality of parts and is provided apart from the first wiring part 51. Each third wiring part 53 has one end electrically connected to the driving IC 21 via the anisotropic conductive layer 23 and the other end anisotropically connected to the other driving IC 21 or the external wiring substrate 22. They are electrically connected through the conductive layer 23. The third wiring part 53 contributes to supplying power to the heat generating part 60a by supplying power to the driving IC 21 or supplying a control signal to the driving IC 21 when supplying power to the heat generating part 60a. Is.

The insulating portion 54 surrounds the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53, and on the side surfaces of the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. The first wiring part 51, the second wiring part 52, and the third wiring part 53 are insulated from each other. Here, “insulation” refers to the extent to which current does not substantially flow. For example, the resistivity is 1.0 × 10 12 Ω · m or more. The insulating portion 54 is configured to penetrate the electric pattern layer 50 in the thickness directions D5 and D6, and the upper and lower surfaces in the thickness directions D5 and D6 are part of the upper and lower surfaces in the thickness directions D5 and D6 of the electric pattern layer 50. It is composed. The insulating part 54 of this example has a plurality of holes between the upper and lower surfaces.

  The insulating portion 54 includes an oxide of a conductive material mainly constituting the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53, and the conductive portion located at the formation portion of the insulating portion 54. By oxidizing part of the material, the first wiring part 51, the second wiring part 52, the third wiring part 53, and the insulating part 54 are integrally formed. The insulating portion 54 has a larger hardness and a lower thermal conductivity than the conductive materials that constitute the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. Here, “mainly composed” means one having the largest molar ratio of constituent atoms, and may contain, for example, an additive. “Hardness” refers to Shore hardness and is defined in JIS standard Z2246: 2000. The insulating part 54 of this example oxidizes a part of the conductive material of the first wiring part 51, the second wiring part 52, and the third wiring part 53, which was located at the formation part of the insulating part 54, The 1st-3rd wiring parts 51, 52, and 53 and the insulating part 54 are integrally formed.

  Further, the insulating portion 54 of this example protrudes in the D5 direction in the thickness directions D5 and D6 as compared with the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. That is, the insulating portion 54 is configured to be thicker than the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. The insulating portion 54 is configured so as to gradually increase in thickness with increasing distance from the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53, and to have substantially the same thickness.

  The electrical resistance layer 60 has a heat generating portion 60a that functions as a heat generating element that generates heat when power is supplied. The electrical resistance layer 60 is provided on the first wiring part 51, the second wiring part 52, and the third wiring part 53 of the electrical pattern layer 50. Further, the electrical resistance layer 60 is provided from the first wiring portion 51 to the second wiring portion 52 that is a pair of the first wiring portion 51, and the first wiring portion 51 and the second wiring portion are connected to each other. The insulating part 54 provided between them is covered. A portion provided from the first wiring portion 51 to the second wiring portion 52 that is a pair of the first wiring portion 51 functions as the heat generating portion 51. The electrical resistance layer 60 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the electrical pattern layer 50. Examples of such an electric resistance material include TaN-based materials, TaSiO-based materials, TaSiNO-based materials, TiSiO-based materials, TiSiCO-based materials, and NbSiO-based materials. Further, the electrical resistance layer 60 is configured to have an average thickness smaller than that of the electrical pattern layer 50. Here, the average thickness means an arithmetic average value of the maximum thickness and the minimum thickness. Examples of the thickness of the electric resistance layer 60 include a range of 0.01 μm to 0.5 μm.

  The heat generating part 60a is a part that functions as a heat generating element that generates heat when power is supplied. The heat generating part 60a is configured to generate heat in a temperature range of, for example, 200 ° C. or higher and 550 ° C. or lower when power is supplied from the electric pattern layer 50. The heat generating portions 60a are arranged at substantially the same distance along the main scanning directions D1 and D2. Further, each of the heat generating portions 60a is configured in a rectangular shape in plan view. Furthermore, the heat generating part 60a is configured to have substantially the same length along the main scanning directions D1 and D2. Further, the heat generating portion 60a is configured to have substantially the same length along the sub-scanning directions D3 and D4. Here, “substantially the same” includes those within a general manufacturing error range, for example, a range in which an error with respect to the average value of the length of each part is within 10%. Here, examples of the value of the separation distance between the center of one heat generating portion 60a and the center of another heat generating portion 60a adjacent to the heat generating portion 60a include a range of 5.2 μm or more and 84.7 μm or less. In this example, the arrangement direction of the plurality of heat generating portions 60 a is the main scanning direction of the thermal head 10.

  The electric pad 70 functions as an oxidation reduction layer that reduces oxidation of the connection portions of the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53 with other elements. The electrical pad 70 functions as a connection pad for the anisotropic conductive layer 23 when the electrical pattern layer 50 is connected to the driving IC 21 and the external wiring substrate 22 via the anisotropic conductive layer 23. It is. The electric pad 70 is provided on the electric pattern layer 50. Specifically, the other end of the first wiring part 51 (the end connected to the driving IC 21), the end connected to the external wiring substrate 22 of the second electrical wiring 62, and both ends of the third wiring part 53 An electric pad 70 is provided on (an end connected to the driving IC 21 or the external wiring board 22).

Further, the electric pad 70 has a diameter of the upper surface in the thickness directions D5 and D6 in a plane direction extending in the main scanning directions D1 and D2 and the sub-scanning directions D3 and D4 (hereinafter simply referred to as “plane direction”). In comparison, the diameter of the lower surface in the thickness directions D5 and D6 is smaller. Here, the “diameter” refers to a distance between the side surfaces 70c of the electric pad 70 in a cross section extending in the thickness direction, and the size of the diameter φ is a diameter φ of a different electric pad 70 in one cross section along the thickness direction. Shall be compared. The electric pad 70 has a diameter φ smaller in the plane direction as it approaches the D6 direction side in the thickness directions D5 and D6, that is, the electric wiring layer 60 side. From this, the electric pad 70 has the end of the upper surface 70a in the planar direction located outside the center of the end of the lower surface 70b in the planar direction, and the side surface 70c is inclined so that the upper surface 70a side protrudes .

The protective layer 80 has a function of protecting the heat generating portion 60a and the electric pattern layer 50. The protective layer 80 is formed so as to cover the heat generating portion 60a and a part of the electric pattern layer 50 along the main scanning directions D1 and D2. Examples of the material for forming the protective layer 80 include diamond-like carbon materials, SiC materials, SiN materials, SiCN materials, SiAlON materials, SiO 2 materials, and TaO materials. Here, “diamond-like carbon-based material” refers to a material in which the proportion of carbon atoms (C atoms) taking sp 3 hybrid orbitals is in the range of 1 atomic% or more and less than 100 atomic%. Such a protective layer 80 can be formed by various well-known manufacturing methods using, for example, a vapor deposition method, a CVD method, a sputtering method, a photolithography technique, or a printing technique.

  The drive IC 21 has a function of controlling power supply to the plurality of heat generating units 60a. The drive IC 21 is electrically connected to the other end portion of the first wiring portion 51 via the anisotropic conductive layer 23. The drive IC 21 is electrically connected to the external wiring board 22 via the anisotropic conductive layer 23, and is electrically connected to the reference potential point via the external wiring board 22. By adopting such a configuration, the heat generating part 60a can be selectively heated by electrically connecting the first wiring part 51 and the reference potential point or by releasing the electrical connection. it can.

  The external wiring board 22 shown in FIG. 6 includes a first support board 221, a second support board 222, a circuit wiring layer 223, and an external connection member 224. The external wiring board 22 has a function that contributes to supplying power to the heat generating portion 60a.

The first support substrate 221 and the second support substrate 222 have a function of supporting the circuit wiring layer 223. In addition, the first support substrate 221 and the second support substrate 222 have a function of securing electrical insulation of the circuit wiring layer 223 as a pair. Here, “insulation” refers to the extent to which current does not substantially flow. For example, the electrical resistivity is 1.0 × 10 12 Ω · m or more. The first support substrate 221 and the second support substrate 222 of this example are configured in a rectangular shape extending in the main scanning directions D1 and D2 in plan view.

Examples of the material for forming the first support substrate 221 and the second support substrate 222 include ceramics, resin, and a composite material of ceramics and resin. Examples of this ceramic include alumina ceramics, aluminum nitride ceramics, silicon nitride ceramics, glass ceramics, and mullite ceramics. Examples of this resin include thermosetting or ultraviolet curable resins such as epoxy resins, polyimide resins, acrylic resins, phenol resins, and polyester resins. Among these forming materials, it is more preferable to employ a flexible resin such as a polyimide resin, an epoxy resin, and an acrylic resin. Here, “flexibility” means that the flexural modulus specified in JIS standard K7171: 1994 is, for example, 2.5 × 10 3 N · mm −2 or more and 4.5 × 10 3 N · mm −2 or less. That means. The first support substrate 221 and the second support substrate 222 of this example are formed of a polyimide resin. The thermal expansion coefficients of the first support substrate 221 and the second support substrate 222 that employ this polyimide resin are approximately 10 × 10 −6 K −1 . Note that the first support substrate 221 and the second support substrate 222 may be formed of different materials.

  The circuit wiring layer 223 contributes to supplying power to the heat generating part 60a. The circuit wiring layer 223 is provided between the first support substrate 221 and the second support substrate 222 in the thickness directions D5 and D6. The circuit wiring layer 223 is electrically connected to the second wiring portion 52 and the third wiring portion 53 via the anisotropic conductive layer 23. By adopting such a configuration, the circuit wiring layer 223, for example, supplies the driving power of the driving IC 21, the clock signal for controlling the timing, the image signal corresponding to the image to be printed, and the power supplied to the heating unit 60a to the head. It is supplied to the substrate 20. As a material for forming the circuit wiring layer 223, for example, any one of aluminum, gold, silver, and copper, or an alloy thereof can be used.

  The external connection member 224 contributes to supplying an electric signal to the head substrate 20 via the circuit wiring layer 223. The external connection member 224 is electrically connected to each circuit wiring layer 223. An example of what constitutes the external connection member 224 is a connector.

  The anisotropic conductive layer 23 is for electrically connecting the electric pattern layer 50 of the head substrate 20 to the driving IC 21 and the circuit wiring layer 223. More specifically, the electric pads 70 provided on the electric pattern layer 50 of the head substrate 20 and the circuit wiring layer 223 are electrically and mechanically connected. The anisotropic conductive layer 23 is formed by curing the anisotropic conductive material in a state where the electric pattern layer 50 and the driving IC 21 or the circuit wiring layer 223 are in contact with each other through the anisotropic conductive material. can do. Examples of the anisotropic conductive material include a material in which conductive particles are contained in a resin material such as thermosetting. Examples of the conductive particles include metal, resin mixed with a conductive material, and resin coated with metal. As the anisotropic conductive layer 23 of this example, a material obtained by adding metal particles to a thermosetting resin is employed. Further, in the anisotropic conductive layer 23 of this example, the surface density of the conductive particles is different between the first wiring part 51, the second wiring part 52, the third wiring part 53, and the insulating part 54. Many exist on the first wiring part 51, the second wiring part 52, and the third wiring part 53. Here, the “surface density” refers to the number per unit area of conductive particles present on the part in plan view. This surface density is equal to the conductive particles in the anisotropic conductive layer 23 on the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53 in the cross section in the plane direction of the anisotropic conductive layer 23. The conductive particles in the anisotropic conductive layer 23 on the insulating portion 54 are counted and defined.

F head substrate 2 0, anisotropic conductive layer 23 is present more in the top of the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53 than on the insulating portion 54 since, it is possible to increase the component ratio of the conductive particles on the first through third wiring portion 51,5 2, 53, and first to third wiring portion 51,5 2, 53, other drive IC21 and external The electrical connection with the wiring board 22 can be improved. Further, the conductive particles are present more on the insulating portion 54 than on the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. The composition ratio of the resin material can be increased, and the mechanical connection between the insulating portion 54 and the other driving IC 21 and the external wiring substrate 22 can be improved.

  The head substrate 20 includes a base substrate 30 and an electric pattern layer 50 provided on the base substrate 30, and the electric pattern layer 50 is formed by including a metal material. 3 wiring parts 51, 52, 53 and a metal material provided in contact with the first to third wiring parts 51, 52, 53 and forming the first to third wiring parts 51, 52, 53 And an insulating portion 54 formed by containing a metal oxide formed by oxidizing the insulating portion 54, the insulating portion 54 having a thickness compared to the first to third wiring portions 51, 52, 53. It protrudes in the direction D6 in the directions D5 and D6. Therefore, even if the head substrate 20 is connected to the first to third wiring portions 51, 52, 53, the drive IC 21 and the external wiring substrate 22 via the anisotropic conductive layer 23, the anisotropic conductive layer 23. It is possible to reduce the amount of the conductive particles constituting the first and second wiring parts 51, 52, and 53 from being increased. Therefore, in the head base 20, mechanical connection is satisfactorily performed on the drive IC 21 and the external wiring board 22 and the insulating portion 54, and electrical connection is performed on the first to third wiring portions 51, 52, 53. This can be carried out well, and the reliability can be improved.

  In the head base 20, since the insulating portion 54 has holes therein, the first to third wiring portions 51, 52, 53, the drive IC 21 and the external wiring substrate 22 are made of a thermosetting resin material. Even if connected through the anisotropic conductive layer 23 to be formed, the applied heat can be stored well. Therefore, with this head substrate 20, the production efficiency can be increased.

  The head substrate 20 has an electric pad 70 provided on the first to third wiring portions 51, 52, 53, and the electric pad 70 is larger than the diameter of the upper surface in the thickness directions D5, D6. Since the diameter of the lower surface is small, even if the electric pad 70, the driving IC 21 and the external wiring board 22 are connected via the anisotropic conductive layer 23, the mechanical bonding strength is increased by the anchor effect due to the difference in diameter. In addition, since the conductive particles constituting the anisotropic conductive layer 23 are strongly pressed against the electric pad 70 by the anchor effect, the electrical connection can be performed satisfactorily.

  The thermal head 10 is provided with a plurality of heat generating portions 60a on the base substrate 30 of the head base 20 along the main scanning directions D1 and D2. Therefore, the thermal head 10 can enjoy the effects of the head substrate 20. Therefore, in the thermal head 10, electrical and mechanical reliability can be improved.

  In the thermal head 10, even when the plurality of heat generating portions 60a are electrically connected to the conductive layer, the electrical and mechanical reliability can be improved. Therefore, the wiring portion that supplies power to the heat generating element. The distance between them can be shortened. Therefore, in this recording head, the density of the plurality of heating elements can be increased.

<Manufacturing method of wiring board and recording head>
Next, a method for manufacturing a wiring board according to the present invention will be described using the above-described head substrate 20 and thermal head 10 as examples of the wiring board and the recording head.

<Preparation process of base substrate body>
First, as shown in FIG. 7 (a), preparing a base substrate body 30X has a split groove 30X 1. The dividing groove 30X 1, by dividing the base substrate body 30X along the dividing groove 30X 1, the main portion of the divided base substrate body 30X is provided so that the base substrate 30. That is, the base substrate element 30X has an area serving as a base substrate 30 that is divided by the dividing groove 30X 1.

<Glaze layer forming process>
Next, the glaze layer 40X to be the glaze layer 40 is formed on the base substrate body 30X. Specifically, a substantially flat glaze film is formed on the entire upper surface on the D5 direction side of the thickness direction D5, D6 of the base substrate body 30X by a film forming technique such as printing and sputtering. Next, the glaze film is etched by a film forming technique such as a printing method and sputtering to form a glaze layer 40X having a portion that becomes the protruding portion 40b.

<Formation process of conductive film>
Next, the conductive film 50X is formed on the entire upper surface on the D5 direction side in the thickness directions D5 and D6 of the glaze layer 40X. Specifically, the conductive film 50X is formed by forming a substantially flat film on the glaze layer 40X by a film formation technique such as sputtering and vapor deposition. In this example, aluminum is adopted as a material for forming the conductive film 40X.

<Process for forming wiring pattern layer>
Next, as shown in FIG. 7B, the electric pattern layer 50 is formed on the glaze layer 40X. Specifically, first, a mask is formed over the conductive film 50X by a fine processing technique such as photolithography. Next, processing is performed by using a fine processing technique such as photolithography so that a part of the conductive film 50X located on the region where the insulating portion 54 is formed is exposed from the mask. Next, a part of the exposed conductive film 50X is anodized to form an insulating portion 54. As a result, it is possible to form the electrical pattern layer 50 in which other portions of the conductive film 50X that remain without being anodized function as the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. This anodic oxidation is performed by immersing the conductive film 50X in the solution and applying a positive voltage to the conductive film 50X and a negative voltage to the solution. Examples of this solution include electrolytes such as phosphoric acid, boric acid, oxalic acid, tartaric acid, and sulfuric acid.

<Formation process of electric resistance layer>
An electric resistance layer 60 is formed on the electric pattern layer 50. Specifically, first, a resistor film is formed by a film formation technique such as sputtering and vapor deposition. Next, the resistor film is formed into a pattern that covers a part of the first wiring part 51, the second wiring part 52, the third wiring part 53, and the insulating part 54 by a fine processing technique such as photolithography. The electrical resistance layer 60 is formed by processing. At this time, it is important to provide the portions of the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53 where the electric pads 70 are provided so as to be exposed from the electric resistance layer 60. In addition, since the formation process of this electrical resistance layer is provided in the site | part different from the cross section shown to FIG. 7, 8, it is not shown by FIG.

<Electric pad formation process>
An electric pad 70 is formed on the electric pattern layer 50.

  First, as shown in FIG. 7C, a resist film 90X that covers the electrical pattern layer 50 and the electrical resistance layer 60 is formed on the entire top surface of the base substrate body 30X. When the resist film 90X is formed, it is important that the resist film 90X be thicker than the electric pad 70 to be formed.

  Next, as illustrated in FIG. 8A, the resist film 90 </ b> X is exposed and developed using an exposure mask to form a resist mask 90. At the time of this exposure, a through hole 91 that penetrates the resist mask 90 from the upper surface toward the upper surface of the electric pattern layer 50 is provided in a portion where the electric pad 70 is formed from the resist mask 90. The through hole 91 is provided such that the diameter of the inner wall surface 91a is smaller on the lower surface side than on the upper surface side. Further, the through hole 91 is provided so that the diameter in the planar direction of the inner wall surface 91a becomes smaller as it goes from the upper surface side to the lower surface side, that is, as it approaches the electric wiring layer 60 side. For this reason, the inner wall surface of the through hole 91 is inclined such that the upper surface side is located on the outer side from the center of the lower surface side and the lower surface side is narrowed. When forming the electric pad 70, it is important to make the thickness of the electric pad 70 smaller than the thickness of the resist mask 90. Since the electric pad 70 is provided so as to fill the through hole 91, when the thickness of the electric pad 70 is made smaller than the thickness of the resist mask 90, as a result, the side surface of the electric pad 70 extends along the inner wall surface 91 a of the through hole 91. Will be provided. In this way, the electric pad 70 has a lower surface diameter smaller than the upper surface diameter, and becomes smaller as the diameter approaches the D6 direction side in the thickness directions D5 and D6.

  Next, the base substrate body 30X on which the resist mask 90 is formed is etched using an etching solution, and the surface oxide film on the portion exposed through the through hole 91 of the electrical pattern layer 50 is removed.

  Next, as shown in FIG. 8B, the base substrate body 30 </ b> X on which the resist mask 90 is formed is subjected to a zincate process using a zincate process liquid, and is exposed through the through holes 91 of the electrical pattern layer 50. The zinc film 70 </ b> X is formed by replacing aluminum forming the electric pattern layer 50 and zinc in the portion.

  Next, as shown in FIG. 8C, the base substrate body 30X on which the resist mask 90 is formed is subjected to an electroless plating process using a plating solution to replace the zinc film 70X and nickel, An electric pad 70 made of nickel is formed.

  In this way, a large number of base substrate bodies 30X can be manufactured.

<Step of dividing base substrate body>
Along the dividing groove 30X 1 divides the multi-piece base substrate body 30X, the glaze layer 40, the electrical pattern layer 50, and the electrical resistance layer 60, the base substrate 30 and the electric pad 70 is provided on the upper surface Get.

<Protective layer formation process>
A protective layer 80 covering the electric pattern layer 50 and the electric resistance layer 60 is formed. Specifically, first, a mask is formed so as to expose a portion to be protected by the protective layer 80 by a fine processing technique such as photolithography. Next, the protective layer 80 is formed by a film formation technique such as sputtering or vapor deposition.

  The head substrate 20 of this example is manufactured as described above.

<Drive IC placement process>
Next, the electrical pattern layer 50 of the head substrate 20 and the drive IC 21 are electrically connected via the anisotropic conductive layer 23. Specifically, first, an anisotropic conductive material to be the anisotropic conductive layer 23 is deposited on the electric pad 70. In this example, the anisotropic conductive material is deposited by sticking. Next, the electric pad 70 and the driving IC 21 are opposed to each other through an anisotropic conductive material. Next, the anisotropic conductive material is heated while pressing the driving IC 21 against the electric pad 70 to electrically connect the electric pad 70 and the driving IC 21 via the anisotropic conductive layer 23. Note that the anisotropic conductive material becomes the anisotropic conductive layer 23 by the heat applied during the electrical connection. Further, by curing the anisotropic conductive material while pressing, first and second recesses are relatively recessed from above the insulating portion 54 from which the conductive particles in the anisotropic conductive material protrude relatively. It can be moved onto the wiring portions 51 and 52.

<External wiring board placement process>
Next, the electrical pattern layer 50 of the head base 20 and the external wiring substrate 22 are electrically connected via the anisotropic conductive layer 23. Specifically, first, an anisotropic conductive material to be the anisotropic conductive layer 23 is deposited on the electric pad 70. In this example, the anisotropic conductive material is deposited by sticking. Next, the electric pad 70 and the circuit wiring layer 223 of the external wiring board 22 are opposed to each other through an anisotropic conductive material. Next, the anisotropic conductive material is heated while pressing the external wiring board 22 against the electric pad 70, and the electric pad 70 and the external wiring board 22 are electrically connected through the anisotropic conductive layer 23. Note that the anisotropic conductive material becomes the anisotropic conductive layer 23 by the heat applied during the electrical connection. In addition, by curing the anisotropic conductive material while pressing, the second and third recesses are relatively recessed from above the insulating portion 54 from which the conductive particles in the anisotropic conductive material protrude relatively. It can be moved on the wiring parts 52 and 53.

  As described above, the thermal head 10 of this example can be manufactured.

  The manufacturing method of the head substrate 20 includes a preparation step of preparing the base substrate body 30, a formation step of forming a conductive film 50X containing a metal material on the base substrate body 30X, and oxidizing the metal material. A forming step of forming an electric pattern layer 50 in which a part of the conductive film 50X serves as the insulating portion 54 and the portions of the conductive film 50X that have not oxidized the metal material are the first to third wiring portions 51, 52, and 53. Prepare. Therefore, the manufacturing method of the head substrate 20 can manufacture the head substrate 20 satisfactorily.

  The manufacturing method of the head substrate 20 corresponds to the step of providing an anisotropic conductive material containing conductive particles on the first to third wiring portions 51, 52, and 53 and the first to third wiring portions 51, 52, and 53. An electric element (driving IC 21 or external wiring board 22) having a connecting terminal is disposed on the anisotropic conductive material, and the electric element is pressed to connect the connecting terminal to the first to third wiring parts 51, 52, 53, and a step of increasing the surface density of the conductive particles of the anisotropic conductive material on the first to third wiring parts 51, 52, 53 as compared with the insulating part 54. The electrical connection with the electrical element can be satisfactorily performed on the insulating portion 54, and the electrical connection can be satisfactorily performed on the first to third wiring portions 51, 52, and 53. Can be increased.

In the manufacturing method of the head substrate 20 of this example, the formation process of the electric pad 70 is performed after the formation process of the wiring pattern layer 50. However, the formation process of the electric pad 70 is performed before the formation process of the wiring pattern layer 50. You may go. As a specific process, first, the conductive film 50X is formed on the glaze layer 40X. Next, the electric pad 70 is formed on the conductive film 50X. At this time, the electric pad 70 is formed on the parts to be the first to third wiring parts 51, 52, 53. Next, a part of the conductive film 50 </ b> X around the electric pad 70 is anodized to form the insulating portion 54. As a result, it is possible to form the electrical pattern layer 50 in which other portions of the conductive film 50X that remain without being anodized function as the first wiring portion 51, the second wiring portion 52, and the third wiring portion 53. In addition, the specific method in each process can be performed similarly to the above-mentioned method.
<Recording device>
A thermal printer 1 as an example of an embodiment of the recording apparatus of the present invention shown in FIG. 9 has a thermal head 10, a transport mechanism 11, and a control mechanism 12.

  The transport mechanism 11 has a function of bringing the recording medium P into contact with the protective layer 80 located on the heat generating portion 60a of the thermal head 10 while transporting the recording medium P in the D3 direction in the sub-scanning directions D3 and D4. is there. The transport mechanism 11 includes a platen roller 111 and transport rollers 112, 113, 114, and 115.

  The platen roller 111 has a function of pressing the recording medium P against the protective layer 80 located on the heat generating portion 60a. The platen roller 111 is rotatably supported in contact with the protective layer 80 located on the heat generating portion 60a. The platen roller 111 of this example has a configuration in which the outer surface of a columnar base is covered with an elastic member. The base is made of, for example, a metal such as stainless steel, and the elastic member is made of, for example, butadiene rubber having a thickness dimension in the range of 3 mm to 15 mm. That is, in the thermal printer 1 according to the present embodiment, the recording medium P is brought into sliding contact with the thermal head 10 by the elastic pressure of the elastic member constituting the platen roller.

  The transport rollers 112, 113, 114, and 115 have a function of transporting the recording medium P. That is, the transport rollers 112, 113, 114, and 115 supply the recording medium P between the heat generating portion 60 a of the thermal head 10 and the platen roller 111, and between the heat generating portion 60 a of the thermal head 10 and the platen roller 111. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 112, 113, 114, and 115 may be formed of, for example, a metal columnar member. For example, like the platen roller 111, the outer surface of the columnar substrate is covered with an elastic member. There may be.

  The control mechanism 12 has a function of supplying image information to the drive IC 21. That is, the control mechanism 12 plays a role of supplying image information for selectively driving the heat generating portion 60a to the drive IC 21.

  The thermal printer 1 includes a thermal head 10. Therefore, the thermal printer 1 can enjoy the effects of the head substrate 20. Therefore, the thermal printer 1 can increase electrical and mechanical reliability.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In the present embodiment, the thermal head 10 is described as an example of the recording head, but the present invention is not limited to the thermal head. Even when the configuration of the present invention is employed in a heat-generating element such as an ink jet head or an LED head, the same effect can be obtained.

  In the second wiring part 52 of the present example, it is connected to three or more heat generating parts 60a. However, the structure is not limited to such a structure. For example, the first wiring part is connected to two heat generating parts. It may be configured.

DESCRIPTION OF SYMBOLS 1 Thermal printer 10 Thermal head 11 Conveyance mechanism 111 Platen roller 112,113,114,115 Conveyance roller 12 Drive mechanism 20 Head base | substrate (wiring board)
21 Drive IC
22 External Wiring Board 221 First Support Board 222 Second Support Board 223 Circuit Wiring Layer 224 External Connection Member 23 Anisotropic Conductive Layer 30 Base Board 30X Base Board Base 40 Glaze Layer 40X Glaze Layer 40a Base 40b Protrusion 50 Electric Pattern Layer 50X Conductive film 51 First wiring part (part of wiring part)
52 2nd wiring part (a part of wiring part)
53 3rd wiring part (a part of wiring part)
54 Insulating part 60 Electrical resistance layer 60a Heat generating part (heat generating element)
70 Electric Pad 70X Zinc Film 80 Protective Layer 90 Resist Mask 90X Resist Film 91 Through Hole P Recording Medium

Claims (5)

  1. A base substrate; and an electric pattern layer provided on the base substrate. The electric pattern layer is in contact with a wiring portion formed of a metal material and around the wiring portion. A wiring board that includes an insulating portion that includes a metal oxide formed by oxidizing the metal material and protrudes in a thickness direction as compared to the wiring portion ; ,
    An anisotropic conductive material electrically connected to the wiring board,
    An electrical pad is provided on the wiring part,
    The electric pad has a lower surface diameter smaller than a diameter of the upper surface in the thickness direction, a side surface connecting the upper surface and the lower surface is inclined, and the anisotropic conductive material is provided between the side surface and the wiring portion. A recording head characterized by entering into an enclosed area .
  2. The recording head according to claim 1, wherein the insulating portion has a hole therein.
  3. Recording head according to claim 1 or 2, characterized in that a plurality of heating elements are provided along the main scanning direction over the prior SL-based substrate.
  4. The recording head according to claim 3 , wherein the plurality of heating elements are electrically connected to the wiring portion.
  5. A recording head according to any one of claims 1 to 4, the recording apparatus characterized by comprising a transport mechanism for transporting the recording medium to the recording head.
JP2009176302A 2009-07-29 2009-07-29 Recording head and recording apparatus Expired - Fee Related JP5363898B2 (en)

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Publication number Priority date Publication date Assignee Title
WO2012133178A1 (en) * 2011-03-25 2012-10-04 京セラ株式会社 Thermal head and thermal printer provided with same
CN102729642B (en) * 2011-04-13 2014-12-31 罗姆股份有限公司 Thermal head and manufacture method thereof
JP5865630B2 (en) * 2011-08-23 2016-02-17 京セラ株式会社 Electrode structure, semiconductor element, semiconductor device, thermal head, and thermal printer
JP2013229491A (en) * 2012-04-26 2013-11-07 Kyocera Corp Electrode structure, semiconductor element, semiconductor device, thermal head, and thermal printer
CN107914472B (en) * 2016-10-11 2020-03-03 罗姆股份有限公司 Thermal print head and method of manufacturing thermal print head

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JPS62105646A (en) * 1985-11-02 1987-05-16 Nippon Kogaku Kk <Nikon> Thermal head
JPH048559A (en) * 1990-04-27 1992-01-13 Hitachi Ltd Thermal head
JPH04179187A (en) * 1990-11-09 1992-06-25 Hitachi Ltd Electronic circuit board
JPH06238932A (en) * 1993-02-18 1994-08-30 Oki Electric Ind Co Ltd Thermal head and its manufacture
JP2003220724A (en) * 2002-01-30 2003-08-05 Kyocera Corp Thermal head

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