JP5322314B2 - Floor panel - Google Patents

Description

  The present invention relates to a floor panel constituting a free access floor.

  The floor panel is a free access floor structure having a double floor structure in which a second floor portion is provided with a space above a first floor portion of a concrete base of a building structure. It is used for the part.

  In the conventional floor panel, for example, after applying an adhesive to the back surface of a panel substrate made of calcium silicate, there is one in which a reinforcing metal plate (reinforcing plate member) is bonded to the back surface of the panel substrate (for example, Patent Document 1). The reinforcing metal plate was formed in a substantially box shape with a peripheral portion bent upward and a shallow bottom.

  According to such a conventional floor panel, since the strength of the panel substrate can be improved by the reinforcing metal plate, the panel substrate can secure a desired strength.

Japanese Utility Model Publication No. 5-18429 JP-A-62-294541

  However, in the above-mentioned conventional floor panel, since the reinforcing metal plates are bonded to the back side of the panel substrate, the both surfaces are bonded uniformly over the entire surface with an adhesive. There was a problem that was difficult.

  That is, the floor panel is required for mass production and needs to be manufactured in a short time. For example, the adhesive is applied by concentrating the supplied adhesive on the center of the surface to be bonded. It has been necessary to use a simple method that does not require time and effort, such as pressing between the upper and lower surfaces and applying the adhesive to the entire surface to be bonded by this pressing force.

  However, depending on the method of applying the adhesive, the conventional floor panel is applied so as to spread the adhesive with the pressing force over the entire surface to be bonded. There was a problem that the adhesive could not be spread all the way to the corners over the entire bonding surface of the metal plate.

  Further, in such a conventional floor panel, it is necessary to increase the supply amount of the adhesive in order to spread the adhesive to the corners on the entire back surface of the panel substrate and the adhesive surface of the reinforcing metal plate. For this reason, there is a problem that the adhesive protrudes from between the upper and lower surfaces, and a large amount of the adhesive is wasted.

  On the other hand, as a conventional floor panel, in addition to the floor panel, a mortar or the like is placed on a metal plate on which a large number of inverted L-shaped projections protruding on the upper surface are formed. In some cases, the floor panel is manufactured by integrating the metal plate and the mortar, etc., on which the protrusions are formed by press forming by pressing between the upper and lower molds attached to (see, for example, Patent Documents) 2).

  The conventional floor panel formed by integrating such a metal plate and mortar can improve the adhesion between the metal plate and the mortar by the protrusions. Since it is necessary to provide the protrusions for biting on the plate, the structure becomes complicated, so that there is a problem that the manufacturing cost becomes high.

  Therefore, in view of the above problems, the present invention simplifies the structure, and the bonding surface between the panel substrate and the reinforcing plate member can be bonded uniformly over the entire surface and used for bonding. It is an object of the present invention to provide a floor panel that can prevent a large amount of adhesive from being wasted.

In order to solve the above problems, the floor panel according to the present invention is:
A floor panel comprising a plate-shaped panel substrate and a reinforcing plate member bonded to the back surface of the panel substrate,
Over almost the entire back surface of the panel substrate, a grid-like groove is formed that is recessed along a plurality of straight lines in two directions orthogonal to each other .
The reinforcing plate member has a substantially box shape having a bottom plate portion having a smooth upper surface bonded to substantially the entire back surface of the panel substrate by an adhesive and a rising portion formed on a peripheral portion of the bottom plate portion. It is characterized by being formed .

According to such a floor panel of the present invention,
A floor panel comprising a plate-shaped panel substrate and a reinforcing plate member bonded to the back surface of the panel substrate,
By forming a groove over substantially the entire back surface of the panel substrate,
In addition to simplifying the structure, the bonding surface between the panel substrate and the reinforcing plate member can be bonded uniformly over the entire surface, and a large amount of adhesive used for bonding is prevented from being wasted. can do.

It is a disassembled perspective view which shows the panel board | substrate 22 and the reinforcement board member 24 of the floor panel 20 which concern on one embodiment of this invention. It is a bottom view which shows the back surface of the panel board | substrate 22 shown in FIG. It is a side surface expanded sectional view in the state where the panel board | substrate 22 and the reinforcement board member 24 of the floor panel 20 shown in FIG. 1 were adhere | attached. It is a figure for demonstrating the manufacturing method of the panel board | substrate 22, Comprising: It is side sectional drawing which shows the state which mounted the semi-fluid concrete 30 before solidifying on the inner bottom face 26a of the shaping | molding lower mold | type 26. FIG. It is also a figure for demonstrating the manufacturing method of the panel board | substrate 22, Comprising: The state with which the concrete 30 of the semi-fluid body before combining the lower mold | type 26 for shaping | molding and the upper mold | type 28 for shaping | molding, and solidifying in the type | mold was filled. It is side surface sectional drawing shown. It is also a figure for demonstrating the manufacturing method of the panel board | substrate 22, Comprising: The lower substrate 26 for shaping | molding and the upper mold | type 28 for shaping | molding are isolate | separated, and the panel board | substrate 22 which the semi-fluid concrete 30 solidified in the type | mold It is side surface sectional drawing which shows the state which took out.

  EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing the floor panel which concerns on this invention is demonstrated concretely based on drawing. FIGS. 1 to 6 are views referred to for explaining a floor panel 20 according to an embodiment of the present invention.

  As shown in FIG. 1, a floor panel 20 according to an embodiment of the present invention includes a panel substrate 22 formed in a substantially square plate shape, and a reinforcing iron plate 24 bonded to the back surface of the panel substrate 22 ( Reinforcing plate member).

  The panel substrate 22 of the floor panel 20 is made of concrete, and as shown in FIGS. 2 and 3, a groove 22b is formed over substantially the entire surface from the center of the back surface 22a to the vicinity of the outer periphery.

  The groove portion 22b is formed on the back surface 22a of the panel substrate 22 by being recessed along a plurality of stripes parallel to one side thereof and recessed along the plurality of stripes perpendicular to the one side. In combination with the grooves, the lattice shapes are arranged side by side in both the vertical and horizontal directions.

  As shown in FIG. 3, the upper half of the upper half of the height (thickness) direction of the panel substrate 22 has a constant horizontal outer dimension, which is the outer dimension of the reinforcing iron plate 24. It is formed larger than the dimension.

  The lower height portion of the lower half of the height direction of the panel substrate 22 gradually decreases in outer dimension in the horizontal direction as it approaches the back surface 22a from the upper height portion to the peripheral portion in the horizontal direction. It is formed in an inverted trapezoidal shape having an inclined portion 22c.

  Next, FIGS. 4 to 6 are views referred to for explaining a method of manufacturing the panel substrate 22 of the floor panel 20.

  As shown in FIG. 4, first, the semi-fluid concrete 30 is placed on the inner bottom surface 26 a of the lower mold 26 for molding. On the inner bottom surface 26a of the molding lower mold 26, protrusions 26b protruding upward from the surface are formed in a lattice shape as viewed from above.

  As shown by the arrows in FIG. 4, the molding upper die 28 is lowered from the upper side to apply a pressing force to the molding lower die 26, and is placed on the inner bottom surface 26 a of the molding lower die 26. As shown in FIG. 5, the semi-fluid concrete 30 is expanded in the horizontal direction, and is filled without gaps in the mold space formed inside the lower mold 26 and the upper mold 28.

  When the semi-fluid concrete 30 inside the mold space is sufficiently solidified, the lower mold 26 and the upper mold 28 are separated as shown in FIG. The panel substrate 22 thus formed is taken out.

  The panel substrate 22 thus taken out has a groove 22b formed on the back surface 22a by the lattice-shaped protrusions 26b on the inner bottom surface 26a of the lower mold 26 for molding. A lattice-like groove 22b as shown in FIG. 2 is formed.

  Next, as shown in FIG. 1, the reinforcing steel plate 24 of the floor panel 20 has a substantially square iron plate portion 24a and a rising portion that is bent so as to rise vertically from the four sides of the peripheral portion of the iron plate portion 24a. 24b, and is formed in a substantially box shape with a shallow bottom.

  As shown in FIG. 3, the panel substrate 22 can be placed on the iron plate portion 24a. At this time, the upper end of the rising portion 24b is engaged with the inclined portion 22c of the panel substrate 22. Yes.

  As shown in FIG. 3, the panel substrate 22 and the reinforcing iron plate 24 are bonded to each other by bonding the back surface 22a thereof and the inner bottom surface 24c, which is the upper surface of the iron plate portion 24a, using an adhesive. 22a and the inner bottom surface 24c are fixed to each other.

  In order to bond the back surface 22a and the inner bottom surface 24c, when an adhesive is put between them and they are overlapped, a groove 22b is formed on the back surface 22a of the panel substrate 22, and therefore one adhesive is used. The part enters the groove 22b and is held there.

  Further, the adhesive that has entered the groove 22b travels through the groove 22b formed on the substantially entire back surface 22a of the panel substrate 22, and is subsequently pushed and moved by the adhesive that has entered the groove 22b. By doing so, it spreads over substantially the entire back surface 22a, and can be passed to every corner.

  For this reason, the back surface 22a of the panel substrate 22 and the inner bottom surface 24c of the reinforcing plate member 24 can be uniformly bonded over the entire surface. In addition, since a part of the adhesive used for bonding the panel substrate 22 and the reinforcing iron plate 24 is held in the groove 22b, the amount of the adhesive protruding from the upper and lower two bonding surfaces can be reduced, so that the adhesive A large amount can be prevented from being wasted.

  In addition, since the reinforcing plate member 24 of the floor panel 20 has the rising portion 24b, even if the adhesive protrudes from between the upper and lower two adhesive surfaces, the reinforcing plate member 24 has an outside surface from the inner bottom surface 24c. , It can prevent the adhesive from leaking significantly.

  Further, since the reinforcing plate member 24 of the floor panel 20 has the rising portion 24b, the adhesive protruding from between the upper and lower two adhesive surfaces is the outer peripheral surface rising from the back surface 22a of the panel substrate 22 and the reinforcing plate member. The outer peripheral edge portions of the back surface 22a and the inner bottom surface 24c can be fixed to each other by going around between the 24 rising portions 24b.

  As described above, according to the floor panel 20 according to the embodiment of the present invention, it is not necessary to provide a protrusion on the iron plate unlike the latter of the conventional floor panel, so that the structure is simple. Can be.

  Further, the back surface 22a of the panel substrate 22 and the inner bottom surface 24c of the reinforcing plate member 24 can be bonded uniformly over the entire surface, and a large amount of adhesive is present between the two surfaces of the back surface 22a and the inner bottom surface 24c. It can be prevented that it sticks out and is wasted.

  The panel substrate 22 in the floor panel 20 according to the above embodiment is formed in a substantially square plate shape, but is formed in, for example, a rectangular plate shape or other polygonal plate shape. It may come to be.

  Moreover, although the panel board | substrate 22 in the said embodiment was formed using concrete as a material, as long as it is a material which can be used for the floor panel 20, what kind of other things, such as a calcium silicate, are used? It may be formed using a material.

  In the embodiment, the groove 22b formed on the back surface 22a of the panel substrate 22 includes a groove formed along a plurality of lines parallel to one side of the panel substrate 22 and a plurality of grooves perpendicular to the one side. In combination with the grooves formed along the stripes, the lattice shapes are arranged in both the vertical and horizontal directions, but the present invention is not limited to this. For example, the diagonal line of the back surface 22a of the panel substrate 22 By combining a groove formed along a plurality of parallel lines in one direction and a groove formed along a plurality of vertical lines in one of the diagonal lines, a panel substrate 22 is combined. A grid shape may be arranged in an oblique direction with respect to each of the sides.

  Moreover, as long as it is a groove | channel which can spread an adhesive agent to every corner, you may make it form a groove | channel along the stripes of what kind of shape other than a grid | lattice form.

  Further, the groove 22b of the panel substrate 22 in the above embodiment has its width, depth and number according to the material of the panel substrate 22 and the type of adhesive used for bonding the panel substrate 22 and the reinforcing iron plate 24. Etc. may be changed as appropriate.

20 floor panel 22 panel substrate 22a back surface 22b groove portion 22c inclined portion 24 reinforcing iron plate 24a iron plate portion 24b rising portion 24c inner bottom surface 26 molding lower die 26a inner bottom surface 26b projection portion 28 molding upper die 30 semi-fluid concrete

Claims (1)

A floor panel comprising a plate-shaped panel substrate and a reinforcing plate member bonded to the back surface of the panel substrate,
Over almost the entire back surface of the panel substrate, a grid-like groove is formed that is recessed along a plurality of straight lines in two directions orthogonal to each other .
The reinforcing plate member has a substantially box shape having a bottom plate portion having a smooth upper surface bonded to substantially the entire back surface of the panel substrate by an adhesive and a rising portion formed on a peripheral portion of the bottom plate portion. A floor panel characterized by being formed .

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