JP5309436B2 - 樹脂製微細構造物、その製造方法及び重合性樹脂組成物 - Google Patents
樹脂製微細構造物、その製造方法及び重合性樹脂組成物 Download PDFInfo
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- JP5309436B2 JP5309436B2 JP2006281173A JP2006281173A JP5309436B2 JP 5309436 B2 JP5309436 B2 JP 5309436B2 JP 2006281173 A JP2006281173 A JP 2006281173A JP 2006281173 A JP2006281173 A JP 2006281173A JP 5309436 B2 JP5309436 B2 JP 5309436B2
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- polymerizable
- fluorine
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- resist
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0053—Moulding articles characterised by the shape of the surface, e.g. ribs, high polish
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0002—Condition, form or state of moulded material or of the material to be shaped monomers or prepolymers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Photolithography (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
2,2,3,3,4,4,5,5−オクタフルオロ−1,6−ヘキシル ジアクリレート(SynQuest Laboratories,Inc.)を用いなかった他は実施例2と同様にして光硬化性レジスト単量前駆体組成物を調製した。ついで、この組成物を用いて実施例2と同様の方法でガラス基板上に5000rpmでスピン塗布しようとしたところ、液膜は基板全面の約1/3の面積にしか形成されなかった。
2,2,3,3,4,4,5,5−オクタフルオロ−1,6−ヘキシル ジアクリレートを用いなかった以外は、実施例2と同じ光硬化性レジスト単量前駆体組成物を調製して用いた。この組成物をガラス基板(5.1cmx5.1cm)上に滴下し、270Paまで減圧にしたあと、実施例2で使用したものと同じモールドを押し当て、超高圧水銀ランプを用いてUV光を照射した。このモールドは、実施例2の場合と同様、事前にオプツールDSX(ダイキン工業製)を用いて離型処理を施したものを使用した。UV光を80mJ/cm2照射した後、モールドを剥離した。得られた基板の表面に形成された形状をAFMにて観察した。観察の対象としたのは、径25nm、高さ50nmのレジストのピラー部である。観察の結果、モールドの凹凸形状が正常に転写されたピラー以外に、約58%のピラーで先端の欠損、もしくはピラー全体の欠損が見られた。
Claims (6)
- 数nm〜1000nmの最小寸法の微細凹凸パターンを有する構造物であって、該構造物が含フッ素有機化合物の重合体を0.5〜20重量%含む材料からなり、該含フッ素有機化合物は下記一般式(式1)〜(式3)
及び
で示される光重合可能な含フッ素有機化合物から選ばれた1種以上であることを特徴とする微細樹脂成形体。 - 前記含フッ素有機化合物は、前記成形体の1〜10重量%であることを特徴とする請求項1記載の微細樹脂成形体。
- 数nm〜1000nmの最小寸法の微細凹凸パターンを有する構造物であって、該構造物と樹脂膜が連結されて一体化され、該構造物と該樹脂膜が重合性含フッ素有機化合物の重合体を0.5〜20重量%含む材料からなり、前記重合性含フッ素有機化合物は、下記一般式(式1)〜(式3)
及び
で示される光重合可能な含フッ素有機化合物から選ばれた1種以上であることを特徴とする微細樹脂成形体。 - 前記含フッ素有機化合物は、前記微細樹脂成形体の樹脂成分の1〜10重量%であることを特徴とする請求項3記載の微細樹脂成形体。
- 表面に数nm〜1000nmの最小寸法の微細凹凸パターンを有するモールドを、重合性含フッ素有機化合物及びその重合開始剤を含む液状重合性樹脂組成物に接触して前記微細な凹凸パターンを上記重合性樹脂組成物に転写する工程と、上記モールドを前記重合性組成物に接触した状態で重合させる工程と、前記モールドを前記重合性樹脂組成物から分離する工程を含み、前記重合性含フッ素有機化合物は、下記一般式(式1)〜一般式(式3)
(R1およびR2は重合性不飽和結合を有するアルキル基、フェニル基、またはアラルキル基を表す。)
で示される光重合可能な有機フッ素化合物の1種以上であり、前記重合性組成物は該有機フッ素化合物を0.5〜20重量%含むことを特徴とする樹脂成形体の製造方法。 - 前記液状重合性樹脂組成物が、重合開始剤を除いて、重合性を示さない物質を実質的に含まないことを特徴とする請求項5に記載の微細樹脂成形体の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006281173A JP5309436B2 (ja) | 2006-10-16 | 2006-10-16 | 樹脂製微細構造物、その製造方法及び重合性樹脂組成物 |
CN200710180247.6A CN101173018B (zh) | 2006-10-16 | 2007-10-16 | 树脂制微细结构体、其制造方法及聚合性树脂组合物 |
US11/873,024 US7883764B2 (en) | 2006-10-16 | 2007-10-16 | Fine resinous structure, fabrication thereof, and polymerizable resin-precursor composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006281173A JP5309436B2 (ja) | 2006-10-16 | 2006-10-16 | 樹脂製微細構造物、その製造方法及び重合性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008095037A JP2008095037A (ja) | 2008-04-24 |
JP5309436B2 true JP5309436B2 (ja) | 2013-10-09 |
Family
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JP2006281173A Expired - Fee Related JP5309436B2 (ja) | 2006-10-16 | 2006-10-16 | 樹脂製微細構造物、その製造方法及び重合性樹脂組成物 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7883764B2 (ja) |
JP (1) | JP5309436B2 (ja) |
CN (1) | CN101173018B (ja) |
Cited By (1)
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2006
- 2006-10-16 JP JP2006281173A patent/JP5309436B2/ja not_active Expired - Fee Related
-
2007
- 2007-10-16 US US11/873,024 patent/US7883764B2/en not_active Expired - Fee Related
- 2007-10-16 CN CN200710180247.6A patent/CN101173018B/zh not_active Expired - Fee Related
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US10995215B2 (en) | 2017-07-12 | 2021-05-04 | EWHA University—Industry Collaboration Foundation | Fluoromonomer and fluorooligomer compounds, photopolymerizable composition, and hydrophobic film using the same |
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JP2008095037A (ja) | 2008-04-24 |
US7883764B2 (en) | 2011-02-08 |
CN101173018A (zh) | 2008-05-07 |
US20080167396A1 (en) | 2008-07-10 |
CN101173018B (zh) | 2012-11-21 |
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