JP5295669B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP5295669B2
JP5295669B2 JP2008182750A JP2008182750A JP5295669B2 JP 5295669 B2 JP5295669 B2 JP 5295669B2 JP 2008182750 A JP2008182750 A JP 2008182750A JP 2008182750 A JP2008182750 A JP 2008182750A JP 5295669 B2 JP5295669 B2 JP 5295669B2
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Prior art keywords
layer
wiring layer
insulating member
wiring
speed
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JP2008182750A
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Japanese (ja)
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JP2010021473A (ja
JP2010021473A5 (https=
Inventor
雄一郎 清水
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008182750A priority Critical patent/JP5295669B2/ja
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Publication of JP2010021473A5 publication Critical patent/JP2010021473A5/ja
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2008182750A 2008-07-14 2008-07-14 配線基板の製造方法 Active JP5295669B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008182750A JP5295669B2 (ja) 2008-07-14 2008-07-14 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008182750A JP5295669B2 (ja) 2008-07-14 2008-07-14 配線基板の製造方法

Publications (3)

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JP2010021473A JP2010021473A (ja) 2010-01-28
JP2010021473A5 JP2010021473A5 (https=) 2011-07-21
JP5295669B2 true JP5295669B2 (ja) 2013-09-18

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JP2008182750A Active JP5295669B2 (ja) 2008-07-14 2008-07-14 配線基板の製造方法

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JP (1) JP5295669B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253911A (ja) * 2010-06-01 2011-12-15 Shinko Electric Ind Co Ltd 配線基板
JP2013081327A (ja) * 2011-10-05 2013-05-02 Jtekt Corp 電動機用のステータおよびステータの製造方法
US9606430B2 (en) * 2014-08-28 2017-03-28 Xerox Corporation Method of aerosol printing a solder mask ink composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3587884B2 (ja) * 1994-07-21 2004-11-10 富士通株式会社 多層回路基板の製造方法
JP3852387B2 (ja) * 2002-08-30 2006-11-29 東陶機器株式会社 複合構造物の形成方法
JP2005183792A (ja) * 2003-12-22 2005-07-07 Mitsubishi Gas Chem Co Inc フリップチップ搭載用プリント配線板の製造方法
JP2006257501A (ja) * 2005-03-17 2006-09-28 Hitachi Cable Ltd 誘電体薄膜の製造方法
JP2006289683A (ja) * 2005-04-07 2006-10-26 Toto Ltd 複合構造物及び複合構造物の製造方法
JP2006326523A (ja) * 2005-05-27 2006-12-07 Canon Inc 成膜方法、該成膜方法により形成された圧電膜、および該圧電膜を備えた圧電素子、ならびに該圧電素子を用いたインクジェット装置

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