JP5257599B2 - 冷却部材の取付構造 - Google Patents
冷却部材の取付構造 Download PDFInfo
- Publication number
- JP5257599B2 JP5257599B2 JP2008292289A JP2008292289A JP5257599B2 JP 5257599 B2 JP5257599 B2 JP 5257599B2 JP 2008292289 A JP2008292289 A JP 2008292289A JP 2008292289 A JP2008292289 A JP 2008292289A JP 5257599 B2 JP5257599 B2 JP 5257599B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- cooling member
- support member
- cooling
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (1)
- 電装部品が電気的に接続される基板と、冷媒を導入する通路が形成され前記電装部品に接触する冷却部材と、前記基板に固定され前記電装部品を支持する支持部材と、前記冷却部材及び前記電装部品を前記支持部材に締結する締結手段とを備え、前記冷却部材と前記支持部材との間に前記電装部品を配置し、前記締結手段が、前記冷却部材及び前記電装部品を貫き前記支持部材に螺合するビスである冷却部材の取付構造であって、
前記支持部材が、前記基板の電装部品と反対側の面に沿って固定される板状部と、スリーブの内周に雌ねじを形成したスタッドナットとを接合したものであり、前記スタッドナットが、前記基板に形成した挿通孔を通して、前記基板から前記電装部品へ向けて突出し、前記ビスが前記スタッドナットに螺合したことを特徴とする冷却部材の取付構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008292289A JP5257599B2 (ja) | 2008-11-14 | 2008-11-14 | 冷却部材の取付構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008292289A JP5257599B2 (ja) | 2008-11-14 | 2008-11-14 | 冷却部材の取付構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010118606A JP2010118606A (ja) | 2010-05-27 |
JP5257599B2 true JP5257599B2 (ja) | 2013-08-07 |
Family
ID=42306062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008292289A Expired - Fee Related JP5257599B2 (ja) | 2008-11-14 | 2008-11-14 | 冷却部材の取付構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5257599B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101619012B1 (ko) * | 2012-04-27 | 2016-05-09 | 다이킨 고교 가부시키가이샤 | 냉동장치 |
KR101633780B1 (ko) * | 2014-03-18 | 2016-06-27 | 엘지전자 주식회사 | 공기조화기의 실외기 및 그 제조방법 |
JP6369722B2 (ja) * | 2014-07-10 | 2018-08-08 | 三菱重工サーマルシステムズ株式会社 | 発熱性電子部品を備えたコントローラおよび空気調和機 |
CN106610060B (zh) | 2015-10-26 | 2019-06-07 | Lg电子株式会社 | 空气调节器 |
JP6989760B2 (ja) * | 2017-07-19 | 2022-01-12 | ダイキン工業株式会社 | 電子機器 |
CN107493672B (zh) * | 2017-08-04 | 2019-07-30 | 广东美的制冷设备有限公司 | 电控板及制冷装置 |
JP6884241B1 (ja) * | 2020-01-29 | 2021-06-09 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291396U (ja) * | 1988-12-28 | 1990-07-19 | ||
JP2500781Y2 (ja) * | 1990-03-31 | 1996-06-12 | 富士通テン株式会社 | 半導体素子の放熱構造 |
JP3725257B2 (ja) * | 1996-08-27 | 2005-12-07 | 富士通株式会社 | 実装部品の冷却構造 |
JP4140138B2 (ja) * | 1999-08-30 | 2008-08-27 | 横河電機株式会社 | プリント基板の冷却構造 |
JP3102365U (ja) * | 2003-12-18 | 2004-07-02 | 華▲孚▼科技股▲ふん▼有限公司 | ヒートシンク装置の留め具 |
-
2008
- 2008-11-14 JP JP2008292289A patent/JP5257599B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2010118606A (ja) | 2010-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5257599B2 (ja) | 冷却部材の取付構造 | |
JP4129027B2 (ja) | 半導体装置 | |
US20080019095A1 (en) | Configurable heat sink with matrix clipping system | |
US7881060B2 (en) | Heat-dissipation module and electronic apparatus having the same | |
US9382938B2 (en) | Sprung washer and fixing device | |
JP2010114121A (ja) | 電装部品の放熱器 | |
JP6182474B2 (ja) | 電子部品の固定構造および固定方法 | |
JP6722540B2 (ja) | 放熱構造および電子機器 | |
JP2010123892A (ja) | 半導体装置の固定具及びその取付構造 | |
US10790215B1 (en) | Heat dissipation device | |
JP2007305649A (ja) | 放熱器固定手段 | |
US20140345830A1 (en) | Dc motor device and dc fan using the same | |
JP5787435B2 (ja) | 半導体放熱装置 | |
JP5148755B2 (ja) | 多層印刷回路基板の固定構造 | |
JP5085429B2 (ja) | 回路ユニットの放熱構造 | |
JP2008135422A (ja) | モータ制御装置 | |
US20120119351A1 (en) | System for clamping heat sink | |
JPWO2017138341A1 (ja) | 放熱装置および放熱装置の組み立て方法 | |
JP3748733B2 (ja) | 電子機器の放熱装置 | |
JP4417199B2 (ja) | 電子部品の取付構造 | |
KR100910227B1 (ko) | 반도체 모듈용 냉각 유닛 | |
JP2008172146A (ja) | 電力半導体装置 | |
JP2011258831A (ja) | 冷却装置の固定構造 | |
JP5443725B2 (ja) | 半導体装置の取付構造 | |
JP2014067824A (ja) | 電気部品の取付構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110811 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120921 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120926 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121126 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130327 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130409 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160502 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |