JP5237539B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5237539B2 JP5237539B2 JP2006254803A JP2006254803A JP5237539B2 JP 5237539 B2 JP5237539 B2 JP 5237539B2 JP 2006254803 A JP2006254803 A JP 2006254803A JP 2006254803 A JP2006254803 A JP 2006254803A JP 5237539 B2 JP5237539 B2 JP 5237539B2
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- light
- light emitting
- optical member
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Led Device Packages (AREA)
Description
以下、本実施形態の発光装置について図1〜図4を参照しながら説明する。
以下、本実施形態の発光装置1を図5〜図9に基づいて説明する。
以下、本実施形態の発光装置を図10および図11に基づいて説明する。
以下、本実施形態の発光装置を図12〜図17に基づいて説明するが、実施形態2と同様の構成要素には同一の符号を付して、その説明は省略する。
10 LEDチップ
14 ボンディングワイヤ
20 実装基板
21 金属板(伝熱板)
22 配線基板
22a 絶縁性基材
23 リードパターン
30 サブマウント部材
50 封止部
60 光学部材
70 保護カバー
Claims (1)
- LEDチップと、前記LEDチップが搭載された実装基板と、透光性材料により形成されて前記LEDチップおよび前記LEDチップの電極に電気的に接続されたボンディングワイヤを封止する封止部と、前記封止部を透過した前記LEDチップからの放射光の配光を制御する光学部材と、前記光学部材を覆うようにして前記実装基板に配置された保護カバーとを備え、
前記実装基板は、熱伝導性材料からなり前記LEDチップが搭載される伝熱板と、前記伝熱板における前記LEDチップの非搭載部位に積層され、前記LEDチップの電極に前記ボンディングワイヤを介して電気的に接続されるリードパターンが前記伝熱板と反対側の表面に形成された絶縁性基材とからなり、
前記伝熱板における前記LEDチップの搭載部位に、絶縁性材料により形成されて前記伝熱板と前記LEDチップとの間に介装されるサブマウント部材を配置し、前記サブマウント部材の材料を前記LEDチップの材料と線膨張率が略同じ絶縁性材料とし、
前記光学部材の光出射面は凸曲面状であり、
前記保護カバーは、透光性材料及び蛍光体を含む材料によりドーム状に形成され、前記光学部材の前記光出射面と前記保護カバーの内面との間の距離が略一定値となるように、前記光出射面と前記内面との間に隙間を設けた状態で、前記光出射面を覆うように設けられたことを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006254803A JP5237539B2 (ja) | 2005-09-20 | 2006-09-20 | 発光装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005272843 | 2005-09-20 | ||
JP2005272843 | 2005-09-20 | ||
JP2006254803A JP5237539B2 (ja) | 2005-09-20 | 2006-09-20 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007116122A JP2007116122A (ja) | 2007-05-10 |
JP5237539B2 true JP5237539B2 (ja) | 2013-07-17 |
Family
ID=38097994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006254803A Active JP5237539B2 (ja) | 2005-09-20 | 2006-09-20 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5237539B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009105379A (ja) * | 2007-10-05 | 2009-05-14 | Panasonic Electric Works Co Ltd | 発光装置 |
JP5204585B2 (ja) * | 2007-12-13 | 2013-06-05 | パナソニック株式会社 | 発光装置および照明器具 |
JP5612991B2 (ja) | 2010-09-30 | 2014-10-22 | シャープ株式会社 | 発光装置及びこれを備えた照明装置 |
DE102013100711B4 (de) * | 2013-01-24 | 2021-07-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl optoelektronischer Bauelemente |
CN103904207A (zh) * | 2014-04-04 | 2014-07-02 | 利亚德光电股份有限公司 | 晶片电路 |
JP2014187392A (ja) * | 2014-06-23 | 2014-10-02 | Sharp Corp | 発光装置及びこれを備えた照明装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4306846B2 (ja) * | 1998-11-20 | 2009-08-05 | 株式会社朝日ラバー | 照明装置 |
JP2002133925A (ja) * | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
JP2004119634A (ja) * | 2002-09-25 | 2004-04-15 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
JP2005159045A (ja) * | 2003-11-26 | 2005-06-16 | Sumitomo Electric Ind Ltd | 半導体発光素子搭載部材とそれを用いた発光ダイオード |
JP4432724B2 (ja) * | 2004-10-22 | 2010-03-17 | パナソニック電工株式会社 | 照明光源の製造方法および照明光源 |
-
2006
- 2006-09-20 JP JP2006254803A patent/JP5237539B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007116122A (ja) | 2007-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4622985B2 (ja) | 照明器具 | |
KR100983836B1 (ko) | Led조명 기구 | |
US8044424B2 (en) | Light-emitting device | |
JP5665160B2 (ja) | 発光装置および照明器具 | |
JP4678388B2 (ja) | 発光装置 | |
JP3948488B2 (ja) | 発光装置 | |
JP5209910B2 (ja) | Led照明器具 | |
JP3998028B2 (ja) | 照明器具 | |
WO2007057984A1 (ja) | 発光装置 | |
JP4650466B2 (ja) | 照明器具 | |
JP2008010435A (ja) | 照明器具 | |
JP2007116095A (ja) | 発光装置 | |
JP4981600B2 (ja) | 照明器具 | |
JP5237539B2 (ja) | 発光装置 | |
JP2007243054A (ja) | 発光装置 | |
JP4001178B2 (ja) | 発光装置 | |
JP5237540B2 (ja) | 発光装置 | |
JP4029918B2 (ja) | Led照明装置 | |
JP4960657B2 (ja) | 発光装置 | |
JP2009094213A (ja) | 発光装置 | |
JP5155539B2 (ja) | 発光装置 | |
JP4678389B2 (ja) | 発光装置 | |
JP3918871B2 (ja) | 発光装置 | |
JP4829577B2 (ja) | 発光装置 | |
JP3918863B1 (ja) | 発光装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090420 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100819 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110720 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120112 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121127 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130128 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130305 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130329 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5237539 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160405 Year of fee payment: 3 |