JP5228626B2 - 立体プリント配線板とその製造方法 - Google Patents

立体プリント配線板とその製造方法 Download PDF

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Publication number
JP5228626B2
JP5228626B2 JP2008137578A JP2008137578A JP5228626B2 JP 5228626 B2 JP5228626 B2 JP 5228626B2 JP 2008137578 A JP2008137578 A JP 2008137578A JP 2008137578 A JP2008137578 A JP 2008137578A JP 5228626 B2 JP5228626 B2 JP 5228626B2
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Japan
Prior art keywords
connection layer
wiring board
printed wiring
substrate
upper substrate
Prior art date
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Expired - Fee Related
Application number
JP2008137578A
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English (en)
Japanese (ja)
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JP2009010357A (ja
JP2009010357A5 (https=
Inventor
禎志 中村
文雄 越後
貴之 北
航太 深澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008137578A priority Critical patent/JP5228626B2/ja
Publication of JP2009010357A publication Critical patent/JP2009010357A/ja
Publication of JP2009010357A5 publication Critical patent/JP2009010357A5/ja
Application granted granted Critical
Publication of JP5228626B2 publication Critical patent/JP5228626B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008137578A 2007-05-29 2008-05-27 立体プリント配線板とその製造方法 Expired - Fee Related JP5228626B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008137578A JP5228626B2 (ja) 2007-05-29 2008-05-27 立体プリント配線板とその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007141522 2007-05-29
JP2007141522 2007-05-29
JP2008137578A JP5228626B2 (ja) 2007-05-29 2008-05-27 立体プリント配線板とその製造方法

Publications (3)

Publication Number Publication Date
JP2009010357A JP2009010357A (ja) 2009-01-15
JP2009010357A5 JP2009010357A5 (https=) 2011-06-30
JP5228626B2 true JP5228626B2 (ja) 2013-07-03

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ID=40325088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008137578A Expired - Fee Related JP5228626B2 (ja) 2007-05-29 2008-05-27 立体プリント配線板とその製造方法

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JP (1) JP5228626B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3507638B2 (ja) 1996-11-13 2004-03-15 株式会社東芝 サイリスタ式パルス放電回路

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR112013026086A2 (pt) * 2012-02-16 2020-08-11 Sony Corporation aparelho de transmissão, método de transmissão e aparelho de recepção

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3375555B2 (ja) * 1997-11-25 2003-02-10 松下電器産業株式会社 回路部品内蔵モジュールおよびその製造方法
JP2000277913A (ja) * 1999-03-25 2000-10-06 Kyocera Corp 多層配線基板及びその製造方法
JP2001237549A (ja) * 2000-02-25 2001-08-31 Matsushita Electric Ind Co Ltd 多層配線基板およびその製造方法
JP4168223B2 (ja) * 2000-05-10 2008-10-22 日本ゼオン株式会社 硬化性樹脂組成物、絶縁材料及び回路基板
JP2003298232A (ja) * 2002-04-02 2003-10-17 Sony Corp 多層配線基板の製造方法および多層配線基板
JP4689375B2 (ja) * 2005-07-07 2011-05-25 富士通株式会社 積層基板および該積層基板を有する電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3507638B2 (ja) 1996-11-13 2004-03-15 株式会社東芝 サイリスタ式パルス放電回路

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Publication number Publication date
JP2009010357A (ja) 2009-01-15

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