JP5228500B2 - Electromagnetic field distribution measuring method, scanning electromagnetic field sensor unit, and scanning electromagnetic field measuring apparatus - Google Patents

Electromagnetic field distribution measuring method, scanning electromagnetic field sensor unit, and scanning electromagnetic field measuring apparatus Download PDF

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JP5228500B2
JP5228500B2 JP2008012491A JP2008012491A JP5228500B2 JP 5228500 B2 JP5228500 B2 JP 5228500B2 JP 2008012491 A JP2008012491 A JP 2008012491A JP 2008012491 A JP2008012491 A JP 2008012491A JP 5228500 B2 JP5228500 B2 JP 5228500B2
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electromagnetic field
sensor unit
unit
surface
scanning
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JP2009174945A (en
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大輔 内田
伸一 若菜
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富士通株式会社
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  The present invention relates to an electromagnetic field radiated from an electronic device or the like, an electromagnetic field distribution measurement method for measuring an electromagnetic field distribution in the vicinity of a component unit such as an electronic device, a scanning electromagnetic field sensor unit used for measurement, and a scanning type The present invention relates to a scanning electromagnetic field measuring apparatus using the electromagnetic field sensor unit.

  Many electronic devices are required to have multi-function and high-speed processing, and signal noise and radiation noise generated on a printed circuit board are factors that greatly reduce the performance of the device. In particular, mobile phones and notebook personal computers with wireless functions are directly affected by noise disturbances, so detection and countermeasures for noise sources at the design stage are desired.

  For these noise countermeasures, structural design evaluation using electromagnetic field simulation has been performed, but electromagnetic field distribution measurement technology on the actual circuit board surface and its vicinity has not been established, and verification with simulation accuracy has been made. The current situation is not.

  Distant electromagnetic field distribution at a location away from the printed circuit board using an antenna of a wavelength size, such as a horn antenna or a dipole antenna, where the diameter of the opening of the horn antenna or the dipole length of the dipole antenna is close to the wavelength. A system that measures the electromagnetic field distribution in the vicinity of the printed circuit board using the measurement result and the design data of the printed circuit board to be measured has been studied. However, in this method, it is difficult to estimate the electromagnetic field generated by each wiring, and application to simulation verification is difficult. On the other hand, Patent Document 1 proposes a method of detecting a wiring current magnetic field using a micro-loop coil, and is partially commercialized.

  In Patent Document 2, a probe (cantilever type) probe used in a scanning tunneling microscope (STM) detects a tunnel current and an atomic force by operating perpendicularly to the surface of a measurement object. This is a method for measuring the surface state of a substance. By using this technique, it is possible to measure a minute region with high resolution.

  In the measurement method described in Patent Document 1, since the spatial resolution and scanning speed in the measurement region depend on the drive motor performance, it takes a lot of time to scan the entire printed circuit board with high resolution and search for the source of noise. It was necessary.

In addition, simply applying the cantilever probe described in Patent Document 2 to electric field distribution measurement cannot obtain position information when moved in the horizontal direction, and only a small area can be detected. It was a problem that it was unsuitable.
JP 2000-19204 A Japanese Patent No. 2741629

  SUMMARY OF THE INVENTION Accordingly, the present invention provides an electromagnetic field distribution measurement method that solves the above-described problems and measures the electromagnetic field distribution in the vicinity of a printed circuit board or the like at high speed, a scanning electromagnetic field sensor unit used therefor, and the scanning electromagnetic field sensor. An object of the present invention is to provide a scanning electromagnetic field measuring apparatus using the unit.

  In the present invention, in order to measure electromagnetic noise near the surface of a printed board or the like with high resolution and high speed, a detection electrode is formed on the piezoelectric body using a semiconductor process, and a voltage is applied to both ends of the piezoelectric body. Accordingly, a scanning electromagnetic field detection sensor unit that scans in the horizontal direction while repeatedly bending the detection unit arranged substantially perpendicular to the inspection target surface at high speed is used.

  Then, for example, a vertically long scanning electromagnetic field detection sensor unit is positioned substantially perpendicular to the surface of the inspection object, and the other end is gripped so that the detection unit is positioned near the surface of the inspection object. By applying a continuous or intermittent voltage of a desired value of 1 kHz or more and 500 kHz or less to the piezoelectric body, the piezoelectric body performs a bending operation according to the application condition, so that the detection unit is linear in the vicinity of the surface of the inspection object. Fine reciprocating motion. The position in which the linear direction of this fine movement reciprocating operation and the operation direction of the coarse operation of the part that holds the scanning electromagnetic field detection sensor unit are matched, the coarse operation is intermittently performed in a fixed direction, and is positioned by the coarse operation. , The fine reciprocating operation is performed to obtain intensity distribution information including an electric field or a magnetic field from the detector.

  According to this method, the electromagnetic field detection sensor is coarser and more accurate than the conventional method of accurately positioning the electromagnetic field detection sensor and measuring the electromagnetic field information each time. While positioning, electromagnetic field information in a minute position interval between them is obtained at a desired position performed by a fine reciprocating motion of an electromagnetic field detection sensor scanned at high speed.

  In other words, in a conventional positioning device with a large inertia, enormous time is required to obtain electromagnetic field information while finely positioning, but according to the present invention, positioning is performed at a desired coarse interval, and the time between them is increased at high speed. Since electromagnetic field information is obtained by the scanned electromagnetic field detection sensor, significant time can be saved.

  Hereinafter, the electromagnetic field detection sensor is used to mean a detection sensor including an electric field or a magnetic field, and the scanning electromagnetic field detection sensor or the electromagnetic field detection sensor is also simply referred to as a sensor.

  According to the first aspect of the present invention, an end of an electromagnetic field detection sensor unit in which an electromagnetic field detection sensor is formed by a semiconductor process on a surface substantially parallel to a bonding surface of a piezoelectric element inside a piezoelectric body is provided. A coarse motion drive unit that performs at least one-dimensional coarse operation is directly or indirectly gripped, and the sensor detection unit is disposed at the other end of the sensor unit, and the piezoelectric body has a frequency of 1 kHz to 500 kHz. By applying a voltage having a desired value continuously or intermittently, the sensor unit continuously performs a bending operation according to the voltage from the one end to the other end in a plane substantially perpendicular to the bonding surface. The sensor unit has an intermittent structure, and the inclination of the sensor unit is set so that the bonding surface when no voltage is applied is positioned in a plane substantially perpendicular to the surface of the inspection object. By scanning the sensor unit by combining the rough motion and the bending motion in a direction substantially perpendicular to the bonding surface and in a direction substantially parallel to the surface of the inspection target, An electromagnetic field distribution measuring method characterized by measuring a distribution including an electric field distribution or a magnetic field distribution near a surface.

  According to the first aspect of the present invention, the piezoelectric body is, for example, a piezoelectric body having a bamorph structure or a vertically long structure in which a piezoelectric element is bonded to the surface of one electrode, and the bonded piezoelectric body By applying a voltage to the piezoelectric element in the element and the piezoelectric element, or in the piezoelectric element and the electrode, due to the difference in the direction of + or-distortion in the vertical direction of the piezoelectric element and the difference in the absolute value thereof, The piezoelectric elements on both sides of the bonded surface are expanded and contracted to bend in the longitudinal direction of the piezoelectric body.

  Directly on one or both sides of a surface substantially parallel to the above-mentioned bonding surface (hereinafter simply referred to as a bonding surface) inside such a piezoelectric body, or indirectly through an insulating layer or the like, An electromagnetic field detection sensor is formed by a semiconductor process, and constitutes an electromagnetic field detection sensor unit integrally.

  The sensor unit applies voltage to the piezoelectric body (application of voltage to the piezoelectric element inside the piezoelectric body is simply referred to as “applying voltage to the piezoelectric body” hereinafter), and bonding is performed when no voltage is applied. Curves in a plane substantially perpendicular to the plane.

  Therefore, the other end of the sensor unit having a structure in which a detection unit for detecting an electric field or a magnetic field is provided at one end of the vertically long sensor unit, the detection unit is inspected substantially perpendicular to the surface of the inspection object. The piezoelectric body can be placed in the vicinity of the surface of the object, and a desired voltage value of 1 kHz or more and 500 kHz or less, preferably 10 kHz or more and 100 kHz or less, is applied to both ends of the piezoelectric body. Since the bending operation is repeatedly performed, the detection unit can perform a substantially linear fine movement reciprocating operation in the vicinity of the surface of the inspection object.

  For example, when a DC voltage of several tens to several hundreds volts is applied to the piezoelectric body, the detection unit can obtain a movement amount of several nm to several μm in the X direction. The linear direction of this fine movement reciprocation and the direction of the coarse movement of the portion that holds the scanning electromagnetic field detection sensor unit are made to coincide, and the coarse movement is intermittently performed in a fixed direction. At the position, fine reciprocation is performed to obtain intensity distribution information including a minute interval or a continuous electric field or magnetic field from the detection unit. The electromagnetic field is measured by connecting to a spectrum analyzer or oscilloscope.

  If the position of the detection unit in the reciprocating sensor unit is sufficiently short compared to the distance from the position where the sensor unit is gripped, the variation in the distance between the detection unit and the inspection object is ignored. it can.

  In addition, the relationship between the amount of movement of the detector with respect to the voltage applied to the piezoelectric body can be obtained by calibration in advance.

  Here, as an example, the detection unit is finely reciprocated. However, the detection unit is a stepped movement mode regardless of whether it is a vibration mode having a continuous constant period and a constant maximum amplitude, or a single-side amplitude mode. It doesn't matter.

  According to a second aspect of the present invention, there is provided a shield between the piezoelectric body and the detection section, which shields the detection section from an electrical signal that drives the piezoelectric body. 1. The electromagnetic field distribution measuring method according to 1.

  According to the second aspect of the present invention, the shield electrode for blocking the signal for driving the piezoelectric body is disposed between the piezoelectric body and the detection unit. An insulator is disposed on the shield electrode, and an electrode for measuring an electromagnetic field is formed thereon. More preferably, a shield is disposed so as to cover the periphery of the detection unit.

  According to a third aspect of the present invention, in the electromagnetic field according to the first or second aspect, the detection sensor disposed on the piezoelectric body has an antenna structure to detect an electric field. There is a distribution measurement method.

  According to the third aspect of the present invention, the electric field is detected by detecting the electric field with the detection sensor having an antenna shape such as a T-shaped, L-shaped, or I-shaped tip.

  According to a fourth aspect of the present invention, in the electromagnetic field distribution measuring method according to the first aspect, the detection sensor disposed on the piezoelectric body has a coil structure and performs magnetic field detection. is there.

  According to the fourth aspect of the present invention, the magnetic field distribution is measured by detecting the magnetic field using the detection sensor as a loop.

The invention according to claim 5 of the present invention is a scanning electromagnetic field sensor unit in which an electromagnetic field detection sensor is formed by a semiconductor process on a surface substantially parallel to a bonding surface of piezoelectric elements inside a piezoelectric material. The piezoelectric body has a piezoelectric element and a non-piezoelectric element inside the piezoelectric body, or a bonding surface between the piezoelectric elements, and the piezoelectric element when a voltage is applied to the piezoelectric element from the outside Is distorted in a direction substantially parallel to the bonding surface, and has a structure in which the sensor unit is bent by bending the piezoelectric body including the bonding surface, and the electromagnetic field detection sensor detects an electromagnetic field. And a lead wire electrically connected to the detection portion, and an electrode electrically connected to the lead wire, and the sensor unit is configured such that the piezoelectric element is applied by voltage application from the outside. No distortion A vertically long shape substantially parallel to the direction, holding one end of the sensor unit on which the electrode is disposed at a direct or indirect point, and positioning the sensor unit substantially perpendicular to the surface of the inspection object; When the voltage of 1 kHz or more and 500 kHz or less is applied to the piezoelectric body from the outside continuously or intermittently, a desired value is applied to the detection unit in a plane perpendicular to the surface of the detection unit when no voltage is applied. A scanning electromagnetic field sensor unit having a structure in which scanning is performed by performing a bending operation in accordance with a voltage having a desired value .

According to a sixth aspect of the present invention, there is provided a scanning electromagnetic field measuring apparatus, wherein the scanning electromagnetic field sensor unit according to the fifth aspect is gripped and coarsely driven in a three-dimensional direction. A coarse drive unit, a coarse drive circuit of the coarse drive unit, a coarse drive control circuit for controlling the coarse drive circuit, and a surface of the inspection object in cooperation with the coarse drive control circuit a bending operation circuit for scanning the detector in the one-dimensional direction against the bending operation and a bending operation control circuit for controlling the circuit, flutter drives the sensor unit in a direction parallel to the surface of the test object an act of, in combination with the bending operation, scanning, characterized in that it comprises an electromagnetic field distribution processing unit that displays the calculation process the electromagnetic field measurements to detect by scanning the surface of the test object This is an electromagnetic field measuring apparatus.

  According to the present invention, the electromagnetic field intensity from a minute region to a large region on a printed circuit board or the like of an electronic device or the like can be detected at high speed and with high resolution, and high-speed electromagnetic field distribution measurement can be performed. In addition, it is possible to search for a highly accurate noise source.

  FIG. 1 shows an embodiment of a scanning electromagnetic field detection sensor unit according to the present invention.

  In FIG. 1A, a piezoelectric body 101 having a flat plate shape and a rectangular shape whose longitudinal direction is the Z direction is used as the sensor unit 100. The piezoelectric body 101 is formed of, for example, a bimorph type piezoelectric element obtained by laminating a piezoelectric element (not shown) having a flat plate shape and a rectangular shape substantially the same as the piezoelectric body 101 in a layer shape.

  For example, a thin film material such as ZnO or AlN or a piezoelectric ceramic such as PZT is used as the piezoelectric element.

The piezoelectric body 101 is provided with electrodes A102 and B103 formed by, for example, a semiconductor process on both sides thereof, and lead wires (not shown) for applying a voltage to the piezoelectric element are connected to each. Alumina on the surface of the electrode B 103, by the SiO 2 or the like to form an insulating layer 104, and sputtering aluminum, gold, or copper or the like on the surface of the insulating layer 104, the electrode 105-1, the lead line 105-2, and, For example, the electromagnetic field detection sensor 105 is formed in a state where the T-shaped detection unit 105-3 is electrically connected.

  The entire sensor unit 100 is covered with an insulating layer as necessary.

  Connected to the electrode 105-1 is a lead wire (not shown) for connecting an electromagnetic field intensity (in this case, an electric field intensity) detected by the detection unit 105-3 to a measuring instrument not shown.

  The thickness of the electromagnetic field detection sensor 105 is about several mm or less.

    The Z direction in the drawing is a direction perpendicular to the surface of the inspection object, and the detection unit 105-3 is disposed in the vicinity of the end in the Z direction. The sensor unit 100 is gripped substantially perpendicularly to the surface of the object to be inspected, for example, by an alumina holder (not shown) at the end opposite to the detection unit 105-3. Since the sensor unit 100 gripped by the holder is curved in the X direction when a voltage is applied from the outside, the sensor unit 100 is intermittently coarsely driven in the X direction by the external coarse movement driving unit, and in the X direction, for example, 1 kHz. By applying a continuous or intermittent voltage of 500 kHz or less, preferably 10 kHz or more and 100 kHz or less, the bending operation is repeated, and the detection unit 107-3 is intermittently moving in the X direction. A minute forward / reverse repeat operation is performed in the X direction. The continuous or intermittent desired voltage value of 1 kHz or more and 500 kHz or less is applied to both ends of the piezoelectric body because the movement of the piezoelectric body responds to, for example, several Hz to about 500 kHz. The coarse drive unit intermittently drives in the X direction at a predetermined speed and repeats the bending operation in the +/− direction of the X so that the sensor unit 100 is practically used in the + direction of the X as a whole. This is because it is suitable for moving at a specific speed and continuing measurement.

  By setting the voltage applied to the piezoelectric body 101 to a DC voltage of several tens to several hundreds volts, for example, the displacement in the X direction of the detection unit 105-3 can be about several nm to several μm.

  That is, the detection unit 107-3 performs a reciprocating motion on the straight line at a position where the detection unit 107-3 is stopped at a predetermined interval in one linear direction, so that the distance between the points on the straight line that are separated and stopped by the coarse drive is separated. The measurement points are dense or continuous. It is desirable that the minute forward / reverse repetitive motion in the X direction has an amplitude that sufficiently covers a point on a straight line that stops in a separated manner by coarse motion driving.

  FIGS. 1B to 1G are examples of external views of the surface of the electromagnetic field detection sensor 107 viewed from the X direction, and FIGS. 1B to 1D illustrate the detection unit 107. -3 shows an example of an electric field detection sensor whose shape is T-type, L-type, and I-type, respectively. FIGS. 1E to 1G show examples of magnetic field detection sensors in which the shape of the detection unit 107-3 has loops of L type, T type, and circular type, respectively.

  1 (b) to 1 (d) each have one electrode 107-1. In FIGS. 1 (e) to 1 (g), the electrode 107-1 corresponds to the lead line of each loop. 2 each.

  As dimensions, for example, in the case of the type shown in FIG. 1D, the wiring width (the widths of the lead-out line 105-2 and the detection unit 105-3 are the same) is about 5 to 100 μm and the length is about several mm. In the case of the type shown in FIG. 1E, the length of the loop-shaped side of the detection unit 105-3 is about 10 to 100 μm.

  FIG. 2 shows an embodiment of a detection method using the scanning electromagnetic field sensor unit according to the present invention. A sensor unit 200 of the same type as the sensor unit 100 shown in FIG. 1 is provided with a holder 201 made of alumina, for example, and arranged so that the sensor unit 200 is positioned substantially vertically on a printed circuit board 202 that is an inspection object. The

  In FIG. 2, in order to measure the electromagnetic field distribution in the vicinity of the wiring pattern 203 arranged in the Y direction on the printed circuit board 202, the surface of the detection unit (not shown) is arranged perpendicular to the X direction perpendicular to the wiring pattern 203. The tip of the sensor unit 200 is brought close to the Z direction, and the height in the Z direction is kept at several μm to several tens of μm. The coarse movement speed in the X direction of the holder 201 is set to about 100 μm / Sec or more, and the drive unit (not shown) that holds the holder 201 is moved in the Z direction while capturing the inspection object with a camera (not shown). It is designed to avoid collision with the object. Therefore, the electromagnetic field intensity can be measured while scanning the sensor unit 200 from the position (a) in FIG. 2 to the positions (b) and (c).

  Here, as an example, the inspection object is the wiring pattern 203 on the printed board. However, the LSI mounted on the printed board, the lead wires of the terminals, and the like are also inspection objects.

  With respect to the position information of the detection unit, calibration is performed in the vicinity of the standard signal source in advance to obtain a movement amount with respect to the applied voltage to the piezoelectric body and a calibration coefficient for each signal. Further, the position information by the coarse movement drive of the holder 201 in the X, Y, and Z directions is performed using a precision scale incorporated in a coarse movement drive device (not shown).

  When the frequency of the bending operation of the sensor unit 200 is 10 kHz or more and the maximum amplitude is 100 μm or more, the average coarse movement speed in the X direction can be set to about 100 μm / s including the average processing time of measurement data. When the sensor unit 200 scanned linearly within the measurement range reaches the boundary within the measurement range, the coarse drive device moves the sensor unit 200 in the Y direction by a predetermined distance, and reverses the X direction again. Thus, scanning can be performed even when the measurement range is set wide.

  Here, for example, the magnitude of signal noise to be measured is about −80 dBm, and the magnitude of radiation noise is about −70 dBm. The intensity of the detected electromagnetic field is measured by connecting to a spectrum analyzer or oscilloscope (not shown).

  FIG. 3 shows an embodiment of a scanning electromagnetic field measuring apparatus according to the present invention. The scanning electromagnetic field measurement apparatus 300 has a rigid XY table 302 and a coarse motion drive unit (fixed side) 303 on a base 301, and the coarse motion drive unit (fixed side) 303 includes X, Y, A coarse drive unit (movable side) 304 that moves in the Z direction is incorporated.

  The coarse drive unit (movable side) 304 includes a grip unit (not shown), and grips the sensor unit 306 via a ceramic holder 305 perpendicular to the surface of the XY table 302. In order to measure the electromagnetic field distribution in the vicinity of the wiring pattern 307-1 included in the printed circuit board 307 fixed on the XY table 302, a DC voltage of several tens to several hundreds of volts is applied to a piezoelectric body (not shown) in the sensor unit 306. Is applied, and a deflection width of about several nm to several μm in the X direction can be obtained at the tip of the sensor unit 306.

  The distance between the surface of the inspection object on the printed circuit board 307 and the tip of the sensor unit 306 is maintained at about several μm to several tens of μm. The inspection object is captured by a camera (not shown) attached to the coarse motion drive unit (movable side) 304, and the positional information obtained by the coarse motion drive of the sensor unit 306 in the X, Y, and Z directions is coarse motion. This is performed using a precision scale (not shown) incorporated in the drive unit (fixed side) 303 to avoid a collision between the tip of the sensor unit 306 and the inspection object.

  A coarse motion driving circuit (X, Y, Z) 308 for driving the coarse motion drive unit (movable side) 304 in the X, Y, Z directions, and a fine motion operation circuit for driving the piezoelectric body of the sensor unit 306 in the X direction ( X) 309, an electromagnetic field measurement processing unit 310 that processes the output of the electromagnetic field intensity from the sensor unit 306, and a control circuit 311 that includes a CPU that controls these in cooperation with each other are electrically connected to each other and measured electromagnetic The field intensity distribution is displayed on the display 312.

  When the frequency of the bending operation of the sensor unit 306 is 10 kHz or more and the maximum amplitude is 100 μm or more, the average coarse movement speed in the X direction is about 100 μm / s including the average processing time of measurement data. When the sensor unit 306 that linearly scans the measurement range in the X direction reaches the boundary in the measurement range, the coarse motion drive unit (movable side) 304 moves the sensor unit 306 in the Y direction by a predetermined distance. Then, the scanning step is repeated by reversing the X direction.

  Data measured by the sensor unit 306 within the measurement range is synthesized by the electromagnetic field measurement processing unit 310 and displayed on the display 312.

  FIG. 4 shows an example of the calibration flow of the sensor unit in the present invention. A sine wave is applied to the microstrip line as a standard signal source, and the sensor unit is brought closer (S41). The amplitude of the sensor unit is determined (S42), and the amplitude for each drive voltage and the detection signal for each distance are acquired (S43).

  Using commercially available electromagnetic field simulation analysis software or the like, the electric field / magnetic field for the standard signal source is calculated and compared with the signal detected by the actual sensor unit (referred to as simulation comparison) (S44). When the simulation comparison is performed, if the electromagnetic field strength determined as the allowable range is too large or too small, the drive signal that determines the amplitude of the sensor unit is inappropriate. The calibration is repeated until the range is reached (S45). If it is within the allowable range, the calibration is terminated (S46).

  FIG. 5 shows an example of an electromagnetic field measurement flow according to the present invention. The calibrated sensor unit is brought close to the surface of the inspection object (S51), a voltage is applied to the piezoelectric body of the sensor unit (S52), and scanning in the X direction detects an electromagnetic field signal (S53). When the boundary of the measurement area is reached while acquiring the electromagnetic field signal (S54), the sensor unit is stepped in the Y direction by a predetermined distance (S55), and the sensor unit is repeatedly scanned to detect the electromagnetic field in the measurement area.

  The electromagnetic field signal measured in the measurement area is synthesized to overlap the detection signal for the distance obtained by driving the sensor unit and the position information of the coarse motion and output it as electromagnetic field distribution data in the measurement area. (S56) The display is made on the display (S57), and the measurement is terminated (S58).

An embodiment of a scanning electromagnetic field detection sensor unit according to the present invention An embodiment of a detection method using a scanning electromagnetic field detection sensor unit according to the present invention An embodiment of a scanning electromagnetic field measuring apparatus according to the present invention Example of calibration flow of sensor unit in the present invention An example of an electromagnetic field measurement flow according to the present invention

Explanation of symbols

100, 200, 306 Sensor unit 101 Piezoelectric body 102 Electrode A
103 Electrode B
104 Insulating layer 105 Electromagnetic field detection sensor 201, 305 Holder 202, 307 Printed circuit board 203 Wiring pattern 300 Scanning electromagnetic field measuring device 301 Base 302 XY table 303 Coarse motion drive unit (fixed side)
304 Coarse drive unit (movable side)
308 Coarse drive circuit (X, Y, Z)
309 Fine movement bending operation circuit (X)
310 Electromagnetic Field Measurement Processing Unit 311 Control Circuit

Claims (6)

  1. Coarse motion that at least one-dimensionally performs coarse motion on one end of an electromagnetic field detection sensor unit in which an electromagnetic field detection sensor is formed by a semiconductor process on a surface substantially parallel to a bonding surface of piezoelectric elements inside a piezoelectric body. The drive part grips directly or indirectly,
    The sensor detection unit is disposed at the other end of the sensor unit,
    By applying a continuous or intermittent desired voltage of 1 kHz or more and 500 kHz or less to the piezoelectric body, the sensor unit moves from the one end to the other end in the plane substantially perpendicular to the bonding surface. Has a structure that performs the bending operation according to the continuous or intermittent,
    Set the tilt of the sensor unit so that the bonding surface is positioned when no voltage is applied in a plane substantially perpendicular to the surface of the inspection object,
    By scanning the sensor unit by combining the rough operation and the bending operation in a direction substantially perpendicular to the bonding surface when no voltage is applied and in a direction substantially parallel to the surface of the inspection object. ,
    An electromagnetic field distribution measuring method, comprising: measuring distribution including an electric field distribution or a magnetic field distribution near a surface of the inspection object.
  2.   The electromagnetic field distribution measuring method according to claim 1, wherein a shield that shields the detection unit from an electrical signal that drives the piezoelectric body is provided between the piezoelectric body and the detection unit.
  3.   The electromagnetic field distribution measuring method according to claim 1, wherein the detection sensor disposed on the piezoelectric body has an antenna structure and performs electric field detection.
  4.   The electromagnetic field distribution measurement method according to claim 1, wherein the detection sensor disposed on the piezoelectric body has a coil structure and performs magnetic field detection.
  5. A scanning electromagnetic field sensor unit in which an electromagnetic field detection sensor is formed by a semiconductor process on a surface substantially parallel to a bonding surface of piezoelectric elements inside a piezoelectric body,
    The piezoelectric body has a piezoelectric element inside the piezoelectric body and a non-piezoelectric element, or a bonding surface between the piezoelectric elements,
    When a voltage is applied to the piezoelectric element from the outside, the piezoelectric element is distorted in a direction substantially parallel to the bonding surface, and the piezoelectric unit including the bonding surface is curved, thereby causing the sensor unit to bend. Has a curved structure,
    The electromagnetic field detection sensor is
    A detection unit for detecting an electromagnetic field;
    A lead wire electrically connected to the detector;
    An electrode electrically connected to the lead wire,
    The sensor unit has a vertically long shape substantially parallel to a direction in which the piezoelectric element is distorted by an external voltage application,
    Gripping one end of the sensor unit where the electrode is disposed directly or indirectly to position the sensor unit substantially perpendicular to the surface of the object to be inspected;
    By continuously or intermittently applying a desired voltage of 1 kHz or more and 500 kHz or less to the piezoelectric body,
    Scanning the electromagnetic field sensor characterized by having a structure for scanning by the inside plane which is perpendicular to a surface of the detection unit when no voltage is applied the detecting unit performs the bending operation in response to the voltage of the desired value unit.
  6. A scanning electromagnetic field measuring device,
    The scanning electromagnetic field sensor unit according to claim 5;
    A coarse drive unit for gripping the sensor unit and driving coarsely in a three-dimensional direction;
    A coarse drive circuit of the coarse drive unit;
    A coarse drive control circuit for controlling the coarse drive circuit;
    A bending operation circuit that scans the detection unit in a one-dimensional direction with respect to the surface of the inspection object in cooperation with the coarse motion drive control circuit;
    A bending operation control circuit for controlling the bending operation circuit,
    The electromagnetic field measurement value detected by scanning the surface of the inspection object is calculated by combining the operation of coarsely driving the sensor unit in a direction parallel to the surface of the inspection object and the bending operation. An electromagnetic field distribution processing unit for displaying the display.
JP2008012491A 2008-01-23 2008-01-23 Electromagnetic field distribution measuring method, scanning electromagnetic field sensor unit, and scanning electromagnetic field measuring apparatus Expired - Fee Related JP5228500B2 (en)

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