JP5164347B2 - 導電性焼成物パターンの形成方法 - Google Patents
導電性焼成物パターンの形成方法 Download PDFInfo
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- JP5164347B2 JP5164347B2 JP2006211129A JP2006211129A JP5164347B2 JP 5164347 B2 JP5164347 B2 JP 5164347B2 JP 2006211129 A JP2006211129 A JP 2006211129A JP 2006211129 A JP2006211129 A JP 2006211129A JP 5164347 B2 JP5164347 B2 JP 5164347B2
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
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- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
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- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
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- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
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- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- LXTZRIBXKVRLOA-UHFFFAOYSA-N padimate a Chemical compound CCCCCOC(=O)C1=CC=C(N(C)C)C=C1 LXTZRIBXKVRLOA-UHFFFAOYSA-N 0.000 description 1
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- 150000002978 peroxides Chemical class 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
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- 239000010452 phosphate Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
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- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Gas-Filled Discharge Tubes (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
また、本発明の他の目的は、この焼成物パターンの形成方法にて、焼成後に十分な導電性を有する導電性焼成物パターンを提供することにある。
すなわち、本発明にかかる導電性焼成物パターンの形成方法は、基材上に卑金属を含む樹脂組成物のパターンを形成し、そのパターンを大気中で焼成して導電性焼成物パターンを形成する方法であって、焼成時の昇温速度が30〜100℃/分であることを特徴とする。
まず、基材上に卑金属を含む光硬化性樹脂組成物を全面塗布し、ついで乾燥し、露光、現像してパターンを形成する。
基材上への光硬化性樹脂組成物の塗布方法としては、スクリーン印刷法、バーコーター、ブレードコーターなどの塗布方法が挙げられ、なかでもスクリーン印刷法が好ましい。なお、ペーストが予めフィルム状に成膜されている場合には基材上にラミネートすればよい。
スクリーン印刷法に用いるスクリーンメッシュの素材としては、ステンレスやポリエステルなどを用いることができる。
形成される光硬化性樹脂組成物の塗膜は、ウエット膜厚で5〜50μmとすることが好ましい。この理由は、5μm未満では塗膜にピンホールを生じる場合があり、一方、50μmを超えると塗膜が厚くなるため溶剤が蒸発し難くなり乾燥が不十分となる場合があり好ましくない。
これにより、卑金属を含む樹脂組成物を用いても、大気中で、焼成後に十分な導電性を有する導電性焼成物パターンを形成することができる。
ここで、昇温速度が10℃/分より遅くなると導電性が得られ難く好ましくない。一方、昇温速度が100℃/分を超えて早くなるとガラス基板にひび割れなどを生じ易くなり好ましくない。
これは、導電性粉末が焼結又は融着する温度に達する以前に樹脂組成物の脱バインダーが完了してしまうと導電性粉末の表面が大気中で酸化され、導電性粉末が焼結又は融着し難くなり、導電性が得られ難くなるためである。
また、基材としてガラス基板を用いる場合、ガラス基板の黄変の面から、銀の含有量は20質量%以下とすることが好ましく、その他の貴金属についてもコストの面から、含有量を20質量%以下とすることが好ましい。
このカルボキシル基含有感光性樹脂及びカルボキシル基含有樹脂は、単独でまたは混合して用いてもよいが、いずれの場合でもこれらは合計で組成物全量の1〜35質量%の割合で配合することが好ましい。これらのポリマーの配合量が上記範囲より少ない場合、形成する皮膜中の上記樹脂の分布が不均一になり易く、充分な光硬化性および光硬化深度が得られ難く、選択的露光、現像によるパターニングが困難となる。一方、上記範囲よりも多い場合、焼成時のパターンのよれや線幅収縮を生じ易くなるので好ましくない。
これらの光重合開始剤(D)の配合割合は、前記有機バインダー(カルボキシル基含有感光性樹脂及び/又はカルボキシル基含有樹脂)(B)100質量部当り、1〜30質量部が適当であり、好ましくは、5〜20質量部である。
さらに、より深い光硬化深度を要求される場合、必要に応じて、可視領域でラジカル重合を開始するチバ・スペシャルティ・ケミカルズ社製イルガキュアー784等のチタノセン系光重合開始剤、ロイコ染料等を硬化助剤として組み合わせて用いることができる。
ガラス粉末は、焼成後の導体回路との密着性向上のために、導電性粉末(A))100質量部当り、50質量部以下、好ましくは10質量部以下の割合で添加できる。この理由は、その配合量が上記範囲よりも多いと焼成後に充分な導通が得られず、好ましくない。このガラス粉末としては、そのガラス転移点(Tg)300〜500℃、ガラス軟化点(Ts)400〜600℃のものが好ましい。ガラス粉末の軟化点が400℃より低いと、有機バインダーを包み込み易くなり、残存する有機バインダーが分解することによって組成物中にブリスターが生じ易くなるので好ましくない。また、解像度の点からは、平均粒径10μm以下、好ましくは3μm以下のガラス粉末を用いることが好ましい。
(感光性樹脂組成物)
有機バインダー 250部
トリメチロールプロパントリアクリレート 74部
EO変性トリメチロールプロパントリアクリレート 100部
2−メチル−1−[4−(メチルチオ)フェニル]−
2−モルフォリノプロパン−1−オン 10部
導電性粉末 2222部
消泡・レベリング剤(XL490−50:伊藤製油社製) 5部
感光性樹脂組成物をガラス基板上に、100メッシュのポリエステルスクリーンを用いて全面に塗布し、次いで、熱風循環式乾燥炉にて80℃で30分間乾燥して指触乾燥性の良好な皮膜を形成した。その後、パターン寸法4mm×100mmのラインが形成できるネガマスクを用いて、組成物上の積算光量が900mJ/cm2となるように露光した後、液温30℃の0.4質量%Na2CO3水溶液を用いて現像を行ない、水洗した。最後に空気雰囲気下にて10℃/分の昇温速度で昇温し、550℃で10分間焼成して試験片を作製した。
昇温速度を20℃/分としたこと以外参考例1と同様に試験片を作製した。
昇温速度を55℃/分としたこと以外参考例1と同様に試験片を作製した。
昇温速度を2℃/分としたこと以外参考例1と同様に試験片を作製した。
昇温速度を5℃/分としたこと以外参考例1と同様に試験片を作製した。
上記試験片を用いてウエット膜厚をウエット膜厚計(ERCHSEN ウエットゲージ)、現像膜厚、焼成膜厚を表面粗さ計(小坂研究所社製 SE−30H)により測定した。
上記試験片を用いてテスター(HIOKI 3540 mΩ HITESTER)により抵抗値を測定した。
得られた膜厚、抵抗値の値から下記計算式に従い比抵抗値を算出した。
比抵抗値ρ(Ω・cm)=断面積S(cm2)×抵抗値R(Ω)/長さl(cm)
断面積S(cm2)=膜厚(cm)×パターン幅(cm)
Claims (7)
- 基材上に卑金属を含む樹脂組成物のパターンを形成し、そのパターンを大気中にて焼成して導電性焼成物パターンを形成する方法であって、焼成時の昇温速度が30〜100℃/分であることを特徴とする導電性焼成物パターンの形成方法。
- 焼成温度が400〜600℃であることを特徴とする請求項1に記載の形成方法。
- プラズマディスプレイパネルの部材に用いられる導電性焼成物パターンの形成方法である請求項1又は2に記載の形成方法。
- 樹脂組成物として、(A)少なくとも卑金属を含む導電性粉末、(B)有機バインダー、(C)光重合性モノマー、及び(D)光重合開始剤を含有する光硬化性樹脂組成物を用いることを特徴とする請求項1〜3のいずれか一項に記載の形成方法。
- 前記導電性粉末(A)が、卑金属を80質量%以上含むことを特徴とする請求項4に記載の形成方法。
- 請求項1〜5のいずれか一項に記載の方法に用いられる、(A)少なくとも卑金属を含む導電性粉末、(B)有機バインダー、(C)光重合性モノマー、及び(D)光重合開始剤を含有する光硬化性樹脂組成物。
- 前記請求項1〜5のいずれか一項に記載の方法によって得られる導電性焼成物パターン。
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