JP5102783B2 - 射出成形により形成したエネルギ獲得デバイス - Google Patents
射出成形により形成したエネルギ獲得デバイス Download PDFInfo
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/18—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
- H02N2/186—Vibration harvesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60C—VEHICLE TYRES; TYRE INFLATION; TYRE CHANGING; CONNECTING VALVES TO INFLATABLE ELASTIC BODIES IN GENERAL; DEVICES OR ARRANGEMENTS RELATED TO TYRES
- B60C23/00—Devices for measuring, signalling, controlling, or distributing tyre pressure or temperature, specially adapted for mounting on vehicles; Arrangement of tyre inflating devices on vehicles, e.g. of pumps or of tanks; Tyre cooling arrangements
- B60C23/02—Signalling devices actuated by tyre pressure
- B60C23/04—Signalling devices actuated by tyre pressure mounted on the wheel or tyre
- B60C23/0408—Signalling devices actuated by tyre pressure mounted on the wheel or tyre transmitting the signals by non-mechanical means from the wheel or tyre to a vehicle body mounted receiver
- B60C23/041—Means for supplying power to the signal- transmitting means on the wheel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/304—Beam type
- H10N30/306—Cantilevers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Fluid Pressure (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
202 プラスチックベース
204 裏打ちピース
206 圧電エレメント
208 プルーフマス
Claims (14)
- タイヤ内部の空気圧力を検知するように車両のタイヤの内部に設けられるタイヤ圧力感知デバイスにおいて、
前記タイヤ圧力感知デバイスは、
圧力センサモジュールと、
前記圧力センサモジュールに連結される振動子と、
前記振動子に連結される無線周波数トランスミッターと、
一つまたは複数の導電体を介して前記圧力センサモジュールに連結される圧電ベンダー回路であって、転動する前記タイヤからの振動エネルギを電気に変換して電力を前記圧力センサモジュール、前記振動子及び前記無線周波数トランスミッターに供給するように構成された圧電ベンダー回路と、を備えており、
前記圧電ベンダー回路は、
リードフレームの導電性部分を備える複数のダイパドルリードと、
基板ストリップと、
前記複数のダイパドルリードに取り付けられ、圧電バイモルフエレメントを形成するように前記基板ストリップに接続される圧電材料と、
前記圧電バイモルフエレメントに連結されたプルーフマスと、
前記圧電バイモルフエレメントの第1の部分を包囲し、前記バイモルフエレメントの少なくとも第2の部分を露呈したままにするように、前記圧電バイモルフエレメントの周囲に形成された射出成形プラスチック本体であって、前記第2の部分は、前記バイモルフエレメントにおける、前記プルーフマスが連結される部分を少なくとも含んでおり、
前記複数のダイパドルリードは、前記射出成形プラスチック本体から突出しており、且つ、前記リードフレームのフレームレール部分を除去した後残されて前記一つまたは複数の導電体に接続される導電性リードを備える、タイヤ圧力感知デバイス。 - 請求項1に記載のデバイスにおいて、
前記圧電材料は、ジルコン酸チタン酸鉛(PZT)を含み、前記プルーフマスはタングステンを含む、デバイス。 - 請求項1に記載のデバイスにおいて、
前記基板ストリップは、プラスチック基板、圧電材料基板、及び前記リードフレームの一部から形成されたストリップのうちの一つを含む、デバイス。 - 請求項1に記載のデバイスにおいて、
前記圧電バイモルフエレメントは、前記プルーフマスに誘導された振動力と対応する方向に撓み、前記振動力に応じて電流を発生するように形成されている、デバイス。 - 請求項4に記載のデバイスにおいて、
前記電流は、前記プラスチック本体を含むシステムに取り付けられたセンサデバイスに提供され、前記センサデバイスに作動電力を提供する、デバイス。 - システムにおいて、
センサ回路、このセンサ回路に接続されたトランスミッター回路、及びこのトランスミッター回路に接続されたアンテナを含むマイクロシステムセンサと、
前記マイクロシステムセンサに接続された電力回路とを含み、
前記電力回路は複数のリードによって前記マイクロシステムセンサに接続されており、
前記マイクロシステムセンサは、プラスチック本体と、このプラスチック本体に連結された圧電バイモルフストリップと、前記圧電バイモルフストリップに連結されたプルーフマスとを含み、前記プラスチック本体は、射出成形プロセスにより、前記圧電バイモルフストリップの一部を露呈したままにするように前記圧電バイモルフストリップを包囲し、前記圧電バイモルフストリップの前記一部は、前記バイモルフストリップにおける、前記プルーフマスが連結される部分を少なくとも含み、前記プラスチック本体は、前記リードが前記プラスチック本体から露呈されるようにリードフレームの周囲に形成され、
前記リードは、前記圧電バイモルフストリップを射出成形プロセスによって包囲した後、前記リードフレームの一つ又はそれ以上のレールを除去することによって形成される、
システム。 - 請求項6に記載のシステムにおいて、
前記圧電バイモルフストリップは、基板に接続された圧電材料を含む、システム。 - 請求項7に記載のシステムにおいて、
前記基板は、プラスチック、圧電材料、及び金属のうちの一つで形成された材料のストリップを含む、システム。 - 請求項7に記載のシステムにおいて、
前記圧電バイモルフストリップは、前記プルーフマスに誘導された振動力と対応する方向に撓み、前記振動力に応じて電流を発生し、前記マイクロシステムセンサに作動電力を提供するように形成されている、システム。 - 請求項9に記載のシステムにおいて、
前記圧電材料は、ジルコン酸チタン酸鉛(PZT)を含み、前記プルーフマスはタングステンを含む、システム。 - 請求項6に記載のシステムにおいて、
前記マイクロシステムセンサは、空気圧力センサを含む、システム。 - 請求項11に記載のシステムにおいて、
前記空気圧力センサ及び電力回路は、車輛のタイヤの内部に取り付けられる、システム。 - 方法において、
対をなした導電性部材がレールエレメントに連結されたリードフレームを提供する工程と、
前記リードフレームの一つ又はそれ以上の導電性部材に接着剤を取り付ける工程と、
前記リードフレームの前記一つ又はそれ以上の導電性部材のうちの少なくとも一つの導電性部材に圧電エレメントを取り付ける工程と、
プルーフマスを前記圧電エレメントの第1部分に取り付ける工程と、
射出成形によりプラスチック本体を前記圧電エレメントの、前記第1部分とは異なる第2部分の周囲に形成し、前記リードフレームの一つ又はそれ以上の導電性部材の部分を前記射出成形により形成したプラスチック本体から露呈したままにし、電気接点を形成する工程と、
前記リードフレームの前記レールエレメントを前記プラスチック本体から切断し、別々の圧電デバイスを形成する工程とを含む、方法。 - 請求項13に記載の方法において、更に、
前記圧電エレメントの前記第1部分を基板に結合することによって圧電バイモルフストリップを形成する工程を含み、前記基板は、プラスチック、圧電材料、及び金属のうちの一つで形成されたストリップ材料を含む、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US11/354,399 | 2006-02-14 | ||
US11/354,399 US20070188053A1 (en) | 2006-02-14 | 2006-02-14 | Injection molded energy harvesting device |
PCT/US2007/002328 WO2007094948A1 (en) | 2006-02-14 | 2007-01-26 | Injection molded energy harvesting device |
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JP2009527212A JP2009527212A (ja) | 2009-07-23 |
JP5102783B2 true JP5102783B2 (ja) | 2012-12-19 |
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Country Status (5)
Country | Link |
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US (2) | US20070188053A1 (ja) |
EP (1) | EP1987551B1 (ja) |
JP (1) | JP5102783B2 (ja) |
DE (1) | DE602007005459D1 (ja) |
WO (1) | WO2007094948A1 (ja) |
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-
2006
- 2006-02-14 US US11/354,399 patent/US20070188053A1/en not_active Abandoned
-
2007
- 2007-01-26 DE DE602007005459T patent/DE602007005459D1/de active Active
- 2007-01-26 WO PCT/US2007/002328 patent/WO2007094948A1/en active Application Filing
- 2007-01-26 EP EP07717095A patent/EP1987551B1/en not_active Expired - Fee Related
- 2007-01-26 JP JP2008555250A patent/JP5102783B2/ja not_active Expired - Fee Related
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2010
- 2010-05-27 US US12/789,405 patent/US8225471B2/en active Active
Also Published As
Publication number | Publication date |
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JP2009527212A (ja) | 2009-07-23 |
DE602007005459D1 (de) | 2010-05-06 |
US20070188053A1 (en) | 2007-08-16 |
EP1987551B1 (en) | 2010-03-24 |
US8225471B2 (en) | 2012-07-24 |
EP1987551A1 (en) | 2008-11-05 |
US20100236036A1 (en) | 2010-09-23 |
WO2007094948A1 (en) | 2007-08-23 |
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