JP5056051B2 - Card type information device - Google Patents

Card type information device Download PDF

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Publication number
JP5056051B2
JP5056051B2 JP2007037544A JP2007037544A JP5056051B2 JP 5056051 B2 JP5056051 B2 JP 5056051B2 JP 2007037544 A JP2007037544 A JP 2007037544A JP 2007037544 A JP2007037544 A JP 2007037544A JP 5056051 B2 JP5056051 B2 JP 5056051B2
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Prior art keywords
substrate
memory module
base
mounted
base body
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JP2008204037A (en
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能彦 八木
道朗 吉野
和岐 深田
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パナソニック株式会社
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Description

  The present invention relates to a semiconductor module and a card type information device for mounting a substrate on which a semiconductor element is mounted at high density.

  Along with the downsizing of electronic equipment, there has been a need for a semiconductor module in which semiconductor elements are mounted at a high density and housed in a substrate that is a single package. In addition, in many cases, a card type information device has a planar size and thickness determined by a standard, and in order to obtain a high-performance information device, it is necessary to mount more semiconductor elements in the determined space. .

  Here, as a method for mounting semiconductor elements at a high density, stacking semiconductor elements in the thickness direction of the substrate is more efficient than mounting a large number of semiconductor elements in one plane without increasing the mounting area. High density mounting is possible.

FIG. 10 is a cross-sectional view of a package of Patent Document 1 which is a conventional example in which semiconductor elements are stacked in the thickness direction of such a substrate. As shown in FIG. 10, the recess 5 has a stepped portion 52 in the inner peripheral portion, and the LSI 2 is electrically connected to the stitch 3 provided in the stepped portion 52. Further, the concave portion 5 has a step portion 53 provided on the upper portion of the step portion 52 in the peripheral portion inside, and the LSI 12 is electrically connected to the stitch 13 provided in the step portion 53. In this way, by providing the package 1 with an opening that extends from the lower part to the upper part of the package 1, the LSIs are stacked and accommodated in the upper and lower directions, so that the LSI can be mounted at a high density. It is shown.
Japanese Patent Laid-Open No. 10-135406

  However, in Patent Document 1, both ends of the substrate 11 are connected to the stitches 13 of the step portion 53 via solder balls 16 for electrical connection between the external connection terminals of the LSI 12 and the internal wiring of the package 1. .

  Such a substrate 11 is mounted on a semiconductor module and built in an information device such as a card type information device. In many cases, the information device is excessively pressed during handling or receives an impact caused by dropping. At this time, when a load is applied to the substrate 11 and a bending moment or a torsional moment is applied, there is a problem in that the connection portion between the substrate 11 and the package 1 is cracked or broken.

  Further, in the base body (package) having the shape of Patent Document 1, since the size of the opening is different between the lower part and the upper part of the base body, the size of the substrate to be mounted on each step part is also different, and the semiconductor elements are mounted with higher density If it is going to do, a several board | substrate will be mounted in a big board | substrate.

  Therefore, in the base of the shape of Patent Document 1, the size of the substrate is different, and the number of semiconductor elements mounted on each substrate may be different. In this case, it is necessary to separately prepare substrates having different sizes and the number of semiconductor elements to be mounted, and a small number of many types of substrates are prepared.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object of the present invention is to provide a semiconductor module and a card-type information device that are mounted with high density on a substrate on which semiconductor elements are mounted and that are excellent in reliability and productivity. .

  In order to achieve the above object, a semiconductor module of the present invention includes a substrate on which at least one surface is mounted with a semiconductor element and a take-out electrode for taking out a signal of the semiconductor element is provided only at one end, a first surface and a second surface. And a base having an electrical connection terminal on the first surface, and a take-out electrode connected to the connection terminal.

  In the semiconductor module having such a configuration, since only one end of the substrate is connected to the base body, the other end of the substrate is a free end even if the substrate is pressed and a bending moment or a torsional moment is applied. Bending and twisting moments are alleviated. Therefore, the stress applied to the connection portion where the substrate and the base are connected is reduced, and a highly reliable semiconductor module that is unlikely to cause damage to the connection portion can be provided. Further, since only one end of the substrate is connected to the base, the same shape substrate can be used, and productivity is improved.

  Further, a plurality of step portions may be provided on the base of the semiconductor module of the present invention.

  Such a base body provided with a plurality of stepped portions can connect a substrate to each first surface, and can mount a substrate on which a semiconductor element is mounted with higher density.

  Further, the plurality of step portions of the semiconductor module of the present invention each have a shape from the lower part to the upper part of the base, and the vertical cross-sectional shape of the base may be wider as it goes from the upper part to the lower part of the base.

  Since such a base has a shape in which the lower part is wider than the upper part, the base occupies a relatively large volume. However, the board can be mounted sequentially from the lower part, and mounting becomes easy.

  In addition, the plurality of step portions of the semiconductor module of the present invention has a shape from the bottom to the top of the base and a shape from the top to the bottom of the base, and the vertical cross section of the base is a shape surrounded by two step portions. Also good.

  When the base has such a shape, more substrates can be stacked in the thickness direction of the base without increasing the volume of the base, so that the substrate on which the semiconductor elements are mounted can be mounted with higher density.

  In the semiconductor module of the present invention, a plurality of staircase portions are arranged at positions where the substrates are stacked in the vertical direction, and the height of the second surface of each staircase portion is set to a height at which the substrates do not overlap in the vertical direction. May be.

  Even in such a semiconductor module, since the substrates can be stacked with higher density in a limited space, the mounting density of the substrate on which the semiconductor elements are mounted can be further increased. In addition, since a plurality of step portions can be arranged in an arbitrary direction, the planar shape can be mounted in an L-shaped or T-shaped space.

  A semiconductor element may be mounted on the other surface of the substrate of the semiconductor module of the present invention.

  With such a semiconductor module, since the semiconductor elements are mounted on both sides of the substrate, the semiconductor elements can be mounted at a higher density.

  The substrate of the semiconductor module of the present invention may have flexibility.

  When a flexible substrate is used, even if a load is applied, the substrate is less likely to damage the connection portion between the substrate and the substrate.

  The semiconductor element of the semiconductor module of the present invention may be a memory chip.

  Further, the card type information device of the present invention includes a memory module substrate provided with an external connection terminal for connecting to an external terminal in the above-described semiconductor module, a circuit control element for controlling the semiconductor element, and the memory module substrate and the circuit control element. It is good also as a structure provided with the housing | casing to perform.

  In the card type information device having such a configuration, only one end of the substrate on which the semiconductor element is mounted is connected, and the other end is a free end. Therefore, even when a load is applied to the substrate from the outside, a moment due to the load is relieved by the free end, and a highly reliable card type information device that hardly damages the connection portion between the substrate and the substrate can be provided.

  In the card type information device of the present invention, the circuit control element may be attached to the memory module substrate.

  With such a configuration, the memory module substrate can be provided with a recess to accommodate the circuit control element, and the substrate can be mounted at a higher density.

  According to the present invention, a substrate on which semiconductor elements are mounted can be mounted with high density, and even when a load is applied from the outside, the moment applied to the connecting portion between the substrate and the substrate is relaxed, and the substrate having the same shape and high reliability is achieved. It is possible to provide a semiconductor module and a card type information device with excellent productivity that can be used.

  Hereinafter, a semiconductor module and a card type information device according to embodiments of the present invention will be described with reference to the drawings. In the embodiment of the present invention, a memory module substrate on which a memory chip is mounted as a semiconductor module will be described as an example.

(First embodiment)
1A is a perspective view of the memory module substrate according to the first embodiment of the present invention, FIG. 1B is a plan view of FIG. 1A, and FIG. 1C is FIG. 1B. It is AA sectional view. The memory module substrate 100 includes, for example, an epoxy resin base 102 and four boards 104 having only one end connected to the first surface 108 of each base 102. A memory chip 106 that is a semiconductor element is mounted on one surface 103 of each substrate 104, and an extraction electrode 107 that extracts a signal from the memory chip 106 is provided at an end of the substrate 104. Here, the first surface 108 has such a size that the substrate 104 can be connected, and each of the second surfaces 110a to 110d has such a height that the substrates 104 adjacent in the vertical direction do not overlap each other.

  The base body 102 is provided with a staircase portion 112 in which a plurality of first and second surfaces 110a to 110d, which are horizontal surfaces and horizontal surfaces, and second surfaces 110a to 110d that are vertical surfaces and vertical surfaces are alternately formed. Yes. As shown in FIG. 1C, the base body 102 has a shape that becomes wider from the upper part 114 toward the lower part 116. A connection terminal 109 connected to each extraction electrode 107 is provided on the first surface 108 of the base 102, and only one end of the substrate 104 is connected via the connection terminal 109 and the extraction electrode 107. In the base 102, the connection terminals 109 are connected by wiring 118.

  Here, the substrate 104 is preferably a flexible flexible substrate such as polyimide resin or polyethylene resin. Such a flexible substrate can be thinned to about 50 μm and is suitable for mounting semiconductor elements at high density. It is a substrate. Further, the memory chip 106 and the substrate 104, and the extraction electrode 107 and the connection terminal 109 are pressure-bonded to each other via an NCP (Non Conductive Paste) or an ACF (Anisotropic Conductive Film).

  In this way, only one end of the substrate 104 is connected to the base body 102 via the extraction electrode 107 and the connection terminal 109, and the other end of the substrate 104 is a non-connected free end. Therefore, even when a load is applied to such a substrate 104, the moment due to the load can be relaxed at the free end. The state of the substrate when a moment is applied to the substrate to which only one end is connected will be described with reference to FIG.

  FIG. 2A is an explanatory diagram when a load is applied to the memory module substrate of the first embodiment of the present invention and a bending moment is generated in the substrate, and FIG. 2B is a diagram of the memory module substrate of the same embodiment. It is explanatory drawing when a load is added and the torsional moment generate | occur | produces in the board | substrate.

  As shown in FIG. 2A, when a load is applied to the substrate 104 from below, a bending moment is applied to bend the substrate 104 upward. Further, as shown in FIG. 2B, when a load is applied to the substrate 104 from above and below, a torsional moment that tries to twist the substrate 104 acts. When a bending moment or a torsional moment is applied to the substrate with both ends fixed, a large force is applied to the connection portions at both ends, and the connection portions may break. However, when only one end of the substrate 104 is connected and fixed in this way and the other end is a free end, the bending moment and the torsional moment are relaxed at the free end, so that the connection portion 101 between the base 102 and the substrate 104 is broken. It is less likely to cause damage. The connection portion 101 is a portion where the extraction electrode 107 of the substrate 104 is connected to the connection terminal 109 of the base body 102.

  In addition, as the substrate 104 to which only one end is connected, those produced in a batch in the same shape can be used, and productivity can be improved.

  Next, FIG. 3 is a cross-sectional view of a memory module substrate 120 according to a modification of the first embodiment of the present invention. In addition to one surface 103 of each substrate 124, the memory chip 106 is also formed on the other surface 105. It is installed. With such a memory module substrate 120, the memory chips 106 are mounted on both sides of the substrate 124, so that the memory chips 106 can be mounted at a higher density. In addition, by mounting memory chips 106 of the same size on both sides of the substrate 124, even if a load is applied to the substrate 124, it is symmetrical in the thickness direction of the substrate 124, so that an uneven distribution of stress can be prevented. is there.

(Second Embodiment)
4A is a perspective view of a memory module substrate according to the second embodiment of the present invention, FIG. 4B is a plan view of FIG. 4A, and FIG. 4C is FIG. 4B. It is a BB sectional view.

  The memory module substrate 130 according to the second embodiment of the present invention differs from the memory module substrate 100 according to the first embodiment of the present invention in the shape of the base, and this point will be mainly described. That is, as shown in FIG. 4, the base 132 of the memory module substrate 130 includes two step portions 134 and 135. The staircase portions 134 and 135 are shaped from the lower portion 116 to the upper portion 114 of the base body 132, and the shape of the vertical cross section of the base body 132 is wider as it goes from the upper portion 114 to the lower portion 116 of the base body 132. Further, in the base 132, the connection terminals 109 are connected by wiring 136.

  Since the memory module substrate 130 can mount the substrate 104 on the two stepped portions 134 and 135, the substrate 104 on which the memory chip 106 is mounted can be mounted at a higher density. Further, since the base body 132 has a shape in which the lower part 116 is wider than the upper part 114, the base body 132 occupies a relatively large volume. However, since the board 104 can be mounted sequentially from the lower part 116, the board 104 can be easily mounted. Become.

  In the second embodiment of the present invention, the example in which the two staircase portions 134 and 135 are provided on both sides has been described. However, the position where the staircase portion is provided may be determined in accordance with the mounting space. Further, the number of staircase portions may be three or more according to the mounting space.

(Third embodiment)
5A is a perspective view of a memory module substrate according to the third embodiment of the present invention, FIG. 5B is a plan view of FIG. 5A, and FIG. 5C is FIG. 5B. It is CC sectional view taken on the line.

  As shown in FIG. 5, the base 142 of the memory module substrate 140 according to the third embodiment of the present invention also includes two stepped portions 144 and 145. The staircase portion 144 is shaped from the lower portion 116 of the base body 142 toward the upper portion 114, and the staircase portion 145 is shaped toward the lower portion 116 from the upper portion 114 of the base body 142. The vertical cross section of the base body 142 has a shape surrounded by the staircase portion 144 and the staircase portion 145. Further, in the base body 142, the connection terminals 109 are connected by a wiring 146.

  The memory module substrate 140 according to the third embodiment of the present invention can mount the substrate 104 more densely than the memory module substrate 130 according to the second embodiment of the present invention. As shown in FIG. 5C, when the cross-sectional length of the base body 142 is p and the protruding length of the substrate 104 from the base body 142 is q, the cross-sectional length of the memory module substrate 140 is p + 2q. On the other hand, since the cross-sectional length of the memory module substrate 130 is 2 (p + q) as shown in FIG. 4C, the cross-sectional length p of the base body 142 can be shortened, and the space with a limited length can be obtained. The memory module substrate 140 can be incorporated.

(Fourth embodiment)
6A is a perspective view of a memory module substrate according to a fourth embodiment of the present invention, FIG. 6B is a plan view of FIG. 6A, and FIG. 6C is FIG. 6B. It is DD sectional view taken on the line. In the memory module substrate 160 according to the fourth embodiment of the present invention, two bases 162 and 164 are arranged at positions where the substrates 104 are stacked in the vertical direction, and the second surfaces 166a to 166h of the bases 162 and 164 are arranged. Is set so that the substrates 104 do not overlap each other in the vertical direction. That is, the memory module substrate 160 is disposed so that the respective stepped portions 168 and 170 of the bases 162 and 164 face each other. In the base 162, the connection terminals 109 are connected by wiring 172, and in the base 164, the connection terminals 109 are connected by wiring 174. And
(Height of second surface 166a of base 162)> (Height of second surface 166e of base 164) + (thickness of substrate 104 including memory chip 106))
(Height of second surface 166f of base 164)> (height of second surface 166a of base 162) − (height of second surface 166e of base 164) + (including memory chip 106) Thickness of substrate 104))
(Height of second surface 166b of base 164)> (height of second surface 166e of base 164) + (height of second surface 166f of base 164) − (second of base 162) (Height of surface 166a) + (thickness of substrate 104 including memory chip 106))
The setting of the heights of the second surfaces 166a to 166h of the bases 162 and 164 described above is continued until the substrate 104 of the base 162 and the substrate 104 of the base 164 do not overlap in the vertical direction. For example, in the case of FIG. 6, the second surface 166 c of the base body 162 and the substrates 104 arranged at a position higher than the second surface 166 g of the base body 164 do not overlap with each other, so the height of the second surfaces 166 a, 166 b, 166 f May be set by the method described above.

  With such a memory module substrate 160, the substrates 104 can be stacked in a higher density within a limited space. As shown in FIG. 6C, when the cross-sectional length of the bases 162 and 164 is p and the protruding length of the substrate 104 from the bases 162 and 164 is q, the cross-sectional length of the memory module substrate 160 is (2p + q). Become. As described above, since the cross-sectional length of the memory module substrate 130 on which the same number of substrates 104 are mounted is 2 (p + q), the memory module substrate 160 according to the fourth embodiment of the present invention can be shortened by q. .

  FIG. 7 is a cross-sectional view of Modification 1 of the memory module substrate according to the fourth embodiment of the present invention. The memory module substrate 160 is arranged so that the step portions 168 and 170 of the two bases 162 and 164 face each other. However, like the memory module substrate 180 shown in FIG. Portions 184 and 186 may be provided.

  FIG. 8A is a plan view of a memory module substrate according to Modification 2 of the fourth embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along the line EE of FIG. 8A. As shown in FIG. 8, the memory module substrate 190 is composed of two bases 192 and 194. The central axis of the base body 192 and the central axis of the base body 194 are disposed at a position orthogonal to each other.

  In the memory module substrate 190, the heights of the second surfaces 196a to 196h of the bases 192 and 194 are set so that the substrate 104 of the base 192 and the substrate 104 of the base 194 do not overlap in the vertical direction. Good.

  With such a memory module substrate 190, the planar shape can be mounted in a space such as an L-shaped corner or a T-shape, and a limited space such as a mobile phone can also be used.

(Fifth embodiment)
Next, a memory card incorporating a memory module substrate will be described as a card type information device. FIG. 9A is a perspective view of a memory card according to the fifth embodiment of the present invention, and FIG. 9B is a cross-sectional view of the memory card of FIG.

  As shown in FIG. 9A, the memory card 200 has a standardized rectangular size and thickness. For example, an SD memory card (registered trademark) has a length of 32 mm, a width of 24 mm, and a thickness of 2.1 mm. The memory capacity of the memory card 200 can be increased by incorporating a memory module substrate in which the substrate 104 on which the memory chips 106 are mounted in such a limited space is mounted at high density. For example, when one memory chip 106 is 512 MB, the memory module substrate 130 according to the second embodiment of the present invention includes eight memory chips 106, so that the storage capacity can be about 4 GB.

  Further, as shown in FIG. 9B, the memory card 200 is mounted with the memory chip 106, for example, the memory module substrate 130 according to the second embodiment of the present invention, and the circuit control element 202 that controls the memory chip 106. It is comprised with the housing | casing 204 which consists of a polycarbonate / ABS alloy etc. which included the.

  Here, the circuit control element 202 is housed and mounted with a countersink in the lower surface of the base body 132. Therefore, the lower space 203 in which the circuit control element is accommodated in the conventional memory card can also be used effectively. For example, the memory chip 106 can be further stacked by expanding the base 132 of the memory module substrate 130 in the lower space 203.

  The memory module substrate 130 is provided with an external connection terminal 206 for connection to an external terminal, and a bypass chip capacitor 208 is attached to the base 132. Further, by covering the periphery of the memory module substrate 130 with the sealing resin 210, it is possible to improve reliability such as prevention of entry of foreign matter and moisture resistance.

  Since such a memory card 200 has a built-in memory module substrate 130 including the substrate 104 mounted at a high density, it can be a card type information device having a large storage capacity. Since only one end of the substrate 104 on which the memory chip 106 is mounted is connected and the other end is a free end, even if a load is applied to the substrate 104 from the outside, the moment due to the load is reduced at the free end. Therefore, it is possible to provide a highly reliable card type information device that is unlikely to damage the connection portion 101.

  In the embodiment of the present invention, the memory chip is described as the semiconductor element. However, an ASIC IC chip such as a single chip microcomputer may be used.

  In the embodiment of the present invention, the example in which the wiring connecting the connection terminals 109 is provided in the base body is shown. However, the wiring may be provided on the surface of the staircase portion.

  The semiconductor module and the card type information device of the present invention are useful as an information transmission medium used for portable digital devices such as a digital camera, a portable music player, and a portable information terminal.

(A) Perspective view of the memory module substrate according to the first embodiment of the present invention (b) Plan view of FIG. 1 (a) (c) Cross-sectional view taken along line AA of FIG. 1 (b) (A) Explanatory drawing when a load is applied to the memory module substrate of the embodiment and a bending moment is generated in the substrate (b) When a load is applied to the memory module substrate of the embodiment and a torsional moment is generated in the substrate Illustration Sectional drawing of the memory module board | substrate of the modification of the embodiment (A) Perspective view of a memory module substrate according to the second embodiment of the present invention (b) Plan view of FIG. 4 (a) (c) Sectional view taken along line BB of FIG. 4 (b) (A) Perspective view of a memory module substrate according to the third embodiment of the present invention (b) Plan view of FIG. 5 (a) (c) Cross-sectional view taken along line CC of FIG. 5 (b) (A) Perspective view of a memory module substrate according to the fourth embodiment of the present invention (b) Plan view of FIG. 6 (a) (c) Sectional view taken along line DD of FIG. 6 (b) Sectional drawing of the memory module board of the modification 1 of the embodiment (A) Plan view of memory module substrate of modification 2 of same embodiment (b) Cross-sectional view taken along line EE of FIG. 8 (a) (A) Perspective view of a memory card according to the fifth embodiment of the present invention (b) A cross-sectional view of the memory card of FIG. Cross section of conventional package

Explanation of symbols

100, 120, 130, 140, 160, 180, 190 Memory module substrate (semiconductor module)
DESCRIPTION OF SYMBOLS 101 Connection part 102,132,142,162,164,182,192,194 Base | substrate 103 One side 104,124 Board | substrate 105 The other side 106 Memory chip (semiconductor element)
107 Extraction electrode 108 First surface 109 Connection terminal 110a, 110b, 110c, 110d, 166a, 166b, 166c, 166d, 166e, 166f, 166g, 166h, 196a, 196b, 196c, 196d, 196e, 196f, 196g, 196h Second surface 112, 134, 135, 144, 145, 168, 170, 184, 186 Step portion 114 Upper portion 116 Lower portion 118, 136, 146, 172, 174 Wiring 200 Memory card (card type information device)
202 Circuit Control Element 203 Lower Space 204 Case 206 External Connection Terminal 208 Chip Capacitor 210 Sealing Resin

Claims (1)

  1. A memory module substrate comprising a semiconductor module and external connection terminals to which external terminals are connected;
    A card type information device comprising a housing enclosing the memory module substrate,
    The semiconductor module is
    A substrate in which a semiconductor element is mounted on at least one surface and a take-out electrode for taking out a signal of the semiconductor element is provided only at one end;
    Comprises a first surface and the first substrate provided with a stepped portion having a plurality of sets are alternately perpendicular second plane to the surface having the connection terminal connected to the extraction electrode,
    The substrate is
    The staircase portion has a staircase shape that extends from the lower portion to the upper portion of the base body, and at least two of the staircase portions face so that a horizontal width of a vertical cross section of the base body becomes wider from the upper portion to the lower portion of the base body. Arranged together,
    A circuit control element that controls the semiconductor element is housed and mounted with a countersink in the lower surface of the base body,
    The card-type information device according to claim 1, wherein the base has the connection terminal and the circuit control element connected to each other by wiring .
JP2007037544A 2007-02-19 2007-02-19 Card type information device Expired - Fee Related JP5056051B2 (en)

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GB2524327A (en) * 2014-03-21 2015-09-23 Nokia Technologies Oy Flexible electronics apparatus and associated methods
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JPS6355213B2 (en) * 1980-07-31 1988-11-01 Fujitsu Ltd
JPS6232399Y2 (en) * 1982-11-26 1987-08-19
JPS6010764A (en) * 1983-06-30 1985-01-19 Fujitsu Ltd Semiconductor device
JPH01140649A (en) * 1987-11-27 1989-06-01 Fujitsu Ltd Manufacture of semiconductor device
JP2001135739A (en) * 1999-11-09 2001-05-18 Shinko Electric Ind Co Ltd Semiconductor package, semiconductor device and semiconductor module
JP3768761B2 (en) * 2000-01-31 2006-04-19 株式会社アキタ電子システムズ Semiconductor device and manufacturing method thereof
JP3818359B2 (en) * 2000-07-18 2006-09-06 セイコーエプソン株式会社 Semiconductor device, circuit board and electronic equipment
JP2002288618A (en) * 2001-03-23 2002-10-04 Toshiba Corp Portable electronic medium and electronic circuit component
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