JP4936597B2 - Ultrasonic probe and ultrasonic probe manufacturing method - Google Patents

Ultrasonic probe and ultrasonic probe manufacturing method Download PDF

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Publication number
JP4936597B2
JP4936597B2 JP2001031281A JP2001031281A JP4936597B2 JP 4936597 B2 JP4936597 B2 JP 4936597B2 JP 2001031281 A JP2001031281 A JP 2001031281A JP 2001031281 A JP2001031281 A JP 2001031281A JP 4936597 B2 JP4936597 B2 JP 4936597B2
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Prior art keywords
resin layer
piezoelectric body
ultrasonic probe
single crystal
upper surface
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JP2001298795A (en
Inventor
洋八 山下
俊 武内
守 泉
靖晴 細野
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株式会社東芝
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus, an ultrasonic treatment apparatus, and the like, and a method for manufacturing the ultrasonic probe.
[0002]
[Prior art]
The ultrasonic probe is composed mainly of a piezoelectric body, and irradiates ultrasonic waves toward the object and receives reflected waves from the interface with different acoustic impedances in the object, thereby imaging the internal state of the object. It is used to As an ultrasonic imaging apparatus employing such an ultrasonic probe, there are, for example, a medical diagnostic apparatus for inspecting the inside of a human body, an inspection apparatus for the purpose of flaw detection inside a metal weld, and the like.
[0003]
In this ultrasonic diagnostic apparatus, which is a medical ultrasonic imaging apparatus, in addition to a tomographic image (B-mode image) of a human body, a color flow that displays a blood flow velocity in two dimensions using Doppler shift due to ultrasonic blood flow. Imaging techniques such as a mapping (CFM) method and a tissue harmonic imaging (THI) method in which second harmonics are imaged have been developed. The ultrasonic probe has a form corresponding to these various imaging methods, and enables transmission and reception of ultrasonic waves related to all organs of the human body.
[0004]
In general, an ultrasonic probe used in an ultrasonic diagnostic apparatus is required to obtain a high-resolution image with high sensitivity. This is to make it possible to find small lesions and voids with an image that can be clearly displayed up to the deep part of the diagnosis target. In recent years, as one of the methods, it has been considered to further increase the sensitivity and bandwidth of an ultrasonic probe as a sensor portion.
[0005]
In order to achieve the above-described high sensitivity and wide band, a composite piezoelectric body having a structure in which a piezoelectric column or piezoelectric powder is embedded in a resin has been studied. For example, JP-B-54-19151, JP-A-60-97800, JP-A-61-53562, JP-A-61-109400 and the like, and JP-A-57-45290, JP-A-58-21818, Nos. 60-54600, JP-A 60-85699, JP-A 62-122499, JP-A 62-131700 and the like have been proposed.
[0006]
The ultrasonic probe using the composite piezoelectric material disclosed in these documents has a low acoustic impedance and approaches the impedance of a living body, and the electromechanical coupling coefficient is thin in the 1-3 type or 2-2 type configuration. It has the merit of increasing compared to the case. This is because the composite piezoelectric material has a large dielectric constant and an electromechanical coupling coefficient k. 33 This is because a large PZT piezoelectric ceramic is mainly used.
[0007]
On the other hand, the ultrasonic probe using the composite piezoelectric material also has a problem that the improvement of the electromechanical coupling coefficient is small as compared with the decrease in the dielectric constant due to the resin. Therefore, in reality, the composite piezoelectric body is only used for a single-type mechanical probe or an annular array having a large element area. So k compared to kt 33 Attempts have also been made to solve this problem by using a solid solution type piezoelectric single crystal that is dramatically higher. (JP 09-84194 A)
In order to realize a high-sensitivity and wide-band ultrasonic probe, a composite piezoelectric body 30 of a solid solution type piezoelectric single crystal 32 and resins 34 and 36 is formed as in the array probe 28 shown in FIG. There is a way to do it. However, in the formation of the composite piezoelectric body 30, there is a problem of defects during cutting. That is, since the solid solution type piezoelectric single crystal 32 is generally brittle with low fracture toughness, chipping as shown in FIG. 13C is performed during the cutting process for forming the grooves 38 shown in FIG. There are problems that occur. This chipping causes defects due to deterioration of characteristics and cracks in the element.
[0008]
Therefore, we have proposed a structure as shown in FIG. 14A as an ultrasonic probe using these single crystals (see Japanese Patent Application Laid-Open No. 2000-14672), and have tried to improve the probe manufacturing yield. FIG. 14A shows a cross-sectional structure of an array probe using a single crystal vibration element. Electrodes 4 and 5 are formed on both surfaces of the single crystal vibration element 1, and a backing material 2 is provided on the lower surface of the vibration element 1. In addition, acoustic matching layers 3a and 3b are formed on the upper surface of the single crystal vibration element, and the single crystal vibration element 1 and the acoustic matching layers 3a and 3b are arrayed. The array pitch of the array probes is narrow and is about 0.1 mm. Furthermore, ultrasonic waves are transmitted and received through the acoustic lens 8 provided on the acoustic matching layer 3b. The electrodes 4 and 5 formed on both surfaces of the single crystal vibrating element 1 are connected to a cable via the FPCs 6 and 7 and connected to a diagnostic device (not shown). In the structure of FIG. 14A, the FPC 6 has the conductive layer of the FPC expanded to the area of the vibration element and is bonded to the vibration element with an epoxy-based adhesive over the entire surface. The conductive layer is generally made of metal Cu. FIG. 14B shows the conductive layer under the signal FPC shown in FIG. 14A as viewed from the single crystal resonator element 1. As shown in FIG. 14B, the conductive layer 6a ′ of the signal FPC in FIG. 14A is drawn out from the conductive layer 6a in a staggered manner. These arrangement structures are prepared as described below. The electrodes 4 and 5 are formed on the single crystal vibrating element 1 having an integral shape. The vibration element to which the FPC is bonded is bonded to the backing material 2 to form the acoustic matching layers 3a and 3b, and then cut from the matching layer side using a dicing saw. Thereafter, the acoustic lens 8 is formed on the acoustic matching layer 3b to complete.
[0009]
However, adopting the above manufacturing method, FPC with the conductive layer expanded to the area of the single crystal vibrating element is bonded with epoxy adhesive over the entire vibrating element, and the previous vibrating element is bonded to the backing material with epoxy adhesive. After bonding, forming an acoustic matching layer on the previous vibration element, and performing array processing with a dicing saw, cracks and chipping may occur at the dicing edge portion of the surface to which the FPC of the single crystal vibration element is bonded. There was a problem. This is considered to be caused by simultaneously cutting a piezoelectric single crystal having a low mechanical strength and an FPC conductive layer having a poor machinability during array processing. In addition, the flash from the conductive layer generated during the processing roughens the cut surface of the single crystal vibration element, and the cutting waste caught in the blade causes a reduction in cutting. Such cracks and chipping of the single crystal vibrating element are difficult to suppress even if the processing conditions are adjusted. Large cracks can lead to poor disconnection, reduce manufacturing yield, and small cracks can develop during use and cause market accidents. Further, since chipping reduces the electrode area of the vibration element processed into a strip shape, not only the characteristic deterioration is caused, but also the characteristic variation between the array elements is increased. Since the number of array elements ranges from several tens to several hundreds, variation in characteristics between array elements affects the image quality of tomographic images displayed on the diagnostic apparatus.
[0010]
[Problems to be solved by the invention]
An object of the present invention is to solve the above-mentioned problems, using a composite piezoelectric body of a solid solution type piezoelectric single crystal and a resin, so as not to cause a processing defect during cutting. An object of the present invention is to provide an acoustic probe and a method for manufacturing the ultrasound probe.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the present invention takes the following measures.
[0012]
According to the first aspect of the present invention, the single crystal piezoelectric body cut in an array, the upper surface resin layer formed on the upper surface of the piezoelectric body and having an acoustic impedance smaller than that of the piezoelectric body, and the lower surface of the piezoelectric body are formed. Acoustic impedance is smaller than the piezoelectric body The same material as the upper surface resin layer An ultrasonic vibration element comprising a lower surface resin layer Equipped with , In the case of forming the array-shaped single crystal piezoelectric body by cutting the upper surface resin layer, the single crystal piezoelectric body, and the lower surface resin layer to form a plurality of grooves, The upper surface resin layer and the lower surface resin layer are an ultrasonic probe characterized by having cutting properties, a reinforcing function during cutting of the piezoelectric body, and conductivity, and functioning as electrodes.
According to a second aspect of the present invention, there is provided a piezoelectric body formed of a solid solution single crystal containing at least lead titanate, an upper surface resin layer formed on an upper surface of the piezoelectric body and having an acoustic impedance smaller than that of the piezoelectric body, It is formed on the lower surface of the piezoelectric body and has a lower acoustic impedance than the piezoelectric body. The same material as the upper surface resin layer An ultrasonic vibration element formed of a 1-3 type or 2-2 type composite piezoelectric body comprising a lower surface resin layer; In the case of forming the array-shaped single crystal piezoelectric body by cutting the upper surface resin layer, the single crystal piezoelectric body, and the lower surface resin layer to form a plurality of grooves, The upper surface resin layer and the lower surface resin layer are an ultrasonic probe characterized by having cutting properties, a reinforcing function during cutting of the piezoelectric body, and conductivity, and functioning as electrodes.
According to a fourth aspect of the present invention, there is provided an upper surface of a single crystal piezoelectric body. Surface and On the bottom , Made of the same material Resin layer with smaller acoustic impedance than the single crystal piezoelectric body Form A first step; The resin layer on the upper surface penetrates the piezoelectric body and extends from the resin layer on the lower surface. An ultrasonic probe manufacturing method comprising: a second step of forming a plurality of grooves; and a third step of filling the plurality of grooves with a resin.
According to the seventh aspect of the present invention, a resin sheet is bonded to the upper surface of the single crystal piezoelectric body, and the lower surface of the single crystal piezoelectric body is bonded to the lower surface of the single crystal piezoelectric body. Of the same material as the resin sheet on the top surface A first step of bonding the resin sheet; The resin sheet on the upper surface penetrates the single crystal piezoelectric body and extends to the resin sheet on the lower surface. An ultrasonic probe manufacturing method comprising: a second step of forming a plurality of grooves; and a third step of filling the plurality of grooves with a resin.
[0020]
According to the present invention having the above-described configuration, it is possible to manufacture an ultrasonic probe that does not cause processing defects during cutting. As a result, an ultrasonic probe having high sensitivity and broadband characteristics can be realized.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, first to seventh embodiments of the present invention will be described with reference to the drawings.
[0022]
(First embodiment)
FIG. 1 shows a schematic configuration of an ultrasonic probe 10 according to the first embodiment.
[0023]
In FIG. 1, an ultrasonic probe 10 includes a composite piezoelectric body (1-3 type) 11, an acoustic matching layer 17, an acoustic lens 19, a common electrode plate 21, a flexible wiring board 23, and a backing material 25. Yes.
[0024]
The composite piezoelectric body (1-3 type) 11 includes a single crystal piezoelectric body 111, an upper PVC resin layer 113, and a lower PVC resin layer 115. That is, the composite piezoelectric body (1-3 type) 11 is a piezoelectric body in which one-dimensional thin rods of single crystal piezoelectric ceramics are embedded in a PVC resin matrix that is a three-dimensional polymer. It has a mechanical coupling coefficient and low acoustic impedance. Electrodes (not shown) for transmitting and receiving electrical signals by the piezoelectric direct effect and the piezoelectric inverse effect are formed on the upper and lower surfaces of the composite piezoelectric body 11 by a method described later.
[0025]
The single crystal piezoelectric body 111 is a solid solution single crystal piezoelectric ceramic containing lead zinc niobate (PZN), lead titanate (PT), and the like, and is produced by a method described later.
[0026]
The upper PVC resin layer 113 is a layer formed by applying a PVC resin containing silver on the ultrasonic irradiation side (hereinafter referred to as the upper side) of the piezoelectric body 111. Small acoustic impedance (eg 2 × 10 6 g / m 2 s to 10 × 10 6 g / m 2 s).
[0027]
The lower PVC resin layer 115 is a layer formed by applying a silver-containing PVC resin on the opposite side (hereinafter referred to as the lower side) of the single crystal piezoelectric body 111, and has conductivity, good machinability, The acoustic impedance is smaller than that of the crystal piezoelectric material. The lower PVC resin layer 115 and the upper PVC resin layer 113 play a role in preventing chipping and cracking of the single crystal piezoelectric body 111. A method for forming the lower PVC resin layer 115 and the upper PVC resin layer 113 will be described in detail later.
[0028]
The acoustic matching layer 17 is provided so as to be positioned between a subject (not shown) and the composite piezoelectric body 11, and is composed of a single layer or multiple layers. By adjusting parameters such as sound velocity, thickness, and acoustic impedance in the matching layer 17, it is possible to match the acoustic impedance between the subject and the composite piezoelectric body 11.
[0029]
The acoustic lens 19 is a lens made of silicone rubber or the like whose acoustic impedance is close to that of a living body, and uses ultrasonic wave refraction to focus an ultrasonic beam to improve resolution.
[0030]
The common electrode plate 21 is provided at one end of the upper PVC resin layer 113. The common electrode plate 21 is an electrode for applying electric power to an electrode (not shown) formed on the upper surface of the composite piezoelectric body 11 and is grounded.
[0031]
The flexible wiring substrate 23 is an electrode substrate provided at one end of the lower PVC resin layer 115 and having flexibility for applying electric power to each composite piezoelectric body 11.
[0032]
The backing material 25 is provided on the back surface of the flexible wiring board 23 and mechanically supports the composite piezoelectric body 11. The backing material 25 brakes the composite piezoelectric body 11 in order to shorten the ultrasonic pulse. The thickness of the backing material 25 is kept at a sufficient thickness (thickness that is sufficiently attenuated) with respect to the wavelength of the ultrasonic frequency to be used in order to keep the acoustic characteristics of the transducer good.
[0033]
Next, a method for manufacturing the 1-3 type composite piezoelectric body 11 used in the ultrasonic probe 10 according to the first embodiment will be described. This manufacturing method includes creation of a single crystal piezoelectric body 111 (first step), formation of upper and lower PVC resin layers (second step), dicing of the PVC resin layers 113 and 15 (third step), and resin filling (fourth step). ), And can be divided into five major steps of polishing the PVC resin layers 113 and 15 (fifth step).
[0034]
First, the formation of the composite piezoelectric body 11 in the first step will be described.
[0035]
Lead zinc niobate (PZN) and lead titanate (PT) are mixed in a platinum vessel with a Pb flux at a molar ratio of 91: 9 and heated to dissolve, and then cooled to room temperature to grow a solid solution single crystal. Then, the <001> axis orientation of the single crystal is taken out using a Laue camera and cut with a cutter perpendicular to this axis. Then, after polishing to a thickness of 300 μm, the single crystal piezoelectric body 111 can be formed by forming Ti / Au electrodes on both surfaces by sputtering.
[0036]
Next, the formation of the upper and lower PVC resin layers 113 and 15 in the second step will be described.
[0037]
The piezoelectric body 111 formed in the first step is temporarily fixed to a glass plate, and the periphery is masked with Kapton tape, and then a conductive silver-containing PVC resin is applied and polished to 300 μm with a flat polishing machine. A good upper PVC resin layer 113 is formed. Similarly, the lower PVC resin layer 115 having a good machinability of 300 μm is also formed on the back surface side of the piezoelectric body 11. Note that the order of forming the upper PVC resin layer 113 and the lower PVC resin layer 115 may be reversed.
[0038]
Next, dicing of the upper PVC resin layer 113 and the lower PVC resin layer 115 in the third step and resin filling in the fourth step will be described.
[0039]
The piezoelectric body 111 sandwiched between the silver-filled PVC resin layers 113 and 115 formed in the second step is formed into an array of grooves having a depth of 800 μm (100 μm left uncut) at a pitch of 200 μm by a blade of 50 μm thickness with a dicing saw. The epoxy resin 12 is filled in the cutting groove and cured. Similarly, a similar cut groove is formed at right angles to the previous cut groove, and the epoxy resin 12 is filled and cured.
[0040]
Next, the polishing of the upper and lower PVC resin layers 113 and 115 in the fifth step will be described.
[0041]
Thereafter, the uncut side is temporarily attached to the glass plate with the lower surface as the lower surface, and the opposite layer is polished to 150 μm with a flat polishing machine. Furthermore, it grind | polishes similarly to 150 micrometers by making an uncut side into an upper surface. Then, by forming Ti / Au electrodes on both surfaces by sputtering, the 1-3 type composite piezoelectric element 11 with few chipping and cracks due to cutting or the like can be formed.
[0042]
Finally, a polarization process is performed by applying an electric field of 1 KV / mm to the 1-3 type composite piezoelectric element 11 formed by the above manufacturing method.
[0043]
The above-described composite piezoelectric material manufacturing method can be variously modified without changing the essence. For example, although the 1-3 type composite piezoelectric body 11 has been described as an example, the present invention can also be applied to a 2-2 type composite piezoelectric body as described in the second embodiment. Alternatively, it may be cut into a matrix from the beginning and then filled with resin. Further, when the epoxy resin is filled in two stages as in this embodiment, the type may be changed.
[0044]
Next, an example of a method for manufacturing the one-dimensional array type ultrasonic probe 10 using the 1-3 type composite piezoelectric material manufactured by the above manufacturing method will be described with reference to FIG.
[0045]
FIG. 2 is a view showing a cross section of the ultrasonic probe 10 according to the present embodiment.
[0046]
First, the common electrode plate 21 is connected to the upper PVC resin layer 113 of the composite piezoelectric body 11, the flexible wiring board 23 is connected to the lower PVC resin layer 115 using a conductive paste, and the second surface is connected to the ultrasonic radiation surface side. The acoustic matching layer 17 is formed. Thereafter, the backing material 25 and the flexible wiring board 23 are bonded with an epoxy resin.
[0047]
Next, it is cut at a pitch of 200 μm in the array direction with a blade of 50 μm thickness by a dicing saw. The groove is filled with a silicone-based adhesive, and the acoustic lens 19 is bonded.
[0048]
The one-dimensional array type ultrasonic probe 10 can be manufactured by connecting a coaxial cable having a capacitance of 110 pF / m and a length of 2 m to the flexible wiring board 23.
[0049]
Next, the effect | action by the ultrasonic probe manufactured by the said manufacturing method is demonstrated.
[0050]
In the ultrasonic probe 10, the 1-3 type composite piezoelectric material 11 has the single-crystal piezoelectric material 111 sandwiched between the upper PVC resin layer 113 and the lower PVC resin layer 115. Also, occurrence of chipping can be prevented.
[0051]
Further, since the upper PVC resin layer 113 and the lower PVC resin layer 115 have smaller acoustic impedance, conductivity, and good cutting properties than the single crystal piezoelectric body 111, the upper PVC resin layer 113 and the lower PVC resin layer 115 are related to the single crystal piezoelectric body 111. It can be an electrode for transmitting and receiving electrical signals or an acoustic matching layer.
[0052]
In addition, after the formation of the array-shaped grooves in the first to fourth steps and the filling of the epoxy resin 12, that is, the possibility of occurrence of chipping is eliminated, in the fifth step, the upper PVC resin layer 113 and the lower PVC resin layer 115 are formed. A configuration in which at least one of all is polished and a new electrode or acoustic matching layer is provided may be employed.
[0053]
The upper PVC resin layer 113 and the lower PVC resin layer 115 preferably have a durometer hardness of 700 to 1000 HDd.
[0054]
Therefore, according to such a configuration, the layer having good machinability according to the present invention is provided on at least one of the upper and lower surfaces of the solid solution type piezoelectric single crystal, thereby reducing processing defects during cutting and achieving high sensitivity and wide bandwidth. An acoustic probe can be easily manufactured. In addition, since the PVC resin layer has electrical conductivity, it has high electrical connectivity with the single crystal piezoelectric body, and an ultrasonic vibration element with good characteristics can be formed.
[0055]
(Second Embodiment)
In the first embodiment, the manufacturing method of the 1-3 type composite piezoelectric body 11 and the manufacturing method of the ultrasonic probe 10 using the piezoelectric element have been described. In contrast, in the second embodiment, a method for manufacturing a 2-2 type composite piezoelectric material and a method for manufacturing an ultrasonic probe using the 2-2 type composite piezoelectric material will be described.
[0056]
The appearance of the ultrasonic probe using the 2-2 type composite piezoelectric material is the same as that of the ultrasonic probe 10 using the 1-3 type composite piezoelectric material shown in FIG. The description of the components already described is omitted. Moreover, the description which overlaps with the manufacturing method described in 1st Embodiment is abbreviate | omitted, and only a different part is demonstrated.
[0057]
The manufacturing method of the 2-2 type composite piezoelectric material according to the second embodiment is the same as the first embodiment in the first step and the second step.
[0058]
The dicing of the upper PVC resin layer 113 and the lower PVC resin layer 115 in the third step and the resin filling in the fourth step will be described.
[0059]
The piezoelectric body 11 sandwiched between the layers 3 and 4 of the PVC resin containing silver formed in the second step is formed into a groove of 800 μm depth (100 μm uncut) at a pitch of 200 μm with a blade of 50 μm thickness by a dicing saw. Then, the epoxy resin 12 is filled in the cutting groove and cured.
[0060]
Next, the polishing of the upper and lower PVC resin layers 113 and 115 in the fifth step will be described.
[0061]
Thereafter, the uncut side is temporarily attached to the glass plate with the lower surface as the lower surface, and the opposite layer is polished to 150 μm with a flat polishing machine. Furthermore, it grind | polishes similarly to 150 micrometers by making an uncut side into an upper surface. Then, by forming Ti / Au electrodes on both surfaces by sputtering, it is possible to form the 2-2 type composite piezoelectric element 11 with less chipping and cracking due to cutting or the like.
[0062]
Finally, a polarization process is performed by applying an electric field of 1 KV / mm to the 2-2 type composite piezoelectric body 11 formed by the above manufacturing method.
[0063]
Next, an example of a method for manufacturing the one-dimensional array type ultrasonic probe 10 using the 2-2 type composite piezoelectric material manufactured by the above manufacturing method will be described.
[0064]
First, the common electrode plate 21 is connected to the upper PVC resin layer 113 of the composite piezoelectric body 11, the flexible wiring board 23 is connected to the lower PVC resin layer 115 using a conductive paste, and the second surface is connected to the ultrasonic radiation surface side. The acoustic matching layer 18 is formed. Thereafter, it is bonded to the backing material 25 with an epoxy resin.
[0065]
Next, it cut | disconnected with the pitch of 200 micrometers in the array direction with the blade of 50 micrometers in thickness with the dicing saw. The groove is filled with a silicone-based adhesive, and the acoustic lens 6 is bonded.
[0066]
The one-dimensional array type ultrasonic probe 10 can be manufactured by connecting a coaxial cable having a capacitance of 110 pF / m and a length of 2 m to the flexible wiring board 23.
[0067]
According to the ultrasonic probe having the 2-2 type composite piezoelectric material manufactured by the above method, the same operation and effect as the ultrasonic probe having the 1-3 type composite piezoelectric material described in the first embodiment are obtained. be able to.
[0068]
(Third embodiment)
In the third embodiment, a 1-3 type composite piezoelectric body 11 is used to manufacture a two-dimensional array type ultrasonic probe in which ultrasonic vibration elements are arranged two-dimensionally (for example, arranged in a matrix). A method will be described.
[0069]
FIG. 3 is a cross-sectional view of a two-dimensional array type ultrasonic probe 30 according to the third embodiment.
[0070]
In addition, the same code | symbol is attached | subjected to the component already demonstrated in FIG. 2, and the description is abbreviate | omitted. Moreover, the description which overlaps with the manufacturing method described by 1st, 2nd embodiment is abbreviate | omitted, and only a different part is demonstrated.
[0071]
The manufacturing method of the 1-3 type composite piezoelectric body 11 according to the third embodiment is the same as that of the first embodiment in the first step and the second step.
[0072]
Next, dicing of the upper PVC resin layer 113 and the lower PVC resin layer 115 in the third step and resin filling in the fourth step will be described.
[0073]
The piezoelectric body 11 sandwiched between the silver-containing PVC resin layers 3 and 4 formed in the second step is formed into an array of grooves of 700 μm depth (100 μm left uncut) at a pitch of 200 μm by a blade of 50 μm thickness with a dicing saw. The epoxy resin 12 is filled in the cutting groove and cured. Similarly, a similar cut groove is formed at right angles to the previous cut groove, and the epoxy resin 12 is filled and cured.
[0074]
Next, the polishing of the upper and lower PVC resin layers 113 and 115 in the fifth step will be described.
[0075]
Thereafter, the uncut side is temporarily attached to the glass plate with the lower surface as the lower surface, and the opposite layer is polished to 150 μm with a flat polishing machine. Furthermore, it grind | polishes similarly to 150 micrometers by making an uncut side into an upper surface. That is, the lower PVC resin layer 113 on the uncut side is not cut even after polishing.
[0076]
Then, by forming Ti / Au electrodes on both surfaces by sputtering, it is possible to form the 1-3 type composite piezoelectric body 11 having a two-dimensional array with less chipping and cracking due to cutting or the like.
[0077]
Next, an example of a method of manufacturing the two-dimensional array type ultrasonic probe 30 using the two-dimensional array of composite piezoelectric bodies manufactured by the above manufacturing method will be described.
[0078]
First, the common electrode plate 21 is bonded to the upper surface PVC resin layer 113 on the uncut side, and the flexible wiring board 8 to which the two-dimensional signal wiring is applied is bonded to the entire opposite surface. After forming the second acoustic matching layer 18 on the ultrasonic radiation surface side, it was bonded to the backing material 25 with an epoxy resin. A silicone-based acoustic lens 19 was bonded thereto. The signal side of the FPC was collectively applied and a voltage of 1 KV / mm was applied between the signal side and the GND side to perform polarization treatment.
[0079]
A two-dimensional array type ultrasonic probe 30 can be manufactured by connecting a coaxial cable having a capacitance of 110 pF / m and a length of 2 m to the flexible wiring board 8.
[0080]
In the above description, the two-dimensional array type ultrasonic probe 30 using the 1-3 type composite piezoelectric material has been described. However, the present invention is applicable to the 2-2 type composite piezoelectric material.
[0081]
Therefore, the two-dimensional array type ultrasonic probe 30 having the 1-3 type composite piezoelectric material according to the third embodiment is the same as the one-dimensional array type ultrasonic probe described in the first and second embodiments. Actions and effects can be obtained.
[0082]
(Fourth embodiment)
In the fourth embodiment, another manufacturing method of the 1-3 type or 2-2 type composite piezoelectric body 11 will be described.
[0083]
First, another method for manufacturing the 1-3 type composite piezoelectric body 11 will be described.
[0084]
The single crystal piezoelectric body 111 is created by the same method as the first step shown in the first embodiment.
[0085]
In the subsequent second step, in this embodiment, the upper and lower PVC resin layers 113 and 115 are formed as described below. That is, the plurality of piezoelectric bodies 111 formed in the first step are arranged and bonded on the conductive resin sheet, and the sheet is cut to the size of the back surface of the piezoelectric body 11. As the conductive resin sheet, a sheet of PVC resin containing conductive silver is used.
[0086]
Subsequently, the 1-3 type composite piezoelectric body 11 is formed through the same steps as the third step, the fourth step, and the fifth step shown in the first embodiment. The formed 1-3 type piezoelectric composite 11 is subjected to polarization treatment by applying an electric field of 1 KV / mm.
[0087]
Also by the manufacturing method described above, it is possible to form the 1-3 type composite piezoelectric body 11 described in the first embodiment. In addition, this manufacturing method has an actual benefit when an ultrasonic probe using a piezoelectric single crystal is enlarged. That is, in general, since it is difficult to increase the size of the piezoelectric single crystal itself, it is not easy to increase the size of an ultrasonic probe using a piezoelectric single crystal composite piezoelectric body. However, according to this manufacturing method, in particular, by arranging a plurality of single crystal piezoelectric bodies 111 on a conductive resin sheet, for example, a 1-3 type composite in which a plurality of single crystal piezoelectric bodies 111 are arranged in the array direction, for example. The piezoelectric body 11 can also be easily manufactured, and the ultrasonic probe can be easily enlarged.
[0088]
Next, another method for manufacturing the 2-2 type composite piezoelectric body 11 will be described. Also in the 2-2 type composite piezoelectric body 11, the 2-2 type composite piezoelectric material is changed from the single crystal piezoelectric material bonded to the conductive resin sheet by the same procedure as the manufacturing method of the 1-3 type composite piezoelectric body 11. The body can be formed. Other processes are the same as those in the second embodiment.
[0089]
The one-dimensional or two-dimensional array type ultrasonic probe using the 1-3 type or 2-2 type composite piezoelectric material formed by the above manufacturing methods can be manufactured by the method described above.
[0090]
(Fifth embodiment)
In the fifth embodiment, another one-dimensional or two-dimensional array type ultrasonic probe using the 1-3 type or 2-2 type composite piezoelectric body 11 will be described.
[0091]
FIG. 4 shows a schematic configuration of the array-type ultrasonic probe according to the present embodiment. The difference from the probe shown in FIG. 3 is that an electrode 24 is provided on the lower PVC resin layer 115 of each single crystal piezoelectric body 111, and the flexible wiring board 23 is drawn from one end of the electrode 24. is there. Even in such a configuration, the same operation and effect as the array-type ultrasonic probe described in the first to third embodiments can be obtained.
[0092]
(Sixth embodiment)
In the sixth embodiment, a one-dimensional array type ultrasonic probe that reduces chipping and cracks without forming a lower PVC resin layer and an upper PVC resin layer will be described.
[0093]
First, a schematic configuration of the one-dimensional array type ultrasonic probe 35 according to the present embodiment will be described with reference to FIGS.
[0094]
FIG. 5 shows a cross-sectional view of the one-dimensional array type ultrasonic probe 35 according to the present embodiment.
[0095]
As shown in FIG. 5, the first electrode 40 is formed on the upper surface of each single crystal piezoelectric body 111, and the second electrode 50 is formed on the lower surface. A first flexible wiring board 42 is connected to each first electrode 40 with a conductive paste. On the other hand, a second flexible wiring board 44 is connected to each second electrode 50 with an epoxy adhesive.
[0096]
Predetermined electric power is applied or detected to each electrode 40, 50 via each flexible wiring board 42, 44. The first flexible wiring board 42 is a multilayer board including a conductive layer 420 made of copper or the like and an insulating layer 421 made of polyimide film or the like, and is used for making a GND connection. The second flexible wiring board 44 is a multilayer board composed of conductive layers 440 and 442 made of copper or the like and insulating layers 441, 443 and 445 made of polyimide film or the like. Electrically connect to the device body. Note that the conductive layer 444 has a predetermined wiring pattern to be described later (see FIG. 6).
[0097]
The one-dimensional array type ultrasonic probe 35 includes a first acoustic matching layer 17 and a second acoustic matching layer 18. The arrangement pitch of the vibration elements of the probe 35 is narrow and about 0.1 mm.
[0098]
FIG. 6 shows a top view of the conductive layer 440 of the second flexible wiring board 44.
[0099]
As shown in FIG. 6, the second flexible wiring board 44 has a predetermined pattern of wiring 440a. The pitch width of the wiring 440 a is equal to or smaller than the pitch width of the array arrangement of the single crystal piezoelectric bodies 111 included in the probe 35. Each wiring 440a is bonded to the entire surface of the second electrode corresponding to each single crystal piezoelectric body 111 with an epoxy adhesive, and is alternately drawn out in the opposite direction as shown in FIG. This alternate drawing of the wirings is not essential. For example, a configuration in which all the wirings are drawn in the same direction may be employed.
[0100]
In the present embodiment, the first flexible wiring board 42 is the same as the second flexible wiring board 44.
[0101]
According to such a probe 35, since the first flexible wiring board 42 and the second flexible wiring board 44 are set to be equal to or smaller than the pitch width of the array arrangement of the single crystal piezoelectric bodies 111, in cutting when forming the array arrangement, It is not necessary to cut the conductive layer 444 and the single crystal piezoelectric body 111 at the same time. That is, since the conductive layer 444 and the single crystal piezoelectric body 111 having different machinability are not simultaneously cut, it is possible to suppress the occurrence of cracks and chipping in the manufacture of the array. In addition, by cutting the single crystal piezoelectric body 111 in a state where the first flexible wiring board 42 and the second flexible wiring board 44 are connected, the occurrence of cracks and chipping is suppressed.
[0102]
According to the experiments by the present inventors, when the characteristics of the completed probe 35 were evaluated, there was no disconnection element, and the sensitivity variation was as small as 2 dB.
[0103]
On the other hand, for example, the conductive layer 440 of the second flexible wiring board 44 is expanded to the contact surface size of the single crystal piezoelectric body 111 and an epoxy adhesive is applied over the entire surface of the single crystal piezoelectric body 111. In the case of joining, the inventors' evaluation was as follows. That is, about 30% of cracks occurred during array processing. When the probe was completed and the characteristics were evaluated, there were about 20% of disconnecting elements and the sensitivity variation was as large as 10 dB. When the cause of the disconnection was investigated, cracks that were thought to have occurred during array processing were present in the vibrating element of the channel where the disconnection occurred. In addition, chipping was also observed in many vibration elements. These results are thought to affect the sensitivity variation.
[0104]
By the way, from the viewpoint of mass production of probes, it may not be necessary to use the same first flexible wiring board 42 as the second flexible wiring board 44. Since the wirings 442 of each flexible wiring board are patterned with the same width or less as the arrayed single crystal piezoelectric bodies 111, the positions between the first flexible wiring board 42 and the second flexible wiring board 44 are the same. It is because it is not easy to match.
[0105]
Therefore, the conductor layer shown in FIG. 6 may be used only for the second flexible wiring board 44. According to such a configuration, since the conductive layer that needs to be cut is only in the vicinity of the end of the vibration element of the first flexible wiring board 42, the influence is negligible and cracks and chipping occur during processing. There is nothing. According to the evaluation by the present inventors, there was no disconnection element of the probe 53, and the sensitivity variation was as small as 2 dB.
[0106]
The ultrasonic probe 35 according to the present embodiment is not limited to the above configuration. For example, the following modifications are possible.
[0107]
FIG. 7 is a view for explaining a modification of the ultrasonic probe 35. FIG. 8 is a diagram showing pattern wiring of the second flexible wiring board 44 included in the ultrasonic probe 35 according to the modification.
[0108]
In FIG. 7, the ultrasonic probe 35 has a through hole 45 in addition to the configuration shown in FIG. Through the through hole 45, the wirings 440a and 440b of the conductive layer 440 are energized as shown in FIG.
[0109]
According to the ultrasonic probe 35 according to the present embodiment described above, chipping and cracks can be reduced.
[0110]
(Seventh embodiment)
In the seventh embodiment, a description will be given of an ultrasonic probe in which a wiring drawn out from the first electrode 40 and a wiring drawn out from the second electrode 50 are integrated and taken out from the lower surface of the single crystal piezoelectric body 111.
[0111]
FIG. 9 is a diagram for explaining a schematic configuration of an ultrasonic probe 50 according to the seventh embodiment. The figure shows a state before the first electrode 40 and the second electrode 50 are bonded to the second flexible wiring board 44. In FIG. 9, the first electrode 40 for GND is a spiral electrode that continues from the upper surface of the single crystal piezoelectric body 111 to the lower surface via the side surface. The first electrode 40 is connected to the conductive layer 442 of the second flexible wiring board 44, and the second electrode 50 is connected to the conductive layer 440 of the second flexible wiring board 44. Although not shown, each conductive layer 442, 440 has an exposed portion corresponding to each electrode 40, 50 of the single crystal piezoelectric body 111.
[0112]
The thickness of each conductive layer 440, 442 is 18 μm. The insulating layer 443 made of polyimide has a thickness of 12.5 to 25 μm.
[0113]
Next, a modification of the ultrasonic probe 50 will be shown.
[0114]
FIG. 10 is a view showing an ultrasonic probe 51 which is a modification of the ultrasonic probe 50. As shown in FIG. 10, the conductive layer 442 is extended and connected to the first electrode 40 which is wound around the single crystal piezoelectric body 111. The extended conductive layer 440 wraps around the extended insulating layer 443 and is connected to the second electrode 50. The wrap-around structure can be formed by a method such as plating the end portion.
[0115]
When compared with the ultrasonic probe 50 shown in FIG. 9, the step difference between the conductive layer 442 and the conductive layer 44 is eliminated in the probe 51 shown in FIG. 10. Therefore, with such a configuration, it is possible to prevent the single crystal piezoelectric body 111 from being broken due to pressure adhesion.
[0116]
FIG. 11 is a view showing an ultrasonic probe 52 which is a modification of the ultrasonic probe 51. The probe 52 shown in FIG. 11 is practically useful when it is difficult to take the conductive layer 440 structure in the form of the probe 51 shown in FIG. As shown in FIG. 11, in the probe 52, the vertical relationship between the conductive layer 440 and the conductive layer 442 is opposite to that in FIG. Further, the position of the wrap-around structure of the first electrode 40 is also opposite to that of the probe 51, and the first electrode 40 and the conductive layers 442 and 442 a are energized by the conductive member 48.
[0117]
With such a configuration, the first electrode 40 and the conductive layers 442 and 442a may be connected by the conductive member 48 after the single crystal piezoelectric body 111 and the second flexible wiring board 44 are bonded. The conductive member 48 is preferably a conductive paste. Further, the connection by the conductive member 48 may be performed after the ultrasonic vibration element array is formed.
[0118]
FIG. 12 is a view showing an ultrasonic probe 53 which is a modification of the ultrasonic probe 52. As shown in FIG. 12, the ultrasonic probe 53 has the exposed portion 442 b exposed from the tip of the conductive layer 442, and the exposed portion 442 b is bent and connected to the first electrode 40 after the single crystal piezoelectric body 111 is bonded. With such a configuration, a more stable connection can be obtained.
[0119]
10, 12, and 13, the first flexible wiring board 42 is the same as the second flexible wiring board 44, and the pitch width is equal to or less than the pitch of the array arrangement of the single crystal piezoelectric bodies 111 included in the probe 35. With the configuration having the pattern wiring 440a, cracks and chipping during processing can be suppressed. This is because the conductive layer having inferior machinability and the single crystal piezoelectric body 111 are not cut together.
[0120]
Although the present invention has been described based on the embodiments, those skilled in the art can come up with various changes and modifications within the scope of the idea of the present invention. It is understood that it belongs to the scope of the present invention. For example, as shown in the following (1) and (2), various modifications can be made without changing the gist thereof.
[0121]
(1) The single crystal piezoelectric material used in each embodiment is not particularly limited. For example, it is a composite perovskite type containing at least lead titanate like a single crystal consisting of a solid solution of lead zinc niobate and lead titanate represented by Pb ((Zn1 / 3Nb2 / 3) 0.91Ti0.09) O3, Examples thereof include a single crystal composed of a solid solution of lead magnesium niobate and lead titanate, and a single crystal composed of a solid solution of lead scandium niobate and lead titanate. Alternatively, a single crystal such as lithium niobate or potassium niobate may be used.
[0122]
(2) In the first to third embodiments of the present invention, a PVC resin layer is formed on the upper and lower surfaces of the single crystal piezoelectric body 111 to prevent chipping, and further, an electrode or an acoustic matching layer A high-sensitivity broadband ultrasonic probe has been realized with the above-mentioned configuration. However, even if the PVC resin layer is formed only on one side of the single crystal piezoelectric body 111, it is possible to prevent the occurrence of chipping and serve as an electrode or an acoustic matching layer.
[0123]
【Effect of the invention】
As described above, according to the present invention, it is possible to manufacture an ultrasonic probe that does not cause processing defects during cutting. As a result, an ultrasonic probe having high sensitivity and broadband characteristics can be realized.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a schematic configuration of an ultrasonic probe 10 according to first and second embodiments.
FIG. 2 is a diagram showing a cross section of an ultrasonic probe 10 according to the first and second embodiments.
FIG. 3 is a diagram showing a cross section of an ultrasonic probe 30 according to a third embodiment.
FIG. 4 is a diagram showing a schematic configuration of an array-type ultrasonic probe according to a fifth embodiment.
FIG. 5 is a cross-sectional view of an array-type ultrasonic probe 35 according to a sixth embodiment.
FIG. 6 is a top view of a conductive layer 440 of a second flexible wiring board 44. FIG.
FIG. 7 is a view for explaining a modification of the ultrasonic probe 35;
FIG. 8 is a diagram showing pattern wiring of a second flexible wiring board 44 included in an ultrasonic probe 35 according to a modification.
FIG. 9 is a diagram for explaining a schematic configuration of an ultrasonic probe 50 according to a seventh embodiment.
FIG. 10 is a view showing a modification of the ultrasonic probe according to the seventh embodiment.
FIG. 11 is a view showing a modification of the ultrasonic probe according to the seventh embodiment.
FIG. 12 is a view showing a modification of the ultrasonic probe according to the seventh embodiment.
13A is a view showing a cross section of a conventional composite piezoelectric body 30. FIG. FIGS. 13B and 13C are views for explaining chipping and cracks that occur in the manufacturing process of the conventional composite piezoelectric body 30. FIG.
FIG. 14A is a diagram showing a cross section of a conventional ultrasonic probe. FIG. 14B is a diagram showing pattern wiring of the flexible wiring board 6 included in the conventional ultrasonic probe.
[Explanation of symbols]
10, 35, 50, 51, 52, 53 ... ultrasonic probe
11 ... Composite piezoelectric material
12 ... Epoxy resin
17 ... 1st acoustic matching layer
18 ... Second acoustic matching layer
19 ... Acoustic lens
21 ... Common electrode plate
23. Flexible wiring board
24 ... Electrode
25 ... backing material
38 ... groove
40. First electrode
50 ... second electrode
42. First flexible wiring board
44 ... Second flexible wiring board
45 ... Through hole
50 ... second electrode
111 ... Single crystal piezoelectric material
113 ... Upper PVC resin layer
115 ... Lower PVC resin layer
420, 440, 442 ... conductive layer
421, 443, 445 ... insulating layer
440a ... Pattern wiring
442b ... exposed portion

Claims (7)

  1. Single crystal piezoelectric material cut into an array,
    And acoustic impedance small upper surface resin layer than the formed on the upper surface of the piezoelectric said piezoelectric said formed on the lower surface of the piezoelectric rather small acoustic impedance than the piezoelectric body is the upper surface resin layer of the same material A bottom resin layer;
    Comprising an ultrasonic vibration element comprising
    In the case where the arrayed single crystal piezoelectric body is formed by cutting the upper surface resin layer, the single crystal piezoelectric body, and the lower surface resin layer to form a plurality of grooves, the upper surface resin layer and the lower surface resin layer are formed. The resin layer has machinability, a reinforcing function at the time of cutting the piezoelectric body, and conductivity, and functions as an electrode itself.
    Ultrasonic probe characterized by.
  2. A piezoelectric body formed of a solid solution-based single crystal containing at least lead titanate, an upper surface resin layer formed on the upper surface of the piezoelectric body and having a lower acoustic impedance than the piezoelectric body, and formed on the lower surface of the piezoelectric body. acoustic impedance rather smaller than the body, comprising a lower surface resin layer wherein a top resin layer and the same material, the ultrasonic vibration element formed by 1-3 type or 2-2 type composite piezoelectric element made of,
    In the case where the arrayed single crystal piezoelectric body is formed by cutting the upper surface resin layer, the single crystal piezoelectric body, and the lower surface resin layer to form a plurality of grooves, the upper surface resin layer and the lower surface resin layer are formed. The resin layer has machinability, a reinforcing function at the time of cutting the piezoelectric body, and conductivity, and functions as an electrode itself.
    Ultrasonic probe characterized by.
  3. At least one of the upper surface resin layer or the lower surface resin layer has an acoustic impedance of 2 × 10 6 g / m 2 s to 10 × 10 6 g / m 2 s and functions as an acoustic matching layer. The ultrasonic probe according to claim 2.
  4. The upper surface and the lower surface of the single crystalline piezoelectric body, a first step of acoustic impedance to form a small resin layer than the single crystalline piezoelectric material composed of the same material,
    A second step of forming a plurality of grooves extending from the upper surface resin layer through the piezoelectric body to the lower surface resin layer ;
    A third step of filling the plurality of grooves with resin;
    An ultrasonic probe manufacturing method comprising:
  5.   The ultrasonic probe manufacturing method according to claim 4, wherein in the second step, the plurality of grooves are formed in a lattice shape.
  6.   The ultrasonic probe manufacturing method according to claim 4, wherein the ultrasonic probe manufacturing method includes a fourth step of polishing and removing the resin layer.
  7. A first step of bonding a resin sheet to the upper surface of the single crystal piezoelectric body, and bonding a resin sheet of the same material as the resin sheet of the upper surface to the lower surface of the single crystal piezoelectric body;
    A second step of forming a plurality of grooves extending from the upper surface resin sheet to the lower surface resin sheet through the single crystal piezoelectric body ;
    A third step of filling the plurality of grooves with resin;
    An ultrasonic probe manufacturing method comprising:
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US7421900B2 (en) 2001-11-14 2008-09-09 Kabushiki Kaisha Toshiba Ultrasonograph, ultrasonic transducer, examining instrument, and ultrasonographing device
JP4709500B2 (en) * 2004-05-12 2011-06-22 東芝メディカルシステムズ株式会社 Ultrasonic probe and ultrasonic diagnostic apparatus
JP4746302B2 (en) * 2004-10-05 2011-08-10 オリンパス株式会社 Ultrasonic probe
JP4801989B2 (en) * 2005-12-22 2011-10-26 東芝メディカルシステムズ株式会社 Ultrasonic probe
JP5373249B2 (en) * 2006-01-23 2013-12-18 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー Ultrasonic probe and ultrasonic diagnostic apparatus
CN101431941B (en) * 2006-04-28 2011-05-18 松下电器产业株式会社 Ultrasonic probe
JP2009061112A (en) * 2007-09-06 2009-03-26 Ge Medical Systems Global Technology Co Llc Ultrasonic probe and ultrasonic imaging apparatus
KR101064601B1 (en) * 2009-02-10 2011-09-15 주식회사 휴먼스캔 Ultrasonic Probe, Ultrasonic Imaging Apparatus and Fabricating Method Thereof
JP5408145B2 (en) 2009-02-13 2014-02-05 コニカミノルタ株式会社 Ultrasonic probe and ultrasonic diagnostic apparatus
JP2013501405A (en) * 2009-07-29 2013-01-10 イマコー・インコーポレーテッド Ultrasonic imaging transducer acoustic stack with integrated electrical connections
JP5487007B2 (en) * 2010-05-20 2014-05-07 日立アロカメディカル株式会社 Ultrasonic probe and method for manufacturing ultrasonic probe
JP2011250119A (en) 2010-05-26 2011-12-08 Toshiba Corp Ultrasonic probe
JP5480863B2 (en) * 2011-09-27 2014-04-23 富士フイルム株式会社 Ultrasonic probe and manufacturing method thereof
US9056333B2 (en) 2011-09-27 2015-06-16 Fujifilm Corporation Ultrasound probe and method of producing the same
DE102015209238A1 (en) * 2015-05-20 2016-11-24 Robert Bosch Gmbh Acoustic sensor for sending and receiving acoustic signals
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