JP4897768B2 - Hollow sealing method for electronic component, resin for hollow sealing, and method for manufacturing resin for hollow sealing - Google Patents

Description

  The present invention relates to a method for hollow sealing an electronic component that requires packaging after securing a hollow portion, such as an electronic component with a movable portion, a hollow sealing resin, and a hollow sealing resin. It relates to a manufacturing method.

  For example, a surface acoustic wave (SAW) element used in a mobile communication device such as a micro electro mechanical system (MEMS), a cellular phone, etc., which constitutes a micro switch such as an ink jet printer head, a pressure sensor, an acceleration sensor, 2. Description of the Related Art Electronic components such as bulk acoustic wave (BAW) elements that have mechanically movable parts in functional parts are known.

  An electronic component with a movable part cannot be hermetically sealed with resin or the like as it is because of its function. That is, in order for an electronic component with a movable part to function effectively, it is necessary to secure a “hollow part (non-sealed space)” inside the package. In this specification, such electronic components are collectively referred to as electronic components that require hollow sealing.

  As a structure for forming the hollow portion, conventionally, a method using a metal cap has been proposed. However, this method often has a problem of restriction in the thickness direction due to the metal cap. Therefore, instead of the metal cap, for example, Patent Document 1 discloses a hollow sealing technique for packaging a SAW device while securing a hollow portion using a resin.

  In manufacturing the SAW device, as shown in FIGS. 6A and 6B, first, thermosetting is performed so as to surround the comb-like electrode 6 and the Au bump 8 in the gap between the wiring substrate 3 and the SAW chip 4. A partition wall 12 made of a conductive resin is formed. This is to prevent the mold resin 13 from flowing into the space Sp between the SAW chip 4 and the wiring board 3 due to the presence of the partition wall 12 when the mold resin 13 is molded.

  By securing the non-sealing space Sp into which the mold resin 13 does not flow by the partition wall 12, the SAW device 2 can exhibit its original function.

JP 2007-73554 A

  However, all of the conventional packaging methods for electronic components that require hollow sealing, including the technology disclosed in Patent Document 1, have caps or caps in advance so that the sealing material does not flow into the space to be secured. Since the partition walls and the like are formed with separate members and then sealed with the original sealing material, a process for accurately securing each non-sealing space is provided. There is a problem that it is complicated and takes time to manufacture and is difficult to reduce in size, and requires many parts, and therefore tends to be expensive.

  The present invention has been made to solve such a conventional problem, and realizes downsizing of packaging of electronic parts that require hollow sealing, simplification of manufacturing, and cost reduction. That is the issue.

  The present invention relates to a method for hollow sealing an electronic component, comprising preparing a preformed resin preformed in a predetermined shape using a thermosetting resin that is cured at a predetermined temperature as a material. The stamper member heated above the predetermined temperature is pushed in to form a recess, and the recess is heat-cured by the heat of the stamper member, and the electronic component is arranged / corresponding to the recess, The above-described problems are solved by sealing the electronic component.

  In the present invention, when packaging an electronic component that requires hollow sealing, a thermosetting preformed resin is prepared, and the electronic component is directly resin-sealed with the preformed resin. A stamper member heated to a temperature equal to or higher than the curing temperature of the preformed resin is pushed into the preformed resin before sealing. Thereby, a recessed part is formed when a stamper member is pushed in, and this recessed part can be partially thermoset with the heat which a stamper member has.

  As described above, the present invention is characterized in that only the vicinity of the non-sealed space in which the electronic component is to be placed is thermally cured in advance to form a “recess having a fixed shape”. An electronic component, which is an unsealed product, is made to correspond to and disposed in the recess, and the electronic component is compressed and sealed using the preformed resin. Since the thermosetting has already been completed around the concave portion, the shape of the concave portion is maintained even if compression sealing is performed, and this forms an unsealed space as it is.

  Therefore, according to this invention, in order to ensure a non-sealing space, a separate member is not required and sealing can be completed as it is using the same preforming resin. The size of the recess (non-sealing space) can be defined by the outer diameter of the stamper member. The formation position of the recess can be defined by the mechanical position of the stamper member with respect to the position of the preformed resin. Both are accurate because they depend on mechanical manufacturing accuracy. In addition, since the so-called dimple processing is only performed on a single preformed resin, it is easy to reduce the size, and the manufacturing time can be greatly shortened as compared with the prior art. Further, as described later, this method is suitable for mass production because a plurality of recesses can be formed simultaneously by driving a plurality of stamper members at a time if necessary.

  The present invention is a resin for hollow sealing of an electronic component used when hollowly sealing an electronic component, and preliminarily molded into a predetermined shape using a thermosetting resin that is cured at a predetermined temperature as a material. In addition, it can also be regarded as a resin for hollow sealing of an electronic component provided with a thermosetting recess on a part of its surface.

  Further, a resin preformed in a predetermined shape is prepared using a thermosetting resin that cures at a predetermined temperature as a material, and a stamper having a heated convex portion is pressed against the preformed resin. It can also be regarded as a method for producing a resin for hollow sealing of electronic parts.

  According to the present invention, packaging of electronic components that require hollow sealing can be realized easily and accurately at low cost. In addition, this type of product can cope well with downsizing which has strong needs.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  In the field of electronic component packaging, a method of compressing and sealing under pressure using a sheet-like (flat plate-like) resin called “preliminary resin (preform resin)” is known. Compressed resin sealing using preformed resin is less likely to cause problems such as cutting of electronic component wires because the resin flow is small when sealing electronic components, and can be sealed under pressure High quality packaging with less air entrainment is possible.

  In this embodiment, a predetermined process is performed in advance on the preformed resin, and then the compression resin sealing is performed.

  FIG. 1 is a conceptual diagram showing an example of the most basic embodiment of the present invention. In FIG. 1, reference numeral 20 is a preformed resin, and 22 is a stamper member.

  The preforming resin 20 is manufactured and prepared by molding a thermosetting resin that cures when heated to a predetermined temperature or more into a predetermined flat plate shape at a temperature lower than the curing temperature with a relatively weak compressive force. At this time, as shown in FIG. 2, one by one is formed by sizing after forming a large preformed resin 20T corresponding to the combined size of a plurality (six in the illustrated example) of preformed resins 20. The preformed resin 20 (the base material) may be manufactured. This method is excellent in that the preformed resin 20 having an arbitrary size can be manufactured with an accurate dimension, and thus the preformed resin 20 with small variations can be manufactured accurately and efficiently.

  The stamper member 22 has the same outer diameter d1 as the inner diameter D1 of the non-sealed space to be secured. The stamper member 22 is heated above the curing temperature of the preformed resin 20. Therefore, by pressing the stamper member 22 into the preformed resin 20 by a predetermined depth di, the concave portion 24 corresponding to the non-sealed space having the inner diameter D1 and the depth di can be formed. Since the stamper member 22 is heated to a temperature equal to or higher than the curing temperature of the preformed resin 20, when the pressed state is maintained, only the vicinity of the recess 24 is thermally cured to form a thermosetting portion 24A. The illustrated thermosetting portion 24A is conceptually shown, and does not indicate the actual size (or range) of the thermosetting portion.

  As shown in FIG. 3, when the recess 24 is actually formed, in this embodiment, a total of ten stamper members 22a to 22j are arranged on the base 26 in a state of being arranged in two rows of five. The pressing device 30 is used. The entire base 26 can move up and down together with the stamper members 22a to 22j. Accordingly, ten concave portions 24a to 24j as shown in FIG. 4 can be formed simultaneously by one driving (up and down movement) of the pressing device 30.

  The formation range (thermosetting range) of the thermosetting portion in the vicinity of each of the recesses 24a to 24j is set to a temperature higher than the curing temperature of the preforming resin 20 or how long the stamper member 22 is set. It changes depending on whether the stamper member 22 is pushed into the preformed resin 20 or the like. Qualitatively, the higher the heating temperature of the stamper member 22 and the longer the pressing time, the larger the formation range of the thermosetting portions near the recesses 24a to 24j. When the formation range of the thermosetting portion is increased, the formation strength of the recesses 24a to 24j is increased, but the compression allowance at the time of compression sealing in the next process becomes too small, which may adversely affect the quality of the entire sealing. . Moreover, when the thermosetting part of a contact surface with a board | substrate becomes large too much, the part which fuse | melts in the case of compression sealing and adheres to a board | substrate will be lost. Therefore, the formation range of the thermosetting portion is limited to an appropriate range. Further, the heat distribution at the boundary between the thermosetting portion and the non-curing portion (compression sealing portion in the next process) in the vicinity of the recesses 24a to 24j has a gradation as the heating temperature of the stamper member 22 is higher and the pressing time is shorter. It tends to be steep. Conversely, as the heating temperature of the stamper member 22 is relatively low and the pressing time is long, the gradation of the heat distribution tends to become gentler. The affinity between the thermosetting portion and the compression sealing portion in the next process is basically improved as the gradation of the heat distribution is loosened. However, in reality, this is a balance with the demand for downsizing. Therefore, the heating temperature and the pushing time of the stamper member 22 are set to optimum values in consideration of the size and application of the electronic component to be sealed or the strength per unit volume of the preformed resin 20 itself. Will be set.

  Referring to FIG. 5, MEMS (electronic parts) 54a to 54j, which are to be sealed, are sealed with compression resin using the preformed resin 20 in which the recesses 24a to 24j corresponding to the non-sealing spaces are formed in this way. The process for stopping will be described.

  In this embodiment, the compression sealing step of applying a predetermined pressure to the preformed resin 20 is realized by a set of compression sealing molds 44 constituted by the upper mold 40 and the lower mold 42. The lower mold 42 includes a frame-shaped mold 46 having a through hole 46A, and a compression mold 48 fitted and arranged in the through hole 46A. The compression mold 48 moves back and forth (relatively) toward the substrate 52 and the upper mold 40 along the through hole 46A of the frame-shaped mold 46. Although not shown, a release film is placed on the lower mold 42.

  The substrate 52 includes ten MEMS (micro electro mechanical systems) 54a to 54j. Since the MEMS 54a to 54j include a movable part, a hollow part (non-sealed space) is required. That is, in this embodiment, the MEMS 54a to 54j correspond to “electronic components that require hollow sealing”. The substrate 52 is attached to the upper mold 40 together with the plurality of MEMSs 54 a to 54 j and clamped between the upper mold 40 and the frame-shaped mold 46.

  The preforming resin 20 is placed on the upper surface of the compression mold 48 surrounded by the frame-shaped mold 46. In this embodiment, the preformed resin 20 is designed so that a slight step is formed at the boundary between the frame-shaped mold 46 and the compression mold 48 when the preformed resin 20 is charged. It is positioned by the through hole 46A of the metal mold 46. Accordingly, the recesses 24 a to 24 j formed on the preforming resin 20 are also positioned very accurately with respect to the lower mold 42.

  The compression resin sealing by the compression sealing die 44 is performed in the following procedure.

  First, the substrate 52 is set on the upper mold 40 by a substrate supply mechanism (not shown). Next, the preforming resin 20 is charged and placed in the through hole 46 </ b> A of the frame-shaped mold 46 (the upper surface of the compression mold 48). The preformed resin 20 is arranged with the recessed portions 24a to 24j formed in advance on the upper side. The positions where the recesses 24 a to 24 j are formed correspond to the positions where the MEMS 24 a to 24 j are mounted on the substrate 52. Next, heating of the preforming resin 20 is started, and the frame-shaped mold 46 and the compression mold 48 are both raised toward the upper mold 40, and the substrate 52 is interposed between the frame-shaped mold 46 and the upper mold 40. Is clamped. Further, when the compression mold 48 rises toward the substrate 52, the recesses 24a to 44j of the preforming resin 20 correspond to the positions where the MEMSs 54a to 54j are arranged on the substrate 52, and the upper surface other than the recesses 24a to 24j is the substrate 52. Contact.

  Since the vicinity of the recesses 24a to 24j has already been thermally cured by the pressing of the stamp members 22a to 22e in the previous process, the shape of the recesses 24a to 24j is maintained as it is even by this compression stroke. -24j functions as an unsealed space as it is. Thereafter, after the compression mold 48 is further compressed toward the substrate 52, the temperature is further increased to thermally cure the entire preformed resin 20. After the preforming resin 20 is cured, the compression sealing mold 44 is opened, and the resin-sealed substrate 52 is taken out.

  According to this embodiment, the preformed resin 20 is formed with the recesses 24a to 24j in advance, and the periphery thereof is thermally cured, so that there is no need for a separate member for forming an unsealed space. In addition, it is possible to package an electronic component that requires hollow sealing at an extremely simple and low cost without the need for incorporating the separate member.

  In the present invention, there is no particular limitation on how to manufacture the preformed resin matrix. However, as in the above embodiment, when forming a large preformed resin corresponding to a plurality of preformed resins and sizing the large preformed resin to produce individual preformed resins one by one, This is preferable in that a preformed resin with higher dimensional accuracy can be easily manufactured. By increasing the dimensional accuracy of the preformed resin, the positioning accuracy between the electronic component requiring hollow sealing and the recess can be further increased.

  Moreover, in this invention, it is not necessary to comprise so that a several recessed part may be formed simultaneously. For example, a plurality of preformed resins having one recess may be arranged in accordance with the MEMS. As a result, MEMS of different sizes and types can be collectively sealed. A plurality of recesses may be formed by sequentially moving one stamper member. For example, when forming a total of 10 recesses in two rows of five, prepare a pressing device in which five stamper members are arranged in one row, and move the pressing device in the horizontal direction one row at a time. Thus, a total of 10 recesses may be formed. However, when the plurality of MEMS on the substrate are the same or there is no great difference in size, a pressing device in which stamper members corresponding to all the concave portions are arranged in a matrix form as in the above embodiment is prepared. It is preferable to form the recesses simultaneously. According to this configuration, it is possible not only to simplify the manufacturing process but also to prevent the influence of the concave portion that has been heat-cured first from adversely affecting the concave portion that is to be thermally cured later.

  Moreover, in this invention, it does not specifically limit about the structure of the compression sealing metal mold | die for implement | achieving a compression sealing process. However, for example, as in the above-described embodiment, the compression-sealing mold includes an upper mold, a frame-shaped mold having a through-hole, and a lower mold having a compression mold that is fitted to the through-hole. It is preferable that the mounting position on the lower mold of the preformed resin be positioned by the through-hole of the frame-shaped mold. Thereby, the positioning of the preforming resin on the mold can be performed easily and with high accuracy, and as a result, the positioning accuracy between the recess (sealed space) and the electronic component can be further increased.

  In the above embodiment, the substrate is attached to the upper die, and then the preformed resin is attached to the lower die. However, the substrate is attached to the upper die and the preformed resin is placed on the lower die. It may be. According to this configuration, the preformed resin can be softened and then touched on the substrate, which is particularly effective when a complicated gold wire is provided. Furthermore, the substrate may be placed on the lower mold, and the preformed resin may be placed on the substrate. Alternatively, the preformed resin may be placed on the substrate in advance (for each preformed resin). ) The substrate may be placed on the lower mold.

  Like an electronic component with a movable part, it can utilize for the package of the electronic component which needs to secure a hollow part especially and can package.

Sectional drawing which shows an example of the most fundamental embodiment of the packaging method of the electronic component which concerns on this invention Plan view showing an example of manufacturing a preformed resin base material Front view showing the process of forming 10 recesses in the preformed resin The top view which shows the state in which ten recessed parts were formed in preforming resin Process drawing showing compression sealing process Sectional drawing for demonstrating the packaging method of the electronic component which requires the conventional hollow sealing

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 ... Preliminarily molded resin 22 (22a-22j) ... Stamper member 24 ... Recessed part 24A ... Thermosetting part 26 ... Base 30 ... Pressing device 40 ... Upper mold 42 ... Lower mold 46 ... Frame-shaped metal mold 46A ... Through-hole 48 ... Compression mold 52 ... Substrate 54a to 54j ... MEMS (electronic component)

Claims (6)

A method for hollow sealing electronic components,
Prepare a preformed resin preformed in a predetermined shape in advance using a thermosetting resin that cures at a predetermined temperature,
A stamper member heated above the predetermined temperature is pushed into the preformed resin to form a recess, and the recess is thermally cured by the heat of the stamper member,
A method for hollow sealing an electronic component, wherein the electronic component is sealed after the electronic component is placed in correspondence with the recess. In claim 1,
The preparation of the preformed resin is to produce each preformed resin by sizing after forming a large preformed resin corresponding to the size of a plurality of preformed resins combined. Hollow sealing method for electronic components. In claim 1 or 2,
The method for forming a hollow portion of an electronic component is characterized in that the formation of the concave portion is to simultaneously form a plurality of concave portions by pressing a plurality of stamper members against the preformed resin at once. A resin for hollow sealing of electronic parts used when hollow sealing electronic parts,
A resin for hollow sealing of electronic parts, which is preliminarily molded into a predetermined shape using a thermosetting resin that is cured at a predetermined temperature, and has a concave portion that is thermoset on a part of its surface. In claim 4,
A resin for hollow sealing of electronic parts, wherein a plurality of the recesses are arranged side by side. Prepare a resin preformed in a predetermined shape in advance using a thermosetting resin that cures at a predetermined temperature,
A method for producing a resin for hollow sealing of an electronic component, wherein a stamper having a heated projection is pressed against the preformed resin.

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