JP4881000B2 - Thermoelectric conversion device - Google Patents

Description

The present invention relates to a thermoelectric conversion device in which the first conductor and the second conductor constitutes a thermocouple is provided alternately on the substrate.

  A thermoelectric conversion device using the Seebeck effect that generates power due to a temperature difference can be used as a power supply or auxiliary power supply for an electronic device, a temperature sensor, an infrared sensor, or the like. In Patent Document 1, a flexible substrate, a thermocouple composed of a first metal body and a second metal body provided on the substrate, and a first sheet sandwiching the substrate on which the thermocouple is formed. A thermoelectric conversion device comprising a sheet-like member and a second sheet-like member is presented.

  More specifically, as shown in FIG. 5, the electrically insulating sheet 111 on which the thermocouple 131 is disposed is bent into a cross-sectional wave shape, and the electrically insulating sheet 111 includes the first sheet-like member 141 and the second sheet member. It is clamped by the sheet-like member 142. The electrical insulating sheet 111 includes a bent portion including a plurality of top portions 111a and a plurality of bottom portions 111b. The inclined portion 111c and the inclined portion 111d of the electrically insulating sheet 111 sandwiching the bent portion, and a second inclined portion 111d. The angle formed by the upper surface 142a of the sheet-like member 142 is slanted.

  The thermocouple 131 is connected in series to the electrically insulating sheet 111, and the first contact point 137 that is a connection point between the first metal body 121 and the second metal body 122 of the thermocouple and the connection between the adjacent thermocouples 131. It has the 2nd contact 138 which is a point. Each of the first contacts 137 of the thermocouple 131 is disposed so as to be located at the top 111 a of the electrically insulating sheet 111, and each of the second contacts 138 of the thermocouple 131 is located at the bottom 111 b of the electrically insulating sheet 111. Is arranged.

In the thermoelectric conversion device having such a structure, the first metal body and the second metal body are formed on the electrically insulating sheet by vapor deposition, but the vapor deposition is performed on the surface of the electrically insulating sheet bent into a cross-sectional wave shape. However, it is difficult to perform masking processing. Therefore, after vapor-depositing the first metal body and the second metal body on the surface of the electrical insulating sheet, the electrical insulating sheet is bent into a cross-sectional wave shape.
JP 2005-209718 A

  However, when the electrical insulating sheet is bent after the first metal body and the second metal body are deposited on the surface of the electrical insulating sheet, the first metal body and the second metal body disposed in the bent portion Is subject to bending stress. In order not to break the first metal body and the second metal body due to the bending stress, it is necessary to relax the bending stress, and for that purpose, it is necessary to reduce the angle at which the electrical insulating sheet is bent. As a result, the distance d1 between the bent portions of the electrical insulating sheet tends to be long, which has become a bottleneck in increasing the degree of integration of thermoelectric conversion devices.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a thermoelectric conversion device capable of preventing disconnection of a thermocouple and improving the integration degree of the thermocouple.

In order to solve the above-described problem, the invention described in claim 1 is a thermoelectric conversion device in which the first conductor and the second conductor are alternately provided on the substrate to form a thermocouple. The first conductor and the second conductor are electrically connected via a conductive member having higher conductivity than the first conductor and the second conductor. Among the conductive members, the conductive member that connects adjacent thermocouples is formed thinner than the first conductor and the second conductor, and the conductive member formed thin in the substrate. In addition, a slit is formed in the portion corresponding to , and the periphery of the substrate on which the thermocouple is formed is covered with a heat insulating member having a heat insulating property, and the heat insulating member has a heat conductive property. It is covered by the thermally conductive member The gist of the door.

According to this configuration, it is not necessary to consider bending stress generated when a substrate on which a thermocouple is formed during the manufacture of a conventional thermoelectric conversion device, so that the distance between adjacent substrates can be reduced when arranging the substrates. However, there is no fear of disconnection of the thermocouple, and as a result, disconnection of the thermocouple can be prevented and the degree of integration of the thermoelectric conversion device can be improved.
Moreover, by making the electrical resistance value in the conductive member low, more current can be generated from the voltage generated by the thermoelectric conversion device, and the thermoelectric conversion efficiency of the thermoelectric conversion device is increased.
Furthermore, when the thermoelectric conversion device is brought closer to the heat source, the heat generated from the heat source is more conductive when conducted to the cold junction on the side farther from the heat source than when conducted to the hot junction on the side closer to the heat source. The heat insulating member must be moved a long distance. Therefore, since the heat insulating member is difficult to transfer heat, the temperature difference between the cold junction and the hot junction becomes large, and the efficiency of power generation by the Seebeck effect of the thermoelectric conversion device can be increased.
In addition, since the portion directly in contact with the outside is covered with a heat conductive member having heat conductivity, when the thermoelectric conversion device is brought close to the heat source, the heat conductive member on the heat source side transfers heat to the thermoelectric conversion device. The heat conductive member on the side that is taken in and separated from the heat source dissipates heat. As a result, the temperature difference between the cold junction and the hot junction increases, and the power generation efficiency due to the Seebeck effect of the thermoelectric conversion device can be increased.

The gist of the invention described in claim 2 is that, in addition to the configuration described in claim 1, the plurality of substrates are arranged in parallel.
According to this configuration, since the adjacent substrates are parallel, the distance between the adjacent substrates can be further reduced, and the degree of integration of the thermoelectric conversion devices can be further improved.

  The thermoelectric conversion device of the present invention can prevent disconnection of the thermocouple and can improve the integration degree of the thermoelectric conversion device.

  An embodiment of a thermoelectric conversion device according to the present invention will be described with reference to FIGS. 1 to 3, the X axis is perpendicular to the YZ plane, the Y axis is perpendicular to the XZ plane, and the Z axis is perpendicular to the XY plane.

  As shown in FIG.1 (c), the some electric insulation sheet | seat 11 which is a board | substrate is located in a line at equal intervals in the X-axis direction. Moreover, as shown in FIG.1 (b), the slit 12 is formed in the electrically insulating sheet | seat 11 formed long in the Y-axis direction. The electrically insulating sheet 11 is formed of, for example, a polyimide film. Moreover, as shown in FIG.2 (b), the adjacent electrical insulating sheet | seat 11 is arranged so that the surface 11a and the surface 11b may oppose and it may become parallel.

  As shown in FIG. 1B, each of the plurality of electrically insulating sheets 11 arranged so as to face each other is provided with serpentine thermocouple groups 13 to 17 connected in series. And as shown to FIG. 1 (a), (b), the thermocouple group 13 arrange | positioned at the left end part in the Y-axis direction of the electrical insulating sheet 11 is formed in the adjacent electrical insulating sheet 11. The thermocouple group 13 is electrically connected through a connector 18 made of a ductile conductor. Further, the thermocouple group 17 disposed at the right end portion in the Y-axis direction of the electrical insulating sheet 11 is electrically connected to the thermocouple group 17 formed on the adjacent electrical insulating sheet 11 via the connector 18. It is connected to the.

  Next, the detailed configuration of the thermocouple groups 13 to 17 will be described with reference to FIGS. Since the thermocouple groups 13 to 17 have the same configuration, only the thermocouple group 14 will be described. FIG. 2A is a partially enlarged view of a portion surrounded by a one-dot broken line in FIG.

  As illustrated in FIG. 2A, the thermocouple group 14 includes thermocouples 31 to 34. The thermocouples 31, 32, 33, and 34 are connected in series in order from the left to the right in the Y-axis direction. Each of the thermocouples 31 to 34 includes first conductors 31a to 34a made of p-type bismuth tellurium and second conductors 31b to 34b made of n-type bismuth tellurium, respectively. In addition, the thermocouples 31 to 34 include first conductive members 31c to 34c, first conductors 31a to 34a, and second conductors 31b to 31 that electrically connect the first conductors 31a to 34a and the second conductors 31b to 34b. Second conductive members 31d to 34d that are electrically connected to 34b. The first conductive members 31c to 34c and the second conductive members 31d to 34d are made of a metal (for example, gold) having higher conductivity than the first conductors 31a to 34a and the second conductors 31b to 34b, and FIG. As shown in (b), it is formed in a thin film shape compared to the first conductors 31a to 34a and the second conductors 31b to 34b.

  The first conductors 31a to 34a and the second conductors 31b to 34b are arranged in the Z-axis direction, and the first conductive members 31c to 34c and the second conductive members 31d to 34d are oriented in the Y-axis direction. Are arranged. The first conductor 31a is formed shorter in the Z-axis direction than the other first conductors 32a to 34a, and the second conductor 34b is Z compared to the other second conductors 31b to 33b. It is formed short in the axial direction. Further, the second conductive member 34d is disposed in a portion where the slit 12 is formed in the electrically insulating sheet 11. These configurations are common to the thermocouple groups 13-17.

  As shown in FIGS. 2A and 2B, the periphery of the electrically insulating sheet 11 on which the thermocouples 31 to 34 are formed is covered with a heat insulating member 35 made of transparent silicone rubber, and a heat insulating member. 35 is covered with a heat conductive member 36 in which graphite is mixed in transparent silicone rubber. The heat insulating member 35 also functions as a sealing member that coats the thermocouples 31 to 34. In addition, while showing the connection part of the 1st conductors 31a-34a and 2nd conductors 31b-34b, and the 1st electroconductive members 31c-34c as the 1st contact 37, respectively, the 1st conductors 31a-34a and the 2nd conductors 31b- Connection portions between 34b and the second conductive members 31d to 34d are shown as second contacts 38, respectively.

  As shown in FIGS. 2A and 2B, when a thermoelectric conversion device is brought close to the heat source 40, a temperature difference is generated between the first contact 37 and the second contact 38 in the electrically insulating sheet 11, and the thermoelectric conversion is performed. Electricity is generated by the Seebeck effect of the device.

  Next, the manufacturing method of the thermoelectric conversion device comprised like this embodiment is demonstrated with reference to FIG. 3, FIG. The thermoelectric conversion device is manufactured by performing the first to sixth steps.

  First, as shown in FIG. 3, the first conductors 31 a to 34 a and the second conductors 31 b to 34 b and the first conductive members 31 c to 34 c or the second conductive material are provided on the electrically insulating sheet 10 as a flat plate. Thermocouple groups 13 to 17 are provided alternately in series via members 31d to 34d. The thermocouple groups 13 to 17 thus formed in series are referred to as a thermocouple array 19. Similarly, a plurality of thermocouple arrays 19 are formed in parallel on the electrically insulating sheet 10.

Next, the first step will be described.
As shown in FIG. 4A, in the first step, a predetermined amount of fluid thermosetting resin (resin member) 84 in which a crosslinking material is mixed in transparent silicone rubber is introduced to stretch the resin layer. The amount of the thermosetting resin 84 that flows in is appropriately changed according to the standard of the thermoelectric conversion device to be manufactured.

Next, the second step will be described.
As shown in FIG. 4B, in the second step, the electrically insulating sheet 10 provided with a plurality of thermocouple arrays 19 is placed over the resin layer stretched in the first process.

Next, the third step will be described.
As shown in FIG. 4C, in the third step, the first step and the second step are repeated a predetermined number of times, the first step is finally performed, and then the third step is performed. In the third step, the laminated thermosetting resin 84 and the electrical insulating sheet 10 are compressed in the lamination direction.

Next, the fourth step will be described.
In the fourth step, the laminated thermosetting resin 84 and the electrical insulating sheet 10 are heated to cure the thermosetting resin 84.

Next, the fifth step will be described.
As shown in FIG. 4D, the laminated thermosetting resin 84 and the electrically insulating sheet 10 are cut between the adjacent thermocouple rows 19, that is, along a line indicated by a two-dot broken line in FIG. . As a result, the thermoelectric conversion devices in which the adjacent electrically insulating sheets 10 as shown in FIG. 4E face each other and are parallel to each other are manufactured.

In the thermoelectric conversion device of the present embodiment described above, the following effects can be obtained.
(1) The plurality of electrically insulating sheets 11 on which the thermocouple groups 13 to 17 are formed are arranged so as to face each other. Therefore, it is not necessary to consider the bending stress that occurs when the electrically insulating sheet on which the thermocouple is formed is bent during the manufacture of the conventional thermoelectric conversion device. Therefore, there is no fear of disconnection of the thermocouple groups 13 to 17 even if the distance between the adjacent electrical insulating sheets 11 is reduced when arranging the electrical insulating sheets 11, and as a result, the thermocouple groups 13 to 17 are arranged. Can be prevented, and the degree of integration of thermoelectric conversion devices can be improved.

  (2) Since the adjacent electrical insulating sheets 11 are parallel, the distance from the adjacent electrical insulating sheets 11 can be further reduced, and the degree of integration of the thermoelectric conversion devices can be further improved.

  (3) The first conductive members 31 a to 34 c and the second conductive members 31 b to 34 b are higher in conductivity than the first conductors 31 a to 34 a and the second conductors 31 b to 34 b and the second conductive members. Electrical connection is made through 31d to 34d. Therefore, the electrical resistance values in the first conductive members 31c to 34c and the second conductive members 31d to 34d are reduced, and more current can be generated from the voltage generated by the thermoelectric conversion device. Increases thermoelectric conversion efficiency.

  (4) Since the thermocouples 31 to 34 are coated with the electrical insulating sheet 11 and the heat insulating member 35, the thermocouples 31 to 34 are covered with the heat insulating member 35 and do not directly touch the outside air. It becomes difficult to be affected by the external environment such as temperature, humidity, and particles, so that the life of the thermoelectric conversion device can be extended and the operation can be stabilized.

  (5) Moreover, since the part which provided the slit 12 in the thermoelectric conversion device becomes easy to bend compared with the other part of the thermoelectric conversion device, possibility that stress will be added is high. A second conductive member 34d is disposed in a portion of the electrical insulating sheet 11 where the slit 12 is formed. Since the second conductive member 34d is formed thinner than the first conductors 31a to 34a and the second conductors 31b to 34b, the ductility is improved and the possibility of disconnection is suppressed.

  (6) When the thermoelectric conversion device is brought close to the heat source 40, when the heat generated from the heat source 40 is conducted to the second contact 38, a longer distance than when conducted to the first contact 37, The heat insulating member 35 must be moved. Since the heat insulating member 35 is difficult to transmit heat, the temperature difference between the first contact 37 and the second contact 38 is increased, and the efficiency of power generation due to the Seebeck effect of the thermoelectric conversion device can be increased.

  (7) Since the portion directly in contact with the outside is covered with the heat conductive member 36 having heat conductivity, when the thermoelectric conversion device is brought close to the heat source 40, the heat conductive member 36 on the heat source 40 side is heated. The heat conductive member 36 on the side away from the heat source dissipates heat. As a result, the temperature difference between the first contact 37 and the second contact 38 becomes large, and the power generation efficiency due to the Seebeck effect of the thermoelectric conversion device can be increased.

  (8) The thermoelectric conversion device is manufactured by alternately laminating the electrically insulating sheets 10 in which the thermocouple arrays 19 are arranged in parallel and the thermosetting resin 84. Therefore, the number of the electrically insulating sheets 10 arranged in the same capacity can be increased by narrowing the interval between the electrically insulating sheets 10 and reducing the amount of the thermosetting resin 84 that flows in. Since the electrically insulating sheets 10 on which the thermocouple arrays 19 are formed can be laminated so as to be parallel to each other, a highly integrated thermoelectric conversion device can be easily manufactured. In addition, since no bending stress is applied to the thermocouple array 19 formed on the electrical insulating sheet 10 during the manufacturing process, disconnection of the thermocouple array 19 during manufacturing can be suppressed.

In addition, the component of this embodiment can be changed as follows.
In the present embodiment, the heat insulating member 35 is made of transparent silicone rubber, but this can be changed to another heat insulating material, such as urethane foam.

  -In this embodiment, although the structure which covers the circumference | surroundings of the electrically insulating sheet | seat 11 and the thermocouple groups 13-17 with the heat insulating member 35 and the heat conductive member 36 was shown, this is like the conventional thermoelectric conversion device. The electrical insulating sheet 11 may be changed to a configuration in which it is sandwiched between two sheet-like members.

The first conductors 31a to 34a and the second conductors 31b to 34b may be directly connected without passing through the first conductive members 31c to 34c and the second conductive members 31d to 34d.
-Although the electrically insulating sheet | seat 11 was formed with the polyimide film, you may change this into the material which has another insulating property.

  -The material of the 1st conductor 31a-34a and the 2nd conductor 31b-34b may employ | adopt another material, if it functions as a thermocouple. That is, any material may be used for the first conductors 31a to 34a and the second conductors 31b to 34b as long as they can perform thermoelectric conversion using different materials. In particular, the output voltage (thermoelectric conversion efficiency) of the thermocouple increases as the two types of materials having a larger difference in Seebeck coefficient are used. One material and the other material constituting the thermocouple may be a metal, a semiconductor, an alloy, or an oxide.

Next, a technical idea that can be grasped from the above-described embodiment and changes in the aspect will be described below.
(A) In the thermoelectric conversion device in which the first conductor and the second conductor are alternately provided on the substrate to constitute the thermocouple, the first conductor and the second conductor are compared with the first conductor and the second conductor. The thermoelectric conversion device is electrically connected through a conductive member having high conductivity.

According to this configuration, it is possible to achieve an effect equivalent to the above (3).
(B) In the thermoelectric conversion device in which the first conductor and the second conductor are alternately provided on the substrate to constitute the thermocouple, the periphery of the substrate on which the thermocouple is formed is covered with a heat insulating member having heat insulating properties. In addition, the heat insulating member is covered with a heat conductive member having thermal conductivity.

  According to this configuration, it is possible to achieve the same effects as the above (6) and (7).

(A) is a perspective view of a thermoelectric conversion device, (b) is a sectional view in AA, and (c) is a front view of the thermoelectric conversion device viewed from the Y direction. (A) is the elements on larger scale of FIG.1 (b), (b) is sectional drawing in BB. It is a front view of a thermoelectric conversion device. (A)-(e) is process drawing which shows the manufacturing method of a thermoelectric conversion device. It is a front view of the conventional thermoelectric conversion device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Electrical insulation sheet, 31-34 ... Thermocouple, 31a-34a ... 1st conductor, 31b-34b ... 2nd conductor, 31c-34c ... 1st electroconductive member, 31d-34d ... 2nd electroconductive member, 35 ... heat insulating member (sealing member), 36 ... heat conductive member, 84 ... thermosetting resin.

Claims (2)

In the thermoelectric conversion device in which the first conductor and the second conductor are alternately provided on the substrate to configure the thermocouple, the substrate is plural, and the plural substrates are arranged to face each other,
The first conductor and the second conductor are electrically connected via a conductive member having higher conductivity than the first conductor and the second conductor,
Among the conductive members, the conductive member connecting adjacent thermocouples is formed thinner than the first conductor and the second conductor,
In the substrate, a slit is formed in a portion corresponding to the thinly formed conductive member ,
Further, the periphery of the substrate on which the thermocouple is formed is covered with a heat insulating member having heat insulating properties, and the heat insulating member is covered with a heat conductive member having heat conductivity. A thermoelectric conversion device. The thermoelectric conversion device according to claim 1,
The thermoelectric conversion device, wherein the plurality of substrates are arranged in parallel.

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