JP4841284B2 - WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high reliability wiring board for light emitting elements which is superior in light emitting efficiency and prevents the seal resin from peeling. <P>SOLUTION: A flat insulation ceramic insulation base 1 has wirings 3, 5, 7 formed thereon. A metal body 13 is inserted in a through-hole 11 piercing the base 1 with leaving a gap 15 formed with the through-hole 11 and has a higher thermal conductivity than the insulation base 1, a greater flange 13a at one end greater than the through-hole 11, and a mounting surface 9 on the opposite end face than the end face having the flange 13a for mounting a light emitting element. The body 13 is bonded to the insulation base 1 by the flange 13a to form a space 17 between the flange 13a and the main surface of the base 1; the space 17 communicating with the gap 15 through a connecting part 19. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a light emitting element wiring board and a light emitting device for mounting a light emitting element such as a light emitting diode.

  Conventionally, light emitting devices using LEDs have been used for various applications because of their extremely high luminous efficiency and the small amount of heat generated with light emission compared to incandescent bulbs. However, since it emits less light than incandescent bulbs, fluorescent lamps, etc., it is used not as an illumination light source but as a display light source, and the energization amount is as small as about 30 mA (for example, Patent Document 1). See).

  In recent years, the use of light-emitting devices using light-emitting elements has been expanded to backlights such as mobile phones and large liquid crystal TVs.

Due to this expanded use, it is required to increase the brightness of the light-emitting element, and accordingly, heat generated from the light-emitting device is also increasing, and there is a problem that the sealing resin is peeled off from the filling portion due to thermal stress. On the other hand, a structure is employed in which the light emitting element is mounted on the bottom surface of the concave storage portion and the opening end of the storage portion filled with the sealing resin is exposed like an eaves to prevent the sealing resin from peeling and dropping. (For example, refer to Patent Document 2).
JP 2002-134790 A JP 2004-111937 A

  However, due to the demand for higher luminance of the light emitting element, the heat generated from the light emitting device is also increasing. With the current structure, it is difficult to peel off and prevent the sealing resin from dropping. Further, in a sealing resin having a large shrinkage at the time of thermosetting, the protruding portion must be lengthened in order to prevent peeling and dropping. If it does so, the light emission from an element was interrupted | blocked by the protrusion part, and there existed a subject that luminous efficiency fell.

  The present invention provides a light-emitting element wiring board and a light-emitting device that can suppress peeling and dropping of the sealing resin without hindering light extraction from the light-emitting element, and that are excellent in heat dissipation. Objective.

The wiring board for a light-emitting element of the present invention has a thermal conductivity higher than that of the insulating substrate in a through hole provided through the insulating substrate, with wiring formed on a flat insulating substrate made of ceramics. A metal body having a flange portion larger than the through hole formed at one end portion and a mounting surface on which a light emitting element is mounted is formed on the end surface opposite to the end surface where the flange portion is formed. And a space is formed between the flange and the main surface of the insulating substrate, and the space is formed between the metal body and the flange. And the gap communicated with each other via a communicating portion, and a concave portion communicating with at least one of the gap and the communicating portion is formed on a side surface of the metal body.

  In the light-emitting element wiring board of the present invention, it is preferable that the recess is opposed to the space and communicates with the communication portion.

The light emitting device of the present invention, above-described light emitting element to the mounting surface of the wiring board light emitting device having the structure is mounted, disposed Tei Rutotomoni as sealing resin covering the light emitting element, the sealing resin is The gap, the space, the concave portion, and the communicating portion are integrally filled.

The wiring board for a light emitting element of the present invention emits light because a metal body having a higher thermal conductivity than the insulating base is inserted into a through-hole provided through the insulating base on a flat plate made of ceramics. The heat generated from the element can be dissipated from the metal body efficiently and promptly, and the light emitting element can be prevented from being heated excessively. For this reason, it is possible to prevent a decrease in luminance or to further increase the luminance. Moreover, since the metal body is disposed with a gap between the metal body and the through hole, stress due to a difference in thermal expansion between the insulating base and the metal body can be relieved, and the joining reliability of the metal body can be improved. Further, a space communicating with the gap formed between the metal body and the through hole is formed between the flange portion and the insulating base main surface, and the gap and the communication portion are formed on the side surface of the metal body. Since the concave portion communicating with at least one is provided , the sealing resin that covers the light emitting element can be integrally filled in the gap, the space, and the concave portion , and thereby the metal body is locked by the sealing agent. Therefore , not only the sealing agent but also the metal body can be firmly fixed.

  In addition, when the space and the recess are formed so as to face each other, the metal body can be easily manufactured, and the flow of the sealant is disturbed when the sealant is filled in the space or the recess. Therefore, the light emitting element wiring board of the present invention can be easily formed.

  According to the light-emitting device of the present invention in which the light-emitting element is mounted on the wiring board for the light-emitting element of the present invention described above, heat generated from the light-emitting element can be quickly discharged outside the device, and reliability with the metal body is improved. It is excellent and the sealing resin can be fixed stably.

  For example, as shown in FIG. 1 (a), the wiring board for a light emitting element of the present invention has connection terminals 3 (3a, 3a, 3b), the through electrode 7 is provided through the insulating base 1 so as to electrically connect the external electrode terminal 5, the connection terminal 3 and the external electrode terminal 5 to the other main surface 1b of the insulating base 1. A mounting surface 9 for mounting a light emitting element is formed between one connection terminal 3a and the other connection terminal 3b.

  A metal having a heat conductivity higher than that of the insulating base 1 in a through hole 11 provided through the insulating base 1 and having a flange 13a larger than the through hole 11 at one end. The body 13 is inserted between the through hole 11 with a gap 15 and a space 17 is formed between the insulating base 1 and the flange 13a of the metal body. The space 17 is formed between the metal body 13 and the through hole. It is important to communicate with the gap 15 formed between the two.

  The space 17 and the gap 15 are integrally filled with a sealing resin, and the light emitting element mounted on the light emitting element mounting surface 9 is sealed with the sealing resin, so that the output light from the light emitting element is The sealing resin can be firmly fixed without hindering.

  That is, the sealing resin filled in the space 17 and the sealing resin sealing the light emitting element are integrally connected to the sealing resin filled in the gap 15 at the communication portion 19, thereby sealing the sealing resin. The resin is locked by the space 17.

  Further, since the metal body 13 having a higher thermal conductivity than the insulating base 1 is inserted into the through hole 11, the heat generated by the light emitting element can be efficiently released outside the system, and the luminance of the light emitting element is reduced. It is possible to prevent or increase the brightness. In particular, it is desirable to form the mounting surface 9 on the end surface of the metal body 13.

  Further, the metal body 13 and the insulating base 1 are connected to each other at a connecting portion 13b formed in a projecting manner on the surface of the flange 13a of the metal body 13 facing the insulating base 1, and is directly in contact with the insulating base 1 at the through hole 11. Therefore, stress due to the difference in thermal expansion between the insulating base 1 and the metal body 13 can be relieved, and high reliability against breakdown can be obtained.

  In connecting the metal body 13 and the insulating base 1, for example, a protrusion may be provided on the insulating base 1, for example.

  Further, as shown in FIG. 1B, in order to induce light from the light emitting element mounted on the mounting surface 9 or to protect the light emitting element, the main surface of the insulating substrate 1 on the mounting surface 9 side is provided. A frame 20 may be provided. The frame body 20 can protect the light emitting element and can easily arrange a phosphor or the like around the light emitting element. Further, the light emitted from the light emitting element can be reflected by the frame body 20 and guided in a predetermined direction. The inner wall surface 20a of the frame body 20 may be perpendicular to the main surface 1a of the insulating base or may be inclined. When the inner wall surface 20a of the frame 20 is inclined toward the outside, the light extraction efficiency further increases. Further, a plating layer (not shown) made of Ni, Au, Al, Ag or the like may be formed on the surface of the frame body 20 to increase the light reflectance.

In addition, as shown in FIG. 2, a concave portion 21 that communicates with at least one of the gap 15 and the communication portion 19 is provided on the side surface of the metal body 13 . By filling the concave portion 21 with the sealing resin, the metal body 13 is locked, and not only the filler but also the metal body 13 can be firmly fixed.

  Further, when the space 17 and the recess 21 are formed so as to face each other via the communication portion 19, the metal body 13 can be easily manufactured, and the filler 17 is filled with the filler 17. In addition, the flow of the filler is less disturbed, and the light emitting element wiring board 23 of the present invention can be easily formed.

  The metal body 13 used in the present invention can take any of a columnar shape, a prismatic shape, other columnar shapes, and a staircase shape in which a plurality of columnar shapes are overlapped. Can be eliminated. The metal body 13 may have a shape in which the light emitting element mounting surface 9 protrudes to a position higher than the main surface 1a on the light emitting element mounting surface side of the insulating base. Since the light emitting element mounting surface 9 is located higher than the main surface 1a of the insulating substrate, the light path length through which the light generated from the light emitting element passes through the sealing resin can be shortened, and the light emission efficiency is increased to prevent the loss of light. Can be increased. Moreover, the light output from the side surface of the light emitting element can also be used effectively.

  Further, as shown in FIG. 3, the distance L between the through hole 11 and the metal body 13 in the gap 15 is preferably 100 to 1000 μm. When the distance L is less than 100 μm, it is difficult to fill the sealing resin, and when it is 1000 μm or more, it is difficult to reduce the size of the light emitting element wiring substrate 23. The distance L is particularly preferably 200 to 500 μm.

  The distance T1 between the insulating base 1 and the flange 13a in the space 17 is preferably 100 to 1000 μm. When the distance T1 is less than 100 μm, it is difficult to fill the sealing resin, and when it is 1000 μm or more, it is difficult to reduce the size of the light emitting element wiring substrate 23. The distance T1 is particularly preferably 200 to 500 μm.

  Further, as the distance T2 between the space 17 and the edge of the through hole 11 is larger, the force for locking the sealing resin is larger. However, if the distance T2 is too large, the surface of the insulating substrate 1 having high thermal conductivity has a low thermal conductivity. Since it will be covered with resin, it is not preferable. Therefore, it is desirable that the range be 20 μm or more, particularly 50 μm or more, 500 μm or less, particularly 200 μm or less.

  Further, as the distance T3 from the space 17 to the end face of the metal body 13 in the flange portion 13a is larger, the rigidity of the metal body 13 can be maintained as a structure and the strength of the insulating base 1 can be increased. This prevents the wiring board 23 from being downsized. Therefore, it is desirable that the distance T3 is 100 to 1000 μm, particularly 200 to 500 μm.

  Further, as the distance T4 between the recess 21 and the edge of the through hole 11 increases, the force for locking the metal body 13 and the sealing resin increases. However, if the distance T4 is too large, the surface of the insulating substrate 1 having high thermal conductivity is heated. It is not preferable because it is covered with a resin having low conductivity. Therefore, it is desirable that the range be 20 μm or more, particularly 50 μm or more, 500 μm or less, particularly 200 μm or less. The distance T5 in the direction parallel to the penetration direction of the through hole 11 of the recess 21 is the same as the distance T1 between the insulating base 1 and the flange 13a in the space 17.

  And the shape of the collar part 13a should just form the space 17 mentioned above. Needless to say, the gap 15, the space 17, and the recess 21 may be formed in a circumferential shape so as to surround the metal body 13 or may be formed discontinuously.

  4A, 4B, 5A, and 5B, a light emitting device in which a light emitting element 27 is mounted on the mounting surface 9 of the light emitting element wiring substrate 23 described above. Since 31 can quickly release the heat generated by the light emitting element 27 from the metal body 13, high luminance can be realized. Moreover, since the space | gap 15 exists between the through-hole 11 and the metal body 13, the stress by the thermal expansion difference of a metal and ceramics can be relieve | moderated and high reliability can be acquired. And since the metal body 13 has the space 17 and the recessed part 21 in the collar part 13a, the sealing resin 35 and the metal body 13 can each be fixed stably.

Further, when an Al ₂ O ₃ sintered body having Al ₂ O ₃ as a main crystal phase is used as the insulating base 1, an inexpensive raw material can be used, and an inexpensive light-emitting element wiring substrate 11 is obtained. be able to.

Note that the _Al 2 _{O 3} and _Al 2 _{O 3} quality sintered body composed mainly crystalline phase, for example, by X-ray diffraction, is like the peak of _Al 2 _{O 3} is detected as the main peak, Al ₂ It is desirable to contain 50% or more by volume of O ₃ crystals.

Moreover, such a sintered compact is made of, for example, Al ₂ O ₃ powder having an average particle diameter of 1.0 to 2.0 μm and a purity of 99% or more, and Mn ₂ O ₃ having an average particle diameter of 1.0 to 2.0 μm. , SiO ₂ , MgO, SrO, and CaO, a molded body to which at least one kind of sintering aid is added is obtained by firing in a temperature range of 1300 to 1600 ° C.

And, for the addition amount of Al ₂ O ₃ other than the compositions, such as sintering aids, in order to obtain a dense body of the Al ₂ O ₃ as a main crystal, preferably 15 wt% or less, more desirably, 10 It is desirable to set it as mass% or less. In particular, when the amount of a composition other than Al ₂ O ₃ such as a sintering aid is set to 15% by mass or less, most of the obtained insulating substrate 1 can be formed of Al ₂ O ₃ crystals. . These sintering aids are desirably added in an amount of 5% by mass or more, and more preferably 7% by mass or more in order to lower the firing temperature. As the ceramic used for the insulating substrate 1, a sintered body having a main crystal of glass ceramics, AlN, Si ₃ N ₄ , mullite, MgO, or the like may be used.

A binder and a solvent are further added to such a composition containing Al ₂ O ₃ as a main component to produce a slurry. For example, a sheet-like molded article is produced by a doctor blade method, After printing and filling a conductive paste containing at least metal powder on the surface or through-holes provided in the sheet-like molded body, this sheet is laminated and fired in an oxidizing atmosphere, a reducing atmosphere, or an inert atmosphere. Thereby, the wiring board 23 for light emitting elements in which wiring layers, such as the connection terminal 3, the external electrode terminal 5, and the penetration conductor 7, were formed in the surface or the inside, can be produced. Needless to say, the wiring layer can be formed on the surface of the insulating substrate 1 by a thin film method or by transferring a metal foil onto the surface of the molded body.

  Then, by forming the connection terminal 3, the external electrode terminal 5, the through conductor 7, and the metal body 13 on the surface or inside of the insulating base 1, a wiring circuit can be formed on the light emitting element wiring substrate 23. it can.

  Such a metal body 13 can form the flange 13a, the space 17 and the recess 21 by etching or cutting a metal lump. It can also be formed by forming through holes in a desired shape in a metal sheet, laminating a plurality of layers, and sintering. The metal body 13 produced in this way is connected to the sintered insulating substrate 1 by a connecting portion 13b using a brazing material or the like. When connected with a brazing material, since the brazing agent has a higher melting point than AuSn, AuSn can be used when mounting the light emitting element, and heat dissipation can be improved as compared with resin mounting. Further, when the light emitting element is mounted using a resin, the resin can be used for joining the metal bodies, and easy and inexpensive joining is possible.

  Then, the conductor and the penetrating metal body 13 used in these wiring circuits are formed by using at least one of W, Mo, Cu, and Ag as a main component, so that they are simultaneously fired with the insulating base 1, and the connection terminals 3, The external electrode terminal 5, the through conductor 7, and the metal body 13 can be formed, and an inexpensive light emitting element wiring board 23 can be obtained.

  Further, by applying Ni, Au, Al, or Ag plating to the surfaces of the connection terminal 3 and the metal body 13, the reflectance can be improved and the light extraction efficiency generated by the light emitting element can be improved.

  And the frame 20 as shown in FIG.1 (b) can be formed by stamping a sheet-like molded object, laminating | stacking on the sheet | seat laminated body of an insulating base, and performing simultaneous baking. It is also possible to form a metal such as Al or Fe—Ni—Co alloy by cutting or etching into a frame shape and adhere the sintered insulating substrate 1 using a brazing agent or a resin. When bonding using a brazing agent, it is necessary to form a metal layer (not shown) using a metal paste on the bonding surface between the insulating substrate 1 and the frame 20.

  Then, for example, as shown in FIGS. 4 and 5, an LED chip or the like is mounted as the light emitting element 27 on the wiring board 23 for the light emitting element of the present invention described above using the element bonding material 33, and light is emitted by the bonding wire 29. By supplying power to the element 27, the light emitting device 31 can function.

  The light emitting element 27 is covered with a sealing resin 35 which is a mold resin, and the sealing resin 35 fills the gap 15 provided between the through hole 11 and the metal body 13, and further the metal body collar It also fills the space 17 provided in 13a. Further, the sealing resin 35 may be used in combination with a lid (not shown) or a lens. It is desirable to use a translucent material such as glass or resin for the lid.

  In addition, you may add the fluorescent substance (not shown) for wavelength-converting the light which the light emitting element 27 radiates | emits to this sealing resin 35 as needed.

  Since the light emitting element wiring substrate 23 has good heat dissipation, the light emitting device 31 does not require a heat radiating member such as a heat sink, and can contribute to the miniaturization of the electric device to be mounted. In addition, by providing a heat sink, it is needless to say that heat dissipation is further improved, and for example, provision of a cooling device such as a heat sink is not excluded.

  4 and 5, the light emitting element 27 is fixed to the light emitting element wiring substrate 23 by the element bonding material 33, and power is supplied by the bonding wire 29, but the light emitting element wiring substrate is used. Needless to say, the connection form with the terminal 23 may be flip-chip connection.

  In the example described above, the example in which the through conductor 7 is provided has been described. However, the through conductor 7 may not be provided, and the insulating base 1 may be laminated in multiple layers. Of course it is good.

The raw material powder of the insulating substrate 1 of the wiring substrate 23 for light emitting elements is a purity of 99% or more, an average particle diameter of 1.5 μm, an Al ₂ O ₃ powder of 99% or more of purity of 90% by weight, an average particle diameter of 1.5 μm, and a purity of 99%. The above Mn ₂ O ₃ powder 5% by weight, average particle size 1.5 μm, purity of 99% or more of SiO ₂ powder 5% by weight is mixed, and the raw material powder is an acrylic resin as a molding organic resin (binder). A binder and toluene were mixed as a solvent to prepare a slurry. Thereafter, a green sheet mainly composed of Al ₂ O ₃ was prepared by a doctor blade method.

  The conductive paste was prepared by mixing 70% by weight of W powder having an average particle size of 2.0 μm, 30% by weight of Cu powder having an average particle size of 2.0 μm, an acrylic binder as an organic resin for molding, and acetone as a solvent, followed by heating under reduced pressure. It was prepared by removing acetone.

  Next, the ceramic green sheet was punched to form a through hole and a via hole having a diameter of 100 μm. The via hole was filled with a conductive paste by a screen printing method, printed and applied in a wiring pattern, and laminated. Further, a punching process was applied to a predetermined position of the ceramic green sheet to be the frame body 25, and the laminated body was laminated and pressure-bonded.

  Then, after degreasing in a nitrogen-hydrogen mixed atmosphere at a dew point of + 25 ° C., the insulating substrate 1 provided with a wiring circuit is subsequently baked at a maximum temperature of 1300 ° C. for 2 hours in a nitrogen-hydrogen mixed atmosphere at a dew point of + 25 ° C. Produced.

  Next, eutectic Ag-Cu solder is applied to the connection portion 13b of the flange portion 13a of the copper metal body 13 produced by the etching process, aligned with the through hole 11 of the insulating base 1, and reflowed at 850 ° C. As a result, the insulating base 1 and the metal body 13 were connected.

  The shape of the insulating substrate 1 was 8 mm × 8 mm × 0.7 mm thickness, and the frame 25 was 0.7 mm wide × 0.8 mm thick. The shape of the metal body 13 is such that the entire thickness of the metal body is 1.2 mm, the end surface on the mounting surface side is a circle having a diameter of 3 mm, the end surface on the side of the flange 13a is a circle having a diameter of 6 mm, and the main surface of the flange 13a is The distance T3 from the surface to the space 17 is 0.25 mm, the shape of the gap 15 is a width L0.4 mm, the shape of the space 17 is a width T2 0.5 mm × depth T1 0.25 mm, and the width of the connection portion 13b is 0. It was 6 mm.

  The main surface 1a on the mounting surface 9 side of the insulating substrate 1 and the main surface on the mounting surface 9 side of the metal body 13 are substantially the same surface, and the end surface on the flange 13a side of the metal body 13 is the insulating substrate 1. It protruded 0.5 mm from the other main surface 1b.

  Then, the wiring formed on the surface of the insulating substrate 1 and the surface of the metal body 13 were sequentially subjected to Ni plating and Ag plating, thereby producing the wiring board 23 for the light emitting element of the present invention.

  In addition, as a comparative example, a wiring board for a light emitting element outside the scope of the present invention without the gap 15 and the space 17 was produced using the following insulating base and metal body. The shape of the insulating base used in this comparative example was 8 mm × 8 mm × 0.7 mm in height, and the shape of the frame was 0.7 mm in width × 0.8 mm in height. The metal body used was shaped such that the thickness of the entire metal body was 1.2 mm, the end surface on the mounting surface side was a circle of φ3 mm, and the end surface on the collar side was a circle of φ6 mm.

  In this comparative example, the bonding between the insulating substrate and the metal body is performed by applying eutectic Ag-Cu solder on the side surfaces of the metal body and the flanges connected to the insulator to align with the through holes of the insulating substrate, By reflowing at 850 ° C., the insulating substrate and the metal body were connected. Moreover, also in the sample of the comparative example, similarly to the case of the present invention, Ni plating and Ag plating were sequentially performed to produce a light emitting element wiring board.

  Then, an LED chip, which is a light emitting element, is mounted on the mounting surface 9 using AuSn as the element bonding agent 33 on the light emitting element wiring substrate 23 of the present invention and the light emitting element wiring substrate manufactured as a comparative example. A sealing resin 35 made of an epoxy resin was injected and the epoxy resin was cured to obtain the light emitting device 31 of the present invention and the light emitting device of the comparative example.

  At that time, in the sample of the present invention, the gap 15 between the insulating base 1 and the metal body 13, the space 17 provided in the flange portion 13 a and the communication portion 19 were filled with the sealing resin 35.

  The obtained light emitting device 31 of the present invention and the light emitting device of the comparative example were subjected to a temperature cycle test of −40 ° C. to 125 ° C. for 100 cycles. Thereafter, the metal fittings were bonded using an adhesive in the range of 1 mm □ of the sealing resin of the light emitting device. In adhering, a masking tape was used to prevent the adhesive from spreading beyond 1 mm □. And this metal fitting was pulled up on the conditions of the pulling speed of 0.5 mm / min, and the tension test was done. And what the tensile load exceeded 0.005N was determined to be acceptable. When 20 examples were tested in both the example and the comparative example, 13 sealing resins were peeled in the comparative example, but no peeling was observed in the sealing resin of the example.

  As described above, according to the present invention, it was possible to prevent peeling of the sealing resin and to obtain a light emitting device having excellent heat dissipation by the metal body.

(A) is a sectional view showing a wiring board for emitting optical element, (b) are sectional views showing the form of a light emission element wiring substrate provided with a frame. It is sectional drawing which shows the other form of the wiring board for light emitting elements of this invention. It is a principal part expanded sectional view of the wiring board for light emitting elements of this invention. (A) is a sectional view showing a light emission device, (b) are sectional views showing a light emission device in a form provided with the frame. (A) is sectional drawing which shows the light-emitting device of this invention provided with the recessed part, (b) is sectional drawing which shows the light-emitting device of this invention of the form which provided the recessed part and the frame.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 3 ... Connection terminal 5 ... External electrode terminal 7 ... Through-conductor 9 ... Mounting surface 11 ... Through-hole 13 ... Metal body 13a ... ridge part 13b ... Connection part 15 ... Gap 17 ... Space 19 ... Communication part 20 ... Frame 21 ... Recess 23 ... Wiring board 27 ... Light emitting element 29 ... Bonding wire 31 ... Light emitting device 33 ... Element bonding material 35 ... Sealing resin

Claims (3)

Wiring is formed on a flat insulating substrate made of ceramics, and a through hole provided through the insulating substrate has a higher thermal conductivity than the insulating substrate, and at one end than the through hole. And a metal body having a mounting surface on which a light emitting element is mounted on the end surface opposite to the end surface where the flange portion is formed is inserted with a gap between the through hole. The metal body is connected to the insulating base at the flange, so that a space is formed between the flange and the main surface of the insulating base, and the space and the gap are connected via a communicating portion. A wiring board for a light-emitting element , wherein a recess is formed in communication with at least one of the gap and the communication portion on a side surface of the metal body . The wiring board for a light emitting element according to claim 1, wherein the concave portion is in communication with the communication portion so as to face the space. Claim 1 or 2 light-emitting element is mounted on the mounting surface of the wiring substrate for light-emitting element according to, Tei Rutotomoni are arranged such sealing resin covering the light emitting element, the sealing resin and the space above A light emitting device , wherein the space, the concave portion, and the communication portion are integrally filled.

Images