JP4839362B2 - 高周波回路モジュール - Google Patents
高周波回路モジュール Download PDFInfo
- Publication number
- JP4839362B2 JP4839362B2 JP2008291717A JP2008291717A JP4839362B2 JP 4839362 B2 JP4839362 B2 JP 4839362B2 JP 2008291717 A JP2008291717 A JP 2008291717A JP 2008291717 A JP2008291717 A JP 2008291717A JP 4839362 B2 JP4839362 B2 JP 4839362B2
- Authority
- JP
- Japan
- Prior art keywords
- frequency circuit
- substrate
- circuit module
- connector
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 239000010410 layer Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 22
- 238000011156 evaluation Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 1
- 230000005405 multipole Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
10 多極コネクタ(回路部品)
11 ケース
12 端子
20 同軸コネクタ(高周波コネクタ)
30 基板
31 第1シート層
311 誘電体層
312 絶縁層
313 電極パッド
32 第2シート層
321 誘電体層
322 電源パターン
33 第3シート層(配線層)
331 誘電体層
332 絶縁層
333 グランドパターン(接地導体層)
334 マイクロストリップライン(導波路)
34 スルーホール電極
α1 部品搭載面
α2 配線面
β1 引き出し方向
β2 中間ライン
γ 部品領域
Claims (5)
- 外側に複数の端子が配列された表面実装型の高周波回路部品と、前記高周波回路部品が搭載された多層基板又は単層基板であり且つ接地導体層を有した基板とを備え、前記基板は、同基板の部品搭載面に形成され且つ前記高周波回路部品の端子が各々接続される電極パッドと、同基板の部品搭載面とは異なる外面又は内側面に形成された導波路と、前記高周波回路部品の下方又はその近くに位置し且つ前記電極パッドと前記導波路との間を電気接続するためのスルーホール電極とを有し、隣り合う導波路の全部又は一部の引き出し方向が互いに逆になっていることを特徴とする高周波回路モジュール。
- 請求項1記載の高周波回路モジュールにおいて、前記導波路が前記接地導体層を対向電極としたマイクロストリップラインであることを特徴とする高周波回路モジュール。
- 前記高周波回路部品としての多極コネクタを含めた信号伝送路の高周波特性を測定するのに使用される高速差動伝送対応の評価基板である請求項1記載の高周波回路モジュールにおいて、前記基板上には高周波コネクタが搭載され、前記多極コネクタと前記高周波コネクタとの間が前記導波路を通じて電気接続されていることを特徴とする高周波回路モジュール。
- 請求項3記載の高周波回路モジュールにおいて、前記基板の部品搭載面の反対側が配線面となっていることを特徴とする高周波回路モジュール。
- 請求項4記載の高周波回路モジュールにおいて、前記基板の部品搭載面には、引き出し方向が同一である隣り合う導波路に係る電極パッドの各間に補助導体パターンが配設されており、当該補助導体パターンが前記接地導体層に電気接続されていることを特徴とする高周波回路モジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008291717A JP4839362B2 (ja) | 2008-11-14 | 2008-11-14 | 高周波回路モジュール |
TW098123467A TWI510143B (zh) | 2008-11-14 | 2009-07-10 | High frequency circuit module |
US12/535,176 US8120450B2 (en) | 2008-11-14 | 2009-08-04 | High frequency circuit module |
CN2009102047406A CN101740896B (zh) | 2008-11-14 | 2009-10-14 | 高频电路模块 |
KR1020090102619A KR20100054722A (ko) | 2008-11-14 | 2009-10-28 | 고주파 회로 모듈 |
EP09252612.8A EP2197073B1 (en) | 2008-11-14 | 2009-11-13 | High frequency circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008291717A JP4839362B2 (ja) | 2008-11-14 | 2008-11-14 | 高周波回路モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010118974A JP2010118974A (ja) | 2010-05-27 |
JP4839362B2 true JP4839362B2 (ja) | 2011-12-21 |
Family
ID=42124384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008291717A Active JP4839362B2 (ja) | 2008-11-14 | 2008-11-14 | 高周波回路モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US8120450B2 (ja) |
EP (1) | EP2197073B1 (ja) |
JP (1) | JP4839362B2 (ja) |
KR (1) | KR20100054722A (ja) |
CN (1) | CN101740896B (ja) |
TW (1) | TWI510143B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110277623A (zh) * | 2019-06-28 | 2019-09-24 | 中国航空工业集团公司雷华电子技术研究所 | 一种高隔离功率合成装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4839362B2 (ja) * | 2008-11-14 | 2011-12-21 | ホシデン株式会社 | 高周波回路モジュール |
JP5024356B2 (ja) | 2009-11-09 | 2012-09-12 | 株式会社村田製作所 | 電気特性測定基板 |
WO2012167466A1 (en) * | 2011-07-04 | 2012-12-13 | Huawei Technologies Co., Ltd. | Module and coupling arrangement |
US10677995B2 (en) | 2014-10-23 | 2020-06-09 | Hewlett Packard Enterprise Development Lp | Optical fiber interface for optical device package |
US10534148B2 (en) | 2014-10-24 | 2020-01-14 | Hewlett Packard Enterprise Development Lp | Optical interconnect device |
WO2016122490A1 (en) | 2015-01-28 | 2016-08-04 | Hewlett Packard Enterprise Development Lp | Laser-written optical routing systems and method |
US10462416B2 (en) | 2017-06-07 | 2019-10-29 | Sergey Kvachev | Face plate cover for outdoor in-line multitap |
WO2020137719A1 (ja) * | 2018-12-27 | 2020-07-02 | 株式会社村田製作所 | 多極コネクタセット |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0817268B2 (ja) * | 1984-04-25 | 1996-02-21 | ソニー株式会社 | プリント配線端子装置 |
JPS6467947A (en) * | 1987-09-08 | 1989-03-14 | Nec Corp | Ic package substrate |
JPS6486265A (en) * | 1987-09-29 | 1989-03-30 | Fujitsu Ltd | Restarting processing system for document processor |
JPH0410984A (ja) * | 1990-04-27 | 1992-01-16 | Fuji Photo Film Co Ltd | 熱転写受像材料 |
US5768109A (en) * | 1991-06-26 | 1998-06-16 | Hughes Electronics | Multi-layer circuit board and semiconductor flip chip connection |
EP0547262A1 (en) * | 1991-12-18 | 1993-06-23 | International Business Machines Corporation | Modular photonic waveguide distribution system |
JPH0785931A (ja) * | 1993-09-17 | 1995-03-31 | Kel Corp | 電気コネクタ |
FI114585B (fi) * | 2000-06-09 | 2004-11-15 | Nokia Corp | Siirtojohdin monikerrosrakenteissa |
AU2001294146A1 (en) * | 2000-09-19 | 2002-04-02 | David Nir | Integrated optical switching device |
US20030150643A1 (en) * | 2002-02-13 | 2003-08-14 | Eric Juntwait | Layout for noise reduction on a printed circuit board and connectors using it |
JP2004319257A (ja) * | 2003-04-16 | 2004-11-11 | Japan Aviation Electronics Industry Ltd | 平衡伝送用コネクタ |
US7224857B2 (en) * | 2004-12-20 | 2007-05-29 | Fujitsu Limited | Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the same |
JP2007165945A (ja) | 2005-12-09 | 2007-06-28 | Yazaki Corp | 平衡コネクタ評価用基板 |
JP4839362B2 (ja) * | 2008-11-14 | 2011-12-21 | ホシデン株式会社 | 高周波回路モジュール |
-
2008
- 2008-11-14 JP JP2008291717A patent/JP4839362B2/ja active Active
-
2009
- 2009-07-10 TW TW098123467A patent/TWI510143B/zh not_active IP Right Cessation
- 2009-08-04 US US12/535,176 patent/US8120450B2/en not_active Expired - Fee Related
- 2009-10-14 CN CN2009102047406A patent/CN101740896B/zh not_active Expired - Fee Related
- 2009-10-28 KR KR1020090102619A patent/KR20100054722A/ko active Search and Examination
- 2009-11-13 EP EP09252612.8A patent/EP2197073B1/en not_active Not-in-force
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110277623A (zh) * | 2019-06-28 | 2019-09-24 | 中国航空工业集团公司雷华电子技术研究所 | 一种高隔离功率合成装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2010118974A (ja) | 2010-05-27 |
US20100124390A1 (en) | 2010-05-20 |
US8120450B2 (en) | 2012-02-21 |
CN101740896B (zh) | 2013-10-23 |
EP2197073B1 (en) | 2014-04-30 |
CN101740896A (zh) | 2010-06-16 |
TWI510143B (zh) | 2015-11-21 |
EP2197073A3 (en) | 2012-09-26 |
EP2197073A2 (en) | 2010-06-16 |
TW201019801A (en) | 2010-05-16 |
KR20100054722A (ko) | 2010-05-25 |
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