JP4826593B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component.

  Patent Documents 1 to 11 show a method for manufacturing a thin film capacitor according to the prior art. In the method of manufacturing a thin film capacitor according to the prior art, (1) a method of forming a thin film capacitor on a metal foil and embedding the thin film capacitor in a multilayer circuit board, (2) forming a thin film capacitor on a support, A method of transferring a thin film capacitor to a circuit board, (3) a method of producing a thin film capacitor on a support such as metal, and removing the support are employed.

JP-A-8-78283 JP-A-11-26943 JP 2004-259988 A Japanese Patent No. 3608990 JP 2004-296679 A JP 2006-49510 A JP 2006-108421 A JP 2006-120768 A JP 2007-15377 A JP 2007-19481 A JP 2007-19482 A Nitto Denko Corporation website (http://www.nitto.co.jp/product/datasheet/e_parts/010/index.html)

  In Patent Document 3 (Japanese Patent Application Laid-Open No. 2004-259998), after forming a thin film capacitor on a support such as a glass plate, the adhesive strength of the release film between the support and the thin film capacitor is reduced, The thin film capacitor is separated from the support. In this case, when energy for peeling is not sufficiently applied to the release film, the release film may be peeled off from the support while the release film is attached to the thin film capacitor.

  Moreover, as an adhesive sheet marketed, there is one in which a heat-peeling adhesive material is applied to one surface of a polyester film substrate and a pressure-sensitive adhesive material is applied to the other surface. For example, a thermal release sheet, Riva Alpha (registered trademark) manufactured by Nitto Denko Corporation shown in Non-Patent Document 1. When an electronic component and a support are bonded using such an adhesive sheet, the adhesive sheet remains adhered to the support, so the adhesive sheet is removed from the support and the support is reused. Becomes difficult.

  The present invention has been made in order to solve the above-described problems. In an electronic component manufacturing method in which an electronic component is fixed to a support via an adhesive sheet and the electronic component fixed to the support is processed, An electronic component manufacturing method capable of preventing a part of an adhesive sheet from remaining attached to an electronic component after processing the component and further preventing a part of the adhesive sheet from remaining attached to a support. The purpose is to provide.

  In order to achieve the above-described object, a method for manufacturing an electronic component according to the present invention provides an adhesive sheet in which first and second adhesive layers having different decomposition conditions are arranged with a film substrate interposed therebetween, Bonding the adhesive layer of 1 to the electronic component and bonding the second adhesive layer to the support to fix the electronic component to the support; and processing the electronic component in a state of being fixed to the support The electronic component is peeled from the support in a state where the process and the decomposition condition of the first adhesive layer bonded to the electronic component are satisfied and the decomposition condition of the second adhesive layer bonded to the support is not satisfied And a step of peeling the adhesive sheet from the support as a state satisfying the decomposition condition of the second adhesive layer bonded to the support.

  In the method for manufacturing an electronic component according to the present invention, after processing the electronic component in a state of being fixed to the support, the decomposition condition of the first adhesive layer bonded to the electronic component is satisfied, and the electronic component is bonded to the support. The electronic component is peeled from the support in a state that does not satisfy the decomposition condition of the second adhesive layer. For this reason, when the electronic component is peeled from the support, the first adhesive layer bonded to the electronic component is decomposed, while the second adhesive layer is not decomposed to support the film substrate. Continue to adhere to the body. Therefore, since the electronic component after peeling from the support is reliably separated from the film base material and the second adhesive layer, it is possible to prevent a part of the adhesive sheet from remaining on the electronic component. Can do. Moreover, since the remainder of an adhesive sheet peels from a support body by setting it as the state which satisfy | fills the decomposition | disassembly conditions of a 2nd adhesive bond layer, a support body can be used repeatedly.

  In the method for manufacturing an electronic component according to the present invention, the first and second adhesive layers have the decomposition condition that the same kind of energy is supplied, and the amount of energy that the first adhesive layer decomposes is It is preferable that the second adhesive layer is set to be smaller than the amount of energy for decomposition. According to this method for manufacturing an electronic component, a predetermined amount of energy for decomposing the first adhesive layer is supplied to the adhesive sheet, and only the first adhesive layer is removed without decomposing the second adhesive layer. Can be decomposed.

  Further, in the method for manufacturing an electronic component according to the present invention, the first adhesive layer is heated to the first decomposition temperature, and the second adhesive layer has a temperature higher than the first decomposition temperature. It is preferable that the decomposition conditions include heating to a higher second decomposition temperature. According to this method for manufacturing an electronic component, the adhesive sheet can be heated to the first decomposition temperature, and only the first adhesive layer can be decomposed without decomposing the second adhesive layer.

  Further, in the method for manufacturing an electronic component according to the present invention, the temperature difference between the first decomposition temperature and the second decomposition temperature is calculated using a temperature at which the adhesive force of the adhesive layer is substantially 0 in 10 seconds as a reference. It is preferable that it is 20 degreeC or more. According to this method for manufacturing an electronic component, it is possible to reliably prevent the second adhesive layer from being decomposed when the adhesive sheet is heated to the first decomposition temperature.

  In the method for manufacturing an electronic component according to the present invention, it is preferable that the first and second adhesive layers have a disassembly condition that different kinds of energy are supplied. According to this electronic component manufacturing method, the first adhesive layer is decomposed by supplying energy to the adhesive sheet so that only the first adhesive layer is decomposed without decomposing the second adhesive layer. Can be made.

  In the method for manufacturing an electronic component according to the present invention, the first adhesive layer should be heated under decomposition conditions, and the second adhesive layer should be decomposed under irradiation with electromagnetic waves. Is preferred. According to this method for manufacturing an electronic component, the adhesive sheet can be heated to decompose only the first adhesive layer without decomposing the second adhesive layer.

  In the method of manufacturing an electronic component according to the present invention, the first adhesive layer is heated to be decomposed, and the second adhesive layer is contacted with an organic solvent to be decomposed. Is preferred. According to this method for manufacturing an electronic component, the adhesive sheet can be heated to decompose only the first adhesive layer without decomposing the second adhesive layer.

  According to the present invention, in order to solve the above problems, in an electronic component manufacturing method in which an electronic component is fixed to a support via an adhesive sheet, and the electronic component fixed to the support is processed. Further, it is possible to prevent a part of the adhesive sheet from remaining attached to the electronic component after the processing of the electronic component, and further to prevent a part of the adhesive sheet from remaining attached to the support.

  Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description is omitted.

  The electronic component according to this embodiment is a thin film capacitor for decoupling embedded in a multilayer circuit board. This thin film capacitor for decoupling forms a capacitor composed of a dielectric layer and electrode layers formed on both sides thereof, thereby reducing the disturbance of the signal waveform to the semiconductor element. In addition, although the electronic component of this embodiment is a thin film capacitor for decoupling, other types of electronic components may be used in other embodiments.

  FIG. 1 is a flowchart showing a method for manufacturing a thin film capacitor according to the present embodiment. In the method of manufacturing a thin film capacitor according to the present embodiment, first, a processed body of the thin film capacitor is fixed to a support using an adhesive sheet (S1). Here, the adhesive sheet is a peelable adhesive sheet that decomposes and peels off when a predetermined decomposition condition is satisfied, and is configured by arranging first and second adhesive layers having different decomposition conditions with a film base interposed therebetween. It has been done. The first adhesive layer is bonded to the processed body of the thin film capacitor, and the second adhesive layer is bonded to the support.

  Next, the processing element body of the thin film capacitor is processed while being fixed to the support (S2). Next, the first adhesive layer of the adhesive sheet is decomposed so as to satisfy the conditions for decomposing the first adhesive layer of the adhesive sheet and not satisfying the conditions for decomposing the second adhesive layer, and the thin film The capacitor is peeled from the support (S3). Finally, the second adhesive layer of the adhesive sheet is decomposed so as to satisfy the decomposition condition of the second adhesive layer of the adhesive sheet, and the remaining adhesive sheet is peeled from the support (S4).

  In the method of manufacturing a thin film capacitor according to the present embodiment, the processed body of the thin film capacitor is fixed to the support through the adhesive sheet, so that the deformation of the processed body can be prevented and the processed body is Can be easy to handle.

  In the method of manufacturing a thin film capacitor according to the present embodiment, after the thin film capacitor is processed, the second condition of satisfying the decomposition condition of the first adhesive layer bonded to the thin film capacitor and bonded to the support is provided. The thin film capacitor is peeled from the support in a state that does not satisfy the decomposition condition of the adhesive layer. Therefore, when the thin film capacitor is peeled from the support, the first adhesive layer bonded to the thin film capacitor is decomposed while the second adhesive layer is not decomposed to support the film substrate. Continue to adhere to the body. Therefore, since the thin film capacitor after peeling from the support is surely separated from the film base material and the second adhesive layer, it is possible to prevent a part of the adhesive sheet from remaining on the thin film capacitor. Can do.

  In the method for manufacturing a thin film capacitor according to the present embodiment, the support is repeatedly used in order to peel the remainder of the adhesive sheet from the support as a condition that satisfies the decomposition condition of the second adhesive layer of the adhesive sheet. Can be economical. In addition, if the film base material of an adhesive sheet uses elastic materials, such as polyester and polyethylene, for example, it can give the role which relieve | moderates the stress which acts on a thin film capacitor in the middle of a process, and is preferable.

  There are a plurality of methods for making the decomposition conditions of the two adhesive layers different in the adhesive sheet. For example, the first and second adhesive layers are made of a material that decomposes when the same kind of energy (for example, thermal energy or light energy) is supplied, and the amount of energy that the first adhesive layer decomposes is the second. What is necessary is just to set smaller than the energy amount which an adhesive bond layer decomposes | disassembles. According to this configuration, first, a predetermined amount of energy for decomposing the first adhesive layer is supplied to the adhesive sheet, and only the first adhesive layer is decomposed without decomposing the second adhesive layer. be able to. Next, the second adhesive layer can be decomposed by supplying a predetermined amount of energy that the second adhesive layer decomposes to the adhesive sheet.

  Specifically, when the first and second adhesive layers are made of a material that decomposes when heat energy is supplied, the second adhesive layer has a temperature at which the first adhesive layer decomposes. What is necessary is just to set smaller than the temperature which decomposes | disassembles. By configuring the adhesive sheet in this manner, the adhesive sheet is heated to a temperature at which the first adhesive layer is decomposed, and only the first adhesive layer is decomposed without decomposing the second adhesive layer. be able to. Next, the adhesive sheet can be heated to a temperature at which the second adhesive layer decomposes to decompose the second adhesive layer.

As an adhesive that decomposes when supplied with thermal energy, a heat-peelable adhesive in which a heat-expandable microcapsule that expands when heated to a predetermined temperature in a normal adhesive can be used. FIG. 2 shows the temperature-adhesive properties of the heat peelable adhesive. Heat-peelable adhesive is not lowered adhesive strength when lower than the temperature t _1, at a temperature t _{1 ~} temperature t ₂ proceeds with the lapse reduction in adhesion time instant when higher than the temperature t ₂ Adhesive strength decreases.

  Therefore, when the temperature at which the first adhesive layer is decomposed is close to the temperature at which the second adhesive layer is decomposed, the first adhesive is heated when the adhesive sheet is heated to a temperature at which the first adhesive layer is decomposed. There is a possibility that not only the agent layer is decomposed but also the second adhesive layer is decomposed with time. In order to prevent such a situation, it is preferable to set the temperature difference between the temperature at which the first adhesive layer is decomposed and the temperature at which the second adhesive layer is decomposed to 20 ° C. or more. If the temperature difference is set to 20 ° C. or higher in this way, the second adhesive layer can be prevented from being decomposed when the adhesive sheet is heated to a temperature at which the first adhesive layer is decomposed. In order to more reliably prevent the second adhesive layer from being decomposed, the temperature difference is more preferably set to 30 ° C. or higher, and further preferably set to 40 ° C. or higher.

The temperature used as a reference for calculating the temperature difference between the is defined as the temperature t ₃ when the substantially zero completely decompose adhesion adhesive in 10 seconds. That is, the temperature difference between the temperature at which the first adhesive layer is decomposed in 10 seconds and the adhesive force is substantially zero and the temperature at which the second adhesive layer is decomposed in 10 seconds and the adhesive force is substantially zero. However, it is preferably 20 ° C. or higher, more preferably 30 ° C. or higher, and even more preferably 40 ° C. or higher. In the actual manufacturing process of the thin film capacitor, a work time of about 10 seconds is required to heat the adhesive, and therefore, the temperature t ₃ at which the adhesive is decomposed in about 10 seconds and the adhesive force is almost zero, It is preferable to use it as a reference for calculating the temperature difference. Note that “almost 0” regarding the adhesive force is not completely zero because the adhesive force is completely zero, as well as the adhesive force remains even if the adhesive is completely disassembled. It means that the case is included.

  As another method for differentiating the decomposition conditions of the two adhesive layers, the first and second adhesive layers are made of a material that decomposes when different kinds of energy (for example, thermal energy and light energy) are supplied. There is a way. According to this configuration, first, energy of a kind that the first adhesive layer is decomposed is supplied to the adhesive sheet, and only the first adhesive layer is decomposed without decomposing the second adhesive layer. Can do. Next, the second adhesive layer can be decomposed by supplying the adhesive sheet with the type of energy that the second adhesive layer decomposes. For example, when the first adhesive layer is made of a material that decomposes when supplied with heat energy, and the second adhesive layer is made of a material that decomposes when supplied with light energy, the adhesive sheet is heated. After decomposing the first adhesive layer, the second adhesive layer can be decomposed by irradiating the adhesive sheet with light (electromagnetic waves).

  As another method for differentiating the decomposition conditions of the two adhesive layers, the first adhesive layer is made of a material that decomposes when energy (for example, thermal energy or light energy) is supplied, and the second adhesive layer There is a method in which the agent layer is made of a material that dissolves and decomposes when in contact with an organic solvent. According to this configuration, first, energy of a kind that the first adhesive layer is decomposed is supplied to the adhesive sheet, and only the first adhesive layer is decomposed without decomposing the second adhesive layer. Can do. Next, an organic solvent can be supplied to the adhesive sheet to decompose only the second adhesive layer.

Example 1
3 to 5 are schematic cross-sectional views illustrating the method for manufacturing the thin film capacitor according to the first embodiment. 3 to 5 schematically show a series of manufacturing steps of the thin film capacitor.

  In the first step shown in FIG. 3A, a dielectric element 40, an adhesive sheet 45 and a support 50 are prepared. The dielectric element 40 includes a first conductive layer made of a conductive metal such as copper or nickel on both sides of an element base 42 made of a high dielectric constant material such as barium titanate, barium titanate or lead zirconate titanate. 41 and the second conductive layer 43 are formed into a processed body. In Example 1, the dielectric element 40 is obtained by applying a barium titanate solution on a polished nickel foil body 43 (a square having a thickness of 25 μm and a side of 80 mm) by a chemical solution method (CSD). The dielectric film 42 (thickness 1 μm) is formed by baking at 900 ° C., and copper 41 (thickness 30 μm) is deposited on the dielectric film 42 by sputtering and plating.

  For the adhesive sheet 45, for example, a film base 47 (100 μm to 200 μm) made of polyester, polyethylene or the like is prepared, and two adhesive layers 46 and 48 (10 μm to 50 μm). The first adhesive layer 46 is a thermally expandable micro that expands when heated to a predetermined decomposition temperature (130 ° C.) by a normal adhesive such as an acrylic adhesive, a silicone adhesive, or a polyester adhesive. It is a mixture of capsules and has the property of losing adhesive strength when heated to 130 ° C. The second adhesive layer 48 expands when heated to a predetermined decomposition temperature (150 ° C.) by a normal adhesive such as an acrylic adhesive, a silicone adhesive, or a polyester adhesive. It has a characteristic of losing adhesive strength when heated to 150 ° C. Here, as the adhesive, an acrylic adhesive is particularly preferable from the viewpoint of easy dispersion of the microcapsules.

  In the second step shown in FIG. 3B, the dielectric element 40 is bonded and fixed to the support body 50 via the adhesive sheet 45. Here, the first adhesive layer 46 of the adhesive sheet 45 is disposed on the dielectric element 40 side and adhered to the dielectric element 40, and the second adhesive layer 48 of the adhesive sheet 45 is disposed on the support body 50 side. Then, it adheres to the support 50. Since the support body 50 is a glass plate-like member having a flat surface and a sufficient thickness, fixing the dielectric element 40 to the support body 50 makes it easy to handle the dielectric element 40 and provides a dielectric. The bending of the body element 40 can be prevented.

  In order to fix the dielectric element 40 to the support 50, a commercially available laminator (VAII-700 manufactured by Taisei Laminator) was used to superimpose the dielectric element 40 on the support 50 at 0.4 MPa. Was laminated at a pressure of First, the dielectric element 40 was placed on the support 50 and the warp was corrected through a laminator. Next, the dielectric element 40 was fixed to the first adhesive layer 46 side of the adhesive sheet 45 using a laminator. Next, it fixed to the support body 50 at the 2nd adhesive bond layer 48 side of the adhesive sheet using the laminator. Thus, the dielectric element 40 was passed through the laminator three times.

  In the third step shown in FIG. 3C, the first conductive layer 41 of the dielectric element 40 is covered with a photoresist 52. As the photoresist 52, for example, a dry film or a liquid resist can be used. Specifically, after the dielectric element 40 was heated to 70 ° C. in an oven, a dry film 52 (ALPHO NIT2025 manufactured by Nichigo Morton) was pressure-bonded to the surface of the dielectric element 40 at 105 ° C. using a laminator.

  In the fourth step shown in FIG. 3D, the photoresist 52 is patterned. The photoresist 52 is exposed through a mask, and an uncured portion of the photoresist 52 is removed and developed. As a result, patterns 52 a, 52 b, 52 c, 52 d corresponding to the electrodes are formed on the photoresist 52.

  In the fifth step shown in FIG. 4E, the first conductive layer 41 is patterned. A portion of the first conductive layer 41 that is not covered with the photoresist 52 is etched using a nickel etching solution (ferric chloride solution). As a result, the first electrodes 41 a, 41 b, 41 c and 41 d are formed on the first conductive layer 41.

  The sixth step shown in FIG. 4 (f) is the first half of the individualization process of the thin film capacitor. Using a dicing saw, cut into the dielectric element 40 along the outer edges of the individual thin film capacitors to insert Ca, Cb, and Cc. The cuts Ca, Cb, and Cc are made from the exposed portion of the dielectric layer 41 to a depth about half that of the second conductive layer 43.

  The seventh step shown in FIG. 4G is the latter half of the individualization process of the thin film capacitor. A portion of the second conductive layer 43 where the cut Ca, Cb, Cc is put is etched using a copper etching solution (a solution in which 450 g of water is mixed with 86 g of ammonium peroxodisulfate and 2.5 g of 2-propanol). As a result, the dielectric element 40 is divided into a plurality of thin film capacitors 44 A and 44 B, and second electrodes 43 a and 43 b are formed on the second conductive layer 43.

  In the eighth step shown in FIG. 5H, the photoresist 52 is peeled off and removed.

  In the ninth step shown in FIG. 5I, the support 50 to which the dielectric element 40 is fixed is placed on a hot plate 54 heated to 130 ° C. As a result, the adhesive sheet 45 is heated, the thermally expandable microcapsules contained in the first adhesive layer 46 expand, the first adhesive layer 46 decomposes, and the adhesive force becomes almost zero. Thereafter, the thin film capacitors 44A and 44B are easily peeled off and separated from the support 50 by using vacuum tweezers. On the other hand, even when heated to 130 ° C., the second adhesive layer 48 is not decomposed and the adhesive strength does not become zero, so that the film substrate 47 and the second adhesive layer 48 remain attached to the support 50. is there. Here, since chemical methods such as etching are not used when the support 50 and the thin film capacitors 44A and 44B are peeled off, there is no chemical damage to the thin film capacitors 44A and 44B.

  In the tenth step shown in FIG. 5 (j), the hot plate 54 is heated to 160 ° C. while the support 50 with the second adhesive layer 48 remaining is placed. As a result, the adhesive sheet 45 is heated, the thermally expandable microcapsules contained in the second adhesive layer 48 are expanded, the second adhesive layer 48 is decomposed, and the adhesive force becomes almost zero. For this reason, the film substrate 47 can be peeled off from the support 50.

(Example 2)
FIG. 6 is a schematic cross-sectional view illustrating the method for manufacturing the thin film capacitor according to the second embodiment. FIG. 6 corresponds to the first half (FIG. 3) of the method for manufacturing the thin film capacitor according to the first embodiment. In Example 2, the procedure for forming the thin film capacitor processing element 40 was changed from that in Example 1.

  In the first half of the first step shown in FIG. 6 (a-1), a thin film capacitor processing element 40, an adhesive sheet 45, and a support 50 were prepared. Here, the processed body 40 of the thin film capacitor is in the process of being manufactured, and has only the dielectric layer 42 and the second conductive layer 43. Such a workpiece 40 in the middle of manufacturing is coated with a barium titanate solution on a polished nickel foil body 43 (thickness 25 μm) by a chemical solution method (CSD) and baked to form a dielectric film 42. It was obtained by forming (thickness 1 μm).

  In the latter half of the first step shown in FIG. 6A-2, the thin film capacitor processed body 40 was bonded and fixed to the support 50 via the adhesive sheet 45. Here, the first adhesive layer 46 of the adhesive sheet 45 is adhered to the second conductive layer 43 of the workpiece body 40, and the second adhesive layer 48 of the adhesive sheet 45 is adhered to the support 50. The second conductive layer 43 of the processed body 40 and the support body 50 face each other. It should be noted that when the thin film capacitor processed body 40 was fixed to the support 50, there was no problem that the thin film capacitor processed body 40 was wrinkled on the support 50.

  In the second step shown in FIG. 6B, a first conductive layer 41 (30 μm) was formed by forming a copper film on the dielectric layer 42 using a sputtering apparatus and a plating apparatus. As a result, it became the same state as the 2nd process (FIG.3 (b)) of Example 1. FIG. Then, it processed similarly to the 3rd process after Example 1.

(Example 3)
FIG. 7 is a schematic cross-sectional view illustrating the method of manufacturing the thin film capacitor according to the third embodiment. FIG. 7 corresponds to the latter half (FIG. 5) of the method for manufacturing the thin film capacitor according to the first embodiment. In Example 3, the material of the second adhesive layer 48 was changed with respect to Example 1. In Example 3, the second adhesive layer 48 is made of a photo-releasable adhesive whose adhesive strength decreases when irradiated with light (electromagnetic waves). The photo-releasable adhesive is a material known as an adhesive (for example, an acrylic adhesive, etc.), and is disclosed in patent documents such as JP-A-10-265749 and JP-A-11-61049. ing.

  In the eighth step shown in FIG. 7 (h), a plurality of thin film capacitors 44A and 44B are formed as a result of processing the workpiece body 40 on the support 50. In the eighth step, each of the plurality of thin film capacitors 44 </ b> A and 44 </ b> B is in a state of being fixed to the support body 50 by the adhesive sheet 45.

  In the ninth step shown in FIG. 7 (i), the support 50 on which the plurality of thin film capacitors 44A and 44B are fixed was placed on the hot plate 54 heated to 130 ° C. As a result, the adhesive sheet 45 was heated, the thermally expandable microcapsules contained in the first adhesive layer 46 were expanded, the first adhesive layer 46 was decomposed, and the adhesive force became almost zero. Thereafter, the thin film capacitors 44A and 44B could be easily separated from the support 50 using vacuum tweezers. On the other hand, even when heated to 130 ° C., the second adhesive layer 48 does not decompose, so the film base material 47 and the second adhesive layer 48 remain attached to the support 50.

  In the tenth step shown in FIG. 7 (j), the support 50 and the adhesive sheet 45 are cooled to room temperature without being peeled on the hot plate 54, and then the adhesive sheet 45 is irradiated with ultraviolet light through the transparent support 50. did. As a result, the second adhesive layer 48 was decomposed and the adhesive force became almost zero, and the adhesive sheet 45 (film base material 47) could be easily separated from the support 50.

  In Example 3 described above, the material of the first adhesive layer 46 is a heat-peelable adhesive and the material of the second adhesive layer 48 is a photo-peelable adhesive. The material of the agent layer 46 may be a photo-releasable adhesive and the material of the second adhesive layer 48 may be a heat-releasable adhesive. In this case, in order to irradiate the first adhesive layer 46 with light, the support 50 and the adhesive sheet 45 may be made of a transparent material.

Example 4
FIG. 8 is a schematic cross-sectional view illustrating the method of manufacturing the thin film capacitor according to the fourth embodiment. FIG. 8 corresponds to the latter half (FIG. 5) of the method for manufacturing the thin film capacitor according to the first embodiment. In Example 4, the material of the second adhesive layer 48 was changed with respect to Example 1. In Example 4, the second adhesive layer 48 is made of a normal adhesive such as an acrylic adhesive.

  In the eighth step shown in FIG. 8 (h), a plurality of thin film capacitors 44A and 44B are formed as a result of processing the processed body 40 on the support 50. In the eighth step, each of the plurality of thin film capacitors 44 </ b> A and 44 </ b> B is in a state of being fixed to the support body 50 by the adhesive sheet 45.

  In the ninth step shown in FIG. 8I, the support 50 on which the plurality of thin film capacitors 44A and 44B are fixed was placed on the hot plate 54 heated to 130 ° C. As a result, the adhesive sheet 45 was heated, the thermally expandable microcapsules contained in the first adhesive layer 46 were expanded, the first adhesive layer 46 was decomposed, and the adhesive force became almost zero. Thereafter, the thin film capacitors 44A and 44B could be easily separated from the support 50 using vacuum tweezers. On the other hand, even when heated to 130 ° C., the second adhesive layer 48 does not decompose, so the film base material 47 and the second adhesive layer 48 remain attached to the support 50.

  In the tenth step shown in FIG. 8J, the support 50 and the adhesive sheet 45 were cooled to room temperature without being peeled on the hot plate 54, and then immersed in an organic solvent such as alcohol or ketone. As a result, the second adhesive layer 48 was decomposed, and the support 50 and the adhesive sheet 45 (film substrate 47) could be easily separated.

(Example 5)
FIG. 9 is a schematic cross-sectional view illustrating the method for manufacturing the inductor according to the fifth embodiment. In Example 4, an inductor was manufactured instead of the thin film capacitor. FIG. 9 corresponds to the first half (FIG. 3) of the manufacturing method according to the first embodiment.

  In the first step shown in FIG. 9A, a copper foil 60, an adhesive sheet 45, and a support body 50, which are the processing elements of the inductor, are prepared. Next, in the second step shown in FIG. 9B, the copper foil 60 is bonded and fixed to the support 50 via the adhesive sheet 45. Then, after dry-bonding the copper film 60 to the copper foil 60, exposure and development were performed to pattern the dry film. Next, the copper foil 60 was patterned using ferric chloride. After patterning the copper foil 60, the dry film was removed and an insulating layer was formed to complete the inductor.

  Next, the support body 50 on which the inductor was fixed was placed on a hot plate 54 heated to 130 ° C. As a result, the adhesive sheet 45 was heated, the thermally expandable microcapsules contained in the first adhesive layer 46 were expanded, the first adhesive layer 46 was decomposed, and the adhesive force became almost zero. Thereafter, the thin film capacitors 44A and 44B could be easily separated from the support 50 using vacuum tweezers.

  Next, the hot plate 54 was heated to 160 ° C. while the support body 50 on which the second adhesive layer 48 remained was placed. As a result, the adhesive sheet 45 was heated, the thermally expandable microcapsules contained in the second adhesive layer 48 were expanded, the second adhesive layer 48 was decomposed, and the adhesive force became almost zero. For this reason, the film base material 47 could be peeled off from the support 50.

(Comparative Example 1)
In Comparative Example 1, the material of the second adhesive layer was changed from that in Example 1. In Example 3, the second adhesive layer uses the same material as that of the first adhesive layer, and the thermally expandable microcapsule expands when heated to a predetermined decomposition temperature (130 ° C.). As a result, the adhesive strength is reduced.

  In the eighth step (see FIG. 5 (i)), the support combined with the thin film capacitor is placed on a hot plate heated to 130 ° C. in order to peel the individualized thin film capacitor from the support. Put it on. The heat of the hot plate was transferred to the adhesive sheet through the support. Because the heat from the hot plate flows through the second adhesive layer to the first adhesive layer, the second adhesive layer is heated to a higher temperature faster than the first adhesive layer. It was done. For this reason, before the first adhesive layer is decomposed, the second adhesive layer is first decomposed to lower the adhesive force, and the thin film capacitor is peeled off from the support while the adhesive sheet is attached to the thin film capacitor. I have. As a result, heat conduction from the hot plate to the first adhesive layer deteriorated, the first adhesive layer did not decompose, and the adhesive sheet could not be peeled from the thin film capacitor.

It is a flowchart which shows the manufacturing method of the thin film capacitor which concerns on this embodiment. It is a graph which shows the temperature-adhesive strength characteristic of a heat-peelable adhesive. It is sectional drawing which shows the manufacturing process (1st process-4th process) of a thin film capacitor. It is sectional drawing which shows the manufacturing process (5th process-7th process) of a thin film capacitor. It is sectional drawing which shows the manufacturing process (8th process-10th process) of a thin film capacitor. 6 is a cross-sectional view showing a manufacturing process of the thin film capacitor according to Example 1. FIG. 6 is a cross-sectional view showing a manufacturing process of a thin film capacitor according to Example 2. FIG. 6 is a cross-sectional view showing a manufacturing process of a thin film capacitor according to Example 3. FIG. 6 is a cross-sectional view showing a manufacturing process of a thin film capacitor according to Example 4. FIG.

Explanation of symbols

  40 ... dielectric element, 41 ... first conductive layer, 41a, 41b, 41c, 41d ... electrode, 42 ... dielectric layer, 43 ... second conductive layer, 43a, 43b ... electrode, 43 ... conductive layer, 44A , 44B ... thin film capacitor, 45 ... adhesive sheet, 46 ... first adhesive layer, 47 ... film substrate, 48 ... second adhesive layer, 50 ... support, 52 ... photoresist, 54 ... hot plate.

Claims (9)

An adhesive sheet in which first and second adhesive layers having different decomposition conditions are arranged with a film base interposed therebetween is prepared, and the first adhesive layer is bonded to an electronic component and the second adhesive layer Adhering to a support and fixing the electronic component to the support;
The step of processing the electronic component while being fixed to the support , wherein the electronic component is covered with a photoresist, the photoresist is patterned and then etched, and the dicing saw is used to perform the etching process. Making a cut in an electronic component ,
The electronic component is placed on the support in a state that satisfies the decomposition condition of the first adhesive layer bonded to the electronic component and does not satisfy the decomposition condition of the second adhesive layer bonded to the support. A step of peeling from
As a condition that satisfies the decomposition condition of the second adhesive layer bonded to the support, a step of peeling the adhesive sheet from the support;
The manufacturing method of the electronic component which has this. The first and second adhesive layers have a decomposition condition that the same kind of energy is supplied,
The amount of energy that the first adhesive layer decomposes is set to be smaller than the amount of energy that the second adhesive layer decomposes.
The manufacturing method of the electronic component of Claim 1. The first adhesive layer is heated to a first decomposition temperature, and the decomposition condition is
The second adhesive layer is heated to the second decomposition temperature higher than the first decomposition temperature as a decomposition condition.
The manufacturing method of the electronic component of Claim 2.   4. The temperature difference between the first decomposition temperature and the second decomposition temperature is 20 ° C. or more, with a temperature at which the adhesive force of the adhesive layer is approximately zero in 10 seconds as a reference for calculation. Manufacturing method for electronic parts.   2. The method of manufacturing an electronic component according to claim 1, wherein the first and second adhesive layers are decomposed under the condition that different kinds of energy are supplied. The first adhesive layer has a decomposition condition that is heated,
The second adhesive layer has a decomposition condition that the electromagnetic wave is irradiated.
The manufacturing method of the electronic component of Claim 5. The first adhesive layer has a decomposition condition that is heated,
The second adhesive layer has a decomposition condition of being in contact with an organic solvent.
The manufacturing method of the electronic component of Claim 1. In the step of processing the electronic component, the electronic component is covered with a photoresist, the photoresist is patterned and then etched, and the electronic component is cut using a dicing saw, and further etched. The manufacturing method of the electronic component as described in any one of claim | item 1 -7.   In the said adhesive sheet, the thickness of the said film base material is 100 micrometers-200 micrometers, The thickness of the said 1st and 2nd adhesive bond layer is 10 micrometers-50 micrometers, It is any one of Claims 1-8. The manufacturing method of the electronic component of description.

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