JP4804469B2 - リチウムの蒸発及びリチウム・ディスペンサのための混合物 - Google Patents

リチウムの蒸発及びリチウム・ディスペンサのための混合物 Download PDF

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JP4804469B2
JP4804469B2 JP2007530857A JP2007530857A JP4804469B2 JP 4804469 B2 JP4804469 B2 JP 4804469B2 JP 2007530857 A JP2007530857 A JP 2007530857A JP 2007530857 A JP2007530857 A JP 2007530857A JP 4804469 B2 JP4804469 B2 JP 4804469B2
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Prior art keywords
lithium
mixture
dispenser
evaporation
container
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Japanese (ja)
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JP2008512570A (ja
JP2008512570A5 (https=
Inventor
カッタネオ ロレナ
ピローラ シモーナ
千春 前田
ボヌッチ アントニオ
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サエス ゲッターズ ソチエタ ペル アツィオニ
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/30—Doping active layers, e.g. electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2007530857A 2004-09-10 2005-09-06 リチウムの蒸発及びリチウム・ディスペンサのための混合物 Expired - Lifetime JP4804469B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT001736A ITMI20041736A1 (it) 2004-09-10 2004-09-10 Miscele per l'evaporazione del litio e dispensatori di litio
ITMI2004A001736 2004-09-10
PCT/IT2005/000509 WO2006027814A2 (en) 2004-09-10 2005-09-06 Mixtures for evaporation of lithium and lithium dispensers

Publications (3)

Publication Number Publication Date
JP2008512570A JP2008512570A (ja) 2008-04-24
JP2008512570A5 JP2008512570A5 (https=) 2008-06-05
JP4804469B2 true JP4804469B2 (ja) 2011-11-02

Family

ID=35448266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007530857A Expired - Lifetime JP4804469B2 (ja) 2004-09-10 2005-09-06 リチウムの蒸発及びリチウム・ディスペンサのための混合物

Country Status (8)

Country Link
US (2) US7625505B2 (https=)
EP (1) EP1786946B1 (https=)
JP (1) JP4804469B2 (https=)
KR (1) KR101195634B1 (https=)
CN (1) CN100575536C (https=)
IT (1) ITMI20041736A1 (https=)
TW (1) TWI388501B (https=)
WO (1) WO2006027814A2 (https=)

Cited By (1)

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US9812316B2 (en) 2014-03-06 2017-11-07 Sharp Kabushiki Kaisha Mixed material, method for producing same, and organic element using same

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ITMI20070301A1 (it) 2007-02-16 2008-08-17 Getters Spa Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
AU2008310584A1 (en) 2007-10-12 2009-04-16 University Of Delaware Thermal evaporation sources for wide-area deposition
WO2013072910A1 (en) 2011-10-26 2013-05-23 Konstantin Chuntonov Apparatus and method for droplet casting of reactive alloys and applications
ITMI20112051A1 (it) * 2011-11-11 2013-05-12 Getters Spa Composizione organico-inorganica per il rilascio in fase vapore di metalli alcalini ed alcalino-terrosi
ITMI20131171A1 (it) 2013-07-11 2015-01-11 Getters Spa Erogatore migliorato di vapori metallici
KR102094142B1 (ko) * 2013-08-30 2020-03-27 엘지디스플레이 주식회사 유기전계 발광소자 제조방법
WO2015097894A1 (ja) * 2013-12-27 2015-07-02 パイオニア株式会社 発光素子及び発光素子の製造方法
KR102231490B1 (ko) * 2014-09-02 2021-03-25 삼성디스플레이 주식회사 유기 전계 발광 소자
WO2017118740A1 (en) * 2016-01-08 2017-07-13 Photonis Netherlands B.V. Image intensifier for night vision device
US10685750B2 (en) 2016-03-08 2020-06-16 TerraPower, LLC. Fission product getter
CN207038182U (zh) 2017-03-29 2018-02-23 泰拉能源有限责任公司 铯收集器
CN107523793B (zh) * 2017-08-23 2019-06-07 京东方科技集团股份有限公司 一种金属锂蒸发装置、蒸镀设备及金属锂蒸发方法
US11626213B2 (en) * 2019-08-23 2023-04-11 Terrapower, Llc Sodium vaporizer and methods
US11185915B2 (en) 2019-08-30 2021-11-30 Applied Materials, Inc. Deposition of reactive metals with protection layer for high volume manufacturing
CN115125491A (zh) * 2022-06-15 2022-09-30 北方夜视技术股份有限公司 一种多碱光电阴极制备用碱源的蒸发特性测量的方法
WO2024015129A1 (en) 2022-07-13 2024-01-18 Terrapower, Llc Oxidation of cesium as method for removing cesium vapor from cover gas in nuclear reactors

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812316B2 (en) 2014-03-06 2017-11-07 Sharp Kabushiki Kaisha Mixed material, method for producing same, and organic element using same

Also Published As

Publication number Publication date
US20100021623A1 (en) 2010-01-28
WO2006027814A2 (en) 2006-03-16
CN100575536C (zh) 2009-12-30
EP1786946A2 (en) 2007-05-23
WO2006027814A3 (en) 2006-05-18
CN1981066A (zh) 2007-06-13
JP2008512570A (ja) 2008-04-24
KR20070050920A (ko) 2007-05-16
KR101195634B1 (ko) 2012-10-30
HK1105538A1 (zh) 2008-02-15
US7625505B2 (en) 2009-12-01
TW200621638A (en) 2006-07-01
EP1786946B1 (en) 2014-02-26
TWI388501B (zh) 2013-03-11
US20080042102A1 (en) 2008-02-21
US7794630B2 (en) 2010-09-14
ITMI20041736A1 (it) 2004-12-10

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