JP4786761B1 - Laser light source device - Google Patents

Abstract

A laser chip and a condensing lens can be prevented from being damaged during assembly and position adjustment.
A condensing lens holder for holding a FAC lens and a rod lens for condensing a laser beam outputted from a laser chip of a semiconductor laser is brought into contact with a mounting member of the semiconductor laser and a laser. A protrusion 77 that prevents contact with the chip is formed. In particular, a pair of protrusions are provided so as to abut against the portions of the mount members located on both sides of the laser chip.
[Selection] Figure 5

Description

  The present invention relates to a laser light source device using a semiconductor laser, and in particular, includes a condensing lens that condenses laser light output from the semiconductor laser, and a condensing lens holder that holds the condensing lens is close to the semiconductor laser. It is related with the laser light source device arrange | positioned.

  In recent years, a technique using a semiconductor laser as a light source of an image display device has attracted attention. This semiconductor laser has better color reproducibility, instantaneous lighting, longer life, and higher power consumption compared to mercury lamps that have been widely used in image display devices. It has various advantages, such as being able to be made and being easy to miniaturize.

  In the laser light source device used for such an image display device, since there is no high-power semiconductor laser that directly outputs green laser light, the pumping laser light is output from the semiconductor laser, and this pumping laser light is used. A technique is known in which a laser medium is excited to output infrared laser light, and the wavelength of the infrared laser light is converted by a wavelength conversion element to output green laser light (see, for example, Patent Document 1). ).

JP 2008-16833 A

  In the green laser light source device configured as described above, a condensing lens that condenses laser light diffused from the semiconductor laser is disposed between the semiconductor laser and the laser medium. In order to increase the light efficiency, it is desirable that the laser light is disposed in the vicinity of the semiconductor laser and is incident on the condenser lens before the laser light emitted from the semiconductor laser is diffused over a wide range.

  However, if the distance between the condensing lens and the semiconductor laser is narrowed, the condensing lens and the condensing lens holder that holds the condensing lens come into contact with the semiconductor laser during assembly and position adjustment. The optical lens can be damaged. In particular, a laser chip that outputs laser light is extremely fragile, and is easily damaged by contact.

  The present invention has been devised to solve such problems of the prior art, and its main purpose is to prevent damage to the laser chip and the condenser lens during assembly and position adjustment. It is an object of the present invention to provide a laser light source device configured to be able to perform such a process.

The laser light source device of the present invention holds a semiconductor laser in which a laser chip that outputs laser light is mounted on a mount member, a condensing lens that condenses the laser light output from the laser chip, and the condensing lens And a condensing lens holder with protruding legs , an attachment member for attaching the semiconductor laser to an upper surface, and the attachment member in the optical axis direction so that the condensing lens holder and the semiconductor laser are in a non-contact state. A guide hole that is long in the optical axis direction is formed on the surface that contacts the condenser lens holder, and the condenser lens holder is assembled from above by inserting the leg portion into the guide hole. comprising a support member for movably supporting the condensing lens holder in the optical axis direction, and when assembled to the support member the condenser lens holder from above, If the Kiashi section the converging lens holder by sliding the guide hole are in contact with the semiconductor laser, in the assembly direction of the protruding portion to prevent contact between the laser chip contact with said mounting member The condensing lens holder is configured to be long in the protruding direction of the leg .

  According to the present invention, even when the condenser lens holder collides with the semiconductor laser during assembly or position adjustment, the projection of the condenser lens holder comes into contact with the relatively strong mount member, and the condenser lens holder Since other parts can be prevented from coming into contact with the laser chip, damage to the laser chip can be prevented.

1 is a schematic configuration diagram of an image display device 1 according to the present invention. The schematic diagram which shows the condition of the laser beam in the green laser light source apparatus 2 Perspective view of green laser light source device 2 An exploded perspective view of the condenser lens holder 54 and the support member 55 Top view showing the assembled state of the condenser lens holder 54 Side view showing assembled state of condenser lens holder 54 The perspective view which shows the example which incorporated this image display apparatus 1 in the notebook-type information processing apparatus 81

A first invention made to solve the above problems includes a semiconductor laser in which a laser chip that outputs laser light is mounted on a mount member, a condenser lens that condenses the laser light output from the laser chip, A condensing lens holder that holds the condensing lens and has a protruding leg , a mounting member that attaches the semiconductor laser to the upper surface, and a light so that the condensing lens holder and the semiconductor laser are in a non-contact state. A guide hole that is in contact with the mounting member in the axial direction and that is long in the optical axis direction is formed on a surface in contact with the condensing lens holder, and the leg portion is inserted into the guide hole, thereby the condensing lens holder. includes but a supporting member assembled from above for movably supporting the condenser lens holder in the optical axis direction, wherein the supporting the condenser lens holder from above When assembling the timber, when the condensing lens holder by the leg portion slides the guide hole are in contact with the semiconductor laser, the projecting portion for preventing contact between the laser chip contact with said mounting member Is formed in the condensing lens holder long in the protruding direction of the leg, which is the assembling direction .

  According to this, even when the condenser lens holder collides with the semiconductor laser at the time of assembly or position adjustment, the protruding part of the condenser lens holder comes into contact with the relatively strong mount member, so that Since this portion can be prevented from coming into contact with the laser chip, damage to the laser chip can be prevented.

  According to a second aspect of the present invention, in the first aspect, the laser chip is fixed to a substantially central position on one surface of a plate-shaped mounting member, and the protrusions are formed on both sides of the laser chip. A pair is provided so as to be in contact with each of the portions of the mount member positioned.

  According to this, even when the condensing lens holder rattles during assembly or position adjustment, the protrusion is securely brought into contact with the mount member to reliably prevent contact between the condensing lens holder and the laser chip. Can do.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the protrusion is formed in a cross-sectional shape that is chamfered in a substantially arc shape.

  According to this, since the projecting portion has an arc-shaped cross section without an acute angle portion, it is possible to avoid damaging the mount member even when the condenser lens holder rattles during assembly or position adjustment.

According to a fourth aspect of the present invention, in the first to third aspects of the present invention, the protruding portion is formed longer than the size of the condenser lens located on the semiconductor laser side in the longitudinal direction.

  According to this, it is possible to reliably prevent direct contact between the condensing lens and the semiconductor laser at the time of assembly or position adjustment, and avoid damage to the condensing lens.

According to a fifth aspect of the present invention, in the first to fourth aspects of the invention, the laser chip outputs an excitation laser beam. The laser chip is excited by the excitation laser beam output from the laser chip to be red. A laser medium that outputs external laser light, and a wavelength conversion element that converts the wavelength of infrared laser light output from the laser medium and outputs green laser light, the laser medium and the wavelength conversion element comprising: The semiconductor laser and the condenser lens are integrally supported on the base.

  According to this, a high output green laser beam can be output. In this case, after the semiconductor laser is fixed to the base, the position adjustment of the condenser lens, the laser medium, and the wavelength conversion element is performed with respect to the optical axis of the laser light output from the laser chip.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of an image display device 1 according to the present invention. The image display device 1 projects and displays a required image on a screen, and outputs a green laser light source device 2 that outputs green laser light, a red laser light source device 3 that outputs red laser light, and a blue laser light. The blue laser light source device 4 to output, the liquid crystal reflection type spatial light modulator 5 that modulates the laser light from each laser light source device 2 to 4 according to the video signal, and the laser from each laser light source device 2 to 4 A polarization beam splitter 6 that reflects light to irradiate the spatial light modulator 5 and transmits the modulated laser light emitted from the spatial light modulator 5, and polarizes the laser light emitted from each of the laser light source devices 2 to 4. A relay optical system 7 that leads to the beam splitter 6 and a projection optical system 8 that projects the modulated laser light transmitted through the polarization beam splitter 6 onto a screen are provided.

  The image display device 1 displays a color image by a so-called field sequential method. Laser beams of each color are sequentially output from the laser light source devices 2 to 4 in a time-sharing manner, and an image by the laser beam of each color is generated by an afterimage. Recognized as a color image.

  The relay optical system 7 includes collimator lenses 11 to 13 that convert the laser beams of the respective colors emitted from the laser light source devices 2 to 4 into parallel beams, and the laser beams of the respective colors that have passed through the collimator lenses 11 to 13 in a predetermined direction. First and second dichroic mirrors 14 and 15, a diffusion plate 16 for diffusing the laser light guided by the dichroic mirrors 14 and 15, and a field lens for converting the laser light that has passed through the diffusion plate 16 into a convergent laser 17.

  Assuming that the side from which the laser light is emitted from the projection optical system 8 toward the screen S is the front side, the blue laser light is emitted backward from the blue laser light source device 4 and is green with respect to the optical axis of the blue laser light. The green laser beam and the red laser beam are emitted from the green laser light source device 2 and the red laser light source device 3 so that the optical axis of the laser beam and the optical axis of the red laser beam are orthogonal to each other. , And green laser light are guided to the same optical path by the two dichroic mirrors 14 and 15. That is, the blue laser light and the green laser light are guided to the same optical path by the first dichroic mirror 14, and the blue laser light, the green laser light, and the red laser light are guided to the same optical path by the second dichroic mirror 15.

  The first and second dichroic mirrors 14 and 15 are formed with a film for transmitting and reflecting laser light having a predetermined wavelength on the surface, and the first dichroic mirror 14 transmits blue laser light. And reflects the green laser light. The second dichroic mirror 15 transmits red laser light and reflects blue laser light and green laser light.

  Each of these optical members is supported by the casing 21. The housing 21 functions as a radiator that dissipates heat generated by the laser light source devices 2 to 4 and is formed of a material having high thermal conductivity such as aluminum or copper.

  The green laser light source device 2 is attached to an attachment portion 22 formed in the housing 21 in a state of protruding toward the side. The mounting portion 22 is provided in a state of projecting in a direction perpendicular to the side wall portion 24 from a corner portion where the front wall portion 23 and the side wall portion 24 located respectively in front and side of the accommodation space of the relay optical system 7 intersect. ing. The red laser light source device 3 is attached to the outer surface side of the side wall portion 24 while being held by the holder 25. The blue laser light source device 4 is attached to the outer surface side of the front wall portion 23 while being held by the holder 26.

  The red laser light source device 3 and the blue laser light source device 4 are configured by a so-called CAN package, and the optical axis is positioned on the central axis of the can-shaped exterior portion with the laser chip that outputs the laser light supported by the stem. The laser beam is emitted from a glass window provided in the opening of the exterior part. The red laser light source device 3 and the blue laser light source device 4 are fixed to the holders 25 and 26 by, for example, press-fitting into mounting holes 27 and 28 provided in the holders 25 and 26. The heat generated by the laser chips of the blue laser light source device 4 and the red laser light source device 3 is transmitted to the housing 21 through the holders 25 and 26 to be dissipated, and each of the holders 25 and 26 has a thermal conductivity such as aluminum or copper. It is made of a high material.

  The green laser light source device 2 includes a semiconductor laser 31 that outputs excitation laser light, a FAC (Fast-Axis Collimator) lens 32 that is a condensing lens that condenses the excitation laser light output from the semiconductor laser 31, and a rod. The lens 33, the laser medium 34 that is excited by the excitation laser light and outputs the basic laser light (infrared laser light), and converts the wavelength of the basic laser light to output the half-wavelength laser light (green laser light). A wavelength conversion element 35, a concave mirror 36 that constitutes a resonator together with the laser medium 34, a glass cover 37 that prevents leakage of excitation laser light and fundamental wavelength laser light, a base 38 that supports each part, and each part A cover body 39 for covering.

  The green laser light source device 2 is fixed by attaching a base 38 to the mounting portion 22 of the housing 21, and a required width (for example, 0.5 mm) between the green laser light source device 2 and the side wall portion 24 of the housing 21. The following gaps are formed. This makes it difficult for the heat of the green laser light source device 2 to be transmitted to the red laser light source device 3, suppresses the temperature rise of the red laser light source device 3, and allows the red laser light source device 3 with poor temperature characteristics to operate stably. Can do. Further, in order to secure a required optical axis adjustment allowance (for example, about 0.3 mm) of the red laser light source device 3, a required width (for example, 0.3 mm or more) is provided between the green laser light source device 2 and the red laser light source device 3. ) Is provided.

  FIG. 2 is a schematic diagram showing a state of laser light in the green laser light source device 2. The laser chip 41 of the semiconductor laser 31 outputs excitation laser light having a wavelength of 808 nm. The FAC lens 32 reduces the spread of the first axis of the laser light (the direction orthogonal to the optical axis direction and along the drawing sheet). The rod lens 33 reduces the spread of the slow axis of laser light (in the direction orthogonal to the drawing sheet).

The laser medium 34 is a so-called solid laser crystal, and is excited by excitation laser light having a wavelength of 808 nm that has passed through the rod lens 33 and outputs a fundamental wavelength laser light (infrared laser light) having a wavelength of 1064 nm. This laser medium 34 is obtained by doping Nd (neodymium) into an inorganic optically active substance (crystal) made of Y (yttrium) VO ₄ (vanadate), and more specifically, Y of YVO _{4 as} a base material. And doped with Nd ⁺³ which is an element that emits fluorescence.

  On the side of the laser medium 34 facing the rod lens 33, a film 42 having a function of preventing reflection of excitation laser light having a wavelength of 808 nm and high reflection of laser light having a fundamental wavelength of 1064 nm and half-wavelength laser light having a wavelength of 532 nm. Is formed. On the side of the laser medium 34 facing the wavelength conversion element 35, a film 43 having an antireflection function for the fundamental wavelength laser beam having a wavelength of 1064 nm and the half wavelength laser beam having a wavelength of 532 nm is formed.

  The wavelength conversion element 35 is a so-called SHG (Second Harmonics Generation) element, which converts the wavelength of a fundamental wavelength laser beam (infrared laser beam) having a wavelength of 1064 nm output from the laser medium 34 to generate a half-wavelength laser beam having a wavelength of 532 nm. (Green laser light) is generated. This wavelength conversion element 35 is provided with a periodic polarization reversal structure in which a region where polarization is reversed and a region as it is are alternately formed in a ferroelectric crystal. A fundamental wavelength laser beam is incident in the arrangement direction. As the ferroelectric crystal, for example, a material obtained by adding MgO to LN (lithium niobate) is used.

  On the side of the wavelength conversion element 35 facing the laser medium 34, a film 44 having functions of preventing reflection of the fundamental wavelength laser beam having a wavelength of 1064 nm and highly reflecting the half wavelength laser beam having a wavelength of 532 nm is formed. On the side facing the concave mirror 36 in the wavelength conversion element 35, a film 45 having an antireflection function for the fundamental wavelength laser beam having a wavelength of 1064 nm and the half wavelength laser beam having a wavelength of 532 nm is formed.

  The concave mirror 36 has a concave surface on the side facing the wavelength conversion element 35, and this concave surface has a function of high reflection with respect to a fundamental wavelength laser beam with a wavelength of 1064 nm and antireflection with respect to a half wavelength laser beam with a wavelength of 532 nm. A film 46 is formed. As a result, the fundamental wavelength laser beam having a wavelength of 1064 nm resonates and is amplified between the film 42 of the laser medium 34 and the film 46 of the concave mirror 36.

  In the wavelength conversion element 35, a part of the fundamental wavelength laser light having a wavelength of 1064 nm incident from the laser medium 34 is converted into a half-wavelength laser light having a wavelength of 532 nm and passed through the wavelength conversion element 35 without being converted. The laser beam is reflected by the concave mirror 36 and is incident on the wavelength conversion element 35 again, and is converted into a half-wavelength laser beam having a wavelength of 532 nm. The half-wavelength laser light having a wavelength of 532 nm is reflected by the film 44 of the wavelength conversion element 35 and is emitted from the wavelength conversion element 35.

  Here, the laser beam B1 incident on the wavelength conversion element 35 from the laser medium 34, changed in wavelength by the wavelength conversion element 35, and emitted from the wavelength conversion element 35, and the wavelength conversion element once reflected by the concave mirror 36. When interference occurs with the laser beam B2 that is incident on 35 and reflected by the film 44 and emitted from the wavelength conversion element 35, the output decreases. Therefore, the wavelength conversion element 35 is tilted with respect to the optical axis direction so that the laser light beams B1 and B2 do not interfere with each other due to refraction, thereby avoiding a decrease in output.

  The glass cover 37 shown in FIG. 1 is formed with a film that does not transmit these laser beams in order to prevent the excitation laser beam having a wavelength of 808 nm and the fundamental wavelength laser beam having a wavelength of 1064 nm from leaking to the outside. ing.

  FIG. 3 is a perspective view of the green laser light source device 2. The semiconductor laser 31, FAC lens 32, rod lens 33, laser medium 34, wavelength conversion element 35, and concave mirror 36 are integrally supported by a base 38. The bottom surface 51 of the base 38 is parallel to the optical axis direction. Here, the direction orthogonal to the bottom surface 51 of the base 38 is defined as the height direction, and the direction orthogonal to the height direction and the optical axis direction is defined as the width direction. The height direction is not necessarily the vertical direction.

  The semiconductor laser 31 is obtained by mounting a laser chip 41 that outputs laser light on a mount member 52. The laser chip 41 has a long strip shape in the optical axis direction, and is fixed to a substantially central position in the width direction of one surface of the plate-shaped mount member 52 in a state where the light emission surface faces the FAC lens 32 side. Yes. The semiconductor laser 31 is fixed to the base 38 via an attachment member 53. The mounting member 53 is formed of a metal having high thermal conductivity such as copper or aluminum, and thereby heat generated by the laser chip 41 is transmitted to the base 38 and can be dissipated.

  A driving voltage supplied from a laser driving unit 67 is applied to the laser chip 41 of the semiconductor laser 31 via leads 65 and 66. The mounting member 52 of the semiconductor laser 31 is fixed to the mounting member 53 with a conductive adhesive (for example, silver paste), and an electrode provided on the lower surface side of the mounting member 52 is electrically connected to the mounting member 53 via an adhesive layer. Connected to.

  The FAC lens 32 and the rod lens 33 are held by a condenser lens holder 54. The condensing lens holder 54 is fixed to the base 38 via a support member 55. The condensing lens holder 54 is connected to the support member 55 so as to be movable in the optical axis direction, and the support member 55 is connected to the base 38 so as to be movable in the height direction. The positions of the holder 54, that is, the FAC lens 32 and the rod lens 33 are adjusted in the height direction and the optical axis direction. The FAC lens 32 and the rod lens 33 are fixed to the condenser lens holder 54 with an adhesive before the position adjustment work, and after the position adjustment work, the condenser lens holder 54, the support member 55, and the base 38 are made of an adhesive. Fixed to each other.

  The laser medium 34 is held by a laser medium holder 56. The laser medium holder 56 is fixed to the base 38 via a support member 57.

  The wavelength conversion element 35 is held by a wavelength conversion element holder 58. The wavelength conversion element holder 58 is fixed to the base 38 via the first and second support members 59 and 60. The wavelength conversion element holder 58 is connected to the first support member 59 so as to be tiltable, whereby the inclination angle of the wavelength conversion element holder 58, that is, the wavelength conversion element 35 is adjusted. The first support member 59 is connected to the second support member 60 so as to be movable in the width direction, and the second support member 60 is connected to the base 38 so as to be movable in the height direction. Thereby, the position of the wavelength conversion element holder 58, that is, the wavelength conversion element 35 is adjusted in the height direction and the width direction. The wavelength conversion element 35 is fixed to the wavelength conversion element holder 58 with an adhesive before the position adjustment work, and after the position adjustment work, the wavelength conversion element holder 58, the first and second support members 59, 60, and the base 38 are fixed. Are fixed to each other with an adhesive.

  The concave mirror 36 is held by a holding portion 61 formed integrally with the base 38. The glass cover 37 is held by the cover body 39 shown in FIG.

  FIG. 4 is an exploded perspective view of the condenser lens holder 54 and the support member 55. FIG. 5 is a top view showing the assembled state of the condenser lens holder 54. FIG. 6 is a side view showing the assembled state of the condenser lens holder 54.

  As shown in FIG. 4, the condensing lens holder 54 has a pair of lens holding portions 71 erected from the base 72, and the pair of lens holding portions 71 holds the FAC lens 32 and the rod lens 33. An optical path of the laser light emitted from the semiconductor laser 31 is formed between the pair of lens holding portions 71.

  The condensing lens holder 54 is supported by the support member 55 in a state where the mounting surface 73 of the base 72 is in contact with the support surface 74 of the support member 55. The support surface 74 of the support member 55 is formed to be parallel to the optical axis direction. A pair of leg portions 75 project from the mounting surface 73 of the condenser lens holder 54. On the other hand, a guide hole 76 that is long in the optical axis direction is formed in the support surface 74 of the support member 55. The leg portion 75 is fitted into the guide hole 76 and the leg portion 75 slides along the guide hole 76, whereby the condenser lens holder 54 can be moved in the optical axis direction with respect to the support member 55. As a result, the position of the condenser lens holder 54 in the optical axis direction is adjusted. In this position adjustment in the optical axis direction, the condensing lens holder is set so that the laser light output from the rod lens 33 has a required beam diameter that passes through the optical path hole formed in the support member 57 of the laser medium holder 56. The position of 54 is adjusted.

  As shown in FIG. 3, the FAC lens 32 is disposed in the vicinity of the laser chip 41 of the semiconductor laser 31 in order to increase the light collection efficiency, and before the laser beam emitted from the laser chip 41 diffuses over a wide range, It is made to enter into the lens 32, and the space | interval of the FAC lens 32 and the laser chip 41 becomes very small with about 200 micrometers, for example.

  In the assembly of the green laser light source device 2, the mounting member 53 to which the semiconductor laser 31 is mounted is fixed to the base 38, and then the position of the laser chip 41 is adjusted while the condenser lens holder 54 is assembled to the base 38. In other words, the condenser lens holder 54 may collide with the semiconductor laser 31 during the assembly or position adjustment. When the condenser lens holder 54 comes into contact with the laser chip 41 at this time, the laser chip 41 is extremely fragile. It is easily damaged.

  Therefore, as shown in FIG. 4, the condensing lens holder 54 is formed with a protrusion 77 that contacts the mount member 52 of the semiconductor laser 31 to prevent contact with the laser chip 41. As a result, even when the condenser lens holder 54 collides with the semiconductor laser 31 during assembly or position adjustment, the projection 77 of the condenser lens holder 54 comes into contact with the mount member 52 having a relatively high strength. Since the other part of the lens holder 54 can be prevented from coming into contact with the laser chip 41, damage to the laser chip 41 can be prevented. The protrusion dimension of the protrusion 77 is set as appropriate (for example, 100 μm) based on the distance between the condenser lens holder 54 and the semiconductor laser 31.

  The guide hole 76 of the support member 55 is formed to be slightly wider than the outer diameter of the leg portion 75 so that the leg portion 75 of the condenser lens holder 54 moves smoothly along the guide hole 76. There is a slight gap between 75 and the guide hole 76. For this reason, when adjusting the position of the condensing lens holder 54 in the optical axis direction, the condensing lens holder 54 slightly fluctuates on the support surface 74 of the support member 55. In addition, even when the position of the support member 55 in the height direction is moved relative to the base 38 in the height direction, the support member 55 is caused to move to the condensing lens holder by the gap between the connecting portions of the base 38 and the support member 55. Slightly shakes with 54.

  Therefore, as shown in FIG. 5, a pair of protruding portions 77 of the condenser lens holder 54 are provided so as to contact the portions of the mount members 52 located on both sides of the laser chip 41. In particular, here, each protrusion 77 is provided at the end of the surface 78 of the lens holding portion 71 facing the semiconductor laser 31. Thereby, even when the angle of the condenser lens holder 54 changes due to rattling of the condenser lens holder 54 during assembly or position adjustment, the projection 77 is brought into contact with the mount member 52 and the condenser lens holder 54 And the laser chip 41 can be reliably prevented.

  Furthermore, the protrusion 77 is formed in a cross-sectional shape that is chamfered in a substantially arc shape. In particular, here, it has a semi-cylindrical shape. Thereby, since the projecting portion 77 has a substantially arc-shaped cross section without an acute angle portion, it is possible to avoid damaging the mount member 52 even when the angle of the condenser lens holder 54 is changed during assembly or position adjustment. it can.

  Further, the protruding portion 77 has a constant cross-sectional shape in the longitudinal direction, and is formed straight in a side view as shown in FIG. Thus, when the protruding portion 77 hits the mount member 52, the protruding portion 77 contacts along the planar end surface of the mount member 52, thereby preventing the condenser lens holder 54 from wobbling. it can.

  The condenser lens holder 54 is assembled to the support member 55 from above so that the leg portion 75 is inserted into the guide hole 76, and the protrusion 77 is an assembly direction of the condenser lens holder 54 with respect to the support member 55, that is, the leg. It is formed long in the protruding direction of the portion 75. Thereby, when the condenser lens holder 54 is assembled from above, even if the condenser lens holder 54 collides with the semiconductor laser 31, the protruding portion 77 of the condenser lens holder 54 comes into contact with the mount member 52, so that the FAC. It is possible to reliably prevent the lens 32 and other portions of the condenser lens holder 54 from coming into contact with the laser chip 41.

  The condensing lens holder 54 may be assembled with the protruding portion 77 in contact with the mount member 52 intentionally. In this case, the protruding portion 77 is connected to the laser chip 41 by the condensing lens holder 54. On the other hand, the condenser lens holder 54 functions as a guide for guiding the condenser lens holder 54 so as to be held in a non-contact state, and the condenser lens holder 54 can be assembled without the condenser lens holder 54 wobbling.

  The protrusion 77 is formed longer than the size of the FAC lens 32 in the longitudinal direction. That is, the length of the protrusion 77 is larger than the dimension in the height direction of the FAC lens 32, and the semiconductor laser 31 side of the FAC lens 32 is covered with the protrusion 77 in a side view. In other words, the upper surface of the protrusion 77 is positioned above the upper side of the incident surface of the FAC lens 32, and the lower surface of the protrusion 77 is positioned lower than the lower side of the incident surface of the FAC lens 32. Thereby, it is possible to reliably prevent the FAC lens 32 and the semiconductor laser 31 from coming into direct contact during assembly or position adjustment, and to avoid damage to the FAC lens 32.

  FIG. 7 is a perspective view showing an example in which the image display device 1 is built in a notebook information processing device 81. In the housing 82 of the information processing device 81, a housing space in which the image display device 1 is retractable is formed on the back side of the keyboard, and the image display device 1 is housed in the housing 82 when not in use. In use, the image display device 1 is pulled out from the housing 82, and the image display device 1 is rotated at a required angle with respect to the base portion 83 that rotatably supports the image display device 1, whereby the image is displayed. Laser light from the display device 1 can be projected onto the screen.

  In the above example, the protrusion 77 provided on the condenser lens holder 54 has a semi-cylindrical shape, that is, a cross section cut by a plane perpendicular to the longitudinal direction has a semicircular shape. The protrusion in the present invention is not limited to this. For example, it is possible that the tip portion has a substantially arc shape and has a U-shaped cross section as a whole. Further, the protrusion 77 is formed longer on the mounting surface 73 side than the example shown in FIG. 6 in order to reliably prevent other parts of the condenser lens holder 54 from coming into contact with the semiconductor laser 31 during assembly. May be.

  In the above example, the laser chip 41, the laser medium 34, and the wavelength conversion element 35 of the green laser light source device 2 are respectively the excitation laser beam having a wavelength of 808 nm and the fundamental wavelength laser beam (infrared laser beam) having a wavelength of 1064 nm. In addition, although half-wavelength laser light (green laser light) having a wavelength of 532 nm is output, the present invention is not limited to this. The laser light finally outputted from the green laser light source device 2 may be anything that can be recognized as green. For example, it is preferable to output laser light in a wavelength region in which the peak wavelength is in the range of 500 nm to 560 nm.

  The laser light source device according to the present invention has an effect of preventing damage to the laser chip and the condenser lens during assembly and position adjustment, and is useful as a laser light source device using a semiconductor laser. .

DESCRIPTION OF SYMBOLS 1 Image display apparatus 2 Green laser light source apparatus 3 Red laser light source apparatus 4 Blue laser light source apparatus 31 Semiconductor laser 32 FAC lens (condensing lens)
33 Rod lens (Condenser lens)
34 Laser medium 35 Wavelength converting element 36 Concave mirror 37 Glass cover 38 Base 39 Cover body 41 Laser chip 52 Mount member 53 Mounting member 54 Condensing lens holder 55 Support member 71 Lens holding portion 72 Base 73 Mounting surface 74 Support surface 75 Leg Part 76 guide hole 77 protruding part

Claims (5)

A semiconductor laser in which a laser chip that outputs laser light is mounted on a mount member;
A condenser lens that condenses the laser light output from the laser chip;
A condenser lens holder that holds the condenser lens and protrudes from the leg ,
A mounting member for attaching the semiconductor laser to the upper surface;
The condensing lens holder and the semiconductor laser are in contact with the mounting member in the optical axis direction, and a guide hole long in the optical axis direction is formed on the surface in contact with the condensing lens holder so that the condensing lens holder and the semiconductor laser are not in contact with each other. A support member that supports the condensing lens holder so that the condensing lens holder can be moved in the optical axis direction by assembling the condensing lens holder from above by inserting the leg portion into the guide hole ,
When the condensing lens holder is assembled to the support member from above, when the condensing lens holder comes into contact with the semiconductor laser by sliding the leg portion through the guide hole, A laser light source device characterized in that a protruding portion for preventing contact with a laser chip is formed in the condenser lens holder so as to extend in the protruding direction of the leg portion, which is the assembling direction . The laser chip is fixed at a substantially central position on one surface of a plate-shaped mount member,
2. The laser light source device according to claim 1, wherein a pair of the projecting portions are provided so as to abut on portions of the mount member located on both sides of the laser chip.   The laser light source device according to claim 1, wherein the projecting portion is formed in a cross-sectional shape that is chamfered in a substantially arc shape. The protrusion, the laser light source apparatus according to any one of claims 1 to 3, characterized in that in its longitudinal direction is longer than the size of the condenser lens positioned in the semiconductor laser side. The laser chip outputs excitation laser light,
A laser medium that is excited by the excitation laser light output from the laser chip and outputs infrared laser light, and a wavelength that converts the wavelength of the infrared laser light output from the laser medium and outputs green laser light A conversion element,
The laser light source device according to any one of claims 1 to 4 , wherein the laser medium and the wavelength conversion element are integrally supported on a base together with the semiconductor laser and the condenser lens.

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