JP4741939B2 - Injection molded product - Google Patents
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- JP4741939B2 JP4741939B2 JP2005339978A JP2005339978A JP4741939B2 JP 4741939 B2 JP4741939 B2 JP 4741939B2 JP 2005339978 A JP2005339978 A JP 2005339978A JP 2005339978 A JP2005339978 A JP 2005339978A JP 4741939 B2 JP4741939 B2 JP 4741939B2
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Description
本発明は、特定のＡＢＳ樹脂を使用し、かつ特定の成形法により成形された射出成形品に関するものである。詳細には、パソコンやＴＶ、各種の家電製品等の組み立てで頻繁に使われるボス強度に優れたＡＢＳ樹脂製の射出成形品に関するものである。 The present invention relates to an injection molded product using a specific ABS resin and molded by a specific molding method. Specifically, the present invention relates to an injection molded product made of ABS resin having excellent boss strength, which is frequently used in assembling personal computers, TVs, various home appliances, and the like.
ＡＢＳ樹脂はその成形性や良好な光沢が得易いことから、パソコンやＴＶあるいは家電製品等の筐体用材料として広く一般に使われている。この場合、筐体は通常上下あるいは左右で２つ以上に分割されて成形されることが通常であり、これらを接合する場合には、一方に設けられたボス成形部分に他方より挿入されたビス（タッピングや丸ビス等）を締めこむことでそれぞれの部品を接合する方法をとる場合が非常に多い。この場合ボスの部分には成形による成形歪に加えてビスの締め込みによる締め込み応力が加わり、例えば脱脂していないビスを使用するとストレスクラックにより容易にボスにクラックあるいは割れが生じやすいという欠点を有している。
これらの欠点を改善するために、例えばＡＢＳ樹脂自体の耐薬品性を向上させるためにアクリロニトリル成分を増量することや耐薬品性の良好なナイロン樹脂やＰＢＴ樹脂を添加することが提案されているが、色相が悪くなる、寸法が安定しない、コストアップ等の不具合が発生するため、更なる改善が求められているのが現状である。
一方、特開２００１−１８２２９号公報（特許文献１）や特開２００１−２６９９７８号公報（特許文献２）には、金型のキャビティ表面の温度を繰り返し上下するヒートサイクル成形法について記載されているが、本発明にて規定する特定のＡＢＳ樹脂を使用すること、ならびにボス強度の改良との関係については何ら記載されていない。
In order to improve these drawbacks, for example, it has been proposed to increase the amount of acrylonitrile component or to add nylon resin or PBT resin having good chemical resistance in order to improve the chemical resistance of the ABS resin itself. However, the present situation is that further improvement is demanded because problems such as deterioration of hue, unstable dimensions, and cost increase occur.
On the other hand, Japanese Patent Application Laid-Open No. 2001-18229 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2001-269978 (Patent Document 2) describe a heat cycle molding method that repeatedly raises and lowers the temperature of the cavity surface of a mold. However, there is no description regarding the use of the specific ABS resin defined in the present invention and the relationship with the improvement of the boss strength.
本発明の目的は、パソコンやＴＶ、各種の家電製品等の組み立てで頻繁に使われるボス強度に優れたＡＢＳ樹脂製の射出成形品を提供することにある。 An object of the present invention is to provide an injection molded product made of ABS resin having excellent boss strength, which is frequently used in the assembly of personal computers, TVs, various home appliances and the like.
すなわち本発明は、体積平均粒子径０．２μｍ未満の小粒子径ゴム状重合体を凝集肥大化させて得られた体積平均粒子径０．２〜０．８μｍのゴム状重合体５〜４０重量％、アクリロニトリル系単量体１０〜３０重量％、スチレン系単量体３０〜８５重量％およびこれらと共重合可能な他の単量体０〜５５重量％からなるＡＢＳ樹脂を成形して得られた射出成形品であって、該ＡＢＳ樹脂がヒートサイクル射出成形法により成形されたことを特徴とする射出成形品を提供するものである。 That is, the present invention relates to a rubbery polymer having a volume average particle size of 0.2 to 0.8 μm obtained by agglomerating and expanding a small particle size rubbery polymer having a volume average particle size of less than 0.2 μm. %, An acrylonitrile-based monomer 10-30% by weight, a styrene-based monomer 30-85% by weight, and other monomers copolymerizable with these, 0-55% by weight are obtained by molding an ABS resin. The present invention provides an injection molded product characterized in that the ABS resin is molded by a heat cycle injection molding method.
本発明は、特に筐体等の組みつけに頻繁に利用されるボス強度に優れる成形品を安価に得ることができ、これらの性能が要求されるパソコンやＴＶ、各種の家電製品等に好適に使用することができるという効果を奏する。 INDUSTRIAL APPLICABILITY The present invention can obtain a molded article having excellent boss strength that is frequently used for assembling a housing, etc. at low cost, and is suitable for a personal computer, a TV, various home appliances, etc. that require these performances. There is an effect that it can be used.
以下、本発明について詳しく説明する。
本発明におけるＡＢＳ樹脂とは、体積平均粒子径０．２μｍ未満の小粒子径ゴム状重合体を凝集肥大化させて得られた体積平均粒子径０．２〜０．８μｍのゴム状重合体５〜４０重量％、アクリロニトリル系単量体１０〜３０重量％、スチレン系単量体３０〜８５重量％およびこれらと共重合可能な他の単量体０〜５５重量％からなるものである。
The present invention will be described in detail below.
The ABS resin in the present invention is a rubbery polymer 5 having a volume average particle size of 0.2 to 0.8 μm obtained by agglomerating and expanding a small particle size rubbery polymer having a volume average particle size of less than 0.2 μm. -40% by weight, 10-30% by weight of acrylonitrile monomer, 30-85% by weight of styrene monomer, and 0-55% by weight of other monomers copolymerizable therewith.
本発明のＡＢＳ樹脂を構成するゴム状重合体とは、ブタジエンあるいはブタジエンと共重合可能な単量体（例えばスチレンやアクリロニトリル）を重合して得られた体積平均粒子径０．２μｍ未満の小粒子径ゴム状重合体を公知の方法（例えば酸性物質を添加する方法（特公昭４２−３１１２、特公昭５５−１９２４６、特公平２−９６０１、特開昭６３−１１７００５、特開昭６３−１３２９０３、特開平７−１５７５０１）、酸基含有ラテックスを添加する方法（特開昭５６−１６６２０１、特開昭５９−９３７０１、特開平１−１２６３０１、特開平８−５９７０４）等を参照）にて凝集肥大化させて得られた体積平均粒子径０．２〜０．８μｍのゴム状重合体である。
該ゴム状重合体の体積平均粒子径について、０．２μｍ未満では十分な衝撃強度が得難く、０．８μｍを超えると表面光沢が損なわれるため好ましくない。好ましくは０．３〜０．６μｍである。尚、上記の小粒子径ゴム状重合体の粒子径の調整は、重合の際の条件、すなわち重合開始剤の種類や量、重合率、重合時の温度あるいは攪拌条件等を変更することにより任意に調整することが可能である。
また、ゴム状重合体の体積平均粒子径は試料０．３ｇをＭＥＫ３０ｍｌに溶解した後、レーザー光回折粒度分布測定装置（島津製作所製 ＳＡＬＤ−１１００）を用いて測定を行った。
The rubbery polymer constituting the ABS resin of the present invention is a small particle having a volume average particle diameter of less than 0.2 μm obtained by polymerizing butadiene or a monomer copolymerizable with butadiene (for example, styrene or acrylonitrile). A rubber-like polymer having a diameter is known by a known method (for example, a method of adding an acidic substance (Japanese Patent Publication No. Sho 42-3112, Japanese Patent Publication No. Sho 55-19246, Japanese Patent Publication No. Hei 2-96001), Japanese Patent Publication No. Sho 63-111005, Japanese Patent Publication Sho 63-132903, JP-A-7-157501), a method of adding an acid group-containing latex (see JP-A-56-166201, JP-A-59-93701, JP-A-1-126301, JP-A-8-59704, etc.)) It is a rubber-like polymer having a volume average particle diameter of 0.2 to 0.8 μm obtained by making it.
If the volume average particle diameter of the rubbery polymer is less than 0.2 μm, it is difficult to obtain a sufficient impact strength, and if it exceeds 0.8 μm, the surface gloss is impaired. Preferably it is 0.3-0.6 micrometer. The adjustment of the particle size of the above-mentioned small particle size rubbery polymer can be arbitrarily made by changing the conditions during polymerization, that is, the type and amount of the polymerization initiator, the polymerization rate, the temperature during the polymerization, or the stirring conditions. It is possible to adjust to.
The volume average particle size of the rubbery polymer was measured using a laser light diffraction particle size distribution analyzer (SALD-1100 manufactured by Shimadzu Corporation) after dissolving 0.3 g of a sample in 30 ml of MEK.
本発明のＡＢＳ樹脂を構成するスチレン系単量体としては、スチレン、α−メチルスチレン、ｏ−メチルスチレン、ｍ−メチルスチレン、ｐ−メチルスチレン、α−メチル−ｐ−メチルスチレン、ハロゲン化スチレン、エチルスチレン、ｐ−イソプロピルスチレン、ｐ−ｔ−ブチルスチレン、２，４−ジメチルスチレン、ジビニルベンゼン等が例示され、１種または２種以上を選択して使用することが可能である。また、アクリロニトリル系単量体としては、アクリロニトリル、メタクリロニトリル等が例示され、１種または２種以上を選択して使用することが可能である。
さらに、共重合可能な他の単量体としては、（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸プロピル、（メタ）アクリル酸ブチル、（メタ）アクリル酸２−エチルエキシル等の（メタ）アクリル酸エステル系単量体、Ｎ−フェニルマレイミド、Ｎ−シクロヘキシルマレイミド等のマレイミド系単量体、アクリル酸、メタクリル酸等の不飽和カルボン酸等が例示され、それぞれ１種または２種以上を選択して使用することが可能である。
Examples of the styrene monomer constituting the ABS resin of the present invention include styrene, α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methyl-p-methylstyrene, and halogenated styrene. , Ethyl styrene, p-isopropyl styrene, pt-butyl styrene, 2,4-dimethyl styrene, divinylbenzene and the like are exemplified, and one or more kinds can be selected and used. Examples of the acrylonitrile-based monomer include acrylonitrile, methacrylonitrile, and the like, and one or more types can be selected and used.
Further, other monomers that can be copolymerized include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylexyl (meth) acrylate. (Meth) acrylic acid ester monomers such as N-phenylmaleimide, N-cyclohexylmaleimide and other maleimide monomers, acrylic acid, methacrylic acid and other unsaturated carboxylic acids, etc. Two or more types can be selected and used.
本発明におけるＡＢＳ樹脂とは、前述したゴム状重合体の存在下にスチレン系単量体、アクリロニトリル系単量体およびこれらと共重合可能な他の単量体からなる単量体混合物を重合して得られたグラフト重合体、または該グラフト重合体とスチレン系単量体、アクリロニトリル系単量体およびこれらと共重合可能な他の単量体からなる単量体混合物を重合して得られた（共）重合体との混合物から構成されるものであり、最終的に得られる樹脂組成物としての各種成分が上記の組成割合であればよい。
最終的に得られた樹脂組成物中のゴム状重合体が５重量％未満では最終製品で要求されるボス強度が不足し、４０重量％を越えると成形性が著しく低下するため好ましくない。アクリロニトリル系単量体が１０重量％未満では全体的な耐薬品性が低下し、３０重量％を超えると着色あるいは成形性が低下するため好ましくない。スチレン系単量体３０重量％未満では成形性が低下し、８５重量％を超えると製品強度が低下するため好ましくない。
また、上記にて得られたＡＢＳ樹脂のアセトン可溶部の固有粘度については特に制限はないが、ボス強度および成形性の観点から０．３５〜１．２の範囲であることが好ましく、最も好ましくは０．４〜１．０の範囲である。
In the present invention, the ABS resin is obtained by polymerizing a monomer mixture comprising a styrene monomer, an acrylonitrile monomer, and other monomers copolymerizable therewith in the presence of the rubbery polymer described above. Obtained by polymerizing the obtained graft polymer or a monomer mixture comprising the graft polymer and a styrene monomer, an acrylonitrile monomer and other monomers copolymerizable therewith. It is comprised from the mixture with a (co) polymer, and the various components as a resin composition finally obtained should just be said composition ratio.
If the rubber-like polymer in the finally obtained resin composition is less than 5% by weight, the boss strength required for the final product is insufficient, and if it exceeds 40% by weight, the moldability is remarkably lowered. If the acrylonitrile monomer is less than 10% by weight, the overall chemical resistance is lowered, and if it exceeds 30% by weight, coloring or moldability is lowered, which is not preferable. If the styrene monomer is less than 30% by weight, the moldability is lowered, and if it exceeds 85% by weight, the product strength is lowered, which is not preferable.
The intrinsic viscosity of the acetone-soluble part of the ABS resin obtained above is not particularly limited, but is preferably in the range of 0.35 to 1.2 from the viewpoint of boss strength and moldability. Preferably it is the range of 0.4-1.0.
本発明におけるＡＢＳ樹脂の重合方法には特に制限は無く、乳化重合法、懸濁重合、溶液重合法や塊状重合法、あるいはこれらを任意に組み合わせることも可能である。 There is no restriction | limiting in particular in the polymerization method of the ABS resin in this invention, It is also possible to combine emulsion polymerization method, suspension polymerization, solution polymerization method, block polymerization method, or these arbitrarily combining.
更に、本発明のＡＢＳ樹脂には、顔料、染料、酸化防止剤、熱安定剤、紫外線吸収剤、帯電防止剤等を必要に応じて添加することができるが、中でもシリコン系化合物、フェノール系またはリン系酸化防止剤、ベンゾトリアゾール系光安定剤から選ばれた少なくとも１種を添加することが、加工時の製品の変色を防止する点で好ましい。尚、これら添加剤は、ＡＢＳ樹脂１００重量部に対して０．０２〜５．０重量部であることが好ましい。 Furthermore, pigments, dyes, antioxidants, heat stabilizers, ultraviolet absorbers, antistatic agents, and the like can be added to the ABS resin of the present invention as necessary. The addition of at least one selected from phosphorus antioxidants and benzotriazole light stabilizers is preferred in terms of preventing discoloration of the product during processing. In addition, it is preferable that these additives are 0.02-5.0 weight part with respect to 100 weight part of ABS resin.
本発明のＡＢＳ樹脂を構成する各成分の混合方法には特に制限はなく、押出機、バンバリーミキサー、ロール、ニーダー等を用いて混合することができる。 There is no restriction | limiting in particular in the mixing method of each component which comprises the ABS resin of this invention, It can mix using an extruder, a Banbury mixer, a roll, a kneader, etc.
なお、本発明の特徴であるボス強度を十分に高めるためには、本発明におけるＡＢＳ樹脂を射出成形する際にヒートサイクル射出成形法を採用することが必須条件である。具体的には、蒸気あるいは電気ヒーター等を用いて金型を加熱しておくことが重要であり、その際の金型（キャビティ）温度としては８０℃以上であることが好ましい。但し、金型温度が１４０℃を超えた場合、冷却時間が極端に長くなる、あるいは製品上にヒケが目立つ等の不具合が発生しやすいため、金型温度は８０〜１４０℃の範囲であることが好ましい。
なお、このようなヒートサイクル成形法については、特許文献１，２等に詳しく記載されている。
このような方法にて得られた射出成形品は、パソコンやＴＶ、各種の家電製品等の筐体等、さらにはその他家電製品等の各種成形品用部品として好適に使用することができる。
In order to sufficiently increase the boss strength, which is a feature of the present invention, it is an indispensable condition to employ a heat cycle injection molding method when injection molding the ABS resin in the present invention. Specifically, it is important to heat the mold using steam or an electric heater, and the mold (cavity) temperature at that time is preferably 80 ° C. or higher. However, when the mold temperature exceeds 140 ° C, the mold temperature should be in the range of 80 to 140 ° C, because the cooling time becomes extremely long or defects such as conspicuous conspicuousness occur on the product. Is preferred.
Such a heat cycle molding method is described in detail in Patent Documents 1 and 2 and the like.
The injection-molded product obtained by such a method can be suitably used as a part for various molded products such as a personal computer, a TV, a casing of various home appliances, and other home appliances.
〔実施例〕
以下、実施例および比較例によって本発明をさらに具体的に説明するが、本発明はこれらによって何ら制限されるものではない。
〔Example〕
EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further more concretely, this invention is not restrict | limited at all by these.
ＡＢＳ樹脂
グラフト重合体（Ａ）
Ａ−１：公知の乳化重合法により、小粒子径スチレン−ブタジエンゴムラテックス（スチレン５重量％、体積平均粒子径０．１２μｍ）を重合した後、凝集剤としてリン酸を使用して公知の方法で凝集肥大化処理を行い、凝集肥大化ゴムラテックス（体積平均粒子径０．４５μｍ）を作成した。このゴムラテックス５０重量部（固形分）およびアクリロニトリル２０重量部、スチレン３０重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−１を得た。
Ａ−２：Ａ−１と同様の小粒子径スチレン−ブタジエンゴムラテックスを使用し、同様に凝集肥大化処理を行い、凝集肥大化ゴムラテックス（体積平均粒子径０．７μｍ）を作成した。このゴムラテックス６０重量部（固形分）、アクリロニトリル１５重量部、スチレン２５重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−２を得た。
Ａ−３：Ａ−１と同様の小粒子径スチレン−ブタジエンゴムラテックスを使用し、同様に凝集肥大化処理を行い、凝集肥大化ゴムラテックス（体積平均粒子径０．３μｍ）を作成した。このゴムラテックス２０重量部（固形分）、アクリロニトリル１５重量部、スチレン６５重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−３を得た。
Ａ−４：Ａ−１と同様の小粒子径スチレン−ブタジエンゴムラテックスを使用し、同様に凝集肥大化処理を行い、凝集肥大化ゴムラテックス（体積平均粒子径０．３μｍ）を作成した。このゴムラテックス２０重量部（固形分）、アクリロニトリル１０重量部、スチレン３０重量部、メタアクリル酸メチル４０重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−４を得た。
Ａ−ｉ：公知の乳化重合法により、スチレン−ブタジエンゴムラテックス（スチレン５重量％、体積平均粒子径０．３５μｍ）を重合した。この凝集肥大化をすることなく得られたゴムラテックス２０重量部（固形分）、アクリロニトリル２５重量部、スチレン５５重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−ｉを得た。
Ａ−ｉｉ：公知の乳化重合法により、スチレン−ブタジエンゴムラテックス（スチレン５重量％、体積平均粒子径０．１５μｍ）を重合した。この凝集肥大化をすることなく得られたゴムラテックス２０重量部（固形分）、アクリロニトリル２５重量部、スチレン５５重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−ｉｉを得た。
Ａ−ｉｉｉ：Ａ−１と同様の小粒子径スチレン−ブタジエンゴムラテックスを使用し、同様に凝集肥大化処理を行い、凝集肥大化ゴムラテックス（体積平均粒子径０．９μｍ）を作成した。このゴムラテックス２０重量部（固形分）、アクリロニトリル２５重量部、スチレン５５重量部を公知の乳化重合法によりグラフト重合を行いグラフト重合体Ａ−ｉｉｉを得た。
ABS resin
Graft polymer (A)
A-1 : A known method using a phosphoric acid as a flocculant after polymerizing a small particle size styrene-butadiene rubber latex (styrene 5 wt%, volume average particle size 0.12 μm) by a known emulsion polymerization method. The agglomeration and enlargement treatment was performed to prepare an agglomerated and enlarged rubber latex (volume average particle size 0.45 μm). Graft polymerization of 50 parts by weight (solid content) of this rubber latex, 20 parts by weight of acrylonitrile, and 30 parts by weight of styrene was carried out by a known emulsion polymerization method to obtain graft polymer A-1.
A-2 : A styrene-butadiene rubber latex having a small particle diameter similar to that of A-1 was used, and a cohesive enlargement treatment was performed in the same manner to prepare an aggregated enlarged rubber latex (volume average particle diameter 0.7 μm). Graft polymerization of 60 parts by weight (solid content) of this rubber latex, 15 parts by weight of acrylonitrile, and 25 parts by weight of styrene was carried out by a known emulsion polymerization method to obtain graft polymer A-2.
A-3 : A styrene-butadiene rubber latex having a small particle size similar to that of A-1 was used, and a cohesive enlargement treatment was performed in the same manner to produce an aggregated enlarged rubber latex (volume average particle size of 0.3 μm). Graft polymerization of 20 parts by weight (solid content) of this rubber latex, 15 parts by weight of acrylonitrile and 65 parts by weight of styrene was carried out by a known emulsion polymerization method to obtain graft polymer A-3.
A-4 : A styrene-butadiene rubber latex having a small particle size similar to that of A-1 was used, and a cohesive enlargement treatment was performed in the same manner to prepare an aggregated enlarged rubber latex (volume average particle size of 0.3 μm). Graft polymerization of 20 parts by weight (solid content) of this rubber latex, 10 parts by weight of acrylonitrile, 30 parts by weight of styrene and 40 parts by weight of methyl methacrylate was carried out by a known emulsion polymerization method to obtain graft polymer A-4.
Ai : Styrene-butadiene rubber latex (styrene 5% by weight, volume average particle size 0.35 μm) was polymerized by a known emulsion polymerization method. Graft polymerization of 20 parts by weight (solid content) of rubber latex, 25 parts by weight of acrylonitrile, and 55 parts by weight of styrene obtained without this cohesive enlargement was carried out by a known emulsion polymerization method to obtain graft polymer A-i. .
A-ii : Styrene-butadiene rubber latex (styrene 5% by weight, volume average particle size 0.15 μm) was polymerized by a known emulsion polymerization method. Graft polymerization was carried out by a known emulsion polymerization method using 20 parts by weight (solid content) of rubber latex (solid content), 25 parts by weight of acrylonitrile, and 55 parts by weight of styrene. .
A-iii : The same small particle size styrene-butadiene rubber latex as that of A-1 was used, and the coagulation enlargement treatment was performed in the same manner to produce an aggregate enlargement rubber latex (volume average particle size 0.9 μm). 20 parts by weight (solid content) of this rubber latex, 25 parts by weight of acrylonitrile and 55 parts by weight of styrene were subjected to graft polymerization by a known emulsion polymerization method to obtain a graft polymer A-iii.
共重合体（Ｂ）
Ｂ−１：公知の塊状重合法によりアクリロニトリル２５重量部、スチレン７５重量部からなる共重合体Ｂ−１を得た。尚共重合体Ｂ−１のポリスチレン換算重量平均分子量は１０万、Ｑ値は２．３であった。
Copolymer (B)
B-1 : A copolymer B-1 comprising 25 parts by weight of acrylonitrile and 75 parts by weight of styrene was obtained by a known bulk polymerization method. The copolymer B-1 had a polystyrene equivalent weight average molecular weight of 100,000 and a Q value of 2.3.
添加剤（Ｃ）
Ｃ−１：ヒンダードアミン系光安定剤 アデカスタブＬＡ−７７Ｇ（旭電化工業（株）製）
Ｃ−２：フェノール系酸化防止剤 スミライザーＢＰ−７６（住友化学（株）製）
Ｃ−３：シリコン化合物 ＫＦ９６−１００ＣＳ（信越化学工業（株）製）
Additive (C)
C-1: Hindered amine light stabilizer ADK STAB LA-77G (Asahi Denka Kogyo Co., Ltd.)
C-2: Phenolic antioxidant Sumilizer BP-76 (manufactured by Sumitomo Chemical Co., Ltd.)
C-3: Silicon compound KF96-100CS (manufactured by Shin-Etsu Chemical Co., Ltd.)
実施例及び比較例
表１に示す割合で各種成分を混合した後、ベント付き４０ｍｍ単軸押出し機（（株）田辺プラスチックス社製）を使い、設定温度２２０℃の条件で溶融混合を行った。
尚、全ての試料には滑剤としてエチレンビスステアリルアミドを１部添加した。
得られたペレットは、三井化学エンジニアリング（株）製 「ヒートサイクル用金型温度制御装置：高速ＨＣ成形用温調ユニット」をとりつけた日本製鋼所（株）製Ｊ−１５０ＥＰ射出成形機を使用し、ヒートサイクル成形では金型充填時の金型温度は１００℃、冷却時の金型温度は５０℃に設定し、通常成形では金型温度を５０℃（一定）に設定して試験片を作成し、以下の試験を実施した。尚、シリンダー温度は２２０℃に設定した。
Examples and Comparative Examples After mixing various components at the ratios shown in Table 1, melt mixing was performed using a vented 40 mm single screw extruder (manufactured by Tanabe Plastics Co., Ltd.) at a set temperature of 220 ° C. .
In addition, 1 part of ethylenebisstearylamide was added to all samples as a lubricant.
The obtained pellets were manufactured using a J-150EP injection molding machine manufactured by Nippon Steel Works, which was equipped with “Mold temperature control device for heat cycle: temperature control unit for high speed HC molding” manufactured by Mitsui Chemical Engineering Co., Ltd. In heat cycle molding, the mold temperature when filling the mold is set to 100 ° C, the mold temperature during cooling is set to 50 ° C, and in normal molding, the mold temperature is set to 50 ° C (constant) to create a test piece. The following tests were conducted. The cylinder temperature was set to 220 ° C.
実施例中、各種の評価は次の方法で実施した。
ボス強度：外径５．０ｍｍ、内径２．７ｍｍ、深さ１０ｍｍのボスにＭ３．０×６ｍｍのタ＋ナベ頭タッピングビスをねじ込み、ボスに発生するクラックの有無を目視により確認した。
○：異常なし
△：微細なクラックが発生
×：著しいクラックが発生
In the examples, various evaluations were performed by the following methods.
Boss strength : An M3.0 × 6 mm head and pan head tapping screw was screwed into a boss having an outer diameter of 5.0 mm, an inner diameter of 2.7 mm, and a depth of 10 mm, and the presence or absence of cracks generated on the boss was visually confirmed.
○: No abnormality △: Fine cracks occurred ×: Significant cracks occurred
本発明により、特に筐体等の組みつけに頻繁に利用されるボス強度に優れる成形品を提供することが可能であり、これらの性能が要求されるパソコンやＴＶ、各種の家電製品等に好適に使用することができる。
According to the present invention, it is possible to provide a molded article with excellent boss strength that is frequently used for assembling a housing and the like, and is suitable for personal computers, TVs, various home appliances and the like that require these performances. Can be used for
Claims (2)
The injection-molded article according to claim 1, wherein the intrinsic viscosity of the acetone-soluble part of the ABS resin is in the range of 0.35 to 1.2.
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| JP7045228B2 (en) * | 2018-03-19 | 2022-03-31 | 信越ポリマー株式会社 | Manufacturing method of molded products |
| KR102360594B1 (en) | 2018-09-21 | 2022-02-09 | 주식회사 엘지화학 | Thermoplastic resin composition, method for producing the same and metal plated molding product therefrom |
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