JP4717581B2 - 表示用基板の検査方法 - Google Patents
表示用基板の検査方法 Download PDFInfo
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- JP4717581B2 JP4717581B2 JP2005295268A JP2005295268A JP4717581B2 JP 4717581 B2 JP4717581 B2 JP 4717581B2 JP 2005295268 A JP2005295268 A JP 2005295268A JP 2005295268 A JP2005295268 A JP 2005295268A JP 4717581 B2 JP4717581 B2 JP 4717581B2
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- needle tip
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- electrode
- probe
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- 239000000758 substrate Substances 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 14
- 238000007689 inspection Methods 0.000 title claims description 13
- 239000000523 sample Substances 0.000 claims description 66
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- ZMDCATBGKUUZHF-UHFFFAOYSA-N beryllium nickel Chemical compound [Be].[Ni] ZMDCATBGKUUZHF-UHFFFAOYSA-N 0.000 claims description 3
- 239000010408 film Substances 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 10
- 238000002474 experimental method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 229910000952 Be alloy Inorganic materials 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- DAQWSROBHHTPDO-UHFFFAOYSA-N [Ni].[Rh] Chemical compound [Ni].[Rh] DAQWSROBHHTPDO-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Description
12 表示用基板
14 配線
16 フィルム
18 針先
20 先端面
22 プローブ
24 ホルダ
26 補強層
28 削り屑
30 実験装置
32 ステージ
34 反力片
36 針圧測定器
38 デジタルマルチメータ
40、42 ケーブル
Claims (6)
- HV500からHV1000の範囲の硬度を有する針先を備えたプローブの前記針先を表示用基板の電極に、前記電極と前記針先との接触面圧が1平方μm当たり0.04gfから0.06gfとなる力で、押圧することを含む、表示用基板の検査方法。
- 前記力は、これが前記プローブに作用したときの前記電極に対する前記針先の滑り量が前記針先の滑り方向における前記針先の先端の長さ寸法の2倍以上となる値に選択される、請求項1に記載の表示用基板の検査方法。
- 前記針先は、さらに、前記電極に押圧される平坦な先端面を有する、請求項1に記載の表示用基板の検査方法。
- 前記先端面は、前記表示用基板と平行の面内の幅寸法であって前記電極に押圧されたときの前記針先の移動方向に直角の方向おける幅寸法が20μm以下である、請求項3に記載の表示用基板の検査方法。
- 前記針先は、ベリリウム・ニッケル合金又はロジウムである、請求項1に記載の表示用基板の検査方法。
- 前記プローブは、電気絶縁性フィルムの一方の面に一方向へ伸びる状態に形成された配線と、外配線の端部に設けられた前記針先とを含むフィルム状プローブとされている、請求項1から5のいずれか1項に記載の表示用基板の検査方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005295268A JP4717581B2 (ja) | 2005-05-09 | 2005-10-07 | 表示用基板の検査方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005136104 | 2005-05-09 | ||
JP2005136104 | 2005-05-09 | ||
JP2005295268A JP4717581B2 (ja) | 2005-05-09 | 2005-10-07 | 表示用基板の検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006343307A JP2006343307A (ja) | 2006-12-21 |
JP4717581B2 true JP4717581B2 (ja) | 2011-07-06 |
Family
ID=37640361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005295268A Active JP4717581B2 (ja) | 2005-05-09 | 2005-10-07 | 表示用基板の検査方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4717581B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008256410A (ja) * | 2007-04-02 | 2008-10-23 | Micronics Japan Co Ltd | プローブ組立体 |
KR101649220B1 (ko) * | 2009-12-21 | 2016-08-18 | 엘지디스플레이 주식회사 | 액정표시장치의 검사장치 |
JP6740274B2 (ja) | 2018-03-29 | 2020-08-12 | 日本電信電話株式会社 | 情報処理装置、情報処理方法、および、情報処理プログラム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004015030A (ja) * | 2002-06-12 | 2004-01-15 | Hitachi Ltd | 半導体装置の製造方法 |
JP2004233128A (ja) * | 2003-01-29 | 2004-08-19 | Yamaha Corp | プローブユニット及びプローブユニットの製造方法 |
JP2005030790A (ja) * | 2003-07-08 | 2005-02-03 | Renesas Technology Corp | プローブカード |
-
2005
- 2005-10-07 JP JP2005295268A patent/JP4717581B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004015030A (ja) * | 2002-06-12 | 2004-01-15 | Hitachi Ltd | 半導体装置の製造方法 |
JP2004233128A (ja) * | 2003-01-29 | 2004-08-19 | Yamaha Corp | プローブユニット及びプローブユニットの製造方法 |
JP2005030790A (ja) * | 2003-07-08 | 2005-02-03 | Renesas Technology Corp | プローブカード |
Also Published As
Publication number | Publication date |
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JP2006343307A (ja) | 2006-12-21 |
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