JP4676855B2 - ハイブリッド集積回路装置とその製造方法 - Google Patents
ハイブリッド集積回路装置とその製造方法 Download PDFInfo
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- JP4676855B2 JP4676855B2 JP2005289700A JP2005289700A JP4676855B2 JP 4676855 B2 JP4676855 B2 JP 4676855B2 JP 2005289700 A JP2005289700 A JP 2005289700A JP 2005289700 A JP2005289700 A JP 2005289700A JP 4676855 B2 JP4676855 B2 JP 4676855B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
「上下両面のうちいずれか一方又は両方に電子部品をマウントした絶縁基板と,この絶縁基板の下面における左右両側に配設した一対の絶縁体製の棒状脚体とから成るハイブリッド集積回路装置において,
前記両棒状脚体における左右両面には,端子電極の複数個が,当該脚体の長手方向に適宜ピッチの間隔で形成され,前記両棒状脚体は,前記絶縁基板の下面に,当該棒状脚体の両側面における各端子電極を前記絶縁基板の下面に形成されている前記電子部品接続用配線パターンに対して半田付けするか,或いは,導電性ペーストにて接着することによって固着されており,更に,前記両棒状脚体における前記絶縁基板側の上面のうち前記各端子電極の部分には,電極膜が,当該電極膜が左右両側面における端子電極に繋がるように形成されている。」
ことを特徴としている。
「前記請求項1の記載において,前記両棒状脚体における各端子電極は,前記棒状脚体の側面に設けた凹所内に形成されている。」
ことを特徴としている。
「絶縁基板における上下両面のうちいずれか一方又は両方に電子部品をマウントする工程と,
絶縁体製の棒状脚体における左右両側面に,端子電極の複数個を,当該脚体の長手方向に適宜ピッチの間隔で形成する工程と,
前記棒状脚体を,前記絶縁基板の下面における左右両側に,当該棒状脚体の両側面における各端子電極を前記絶縁基板の下面に形成されている前記電子部品接続用配線パターンに対して半田付けするか,或いは,導電性ペーストにて接着することによって固着する工程とを備え,
前記棒状脚体における左右両面に端子電極の複数個を形成する工程が,前記棒状脚体の複数本を並べて一体化して成る素材基板を用意する工程と,前記素材基板のうち前記各棒状脚体の境界線の箇所にスルーホールの複数個を前記境界線に沿って適宜ピッチの間隔で穿設する工程と,前記各スールホール内に端子電極を形成する工程と,前記素材基板における上面のうち前記各スールホールの箇所に電極膜を前記境界線と直角の方向に延びるように形成する工程と,前記素材基板を前記境界線に沿って各棒状脚体ごとに切断する工程とから成る。」
ことを特徴としている。
2 棒状脚体
3 電子部品
4 配線パターン
5 凹所
6 端子電極
7 上面電極
8 下面電極
A 素材基板
A1 境界線
A2 スルーホール
Claims (3)
- 上下両面のうちいずれか一方又は両方に電子部品をマウントした絶縁基板と,この絶縁基板の下面における左右両側に配設した一対の絶縁体製の棒状脚体とから成るハイブリッド集積回路装置において,
前記両棒状脚体における左右両面には,端子電極の複数個が,当該脚体の長手方向に適宜ピッチの間隔で形成され,前記両棒状脚体は,前記絶縁基板の下面に,当該棒状脚体の両側面における各端子電極を前記絶縁基板の下面に形成されている前記電子部品接続用配線パターンに対して半田付けするか,或いは,導電性ペーストにて接着することによって固着されており,更に,前記両棒状脚体における前記絶縁基板側の上面のうち前記各端子電極の部分には,電極膜が,当該電極膜が左右両側面における端子電極に繋がるように形成されていることを特徴とするハイブリッド集積回路装置。 - 前記請求項1の記載において,前記棒状脚体における各端子電極は,前記棒状脚体の側面に設けた凹所内に形成されていることを特徴とするハイブリッド集積回路装置。
- 絶縁基板における上下両面のうちいずれか一方又は両方に電子部品をマウントする工程と,
絶縁体製の棒状脚体における左右両側面に,端子電極の複数個を,当該脚体の長手方向に適宜ピッチの間隔で形成する工程と,
前記棒状脚体を,前記絶縁基板の下面における左右両側に,当該棒状脚体の両側面における各端子電極を前記絶縁基板の下面に形成されている前記電子部品接続用配線パターンに対して半田付けするか,或いは,導電性ペーストにて接着することによって固着する工程とを備え,
前記棒状脚体における左右両面に端子電極の複数個を形成する工程が,前記棒状脚体の複数本を並べて一体化して成る素材基板を用意する工程と,前記素材基板のうち前記各棒状脚体の境界線の箇所にスルーホールの複数個を前記境界線に沿って適宜ピッチの間隔で穿設する工程と,前記各スールホール内に端子電極を形成する工程と,前記素材基板における上面のうち前記各スールホールの箇所に電極膜を前記境界線と直角の方向に延びるように形成する工程と,前記素材基板を前記境界線に沿って各棒状脚体ごとに切断する工程とから成ることを特徴とするハイブリッド集積回路装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289700A JP4676855B2 (ja) | 2005-10-03 | 2005-10-03 | ハイブリッド集積回路装置とその製造方法 |
PCT/JP2006/319672 WO2007040193A1 (ja) | 2005-10-03 | 2006-10-02 | ハイブリッド集積回路装置とその製造方法 |
KR1020087007281A KR101001816B1 (ko) | 2005-10-03 | 2006-10-02 | 하이브리드 집적 회로 장치와 그 제조 방법 |
CN200680034385A CN100576534C (zh) | 2005-10-03 | 2006-10-02 | 混合集成电路装置及其制造方法 |
US12/083,039 US7733668B2 (en) | 2005-10-03 | 2006-10-02 | Hybrid integrated circuit device and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289700A JP4676855B2 (ja) | 2005-10-03 | 2005-10-03 | ハイブリッド集積回路装置とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007103553A JP2007103553A (ja) | 2007-04-19 |
JP4676855B2 true JP4676855B2 (ja) | 2011-04-27 |
Family
ID=37906234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005289700A Active JP4676855B2 (ja) | 2005-10-03 | 2005-10-03 | ハイブリッド集積回路装置とその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7733668B2 (ja) |
JP (1) | JP4676855B2 (ja) |
KR (1) | KR101001816B1 (ja) |
CN (1) | CN100576534C (ja) |
WO (1) | WO2007040193A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2166825A1 (de) * | 2008-09-17 | 2010-03-24 | Vincotech Holdings S.a.r.l. | Lötbares elektronisches Modul mit Schaltungsträger |
JP5510461B2 (ja) * | 2010-04-13 | 2014-06-04 | 株式会社村田製作所 | モジュール基板、及びモジュール基板の製造方法 |
CN101908493B (zh) * | 2010-07-07 | 2011-10-26 | 天水天光半导体有限责任公司 | 一种混合集成电路的生产工艺 |
JP5532141B2 (ja) * | 2010-10-26 | 2014-06-25 | 株式会社村田製作所 | モジュール基板及びモジュール基板の製造方法 |
FR3049155B1 (fr) * | 2016-03-15 | 2018-04-13 | Alstom Transport Technologies | Carte electronique comprenant un circuit intercalaire a demi-trous metallises |
JP6572820B2 (ja) * | 2016-04-25 | 2019-09-11 | 富士通株式会社 | 電源供給構造 |
US20220020807A1 (en) * | 2020-07-16 | 2022-01-20 | Canon Kabushiki Kaisha | Intermediate connection member, method for manufacturing intermediate connection member, electronic module, method for manufacturing electronic module, and electronic equipment |
CN115023035B (zh) * | 2021-09-23 | 2023-05-09 | 荣耀终端有限公司 | 电路板组件以及电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0531256U (ja) * | 1991-09-30 | 1993-04-23 | ローム株式会社 | ハイブリツド集積回路装置 |
JPH06275774A (ja) * | 1993-03-19 | 1994-09-30 | Fujitsu Ltd | 回路ユニットの接続装置および該接続装置を用いた回路モジュール |
JPH1074887A (ja) * | 1996-08-30 | 1998-03-17 | Sony Corp | 電子部品及びその製造方法 |
JP2004172422A (ja) * | 2002-11-20 | 2004-06-17 | Fujitsu Media Device Kk | 立体構造基板及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5588848A (en) * | 1994-09-08 | 1996-12-31 | Lucent Technologies Inc. | Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
JPH11186688A (ja) * | 1997-10-14 | 1999-07-09 | Murata Mfg Co Ltd | ハイブリッドicおよびそれを用いた電子装置 |
US7246434B1 (en) * | 2004-10-11 | 2007-07-24 | Pericom Semiconductor Corp. | Method of making a surface mountable PCB module |
-
2005
- 2005-10-03 JP JP2005289700A patent/JP4676855B2/ja active Active
-
2006
- 2006-10-02 WO PCT/JP2006/319672 patent/WO2007040193A1/ja active Application Filing
- 2006-10-02 KR KR1020087007281A patent/KR101001816B1/ko not_active IP Right Cessation
- 2006-10-02 US US12/083,039 patent/US7733668B2/en active Active
- 2006-10-02 CN CN200680034385A patent/CN100576534C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0531256U (ja) * | 1991-09-30 | 1993-04-23 | ローム株式会社 | ハイブリツド集積回路装置 |
JPH06275774A (ja) * | 1993-03-19 | 1994-09-30 | Fujitsu Ltd | 回路ユニットの接続装置および該接続装置を用いた回路モジュール |
JPH1074887A (ja) * | 1996-08-30 | 1998-03-17 | Sony Corp | 電子部品及びその製造方法 |
JP2004172422A (ja) * | 2002-11-20 | 2004-06-17 | Fujitsu Media Device Kk | 立体構造基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100576534C (zh) | 2009-12-30 |
JP2007103553A (ja) | 2007-04-19 |
KR101001816B1 (ko) | 2010-12-15 |
KR20080039516A (ko) | 2008-05-07 |
CN101268550A (zh) | 2008-09-17 |
WO2007040193A1 (ja) | 2007-04-12 |
US7733668B2 (en) | 2010-06-08 |
US20080278920A1 (en) | 2008-11-13 |
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