JP4642499B2 - Polyolefin resin composition and packaging film - Google Patents
Polyolefin resin composition and packaging film Download PDFInfo
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- JP4642499B2 JP4642499B2 JP2005035246A JP2005035246A JP4642499B2 JP 4642499 B2 JP4642499 B2 JP 4642499B2 JP 2005035246 A JP2005035246 A JP 2005035246A JP 2005035246 A JP2005035246 A JP 2005035246A JP 4642499 B2 JP4642499 B2 JP 4642499B2
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- 239000012785 packaging film Substances 0.000 title claims description 16
- 229920006280 packaging film Polymers 0.000 title claims description 16
- 239000011342 resin composition Substances 0.000 title claims description 13
- 229920005672 polyolefin resin Polymers 0.000 title description 3
- 239000002216 antistatic agent Substances 0.000 claims description 27
- 229920000642 polymer Polymers 0.000 claims description 21
- -1 polypropylene Polymers 0.000 claims description 20
- 229920001155 polypropylene Polymers 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 229920000570 polyether Polymers 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 8
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000010408 film Substances 0.000 description 23
- 239000000126 substance Substances 0.000 description 12
- 229920000098 polyolefin Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000004711 α-olefin Substances 0.000 description 7
- 239000005022 packaging material Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229920005604 random copolymer Polymers 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000003337 fertilizer Substances 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005606 polypropylene copolymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920002961 polybutylene succinate Polymers 0.000 description 1
- 239000004631 polybutylene succinate Substances 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Wrappers (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は帯電防止性の包装用フィルムに関し、さらに詳しくは低光沢性を備えた帯電防止性の包装用フィルムに関する。 The present invention relates to an antistatic packaging film, and more particularly to an antistatic packaging film having low gloss.
ポリオレフィン系樹脂フィルムは成形性、加工性、コストに優れていることより規格袋、レジ袋、ゴミ袋などのほか食品、日用品、電気製品、電子部品、精密機器、医薬品、米穀類、肥料、樹脂ペレットなど様々な製品の包装資材として世の中に広く普及している。ポリオレフィン系樹脂のなかでも特に直鎖状低密度ポリエチレンは強度、シール性、耐ピンホール性が優れているので単層フィルムで、あるいは積層フィルムの構成層として包装資材に多用されている。これらの包装資材は通常シート状またはチューブ状に成形された原反フィルムに必要に応じて印刷をした上でスリット、カット、溶着などの加工を経て製袋されるが、ポリオレフィンは導電性が低いために印刷や加工工程で発生する静電気トラブルの対策が求められていた。 Polyolefin-based resin films are excellent in moldability, processability, and cost. In addition to standard bags, plastic bags, garbage bags, etc., food, daily necessities, electrical products, electronic parts, precision equipment, pharmaceuticals, rice grains, fertilizers, resins Widely used as a packaging material for various products such as pellets. Among polyolefin-based resins, linear low-density polyethylene is particularly frequently used as a packaging material as a single-layer film or as a constituent layer of a laminated film because of its excellent strength, sealability and pinhole resistance. These packaging materials are usually made into sheets or tubes, and are printed as needed, and then processed through slits, cuts, welding, etc., but polyolefins have low conductivity. Therefore, countermeasures against static electricity problems that occur in printing and processing processes have been demanded.
静電気トラブルの例としてはフィルムの送出乱れやインキ反発による印刷不良、フィルムへの埃付着による品質低下、フィルムから作業者への放電による電撃、フィルムの送出乱れによる製袋不良などがある。また包装袋に製品を充填する際にも、例えば製品が粉体の場合には粉体の吹き上がりや包装袋のヒートシール部への粉体付着によるシール不良がしばしば問題になっていた。さらにまたICなどの電子部品の包装においては静電気の放電により過電流が流れて電子部品を破壊するというトラブルも起きていた。 Examples of static electricity troubles include printing failure due to film delivery disturbance and ink repulsion, quality deterioration due to dust adhering to the film, electric shock due to discharge from the film to an operator, and bag making failure due to film delivery disturbance. Also, when filling a product into a packaging bag, for example, when the product is a powder, there is often a problem of sealing failure due to powder blowing or powder adhesion to the heat seal portion of the packaging bag. Furthermore, in the packaging of electronic parts such as ICs, there has been a problem that the electronic parts are destroyed due to an overcurrent caused by electrostatic discharge.
このため、従来からポリオレフィン系フィルムに非イオン系、アニオン系、カチオン系などの界面活性剤、いわゆる低分子型帯電防止剤を練り込むことが行われてきた(例えば、特許文献1および2参照)。しかしながらこれらの低分子型帯電防止剤は経時的にフィルム表面に滲出して印刷性やヒートシール性を低下させたり、内容部を汚染するという問題があった。 For this reason, conventionally, nonionic, anionic and cationic surfactants, so-called low molecular weight antistatic agents, have been kneaded into polyolefin films (see, for example, Patent Documents 1 and 2). . However, these low molecular weight antistatic agents have problems that they exude on the film surface over time and deteriorate printability and heat sealability, or contaminate the contents.
このため親水性ブロックを構造中に含む、いわゆる高分子型帯電防止剤(例えば、特許文献3参照)や高分子型帯電防止剤を配合したポリオレフィンフィルム(例えば、特許文献4参照)が提案されていた。多くの場合、高分子型帯電防止剤を使用することにより低分子型帯電防止剤が有する問題は改善されるが、一般に高分子型帯電防止剤は低分子型帯電防止剤に比べて2〜5倍高価であるうえ、添加量も通常10〜20wt%必要で、通常2wt%以下ですむ低分子型帯電防止剤に比べて極めて高コストになるという問題が存在した。他方、ポリオレフィン系包装資材は従来高光沢品が主流であったが、近年は商品に落ち着いた外観や高級感を出すために低光沢品が求められることも多くなり、印刷で低光沢性を付与する場合もある。
本発明は上記従来の問題点に鑑み、高価な高分子型帯電防止剤の使用量を大幅に低減しつつ、様々な静電気トラブルを起こさず、低光沢性を備え、強度とシール性に優れたポリオレフィン系の包装用フィルムを提供することを課題とする。 In view of the above-described conventional problems, the present invention significantly reduces the amount of expensive polymer antistatic agent used, does not cause various static electricity troubles, has low gloss, and has excellent strength and sealing properties. It is an object to provide a polyolefin-based packaging film.
本発明者らは上記課題を解決するため検討を行い、
メルトフローレート(ASTM D1238、190℃、荷重2.16kg)が0.1〜5g/10分、密度(ASTM 1505、23℃)が0.900〜0.940g/cm3である直鎖状低密度ポリエチレン(A)55〜90重量%、メルトフローレート(ASTM D1238、230℃、荷重2.16kg)が5〜100g/10分のポリプロピレン系樹脂(B)5〜25重量%、高分子型帯電防止剤(C)5〜20重量%からなる樹脂組成物
により高分子型帯電防止剤の使用量を低減しながら帯電防止性を維持し、かつ低光沢性、強度とシール性にも優れたポリオレフィン系の包装用フィルムが提供されることを見出して本発明を完成させた。
本発明のポリオレフィン系包装用フィルムは上記樹脂組成物を公知の方法で成形することにより得られる。
The present inventors have studied to solve the above problems,
A linear low having a melt flow rate (ASTM D1238, 190 ° C., load 2.16 kg) of 0.1 to 5 g / 10 min and a density (ASTM 1505, 23 ° C.) of 0.900 to 0.940 g / cm 3 Density polyethylene (A) 55-90 wt%, melt flow rate (ASTM D1238, 230 ° C., load 2.16 kg) 5-100 g / 10 min polypropylene resin (B) 5-25 wt%, polymer type charging Polyolefin that maintains antistatic properties while reducing the amount of polymer antistatic agent used by the resin composition consisting of 5 to 20% by weight of the inhibitor (C), and that is excellent in low gloss, strength and sealability The present invention has been completed by finding that a system packaging film is provided.
The polyolefin-based packaging film of the present invention can be obtained by molding the above resin composition by a known method.
また、本発明のフィルムの表面固有抵抗値は1×1014Ω未満で、グロス(ASTM D523、測定角度20°)は30%未満であることが好ましい。
本フィルムは単層でも多層でもよいが、多層の場合には上記した樹脂組成物からなる層が必須であり、当該層の表面固有抵抗値が1×1014Ω未満、グロス(ASTM D523、測定角度20°)が30%未満であることがことが好ましい。
また、本発明に使用する高分子型帯電防止剤(C)はその構造中にポリエーテルブロックを含有することが望ましい。
Moreover, it is preferable that the surface specific resistance value of the film of the present invention is less than 1 × 10 14 Ω, and the gloss (ASTM D523, measurement angle 20 °) is less than 30%.
This film may be a single layer or a multilayer, but in the case of a multilayer, a layer made of the above-described resin composition is essential, the surface specific resistance value of the layer is less than 1 × 10 14 Ω, gross (ASTM D523, measurement The angle 20 ° is preferably less than 30%.
Moreover, it is desirable that the polymer type antistatic agent (C) used in the present invention contains a polyether block in its structure.
このような本発明のポリオレフィン系包装用フィルムは高分子型帯電防止剤の添加量が通常より少なくてすむので安価であるとともに、優れた帯電防止性能を有し、直鎖状低密度ポリエチレンを使用しているので優れた強度やヒートシール性を備え、低光沢性なので高級感があり商品価値の向上にも寄与するため、食品、日用品、電気製品、電子部品、精密機器、医薬品、米穀類、肥料、樹脂ペレットなど様々な製品の包装資材として使用することができる。 Such a polyolefin-based packaging film of the present invention is inexpensive because the amount of the polymeric antistatic agent added is less than usual, and has excellent antistatic performance and uses a linear low density polyethylene. Because it has excellent strength and heat-sealability and low gloss, it has a high-class feeling and contributes to the improvement of product value, so food, daily necessities, electrical products, electronic parts, precision equipment, pharmaceuticals, rice grains, It can be used as packaging material for various products such as fertilizer and resin pellets.
本発明で使用する直鎖状低密度ポリエチレン(A)はエチレンと炭素原子数4〜12のα−オレフィンとの共重合体であり、具体的なα−オレフィンとしては1−ブテン、4−メチル−1−ペンテン、1−ヘキセン、1−オクテン、1−デセン、1−ドデセン等を用いることができる。直鎖状低密度ポリエチレン(A)のメルトフローレート(ASTM D1238、190℃、荷重2.16kg)は0.1〜5g/10分であり、密度(ASTM 1505、23℃)は0.900〜0.940g/cm3であることが望ましい。
メルトフローレートが0.1(g/10分)以上5(g/10分)以下であるとフィルムの成形性が良好であるため好ましい。密度が0.900g/cm3以上の場合は成形時にフィルムがブロッキングしにくいので好ましく、0.940g/cm3以下であるとヒートシール性が良好であるため好ましい。
The linear low density polyethylene (A) used in the present invention is a copolymer of ethylene and an α-olefin having 4 to 12 carbon atoms. Specific α-olefins include 1-butene and 4-methyl. -1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, and the like can be used. The melt flow rate (ASTM D1238, 190 ° C., load 2.16 kg) of the linear low density polyethylene (A) is 0.1 to 5 g / 10 minutes, and the density (ASTM 1505, 23 ° C.) is 0.900. It is desirably 0.940 g / cm 3 .
A melt flow rate of 0.1 (g / 10 min) or more and 5 (g / 10 min) or less is preferable because the moldability of the film is good. A density of 0.900 g / cm 3 or more is preferred because the film is difficult to block during molding, and a density of 0.940 g / cm 3 or less is preferred because of good heat sealability.
また本発明で使用するポリプロピレン系樹脂(B)はプロピレンの単独重合体またはプロピレンと1種以上の炭素数2〜12(炭素数3を除く)のα−オレフィンとの共重合体であり、例えばプロピレン−エチレン共重合体、プロピレン−ブテン共重合体、プロピレン−エチレンブロック共重合体、プロピレン−ブテンブロック共重合体、プロピレン−エチレン−ブテン共重合体を挙げることができる。
プロピレンとα−オレフィンとの共重合体を用いる場合、α−オレフィン含量は10モル%以下が好ましい。また、プロピレン系ブロック共重合体の23℃におけるデカン可溶部量は5−20wt%の範囲が好ましい。
The polypropylene resin (B) used in the present invention is a homopolymer of propylene or a copolymer of propylene and one or more α-olefins having 2 to 12 carbon atoms (excluding 3 carbon atoms). Mention may be made of propylene-ethylene copolymers, propylene-butene copolymers, propylene-ethylene block copolymers, propylene-butene block copolymers, propylene-ethylene-butene copolymers.
When using a copolymer of propylene and an α-olefin, the α-olefin content is preferably 10 mol% or less. Further, the decane-soluble part amount of the propylene-based block copolymer at 23 ° C. is preferably in the range of 5-20 wt%.
ポリプロピレン系樹脂(B)のメルトフローレート(ASTM D1238、230℃、荷重2.16kg)は5〜100g/10分であることが望ましく、6〜60g/10分であることが更に好ましい。ポリプロピレン系樹脂(B)のメルトフローレートが5g/10分以上であると、フィルムの表面固有抵抗値が通常1×1014Ω以下となり、帯電防止性能の点から好ましい。100g/10分以下であると、フィルムの強度が保たれるため好ましい。 The melt flow rate (ASTM D1238, 230 ° C., load 2.16 kg) of the polypropylene resin (B) is desirably 5 to 100 g / 10 minutes, and more preferably 6 to 60 g / 10 minutes. When the melt flow rate of the polypropylene resin (B) is 5 g / 10 min or more, the surface specific resistance value of the film is usually 1 × 10 14 Ω or less, which is preferable from the viewpoint of antistatic performance. 100 g / 10 min or less is preferable because the strength of the film is maintained.
また本発明で使用する高分子型帯電防止剤(C)はその構造中に親水性のポリエーテルブロック(I)を含むブロックポリマーを好適に用いることが出来る。高分子型帯電防止剤(C)の構造中に含まれるポリエーテル以外のブロック(II)としてはポリオレフィン、ポリアミド、ポリウレタン、ポリエステル、ポリエステルアミドなどのポリマーブロックや、直鎖状あるいは分岐状または環状の二価脂肪族基、不飽和結合や芳香環を含む二価脂肪族基などの中の1種類以上を挙げることができる。ポリエーテルブロック(I)を含む高分子型帯電防止剤(C)としては、特開2001-278985号公報に記載のブロックポリマー化合物を好適に用いることが出来る。中でも、ポリエーテルブロック(I)がエチレングリコール単位からなり、ポリエーテル以外のブロック(II)がポリオレフィンからなるブロックポリマーが好ましい。 The polymer type antistatic agent (C) used in the present invention is preferably a block polymer containing a hydrophilic polyether block (I) in its structure. As the block (II) other than the polyether contained in the structure of the polymer type antistatic agent (C), a polymer block such as polyolefin, polyamide, polyurethane, polyester, polyesteramide, linear, branched or cyclic One or more types among divalent aliphatic groups, divalent aliphatic groups containing unsaturated bonds and aromatic rings, and the like can be mentioned. As the polymer antistatic agent (C) containing the polyether block (I), a block polymer compound described in JP-A-2001-278985 can be suitably used. Among these, a block polymer in which the polyether block (I) is composed of ethylene glycol units and the block (II) other than the polyether is composed of polyolefin is preferable.
ブロックポリマーの構造としては最も単純なI−IIのジブロック型やI−II−IまたはII−I−IIのトリブロック型、さらにテトラブロック型などの直鎖構造のほか、IまたはIIが側鎖として存在するいわゆる櫛型構造や星型構造を挙げることができる。(I)と(II)の各ブロックは通常エステル結合、エーテル結合、アミド結合、ウレタン結合、イミド結合などを介して結合されている。 The structure of the block polymer is the simplest I-II diblock type, I-II-I or II-I-II triblock type, and a linear structure such as a tetrablock type. Examples include so-called comb structures and star structures that exist as chains. Each block of (I) and (II) is usually bonded through an ester bond, an ether bond, an amide bond, a urethane bond, an imide bond, or the like.
高分子型帯電防止剤(C)中に含まれるポリエーテルブロック(I)の割合は通常20〜80重量%であり、好ましくは30〜70重量%である。また高分子型帯電防止剤(C)の数平均分子量(ポリスチレン基準)は通常1000〜60000であり、好ましくは5000〜50000である。従来、ポリオレフィン系フィルム用途で高分子型帯電防止剤を使用する場合、最低でも10重量%、通常15〜20重量%添加しなければ実用レベルの性能は得られなかったが、本発明の場合には高分子型帯電防止剤(C)の量が5〜10重量%でも同等の性能を発現する。より高度な帯電防止性を必要とする場合には、高分子型帯電防止剤(C)の量を20重量%まで増量すればよいが、20重量%を超えるとフィルムの強度が低下するばかりでなく、高コストになることがある。 The proportion of the polyether block (I) contained in the polymer type antistatic agent (C) is usually 20 to 80% by weight, preferably 30 to 70% by weight. The number average molecular weight (polystyrene basis) of the polymeric antistatic agent (C) is usually 1000 to 60000, preferably 5000 to 50000. Conventionally, when a polymer-type antistatic agent is used for polyolefin film applications, a practical level of performance cannot be obtained unless it is added at least 10% by weight, usually 15 to 20% by weight. Exhibits the same performance even when the amount of the polymeric antistatic agent (C) is 5 to 10% by weight. If a higher level of antistatic properties is required, the amount of the polymeric antistatic agent (C) may be increased up to 20% by weight, but if it exceeds 20% by weight, the strength of the film will be lowered. And may be expensive.
また本発明の樹脂組成物は必要に応じて着色剤、核剤、耐候安定剤、紫外線吸収剤、酸化防止剤、難燃剤、可塑剤、スリップ剤、ブロッキング防止剤、防曇剤、防霧剤、防菌剤、防カビ剤等の公知の添加剤を含有することができる。
本発明の包装用フィルムの厚みは、用途にもよるので特に限定されないが、通常10〜200μmである。
In addition, the resin composition of the present invention includes a colorant, a nucleating agent, a weather resistance stabilizer, an ultraviolet absorber, an antioxidant, a flame retardant, a plasticizer, a slip agent, an antiblocking agent, an antifogging agent, and an antifogging agent as necessary. Well-known additives such as antibacterial and antifungal agents can be contained.
The thickness of the packaging film of the present invention is not particularly limited because it depends on the application, but is usually 10 to 200 μm.
本発明の樹脂組成物を製造するにあたってはドライブレンド、メルトブレンド法を用いることが出来る。すなわち、直鎖状低密度ポリエチレン(A)、ポリプロピレン系樹脂(B)、高分子型帯電防止剤(C)をペレットや粉体等固体の状態で混合しておき、成型時に溶融混錬しても良いし、(A)(B)(C)をあらかじめ溶融混錬した組成物を用いることもできる。 In producing the resin composition of the present invention, dry blending or melt blending can be used. That is, linear low density polyethylene (A), polypropylene resin (B), and polymer type antistatic agent (C) are mixed in a solid state such as pellets and powder and melt kneaded at the time of molding. Alternatively, a composition obtained by melt-kneading (A), (B), and (C) in advance can also be used.
本発明の包装用フィルムの成形方法は特に限定されないが、例えばインフレーション成形やTダイ成形を採用することができる。
多層フィルムの場合には、例えば共押出法のほか、ドライラミネート法や押出ラミネート法などを採用すればよく、必要に応じて層間には接着層を設けることができる。本発明の直鎖状低密度ポリエチレンを主成分とする樹脂組成物層以外の層に使用される熱可塑性樹脂の例としては、ポリエチレン、エチレン−α−オレフィン共重合体、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸共重合体、エチレン−メタアクリル酸共重合体、エチレン−アクリル酸エステル共重合体、エチレン−メタアクリル酸エステル共重合体、エチレン−ビニルアルコール共重合体、アイオノマー樹脂、ポリプロピレン、プロピレン−α−オレフィン共重合体、ポリメチルペンテン、ポリブテン、ポリブタジエン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリスチレン、ポリ乳酸、ポリカプロラクトン、ポリブチレンサクシネート、ポリエチレンテレフタレート、ポリアミド等を挙げることができる。本発明の包装用フィルムとそれを構成する各層は、必要に応じて一軸延伸または二軸延伸されていても良く、またその表面に金属アルミニウムやアルミナ、シリカ等の薄膜が形成されていても良い。
The method for forming the packaging film of the present invention is not particularly limited, and for example, inflation molding or T-die molding can be employed.
In the case of a multilayer film, for example, a dry lamination method or an extrusion lamination method may be adopted in addition to the coextrusion method, and an adhesive layer can be provided between the layers as necessary. Examples of the thermoplastic resin used in layers other than the resin composition layer mainly composed of the linear low-density polyethylene of the present invention include polyethylene, ethylene-α-olefin copolymer, ethylene-vinyl acetate copolymer Polymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-acrylic acid ester copolymer, ethylene-methacrylic acid ester copolymer, ethylene-vinyl alcohol copolymer, ionomer resin, polypropylene , Propylene-α-olefin copolymer, polymethylpentene, polybutene, polybutadiene, polyvinyl chloride, polyvinylidene chloride, polystyrene, polylactic acid, polycaprolactone, polybutylene succinate, polyethylene terephthalate, polyamide and the like. The packaging film of the present invention and each layer constituting the packaging film may be uniaxially or biaxially stretched as necessary, and a thin film of metal aluminum, alumina, silica, or the like may be formed on the surface thereof. .
以下、実施例により本発明をさらに説明するが、本発明はこれに限定されるものではない。なお、表面固有抵抗値およびグロスは次の測定法による。
(表面固有抵抗値)
アドバンテスト(株)製 デジタル超高抵抗/微少電流計 R8340Aを使用して、ASTM D257に準拠して、23℃、50%RH、直流電圧500Vの条件にて測定し
た。
(グロス[光沢])
日本電色工業(株)製 グロスメーター VG2000を使用して、ASTM D523に準拠して、測定角度20度の条件にて測定した。
EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not limited to this. The surface resistivity and gloss are measured by the following measurement method.
(Surface specific resistance)
Using a digital ultrahigh resistance / microammeter R8340A manufactured by Advantest Corporation, measurement was performed under the conditions of 23 ° C., 50% RH, and DC voltage 500 V in accordance with ASTM D257.
(Gloss [Glossy])
Using a gloss meter VG2000 manufactured by Nippon Denshoku Industries Co., Ltd., measurement was performed at a measurement angle of 20 degrees in accordance with ASTM D523.
[実施例1]
直鎖状低密度ポリエチレン[エボリュー(登録商標)SP2320 三井化学(株)製、密度(JIS K7112)=919kg/m3、MFR(JIS K7210、190℃)=1.9g/10分]85重量部と、プロピレン−エチレンランダム共重合体[三井ポリプロ(登録商標)J208 三井化学(株)製、MFR(JIS K7210、230℃)=40g/10分](PP−1)10重量部と、ポリエチレングリコールからなるポリエーテルブロックを含有する(ポリエーテルブロックの含有量約50重量%)高分子型帯電防止剤[商品名ペレスタット303 三洋化成製]5重量部をヘンシェルミキサーで混合(ドライブレンド)して樹脂組成物を得た。
[Example 1]
Linear low density polyethylene [Evolue (registered trademark) SP2320, manufactured by Mitsui Chemicals, Ltd., density (JIS K7112) = 919 kg / m3, MFR (JIS K7210, 190 ° C.) = 1.9 g / 10 min], 85 parts by weight , Propylene-ethylene random copolymer [Mitsui Polypro (registered trademark) J208, manufactured by Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 40 g / 10 min] (PP-1) from 10 parts by weight and polyethylene glycol Polyester block containing (polyether block content of about 50% by weight) Polymer type antistatic agent [trade name Perestat 303 manufactured by Sanyo Chemical Co., Ltd.] 5 parts by weight (dry blending) with a Henschel mixer to resin composition I got a thing.
次にこの樹脂組成物を、モダンマシナリー社製のTダイ成形機(ダイ幅:300mm、押出機:40mmφ、L/D=26)を使用して、押出機設定温度:230℃、ダイ設定温度:230℃、チルロール温度:40℃、引取速度:10m/分、片面エアー冷却の条件で成形して、厚み30μmの単層フィルムを得た。このフィルムのチルロール面の表面固有抵抗値とグロスを測定した。結果を表1に示す。 Next, using this resin composition, a T-die molding machine (die width: 300 mm, extruder: 40 mmφ, L / D = 26) manufactured by Modern Machinery Co., Ltd., extruder setting temperature: 230 ° C., die setting temperature : 230 ° C., chill roll temperature: 40 ° C., take-up speed: 10 m / min, molded on the condition of single-sided air cooling to obtain a single-layer film having a thickness of 30 μm. The surface resistivity and gloss of the chill roll surface of this film were measured. The results are shown in Table 1.
[実施例2〜8および比較例1〜8]
樹脂組成物の内容を表1から3に示したものに変更したほかは、実施例1と同様にして30μmの単層フィルムを得た。直鎖状低密度ポリエチレン(LLDPE)と帯電防止剤は実施例1と同じ物を用いた。
それぞれのフィルムにつき表面固有抵抗値とグロスを測定した。結果を表1から表3に示す。
[Examples 2 to 8 and Comparative Examples 1 to 8]
A 30 μm single layer film was obtained in the same manner as in Example 1 except that the content of the resin composition was changed to those shown in Tables 1 to 3. The same linear low density polyethylene (LLDPE) and antistatic agent as in Example 1 were used.
The surface resistivity and gloss of each film were measured. The results are shown in Tables 1 to 3.
PP−2:ポリプロピレン[同上F109V 三井化学(株)製、MFR(JIS K7210、230℃)=33g/10分]
PP−3:プロピレン−エチレンランダム共重合体[同上F329RA 三井化学(株)製、MFR(JIS K7210、230℃)=27g/10分]
PP−4:ポリプロピレン[同上F107BV 三井化学(株)製、MFR(JIS K7210、230℃)=7.3g/10分]
PP−5:プロピレン−エチレンランダム共重合体[同上F337D 三井化学(株)製、MFR(JIS K7210、230℃)=7.0g/10分]
PP−6:プロピレン−エチレンランダム共重合体[同上S229R 三井化学(株)製、MFR(JIS K7210、230℃)=59g/10分]
PP−7:ポリプロピレン[同上F143W 三井化学(株)製、MFR(JIS K7210、230℃)=4.1g/10分]
PP−8:プロピレン−エチレンランダム共重合体[同上MJS468 三井化学(株)製、MFR(JIS K7210、230℃)=1.5g/10分]
LD−1:高圧法低密度ポリエチレン[ミラソン(登録商標)252 三井化学(株)製、密度(JIS K7112)=926kg/m3、MFR(JIS K7210、190℃)=7.5g/10分]
LD−2:高圧法低密度ポリエチレン[同上MV0607 三井化学(株)製、密度(JIS K7112)=926kg/m3、MFR(JIS K7210、190℃)=23g/10分]
EEA−1:エチレン−エチルアクリレート共重合体[エバフレックス−EEA(登録商標)A−701 三井・デュポンポリケミカル(株)製、密度(JIS K7112)=920kg/m3、MFR(JIS K7210、190℃)=5g/10分]
EL−1:ポリオレフィンエラストマー[タフマー(登録商標)A4050 三井化学(
株)製、密度(JIS K7112)=860kg/m3、MFR(JIS K7210、190℃)=4g/10分]
PP-2: Polypropylene [Same as above, F109V, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 33 g / 10 min]
PP-3: Propylene-ethylene random copolymer [same as above F329RA, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 27 g / 10 min]
PP-4: Polypropylene [Same as above F107BV, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 7.3 g / 10 min]
PP-5: Propylene-ethylene random copolymer [F337D made by Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 7.0 g / 10 min]
PP-6: Propylene-ethylene random copolymer [S229R, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 59 g / 10 min]
PP-7: Polypropylene [Same as above, F143W, Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 4.1 g / 10 min]
PP-8: Propylene-ethylene random copolymer [same as MJS468, manufactured by Mitsui Chemicals, MFR (JIS K7210, 230 ° C.) = 1.5 g / 10 min]
LD-1: High-pressure method low-density polyethylene [Mirason (registered trademark) 252, manufactured by Mitsui Chemicals, density (JIS K7112) = 926 kg / m3, MFR (JIS K7210, 190 ° C.) = 7.5 g / 10 min]
LD-2: High-pressure method low-density polyethylene [supplied by MV0607, Mitsui Chemicals, density (JIS K7112) = 926 kg / m3, MFR (JIS K7210, 190 ° C.) = 23 g / 10 min]
EEA-1: Ethylene-ethyl acrylate copolymer [Evaflex-EEA (registered trademark) A-701, manufactured by Mitsui DuPont Polychemical Co., Ltd., density (JIS K7112) = 920 kg / m3, MFR (JIS K7210, 190 ° C. ) = 5g / 10min]
EL-1: Polyolefin Elastomer [Tuffmer (registered trademark) A4050 Mitsui Chemicals (
Co., Ltd., density (JIS K7112) = 860 kg / m3, MFR (JIS K7210, 190 ° C.) = 4 g / 10 min]
本発明により提供される包装用フィルムは、高価な高分子型帯電防止剤の使用量を大幅に削減しても、通常使用量の場合と同等以上の静電気防止効果を有するので、経済的に極めて有利である。また、本発明により提供される包装用フィルムは、低光沢であるので印刷などの後加工を施さなくても高級な外観を有する。これにより本発明により提供される包装用フィルムは電子部品、精密機器、粉体をはじめとする各種製品の包装材料として好適である。 The packaging film provided by the present invention has an antistatic effect equivalent to or higher than that of the normal use amount even if the use amount of the expensive polymer type antistatic agent is greatly reduced. It is advantageous. In addition, the packaging film provided by the present invention has a low-gloss, so that it has a high-grade appearance without post-processing such as printing. Thus, the packaging film provided by the present invention is suitable as a packaging material for various products including electronic parts, precision instruments, and powders.
Claims (6)
〜5g/10分、密度(ASTM 1505、23℃)が0.900〜0.940g/c
m3である直鎖状低密度ポリエチレン(A)55〜90重量%、メルトフローレート(A
STM D1238、230℃、荷重2.16kg)が5〜100g/10分のポリプロ
ピレン系樹脂(B)5〜25重量%、高分子型帯電防止剤(C)5〜20重量%からなる樹脂組成物。 Melt flow rate (ASTM D1238, 190 ° C., load 2.16 kg) is 0.1
~ 5g / 10min, density (ASTM 1505, 23 ° C) is 0.900 to 0.940g / c
m 3 linear low density polyethylene (A) 55-90% by weight, melt flow rate (A
STM D1238, 230 ° C., load 2.16 kg) 5 to 100 g / 10 min of polypropylene resin (B) 5 to 25% by weight, polymer type antistatic agent (C) 5 to 20% by weight .
が30%未満である請求項3に記載の包装用フィルム。 Surface resistivity is less than 1 × 10 14 Ω, gross (ASTM D523, measurement angle 20 °)
The packaging film according to claim 3 , wherein is less than 30%.
が30%未満である請求項5に記載の包装用多層フィルム。
Surface resistivity is less than 1 × 10 14 Ω, gross (ASTM D523, measurement angle 20 °)
The packaging multilayer film according to claim 5 , wherein is less than 30%.
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JP2004090609A (en) * | 2001-12-12 | 2004-03-25 | Daicel Pack Systems Ltd | Antistatic resin laminated sheet |
JP2004018821A (en) * | 2002-06-20 | 2004-01-22 | Sakai Kagaku Kogyo Kk | Antistatic film, antistatic foamed sheet, and antistatic cellular sheet |
JP2004190028A (en) * | 2002-11-29 | 2004-07-08 | Sanyo Chem Ind Ltd | Antistatic resin composition |
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