JP4554492B2 - Manufacturing method of semiconductor package - Google Patents

Description

The present invention relates to a method for manufacturing a semiconductor package for protecting a semiconductor element, and more particularly to a method for manufacturing a semiconductor package capable of preventing internal condensation in a state in which the semiconductor element is accommodated.

  Conventionally, semiconductor packages have been widely used for the purpose of protecting semiconductor elements. A semiconductor package has a structure in which a cavity for housing a semiconductor element is formed in an insulating package body (substrate). The semiconductor device is housed and fixed in this cavity and sealed by a lid member. It is formed. Thus, the semiconductor element can be prevented from being damaged by an external force, and the semiconductor element can be protected from dust, moisture, and the like.

  When the semiconductor device is a light receiving semiconductor device, a daylighting unit is provided in the semiconductor package so that predetermined light can be received in the semiconductor package. For example, if a translucent member such as a glass plate is used as the lid member, this translucent member can be used as the daylighting unit.

  As an example of the structure of the semiconductor device, a light-receiving semiconductor device using a semiconductor element that receives light will be described. Specific examples of the light receiving type semiconductor include a CCD solid-state imaging device and a CMOS image sensor.

  FIG. 5 is a schematic diagram showing an example of a conventional light-receiving semiconductor device 60, in which the upper stage corresponds to a cross-sectional view and the lower stage corresponds to a cross-sectional view of the upper stage.

  As shown in the upper part of FIG. 5, a cavity 20 is formed in a package body 22 made of an insulating material, and a semiconductor element 23 is accommodated in the cavity 20 to constitute a light receiving semiconductor device 60. The semiconductor element 23 is connected to the inner lead 27 through the metal wiring 26 as shown in the lower part of FIG.

  Further, the cavity 20 is sealed with a lid member 25 through an adhesive portion 24 as shown in the upper part of FIG. The adhesive portion 24 can be made of an adhesive known in the technical field of semiconductor devices, and is formed by applying an adhesive to the entire periphery of the cavity 20 and curing it as shown in the lower part of FIG.

  Here, since the light-receiving semiconductor device 60 shown in FIG. 5 is a light-receiving type, a light-transmissive member such as a glass plate is used as the lid member 25. As a result, light incident from the light receiving surface (upper side of the drawing) of the light receiving semiconductor device 60 can be received by the semiconductor element 23.

  By the way, regardless of the light receiving type, in the technical field of semiconductor devices, the inside of the cavity is usually sealed by a lid member in a state where the semiconductor element is accommodated in the semiconductor package. However, when such a cavity is sealed, there is a risk that condensation may occur inside the cavity due to a temperature difference between the outside air temperature and the inside of the cavity.

  In the technical field of semiconductor devices, as a technique for preventing internal dew condensation in a state where a semiconductor element is sealed in a hollow structure, for example, techniques shown in Patent Document 1 and Patent Document 2 can be cited.

  Patent Document 1 discloses a configuration in which a part of the package has air permeability, and more specifically, a part of the sealing portion of the sealing glass member constituting the package having a hollow structure is disclosed. There are disclosed a configuration in which a part of the sealing portion has air permeability without being bonded, and a configuration in which the lead-out portion of the lead member in the package has air permeability.

  In addition, Patent Document 2 discloses a configuration in which a vent is provided in a package so that a hollow portion communicates with the outside, as in Patent Document 1, and this vent hole is a lead frame that serves as an external connection terminal of the package. Is provided. Further, the air hole is provided toward the mounting substrate on which the semiconductor device is mounted.

  As described above, typical techniques for preventing dew condensation in the cavity include (1) a configuration in which a ventilation portion is provided in an adhesive portion for bonding the lid member to the package body, and (2) the periphery of the lead frame or the lead frame itself. There is known a configuration in which a ventilation portion is provided in the base. These techniques are applied to the configuration of the light-receiving semiconductor device 60 shown in FIG. 5, and will be described in detail with reference to FIGS. In FIG. 6, as in FIG. 5, the upper stage is a cross-sectional view of the light-receiving semiconductor device 61, and the lower stage is a plan view corresponding to the cross-sectional view of the upper stage, and FIG. 7 is a light-receiving semiconductor device. FIG. 8 is an enlarged view of the lead frame portion of FIG.

  First, the technique (1) will be described in detail with reference to FIG. 6. As shown in the upper part of FIG. 6, a cavity 20 is formed in the package body 22, and the semiconductor element 23 is accommodated in the cavity 20. Thus, the light receiving semiconductor device 61 is configured. The semiconductor element 23 is connected to the inner lead 28a of the lead member 28 through the metal wiring 26 as shown in the lower part of FIG. Further, the cavity 20 is sealed with a lid member 25 via an adhesive portion 24 as shown in the upper part of FIG. Here, as shown in the lower part of FIG. 6, a part where the adhesive 16 is not intentionally applied is provided in part in the bonding part 24, and this part is used as the ventilation part 11.

  Next, the technique (2) will be described in detail with reference to FIGS. 7 and 8. As shown in FIG. 7, the light receiving semiconductor device 62 includes a package body as in the upper stage of FIG. 5 and the upper stage of FIG. The semiconductor element 23 is accommodated in the cavity 20 of 22, and the lid member 25 is attached and sealed by the bonding portion 24. The semiconductor element 23 is connected to a lead member (including inner leads) 28 through a metal wiring 26.

  Here, the package main body 22 is mainly composed of an insulating material such as resin or ceramics, and the lead member (lead frame) 28 is integrated with the package main body 22 by the low melting point glass 10. Therefore, as shown in FIG. 8, the vent portion 11 having air permeability is formed in the lead-out portion where the lead member 28 and the low melting point glass 10 are in contact with each other without filling the low melting point glass 10.

  Although a technique for forming a ventilation portion in the lead frame itself is not shown, for example, in Patent Document 2, a bottom wall and side walls made of plastic by injection molding are provided on a lead frame provided with a conducting lead and an auxiliary lead. Are integrally formed to form a package body, and through holes are formed in advance in the auxiliary leads to form ventilation holes.

Thus, conventionally, condensation is prevented in the cavity by allowing ventilation between the inside and outside of the cavity.
JP 2002-124589 (released on April 26, 2002) JP2003-152123A (released on May 23, 2003)

  However, in the prior art (1), various problems occur in practice because a part of the adhesive is not applied. Specifically, when the package main body and the lid member are sealed, a part of the adhesive is not intentionally applied, so that the shape of the ventilation portion is not constant and becomes unstable. Moreover, since the adhesion area which affixes a cover member reduces, there exists a possibility that adhesive force may fall. In addition, it is preferable to suppress the thickness of the adhesive portion in order to prevent foreign matter from entering the cavity from the ventilation portion. However, due to the presence of the ventilation portion to which no adhesive is applied, the thickness of the adhesive portion is further suppressed. May cause a decrease in

  Further, in the prior art (2), there is no problem that the adhesive force of the lid member 25 is lowered unlike the prior art (1). However, since the technique (2) requires a precondition that it has a lead frame structure, in other words, the technique (2) can only be applied to a semiconductor package having a lead frame.

The present invention has been made in view of the above-described problem, and even when the cavity has a ventilation portion, the shape of the ventilation portion can be formed stably and stably, and the entry of foreign matter is also effective. Another object of the present invention is to provide a method for manufacturing a semiconductor package that can be prevented and that can be applied even to a structure that does not have a lead frame.

  As a result of intensive studies on the above problems, the present inventor does not simply form the ventilation portion in the semiconductor package, but forms a ventilation hole of a specific shape in the package body that is a part of the semiconductor package. The present inventors have found that problems such as shape instability, prevention of foreign matter contamination, and adaptation to a structure without a lead frame can be effectively solved, and the present invention has been completed.

That is, a semiconductor package formed by the manufacturing method according to the present invention is a semiconductor package including at least a package body in which a cavity capable of accommodating a semiconductor element is formed. In the state where the element is accommodated in the cavity and sealed with the lid member, a ventilation part for allowing the cavity to communicate with the outside is formed in the package body, and the ventilation part is a through hole including a bent structure. It is characterized by.

  According to the said structure, the package main body which adhere | attaches a semiconductor element has a ventilation part of the shape which prevents invasion of a foreign material. Therefore, it is possible to prevent foreign matter from entering the cavity as compared with the case where a straight through hole is simply formed. Moreover, compared to the technique of forming the ventilation portion depending on whether or not the adhesive is applied, not only can the shape of the ventilation portion be constant and the formation of the ventilation portion can be stabilized, but also the adhesive portion to which the lid member is attached Reduction of the bonding area and adjustment of suppression of the thickness of the bonded portion can also be avoided. Further, since the ventilation portion can be formed regardless of the presence or absence of the lead frame, the versatility of the technique can be improved.

  In the semiconductor package, it is preferable that the ventilation portion is formed around the position where the semiconductor element is fixed and at a position corresponding to at least one of a side surface and a bottom surface of the cavity in the package body.

  If it is the said structure, the structure of the semiconductor package concerning this invention can be applied suitably also in a general purpose semiconductor structure.

  In the semiconductor package, when the cavity has a polygonal shape, the ventilation portion may be formed at a position that is a corner of the cavity in the package body.

  According to the above configuration, since the ventilation portion is provided at a position that becomes the corner of the cavity, it is not necessary to provide a holding portion in a portion to which the metal wire is connected. Therefore, since it becomes less susceptible to dew condensation, it is possible to further reduce the size of the semiconductor package.

The method of manufacturing a semiconductor package according to the present invention, the package body is characterized by being formed by stacking a plurality of layers.

  If it is the said structure, since the package main body will be formed by laminating | stacking the layer which consists of a several organic type material (polymer polymer etc.), for example, a hole is formed in each layer and each layer is piled up. By integrating, the ventilation part which has a bending structure can be formed easily and efficiently.

  In the semiconductor package, the cavity may be formed in the package body in advance, or the cavity may be formed by covering the mounting surface of the semiconductor element of the package body with a lid member. Good.

  In any of the above configurations, condensation in the cavity can be effectively prevented as long as at least a ventilation portion is provided in the package body.

The present invention also includes a method for manufacturing a semiconductor device using the semiconductor package. That is, the semiconductor device formed by the manufacturing method according to the present invention is a semiconductor device using any one of the above semiconductor packages.

  The semiconductor device has a light receiving type in which the lid member is a light-transmitting member, and the semiconductor element can be received by the semiconductor element in a state where the semiconductor element is accommodated in the cavity and sealed with the lid member. Also good.

According to the said structure, the structure of the semiconductor package formed by the manufacturing method concerning this invention can be applied suitably also to a light-receiving type semiconductor device.

  Further, in the light receiving semiconductor device, the lid member may further include an optical unit that guides light to the light transmissive member. An example of such an optical means is a lens. In this case, the lid member itself may be a lens holder unit, or the lid member and the lens holder unit may be integrated.

  According to the above configuration, light from the outside can be received by the semiconductor element via the optical element such as a lens. Therefore, the present invention can be suitably applied to various light receiving semiconductor devices, for example, semiconductor devices such as a CCD solid-state imaging device and a CMOS image sensor.

As described above, the semiconductor package formed by the manufacturing method according to the present invention is provided with a ventilation portion serving as a through hole including a bent structure in the package body enclosing the semiconductor element. As described above, the ventilation portion hardly causes dew condensation in the semiconductor package, and since the ventilation portion includes a bent structure, it is possible to prevent foreign matter from entering the cavity.

Moreover, in the semiconductor package formed by the manufacturing method according to the present invention , since the ventilation portion is provided in the package body, the shape of the ventilation portion is compared with the conventional technique in which the ventilation portion is provided in the bonding portion to which the lid member is attached. It can be stabilized and stabilized. Therefore, there is also an effect that it is possible to provide a ventilation portion that surely has a “bending structure” that is a structure that prevents foreign matter from entering.

  Further, since the ventilation portion is not provided in the bonding portion, it is possible not only to avoid a situation in which the bonding area of the bonding portion is reduced, but also to eliminate the need to suppress the thickness of the bonding portion in order to prevent foreign matter from entering. As a result, it is possible to avoid a decrease in the adhesive strength of the adhesive portion (stability of the bonded state of the lid member) and further improve the reliability of the semiconductor package.

  Further, since the ventilation part is formed in the package body, the presence or absence of the lead frame is irrelevant to the formation of the ventilation part. Therefore, the present invention is not limited to a semiconductor package having a lead frame, and has an effect that it can be widely applied to the technical field of semiconductor packages.

  In the present invention, since a stable and predetermined ventilation portion can be provided, condensation in the cavity is effectively prevented. Therefore, it goes without saying that the reliability of the semiconductor device can be maintained under any environment by using the present invention. In addition, since the bonding area of the bonding portion, the type of adhesive, the moisture permeability of the package body, and the like can be ignored, the semiconductor device can be easily designed and the semiconductor device can be downsized. Further, evaluation of dew condensation is not required even in the development of a semiconductor device, and there is also an effect that process management such as adhesive application is facilitated because the package body has air permeability in manufacturing.

[Embodiment 1]
An embodiment of a semiconductor package and a semiconductor device formed by the manufacturing method according to the present invention will be described below with reference to FIGS. Note that the present invention is not limited to this.

An example of a semiconductor device formed by the manufacturing method according to the present invention is as follows. As shown in FIG. 2, glass is bonded to a package body (substrate) 2 in which a cavity 10 and a plurality of ventilation portions 1 are formed by an adhesive portion 4. An example of the light-receiving semiconductor device 30 is a substrate (lid member) 5 bonded thereto. Here, the light receiving type is a configuration in which the semiconductor element 3 is received in the cavity 10 and sealed with the glass substrate 5 so that the semiconductor element 3 can receive light from the outside using the glass substrate 5 as a lighting part. Point to. In addition, the upper stage of FIG. 2 is a sectional view, and the lower stage is a plan view corresponding to the sectional view of the upper stage.

  As shown in the upper part of FIG. 2, the semiconductor element 3 is accommodated in the cavity 10, and this semiconductor element 3 is connected to the inner lead 7 through the metal wire 6 as shown in the lower part of FIG. 2. . The glass substrate 5 functions as a lid member that seals the cavity 10, and also functions as a daylighting unit that receives light emitted from the outside with the semiconductor element 3. The ventilation portion 1 allows the cavity 10 to communicate with the outside in a state where the semiconductor element 3 is accommodated in the cavity 10 and sealed with the glass substrate 5.

  The ventilation part 1 is a tubular through-hole formed in the package body 2, but has a bent structure as shown in FIG. This bent structure functions as a structure that prevents foreign matter from entering from the outside of the light-receiving semiconductor device 30. Although the specific structure of the bending structure is not particularly limited, as shown in FIG. 2, a substantially right-angled bent shape can be exemplified. In such a right-angled bent shape, as will be described later, in a semiconductor package formed by laminating a plurality of layers, it is easily formed simply by forming a linear hole in each layer and aligning the holes. (See FIG. 1).

  Of course, the shape of the ventilation portion 1 is not limited to a right-angled bent shape, but may be a configuration including an arcuate curve, or a configuration including a bent shape having at least one of an acute angle and an obtuse angle. It may be. Thus, the shape of the ventilation part 1 should just contain the bending structure which can trap the foreign material from the outside.

  The ventilation structure included in the ventilation part 1 may be only one, such as the ventilation part 1 in the lower right in the drawing in the upper part of FIG. 2 may be included, or three or more may be included although not shown. The number of the bent structures is appropriately set depending on the formation method of the ventilation portion 1 and the degree of the trap function required for the ventilation portion 1, and is not particularly limited.

  The number of ventilation portions 1 provided in one package body 2 is not particularly limited, and the occurrence of condensation is effective depending on various conditions such as the assumed use environment of the semiconductor device and the size of the cavity 10. It is sufficient to provide a number that can be prevented. In the configuration shown in FIG. 2, the ventilation portions 1 are provided at five locations of the package body 2, but the number of ventilation portions 1 is not limited to five.

  The position where the ventilation portion 1 is formed is not particularly limited. However, as shown in FIG. 2, in the package body 2, the periphery of the position where the semiconductor element 3 is fixed and the side and bottom surfaces of the cavity 10. Any position corresponding to at least one of them may be used. For example, in FIG. 2, the cavity 10 spreads in a planar shape and is a rectangular recess. However, as shown in the upper part of FIG. 2, one air vent is provided on each side surface of the cavity 10 in the cross section of the package body 2. A portion 1 is formed, and three ventilation portions 1 are formed on the bottom surface. Thus, by forming the ventilation part 1 around the semiconductor element 3, it is possible to avoid a state in which outside air flowing into the ventilation part 1 is directly applied to the semiconductor element 3.

  Further, the ventilation portion 1 is formed in at least one position of the side surface or the bottom surface. This means that the ventilation portion depends on mounting conditions such as on which mounting substrate the light receiving semiconductor device 30 is mounted. 1 may be formed at an appropriate or preferable position. Therefore, the degree of freedom at the design stage can be increased with respect to the formation position of the ventilation portion 1.

  As shown in FIG. 2, the ventilation portion 1 may be formed on both the side surface and the bottom surface, but may be only the side surface or only the bottom surface. Moreover, although the formation position of the ventilation part 1 may be based on the opening part on the cavity 10 side of the ventilation part 1, the ventilation part 1 may be designed based on the opening part on the outside side. Depending on the mounting conditions and the like, for example, it may not be necessary to form the ventilation portion 1 on a specific surface of the light receiving semiconductor device 30. Therefore, as in the example shown in FIG. 2, it is possible to design the ventilation portion 1 so that the opening outside the ventilation portion 1 is not positioned below the lower stage of FIG. In the present embodiment, when viewed as a semiconductor device, in consideration of the influence on the semiconductor element 3 to be accommodated, the formation position of the ventilation part 1 on the basis of the position of the opening formed in the cavity 10 However, it is of course not limited to this.

  The cross section of the ventilation part 1 in the extending direction and the shape of the opening are not particularly limited. For example, a circular shape may be sufficient and a polygonal shape may be sufficient. Moreover, the shape of the cross section does not necessarily have to be constant throughout the ventilation part 1. For example, the opening on the outer side may be circular, and the cross section inside the package body 2 and the opening on the cavity 10 side may be square. As will be described later, when the package body 2 is a stacked type, holes that are easy to form are formed in each layer to be stacked, and when the layers are stacked and integrated, the holes communicate with each other as the ventilation portion 1. If it has, the cross-sectional shape of the ventilation part 1 whole may differ. Further, in this case, for example, in a portion connected from a circular hole to a square hole, a portion that is partially discontinuous on the inner peripheral surface as the ventilation portion 1 is generated. The effect may be improved.

  The cross-sectional area of the ventilation part 1, that is, the inner diameter of the ventilation part 1, is not particularly limited, but is preferably 5 μm or more and 300 μm or less, and more preferably 5 μm or more and 100 μm or less. If the inner diameter of the ventilation part 1 is within the above range, not only can the air to the cavity 10 be sufficiently ventilated, but the ventilation part 1 as a “through hole” is small, so that foreign matter can enter the interior more. There is also an effect of becoming difficult.

  As the package main body 2, a general structure formed of a general material in the technical field of semiconductor devices can be suitably used. Needless to say, known special structures and shapes are also applicable to the present invention.

  The material of the semiconductor package 2 is not particularly limited, and a known insulating material can be suitably used. Specific examples include a polymer (resin) such as epoxy, glass epoxy, and ceramics.

  The specific structure of the package body 2 is not particularly limited. For example, the structure shown in FIG. 2 has a configuration in which a substantially square cavity 10 is formed. Further, the glass substrate 5 is attached to the periphery of the cavity 10 so that the adhesive portion 4 can be attached. Although the area corresponding to the margin (area where the bonding portion 4 is provided) is provided, it is of course not limited thereto. Other configurations are also not particularly limited. For example, in the present embodiment, as will be described later, a laminated type in which a plurality of substrate layers are laminated and integrated, including the ease of forming the ventilation portion 1. The structure can be preferably used.

The cavity 10 only needs to be formed in the package body 2 with a shape and size that can accommodate at least the semiconductor element 3. In the example shown in FIG. 2, since the semiconductor element 3 to be accommodated has a substantially square shape, the cavity 10 only needs to be square. Further, it is preferable to provide a certain margin (room) with respect to the size of the semiconductor element 3 for the convenience of forming the ventilation portion 1 or placing the semiconductor element 3 in the cavity 10. The margin may be a known margin in a general semiconductor device. An example of a method for forming the ventilation portion 1 will be specifically described with reference to FIG. In the following description, the package body (substrate) 2 which is an essential configuration of the semiconductor package formed by the manufacturing method according to the present invention is a stacked package (laminated substrate) formed by stacking a plurality of substrate layers. Of course, the present invention is not limited to this.

  The stacked package is formed by stacking and integrating a plurality of substrate layers. Each substrate layer may be made of any material as long as it is an insulating material, and an organic polymer (so-called synthetic resin or plastic), ceramics, or the like can be suitably used. The material of each layer may be the same or different.

  The ventilation portion 1 is formed by forming holes and grooves in each substrate layer and laminating and integrating them to form the ventilation portion 1 including a bent structure in the obtained package body 2. For example, in the configuration shown in FIG. 1, the substrate layer has a four-layer structure including an uppermost layer 2a, an upper intermediate layer 2b, a lower intermediate layer 2c, and a lowermost layer 2d. First, (1) The uppermost layer 2a is provided with a through hole 1e penetrating from the upper surface to the lower surface of the uppermost layer 2a, and the upper intermediate layer 2b is provided with a non-penetrating ventilation groove 1b formed from the outside to the inside. Provide. The ventilation groove 1b is configured such that the position of the outer end matches the through hole 1e of the uppermost layer 2a. Further, the lower intermediate layer 2c is provided with a ventilation groove 1c that does not penetrate from the inside to the outside, separately from the ventilation groove 1d. The ventilation groove 1c has an outer end that is aligned with the inner end of the ventilation groove 1b. When the uppermost layer 2a and the intermediate layers 2b and 2c are laminated, the through hole 1e, the ventilation groove 1b, and the ventilation groove 1c communicate with each other to form the ventilation portion 1 having two bent structures.

  Next, (2) the lower intermediate layer 2c is in contact with the surface (bottom surface) on which the semiconductor element 3 is disposed and from the surface serving as the side surface of the cavity 10 to the outside, for example, a bent structure (refractive structure) A ventilation groove 1d penetrating therethrough is provided. This ventilation groove 1d becomes the ventilation part 1 having two bent structures.

  Further, (3) the lowermost layer 2d is a layer on which the semiconductor element 3 is disposed (a layer serving as the bottom surface of the cavity 10), and the through hole 1a penetrating from the surface (bottom surface) on which the semiconductor element 3 is disposed to the opposite surface. Is provided. For example, if the substrate layer provided with the through holes 1e such as the uppermost layer 2a and the intermediate layers 2b and 2c and the ventilation grooves 1b to 1d is laminated on the through hole 1a, as described in the above (1) It becomes the ventilation part 1 which has a bending structure.

  In this way, each step shown mainly in the above (1) to (3), or a combination of these steps, and by laminating and integrating each substrate layer, the ventilation portion having a bent structure connected from the cavity 10 to the outside 1 can be formed easily.

  Of course, the formation method of the ventilation part 1 is not limited to this, Other methods can also be used according to the kind (in the case of not being a laminated type) of the package main body 2.

  As the semiconductor element 3, an appropriate one is selected according to the application. In the present embodiment, since the semiconductor device is the light receiving semiconductor device 30, various light receiving semiconductor elements may be used. In addition, since the light-receiving semiconductor device 30 according to the present embodiment can be suitably used as, for example, a CCD solid-state imaging device, a CMOS image sensor, or the like, the package body 2 and the glass substrate 5 that is a lid member are also used for that purpose. An appropriate shape and material may be selected.

  Note that the mounting state of the semiconductor element 3 on the package body 2, that is, the configuration of the metal wire 6 and the inner lead 7 is not particularly limited, and the metal wire 6 and the inner lead 7 preferably have a known configuration. Other known methods may be used as the mounting method.

  The glass substrate 5 is not particularly limited as long as it functions as a lid member that can seal (close) the cavity 10 containing the semiconductor element 3. In the present embodiment, since the light receiving semiconductor device 30 is illustrated, the lid member is a translucent member (translucent plate) like the glass substrate 5, but the translucent member is the glass substrate 5. It may be made of a translucent resin. Further, depending on the type of light received, the translucent member may be colored.

  Although the size of the glass substrate 5 is not particularly limited, as shown in the lower part of FIG. 2, the opening of the cavity 10 can be completely blocked and the reliability of the bonded state is not impaired. It is sufficient if the size is such that the adhesion area can be secured in the periphery. In the lower part of FIG. 2, the region of the bonding portion 4 corresponds to the bonding region. The specific size of the adhesion region is not particularly limited, and may be any size (area) within a range known in the field of semiconductor devices.

  The bonding portion 4 for bonding the glass substrate 5 may be formed of various adhesives generally used in the technical field of semiconductor devices. It should be noted that the thickness of the bonding portion 4, the bonding area of the bonding portion 4 to the glass substrate 5 or the package body 2 (that is, the bonding region of the glass substrate 5), etc. The bonding area is not particularly limited and may be set as appropriate according to the material of the semiconductor device, the usage environment, and the like.

  Furthermore, the lid member that closes the cavity 10 is not limited to the glass substrate 5 as shown in FIG. 2, and a member having an appropriate structure can be adopted according to the use of the semiconductor device and the like. For example, as shown in FIG. 3, a light receiving semiconductor device 31 having a configuration in which a lens holder unit 35 is placed on the package body 2 can be cited. In FIG. 3, the upper part is a cross-sectional view of the light receiving semiconductor device 31, and the lower part is a plan view corresponding to the cross-sectional view of the upper part. Further, the semiconductor element 3 is connected to the inner lead 7 through the metal wire 6 as in FIG.

  In the light receiving semiconductor device 31, the package body 2 has a flat plate shape in which the edge of the cavity 10 that receives the glass substrate 5 is not formed, unlike the light receiving semiconductor device 30 shown in FIG. 2. The package body 2 is provided with a portion for mounting the semiconductor element 3 in the center. However, as in the light-receiving semiconductor device 30 shown in FIG. 2, the package body 2 has a recess (dent) corresponding to a cavity in advance. It is not provided.

  However, the lens holder unit 35 that also serves as a lid member is covered with the package body 2 and the lower edge of the lens holder unit 35 and the package body 2 are bonded together by the bonding portion 4 as shown in the upper part of FIG. In addition, the cavity 10 is formed. At this time, as shown in the lower part of FIG. 3, the package body 2 is formed with a ventilation portion 1 having a bent structure. Therefore, when viewed as the entire semiconductor package (or the entire semiconductor device), the light receiving type shown in FIG. Similar to the semiconductor device 30, it has a plurality of ventilation portions 1.

  Thus, in the present invention, the package body 2 only needs to be capable of forming the cavity 10 that accommodates the semiconductor element 3. Therefore, as shown in FIG. As shown in FIG. 3, the cavity 10 is formed by covering the mounting surface of the semiconductor element 3 of the package body 2 with the lid member (in this case, the lens holder unit 35). It may be like this.

  The lens holder unit 35 is a member for holding the lens 36, that is, an optical means holding member. Alternatively, it is possible to regard the lens holder unit 35 as an optical means by regarding that it is integrated with the lens 36. Furthermore, since the glass substrate 5 is integrated as shown in the upper part of FIG. 3, the lens holder unit 35 also functions as a lid member having a daylighting unit. As described above, in the present invention, the lid member may be provided with optical means for guiding light to the translucent member according to the structure and shape of the package body 2 and the application of the semiconductor device. Alternatively, the lid member itself may be integrated with the optical means.

  As the optical means, one lens 36 is used in the present embodiment, but it is of course not limited to this, and an optical system composed of a plurality of lenses may be used. You may become a structure provided with optical members other than a lens. Furthermore, the package body 2 itself has a configuration in which a cavity 10 is formed in advance as shown in FIG. 2, and may have a configuration in which an optical means such as a lens holder unit is attached to the glass member 5. (The eclectic structure of FIGS. 2 and 3).

  In the configuration shown in FIG. 3, the package body 2 does not have a portion corresponding to the side surface of the cavity 10. Therefore, the ventilation portion 1 is not formed on the side surface of the cavity 10, but is formed only on the bottom surface. . In the configuration shown in FIG. 3, the three ventilation portions 1 formed on the bottom surface have the same shape as the ventilation portion 1 formed on the bottom surface of the package body 2 having the configuration shown in FIG. However, the configuration of the entire semiconductor package is not limited to the configuration shown in FIGS. 2 and 3 as long as the ventilation portion 1 including the bent structure is formed. That is, the ventilation part 1 may be formed in a lid member such as the lens holder unit 36.

As described above, in the semiconductor package and the semiconductor device formed by the manufacturing method according to the present invention, the ventilation portion 1 allows the cavity 10 to communicate with the outside by forming the ventilation portion 1 in the package body 2. Therefore, ventilation between the cavity 10 and the outside becomes possible. As a result, a temperature difference between the cavity 10 and the outside is less likely to occur, and condensation within the cavity 10 can be prevented. In addition, since the ventilation portion 1 includes a bent structure, it is difficult for foreign matter to enter the cavity 10 by trapping the bent structure in the bent structure. Therefore, the ventilation part 1 can prevent a foreign material from entering effectively.

  In this embodiment, since the glass substrate 5 (see FIG. 2) and the lens holder unit (see FIG. 3) are used as the lid member, the obtained semiconductor device is a light receiving type in which the semiconductor element 3 receives light. It has become. The present invention can be suitably used also in such a light receiving type semiconductor device.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIG. For convenience of explanation, members having the same functions as those used in the first embodiment are denoted by the same member numbers, and description thereof is omitted.

  As shown in the lower plan view of FIG. 4, a ventilation portion 1 is provided in the package body (substrate) 2. The formation method of the ventilation part 1 is the same as the formation method shown in the first embodiment. As shown in FIG. 4, the position of the ventilation part 1 is formed at a position that becomes the corner of the cavity. Further, the package body 2 is provided with a holding portion having a foreign matter entry preventing shape. When the package body and the lid material are bonded, the distance and parallelism of the lid material can be secured by this holding portion.

  Therefore, it is only necessary to apply an adhesive for the purpose of preventing the entrance of foreign matter and improving the adhesive strength except for the holding portion, and the holding portion is not necessary at the portion where the metal wire 26 is connected, and the package can be downsized. .

  The present invention is not limited to the configurations described above, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments are appropriately combined. The obtained embodiment is also included in the technical scope of the present invention.

As described above, in the semiconductor package formed by the manufacturing method according to the present invention , the package body of the semiconductor package has a foreign matter-preventing ventilation portion. Therefore, it is possible not only to prevent the inside of the hollow structure (cavity) containing the semiconductor element from condensing, but also to prevent foreign matter contamination, improve the reliability of the sealed state, and apply to a type without an inner lead. In addition, the design and size reduction of the semiconductor device can be realized. Therefore, the present invention can be widely used in the field of manufacturing electronic parts such as various storage devices typified by semiconductor devices, and further in the field of electronic and electrical products using these parts.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 illustrates an example of an embodiment of the present invention, and is a perspective view illustrating an example of forming a ventilation portion formed in a package body in a stacked semiconductor package. 1 shows an example of an embodiment of the present invention, the upper diagram is a sectional view showing an example of the configuration of a semiconductor device formed by the manufacturing method according to the present invention, and the lower diagram corresponds to the upper semiconductor device. FIG. An example of embodiment of the present invention is shown, an upper stage figure is a sectional view showing other examples of composition of a semiconductor device formed by a manufacturing method concerning the present invention, and a lower stage figure is an upper stage semiconductor device. It is a corresponding top view. Another example of an embodiment of the present invention is shown, and the upper diagram is a cross-sectional view showing an example of the configuration of a semiconductor device formed by the manufacturing method according to the present invention, and the lower diagram is a diagram of the upper semiconductor device. It is a corresponding top view. An example of a conventional semiconductor device is shown, and an upper diagram is a cross-sectional view showing an example of a configuration of a conventional semiconductor device, and a lower diagram is a plan view corresponding to the upper semiconductor device. The other example of the conventional semiconductor device is shown, the upper part figure is sectional drawing which shows an example of a structure of the conventional semiconductor device, and the lower part figure is a top view corresponding to the upper semiconductor device. It is sectional drawing which shows the other example of the conventional semiconductor device. FIG. 8 is an enlarged cross-sectional view in the vicinity of a lead frame in the conventional semiconductor device shown in FIG. 7.

1, 1a, 1b, 1c, 1d Ventilation part 2 Package body 2a Top layer 2b, 2c Middle layer 2d Bottom layer 3 Semiconductor element 4 Adhesion part 5 Glass substrate (lid member)
6 Metal wire 7 Inner lead 10 Cavity 30, 31, 32 Semiconductor device 35 Lens holder unit (lid member / optical means)
36 Lens (optical means)

Claims (3)

A method of manufacturing a semiconductor package that houses a semiconductor element in a cavity,
Dividing the substrate layer forming the package body into at least an uppermost layer, an intermediate layer, and a lowermost layer, and forming holes or grooves in each substrate layer in advance,
  A ventilation part having a bent structure in which the holes or grooves of each substrate layer of the package body communicate with each other by laminating and integrating the substrate layers in which the holes or grooves are formed, and connect from the inside of the cavity to the outside Forming a step;
A method for manufacturing a semiconductor package, comprising: The vent in the package body, around the position for fixing the semiconductor element, and semiconductor according to claim 1, characterized in that formed in a position corresponding to either at least the side and bottom surfaces of the cavity Package manufacturing method . 2. The method of manufacturing a semiconductor package according to claim 1, wherein when the cavity has a polygonal shape, the ventilation portion is formed at a position at a corner of the cavity in the package body.

Images