JP4433198B2 - High-voltage feedthrough capacitor and magnetron - Google Patents
High-voltage feedthrough capacitor and magnetron Download PDFInfo
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- JP4433198B2 JP4433198B2 JP2005247238A JP2005247238A JP4433198B2 JP 4433198 B2 JP4433198 B2 JP 4433198B2 JP 2005247238 A JP2005247238 A JP 2005247238A JP 2005247238 A JP2005247238 A JP 2005247238A JP 4433198 B2 JP4433198 B2 JP 4433198B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
Description
本発明は、高電圧貫通型コンデンサ、及び、この高電圧貫通型コンデンサを用いたマグネトロンに関する。 The present invention relates to a high-voltage feedthrough capacitor and a magnetron using the high-voltage feedthrough capacitor.
この種の高電圧貫通型コンデンサは、例えば、マグネトロンの発振動作時に発生する不要輻射波を除去するフィルタとして、マグネトロンに組み込まれるもので、一般的な構造は、たとえば、特許文献１などに開示されている。 This type of high-voltage feedthrough capacitor is incorporated in a magnetron as a filter that removes unnecessary radiation generated during the oscillation operation of the magnetron, for example, and a general structure is disclosed in, for example, Patent Document 1 ing.
この種の高電圧貫通型コンデンサでは、接地金具と、貫通導体との間に、高電圧が印加されるから、両者間で十分な絶縁耐圧を確保しなければならない。その手段の１つとして、特許文献１などにも示されているように、接地金具に備えられた浮き上り部の他面側に凹部を設け、この凹部内に筒状の絶縁カバーを嵌め込込むことにより、接地金具と、貫通導体との間に絶縁のための沿面距離を確保している。 In this type of high-voltage feedthrough capacitor, a high voltage is applied between the grounding metal fitting and the through conductor, so that a sufficient dielectric strength must be ensured between the two. As one of the means, as shown in Patent Document 1, etc., a concave portion is provided on the other surface side of the raised portion provided in the grounding metal fitting, and a cylindrical insulating cover is fitted into the concave portion. As a result, a creeping distance for insulation is secured between the grounding metal and the through conductor.
しかし、特許文献１に示された構成によると、絶縁カバーは、接地金具の凹部内に嵌め込まれるになるから、底面積が大きくなる。しかも、絶縁カバーは、沿面距離を確保するため、背の高い筒状に形成されている。このため、接地金具よりも下側の外形を小型化することが困難である。 However, according to the configuration disclosed in Patent Document 1, since the insulating cover is fitted into the recess of the grounding metal, the bottom area is increased. Moreover, the insulating cover is formed in a tall cylindrical shape in order to ensure a creepage distance. For this reason, it is difficult to downsize the outer shape below the grounding metal fitting.
また、特許文献１に示された構成によると、絶縁カバーを接地金具に固定する必要があるために、絶縁樹脂を、コンデンサ部の内部から、絶縁カバーの内部にまで延長するような状態で充填しなればならない。このため、高電圧貫通型コンデンサは、絶縁樹脂の充填量がどうしても多くなりコスト高を招くとともに、絶縁樹脂の熱膨張／収縮の影響を受け易くなり、絶縁樹脂の膨張／収縮に起因する応力の発生、それに伴う絶縁耐圧の低下を招くおそれがある。
本発明の課題は、小型化を実現しコストダウンを図るとともに、信頼性を向上しうる高電圧貫通型コンデンサ、及び、マグネトロンを提供することである。 An object of the present invention is to provide a high-voltage feedthrough capacitor and a magnetron that can achieve downsizing and cost reduction and can improve reliability.
上述した課題を解決するため、本発明に係る高電圧貫通型コンデンサは、コンデンサ部と、接地金具と、絶縁樹脂と、貫通導体と、絶縁カバーと、絶縁チューブとを含む。コンデンサ部は、一面側に２つの分割電極を有し、他面側に共通電極を有し、接地金具の一面上に搭載され、共通電極が接地金具の一面に接続されている。絶縁樹脂は、コンデンサ部の内部に充填されている。貫通導体は、２つであって、それぞれは、接地金具、及び、コンデンサ部の内部を貫通する棒状導体部を有し、分割電極に接続されている。絶縁チューブは、少なくとも一部がコンデンサ部の内部において、貫通導体の棒状導体部に装着されている。 In order to solve the above-described problem, a high-voltage feedthrough capacitor according to the present invention includes a capacitor portion, a grounding fitting, an insulating resin, a through conductor, an insulating cover, and an insulating tube. The capacitor unit has two divided electrodes on one surface side, a common electrode on the other surface side, is mounted on one surface of the grounding metal, and the common electrode is connected to one surface of the grounding metal. The insulating resin is filled in the capacitor portion. There are two through conductors, each of which has a ground metal fitting and a rod-like conductor portion that penetrates the inside of the capacitor portion, and is connected to the divided electrode. At least a part of the insulating tube is attached to the rod-shaped conductor portion of the through conductor inside the capacitor portion.
上述した構成は、この種の高電圧貫通型コンデンサの基本的な構造である。本発明の特徴は、上述した構造において、絶縁カバーの取り付け構造に工夫を加えた点にある。即ち、本発明において、絶縁カバーは、貫通導体の棒状導体部に装着されており、一端が絶縁チューブの一端に連続している。 The configuration described above is the basic structure of this type of high-voltage feedthrough capacitor. The feature of the present invention resides in that, in the structure described above, a device is added to the insulating cover mounting structure. That is, in the present invention, the insulating cover is attached to the rod-shaped conductor portion of the through conductor, and one end is continuous with one end of the insulating tube.
上述した特徴的構成によれば、絶縁カバーは棒状導体部に装着されているから、その装着の態様、及び、厚みに対応して、接地金具と、貫通導体との間の絶縁耐圧を確保することができる。しかも、絶縁カバーは棒状導体部に装着されているから、絶縁カバーの壁面により区画される底面積を最小限にとどめ、高電圧貫通型コンデンサの小型化を実現することができる。 According to the above-described characteristic configuration, since the insulating cover is mounted on the rod-shaped conductor portion, the insulation withstand voltage between the grounding metal fitting and the through conductor is ensured in accordance with the mounting mode and thickness. be able to. Moreover, since the insulating cover is mounted on the rod-shaped conductor portion, the bottom area defined by the wall surface of the insulating cover can be minimized, and the high voltage feedthrough capacitor can be miniaturized.
さらに、絶縁カバーは棒状導体部に装着されているから、絶縁カバーを接地金具に固定する必要がなくなる。すなわち、高電圧貫通型コンデンサは、特許文献１に示したように、コンデンサ部の内部に備えられる絶縁樹脂を、絶縁カバーの内部にまで延長するような状態で充填する必要がなくなる分、絶縁樹脂の充填量を低減し、コストダウンを図ることができるとともに、絶縁樹脂の熱膨張／収縮の影響を受け難くなり、信頼性を向上することができる。 Furthermore, since the insulating cover is attached to the rod-shaped conductor, it is not necessary to fix the insulating cover to the grounding metal fitting. In other words, as shown in Patent Document 1, the high-voltage feed-through type capacitor does not need to be filled with the insulating resin provided in the capacitor portion so as to extend to the inside of the insulating cover. In addition to reducing the filling amount, the cost can be reduced, and the thermal expansion / contraction of the insulating resin is hardly affected, so that the reliability can be improved.
本発明に係る高電圧貫通型コンデンサは、その好ましい一態様として、絶縁カバーと、絶縁チューブとの連続部分が、絶縁樹脂の内部に埋設される。この構造によれば、絶縁カバーを絶縁樹脂により確実に保持することができる。 As a preferable aspect of the high-voltage feedthrough capacitor according to the present invention, a continuous portion of the insulating cover and the insulating tube is embedded in the insulating resin. According to this structure, the insulating cover can be reliably held by the insulating resin.
もう一つの好ましい態様として、絶縁カバーと絶縁チューブとの連続部分は嵌合されていてもよい。この構造によれば、絶縁カバーと絶縁チューブの嵌合により、両者の連続部分から、絶縁樹脂が棒状導体部の表面に浸入する不都合を回避し、もって、絶縁チューブ、又は、絶縁カバーが、貫通導体から脱落する不都合を回避することができる。 As another preferred embodiment, the continuous portion of the insulating cover and the insulating tube may be fitted. According to this structure, it is possible to avoid the inconvenience that the insulating resin enters the surface of the rod-like conductor portion from the continuous portion of the insulating cover and the insulating tube, and the insulating tube or the insulating cover penetrates. The inconvenience of falling off the conductor can be avoided.
本発明に係るマグネトロンは、上述した高電圧貫通型コンデンサを、フィルタとして用いるので、本発明に係る高電圧貫通型コンデンサの有する利点が、そのまま発揮されることになる。 Since the magnetron according to the present invention uses the above-described high-voltage feedthrough capacitor as a filter, the advantages of the high-voltage feedthrough capacitor according to the present invention are exhibited as they are.
本発明の他の目的、構成及び利点については、添付図面を参照し、更に詳しく説明する。添付図面は、単に、例示に過ぎない。 Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.
以上述べたように、本発明によれば、小型化を実現しコストダウンを図るとともに、信頼性を向上しうる高電圧貫通型コンデンサ、及び、マグネトロンを提供することができる。 As described above, according to the present invention, it is possible to provide a high-voltage feedthrough capacitor and a magnetron that can be reduced in size and reduced in cost and can improve reliability.
図１は本発明の一実施形態に係る高電圧貫通型コンデンサの組み立て構造を示す斜視図、図２は図１に示した高電圧貫通型コンデンサの組み立て状態を示す平面図、図３は図２の３−３線に沿った一部断面図、図４は図２の４−４線に沿った一部断面図である。 1 is a perspective view showing an assembly structure of a high voltage feedthrough capacitor according to an embodiment of the present invention, FIG. 2 is a plan view showing an assembled state of the high voltage feedthrough capacitor shown in FIG. 1, and FIG. FIG. 4 is a partial sectional view taken along line 4-4 of FIG.
図１乃至図４を参照すると、本発明の一実施形態に係る高電圧貫通型コンデンサは、コンデンサ部１０と、接地金具２０と、絶縁ケース３０と、第１及び第２の絶縁樹脂４１、４２と、貫通導体５１、５２と、絶縁チューブ６１、６２と、絶縁カバー７１、７２とを含む。 Referring to FIGS. 1 to 4, a high-voltage feedthrough capacitor according to an embodiment of the present invention includes a capacitor unit 10, a grounding metal 20, an insulating case 30, and first and second insulating resins 41 and 42. And through conductors 51 and 52, insulating tubes 61 and 62, and insulating covers 71 and 72.
コンデンサ部１０は、誘電体磁器素体１１と、２つの分割電極１２、１３と、共通電極１４とを有する。誘電体磁器素体１１には、２つの貫通孔１５、１６が併設されている。誘電体磁器素体１１の組成は、任意である。例えば、BaTiO3−BaZrO3−CaTiO3を主成分とし、一種または複数種の添加物を含む組成とすることができる。誘電体磁器素体１１は、機械的応力、及び、電気的応力の集中を避けるため、全体として適度なＲ（丸み）を付けることが好ましい。 The capacitor unit 10 includes a dielectric ceramic body 11, two divided electrodes 12 and 13, and a common electrode 14. Two through holes 15 and 16 are provided in the dielectric ceramic body 11. The composition of the dielectric ceramic body 11 is arbitrary. For example, it is possible to a main component BaTiO 3 -BaZrO 3 -CaTiO 3, a composition comprising one or more additives. It is preferable that the dielectric ceramic body 11 has an appropriate R (roundness) as a whole in order to avoid concentration of mechanical stress and electrical stress.
分割電極１２、１３は、貫通孔１５、１６の開口する領域を囲うようにして、誘電体磁器素体１１の一面側に備えられている。分割電極１２、１３のそれぞれは、凹部１７により、間隔が隔てられている。図示は省略するが、凹部１７の代わりに凸部としてもよい。凹部１７は、分割電極１２、１３の間の沿面距離を増大させるためのものであるから、その幅や深さは、必要な沿面距離が確保できるように選定される。共通電極１４は、誘電体磁器素体１１の他面側に備えられている。 The divided electrodes 12 and 13 are provided on one surface side of the dielectric ceramic body 11 so as to surround a region where the through holes 15 and 16 are opened. Each of the divided electrodes 12 and 13 is spaced apart by a recess 17. Although not shown, a convex portion may be used instead of the concave portion 17. Since the concave portion 17 is for increasing the creepage distance between the divided electrodes 12 and 13, the width and depth thereof are selected so that a necessary creepage distance can be secured. The common electrode 14 is provided on the other surface side of the dielectric ceramic body 11.
上述したコンデンサ部１０は、接地金具２０の一面上に搭載され、共通電極１４が接地金具２０の一面に接続されている。より詳細に説明すると、図示する接地金具２０は、例えば、鉄材、銅、真鍮等の導電性金属材料からなり、浮き上り部２１と、凹部２２と、貫通孔２３とを有する。浮き上り部２１は接地金具２０の一面側に立ち上がり、凹部２２は接地金具２０の他面側において、浮き上り部２１に対応する位置に備えられている。貫通孔２３は、浮き上り部２１の面内において、接地金具２０を一面側から他面側に貫通している。浮き上り部２１の上には、コンデンサ部１０が搭載されており、コンデンサ部１０は、共通電極１４が浮き上り部２１の面上に、例えば、はんだ付などの手段によって、電気的、機械的に接続固定されている。 The capacitor unit 10 described above is mounted on one surface of the grounding metal 20, and the common electrode 14 is connected to one surface of the grounding metal 20. If it demonstrates in detail, the earthing | grounding metal fitting 20 shown in figure consists of conductive metal materials, such as iron material, copper, brass, etc., for example, and has the floating part 21, the recessed part 22, and the through-hole 23. FIG. The raised portion 21 rises on one surface side of the grounding metal 20, and the recess 22 is provided on the other surface side of the grounding metal 20 at a position corresponding to the raised portion 21. The through hole 23 penetrates the ground metal fitting 20 from the one surface side to the other surface side in the surface of the floating portion 21. The capacitor unit 10 is mounted on the floating portion 21, and the capacitor portion 10 is electrically and mechanically mounted on the surface of the floating portion 21 by means of, for example, soldering. The connection is fixed.
絶縁ケース３０は、例えば、ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）あるいは変性メラミン等で構成でき、接地金具２０の一面側に備えられ、一端が浮き上り部２１の外周に挿着されている。 The insulating case 30 can be made of, for example, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), modified melamine, or the like, and is provided on one surface side of the grounding metal 20, and one end is inserted into the outer periphery of the floating portion 21. Yes.
貫通導体５１、５２は、２つであって、例えば、鉄材、銅、真鍮等の導電性金属材料からなる。図示する貫通導体５１は、棒状導体部５１１と、タブ接続子として用いられるタブ端子部５１２とを有しており、棒状導体部５１１と、タブ端子部５１２とが、かしめ５１３により接続されている。同様に、貫通導体５２は、棒状導体部５２１と、タブ端子部５２２とを有しており、棒状導体部５２１と、タブ端子部５２２とが、かしめ５２３により接続されている。 The through conductors 51 and 52 are two, and are made of, for example, a conductive metal material such as iron, copper, or brass. The through conductor 51 shown in the figure has a rod-shaped conductor portion 511 and a tab terminal portion 512 used as a tab connector, and the rod-shaped conductor portion 511 and the tab terminal portion 512 are connected by a caulking 513. . Similarly, the through conductor 52 includes a rod-shaped conductor portion 521 and a tab terminal portion 522, and the rod-shaped conductor portion 521 and the tab terminal portion 522 are connected by a caulking 523.
貫通導体５１、５２は、棒状導体部５１１、５１２が、電極接続体５３、５４、コンデンサ部１０の貫通孔１５、１６、及び、接地金具２０の貫通孔２３を貫通するとともに、タブ端子部５１２、５２２の基部が電極接続体５３、５４に半田付け等の手段により固着され、電極接続体５３、５４を介して、分割電極１２、１３に電気的、機械的に接続されている。 In the through conductors 51 and 52, the rod-like conductor portions 511 and 512 penetrate the electrode connecting bodies 53 and 54, the through holes 15 and 16 of the capacitor portion 10, and the through hole 23 of the grounding metal member 20, and the tab terminal portion 512. The base portion of 522 is fixed to the electrode connection bodies 53 and 54 by means such as soldering, and is electrically and mechanically connected to the divided electrodes 12 and 13 via the electrode connection bodies 53 and 54.
棒状導体部５１１、５１２は、少なくとも、コンデンサ部１０の貫通孔１５、１６を貫通する部分が、絶縁チューブ６１、６２によって被覆されている。具体的に、絶縁チューブ６１、６２のそれぞれは、例えば、シリコーンゴム等により構成されており、少なくとも一部がコンデンサ部１０の内部において、棒状導体部５１１、５２１に装着されるとともに、第１の絶縁樹脂４１に埋設されている。 The rod-shaped conductor portions 511 and 512 are covered with insulating tubes 61 and 62 at least at portions that penetrate the through holes 15 and 16 of the capacitor portion 10. Specifically, each of the insulating tubes 61 and 62 is made of, for example, silicone rubber, and at least a part of the insulating tubes 61 and 62 is attached to the rod-shaped conductor portions 511 and 521 inside the capacitor portion 10, and the first tube It is embedded in the insulating resin 41.
第１の絶縁樹脂４１は、コンデンサ部１０の内部から、接地金具２０の貫通孔２３の内部まで充填されている。一方、第２の絶縁樹脂４２は、コンデンサ部１０の周囲に充填されている。すなわち、第２の絶縁樹脂４２は、絶縁ケース３０の内部であって、接地金具２０の一面から、かしめ５１３、５２３を覆う位置まで充填されている。第１及び第２の絶縁樹脂４１、４２としては、例えば、ウレタン樹脂、エポキシ樹脂等の熱硬化性樹脂や、フェノール樹脂や、シリコーン樹脂等を用いることができる。 The first insulating resin 41 is filled from the inside of the capacitor unit 10 to the inside of the through hole 23 of the grounding metal piece 20. On the other hand, the second insulating resin 42 is filled around the capacitor unit 10. That is, the second insulating resin 42 is filled from the one surface of the grounding metal fitting 20 to the position covering the caulking 513 and 523 inside the insulating case 30. As the first and second insulating resins 41 and 42, for example, thermosetting resins such as urethane resins and epoxy resins, phenol resins, silicone resins, and the like can be used.
上述した構造は、この種の高電圧貫通型コンデンサにおいて、一般に知られているところである。本発明の一実施形態に係る高電圧貫通型コンデンサの特徴は、上述した高電圧貫通型コンデンサの基本的構成を前提とした、絶縁カバー７１、７２の取り付け構造にある。この点について、さらに図５を参照して詳しく説明する。図５は、図４に示した高電圧貫通型コンデンサにおいて、一点鎖線で円状に囲んだ領域ａを拡大して示す図である。 The structure described above is generally known in this type of high-voltage feedthrough capacitor. The high-voltage feedthrough capacitor according to the embodiment of the present invention is characterized in that the insulating covers 71 and 72 are attached based on the basic configuration of the high-voltage feedthrough capacitor described above. This point will be further described in detail with reference to FIG. FIG. 5 is an enlarged view of a region a circled by an alternate long and short dash line in the high-voltage feedthrough capacitor shown in FIG.
図５を参照すると、絶縁カバー７１、７２のそれぞれは、好ましくは、ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）あるいは変性メラミン等で構成されている筒状体、又は、管状体であって、接地金具２０の他面側において、棒状導体部５１１、５２１の一部を覆うように装着されているとともに、その一端が絶縁チューブ６１、６２の一端に連続して備えられている。具体的には、絶縁カバー７１、７２のそれぞれは、一端の内周に段部７１０、７２０を有しており、段部７１０、７２０を先端にして棒状導体部５１１、５２１に取り付けられている。絶縁チューブ６１、６２は、その一端に段部７１０、７２０が外側から密着して嵌め合わされ、絶縁チューブ６１、６２の一端が、絶縁カバー７１、７２の一端により外側から部分的に覆われている。 Referring to FIG. 5, each of the insulating covers 71 and 72 is preferably a cylindrical body or a tubular body made of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), modified melamine, or the like. The other end of the grounding metal 20 is mounted so as to cover a part of the rod-shaped conductor portions 511 and 521, and one end thereof is provided continuously to one end of the insulating tubes 61 and 62. Specifically, each of the insulating covers 71 and 72 has step portions 710 and 720 on the inner periphery of one end, and is attached to the rod-like conductor portions 511 and 521 with the step portions 710 and 720 as the tips. . The insulating tubes 61, 62 are fitted with the step portions 710, 720 in close contact with each other from the outside, and one ends of the insulating tubes 61, 62 are partially covered from the outside by one ends of the insulating covers 71, 72. .
コンデンサ部１０の内部から、接地金具２０の貫通孔２３の内部まで充填される第１の絶縁樹脂４１は、絶縁チューブ６１、６２の一端と、絶縁カバー７１、７２の一端とが連続して嵌合される部分に限って見ると、両者の連続部分を覆うように充填される。 The first insulating resin 41 filled from the inside of the capacitor unit 10 to the inside of the through hole 23 of the ground metal fitting 20 is fitted with one end of the insulating tubes 61 and 62 and one end of the insulating covers 71 and 72 continuously. When viewed only in the part to be combined, it is filled so as to cover the continuous part of both.
図３乃至図５に示す高電圧貫通型コンデンサにおいて、段部７１０、７２０は絶縁カバー７１、７２のみに備えられているが、絶縁チューブ６１、６２の一端に段部を形成することができる。また、絶縁カバー７１、７２の一端と、絶縁チューブ６１、６２の一端とのそれぞれに、相互に嵌合可能な段部を形成することもできる。 In the high-voltage feedthrough capacitor shown in FIGS. 3 to 5, the step portions 710 and 720 are provided only in the insulating covers 71 and 72, but a step portion can be formed at one end of the insulating tubes 61 and 62. Moreover, the step part which can be mutually fitted can also be formed in the end of the insulation covers 71 and 72 and the end of the insulation tubes 61 and 62, respectively.
上述した特徴的構成によれば、絶縁カバー７１、７２は、筒状、又は、管状であって、棒状導体部５１１、５２１の一部を覆うように装着されているから、絶縁カバー７１、７２の装着の態様、及び、厚みに対応する量的限度で、接地金具２０と、貫通導体５１、５２との間の絶縁耐圧を確保することができる。 According to the characteristic configuration described above, the insulating covers 71 and 72 are tubular or tubular and are mounted so as to cover a part of the rod-shaped conductor portions 511 and 521. The withstand voltage between the grounding metal fitting 20 and the through conductors 51 and 52 can be ensured with a quantitative limit corresponding to the mounting mode and thickness.
しかも、絶縁カバー７１、７２は、棒状導体部５１１、５２１に装着されているから、絶縁カバー７１、７２の壁面により区画される底面積を最小限にとどめることにより、高電圧貫通型コンデンサの小型化を実現することができる。 In addition, since the insulating covers 71 and 72 are attached to the rod-shaped conductor portions 511 and 521, miniaturization of the high-voltage feedthrough capacitor can be achieved by minimizing the bottom area defined by the wall surfaces of the insulating covers 71 and 72. Can be realized.
また、絶縁カバー７１、７２は、棒状導体部５１１、５２１を覆っているから、絶縁カバー７１、７２を接地金具２０に固定する必要がなくなる。すなわち、本発明の一実施形態に係る高電圧貫通型コンデンサにおいては、特許文献１に示したように、第１の絶縁樹脂４１を、コンデンサ部１０の内部から、絶縁カバー７１、７２の内部にまで延長するような状態で充填する必要がなくなる分、第１の絶縁樹脂４１の充填量を低減し、コストダウンを図ることができるとともに、絶縁樹脂の熱膨張／収縮の影響を受け難くなり、信頼性を向上することができる。 Further, since the insulating covers 71 and 72 cover the rod-shaped conductor portions 511 and 521, it is not necessary to fix the insulating covers 71 and 72 to the grounding metal 20. That is, in the high-voltage feedthrough capacitor according to the embodiment of the present invention, as shown in Patent Document 1, the first insulating resin 41 is placed from the inside of the capacitor unit 10 to the inside of the insulating covers 71 and 72. The amount of filling of the first insulating resin 41 can be reduced and the cost can be reduced, and the thermal expansion / contraction of the insulating resin is less likely to be affected. Reliability can be improved.
さらに、本発明の一実施形態に係る高電圧貫通型コンデンサにおいて、絶縁カバー７１、７２の一端は、絶縁チューブ６１、６２の一端に連続しており、両者の連続部分が、第１の絶縁樹脂４１の内部に埋設されているから、絶縁カバー７１、７２を第１の絶縁樹脂４１により確実に保持することができる。 Furthermore, in the high-voltage feedthrough capacitor according to the embodiment of the present invention, one end of the insulating covers 71 and 72 is continuous with one end of the insulating tubes 61 and 62, and the continuous part of both is the first insulating resin. The insulating covers 71 and 72 can be reliably held by the first insulating resin 41 because they are embedded in the interior 41.
しかも、絶縁カバー７１、７２と、絶縁チューブ６１、６２との連続部分は、段部７１０、７２０により相互に密着して嵌合されているから、第１の絶縁樹脂４１が両者の連続部分から棒状導体部５１１、５２１の表面に浸入することがない。このため、絶縁チューブ６１、６２、又は、絶縁カバー７１、７２が、貫通導体５１、５２から脱落する不都合を回避することができる。 Moreover, since the continuous portions of the insulating covers 71 and 72 and the insulating tubes 61 and 62 are closely attached to each other by the step portions 710 and 720, the first insulating resin 41 is removed from the continuous portions of both. It does not enter the surfaces of the rod-like conductor portions 511 and 521. For this reason, the inconvenience that the insulating tubes 61 and 62 or the insulating covers 71 and 72 fall off from the through conductors 51 and 52 can be avoided.
図１及び図５に示した構成によると、絶縁カバー７１、７２は、棒状導体部５１１、５２１に備えられるから、高電圧貫通型コンデンサにおける絶縁カバー７１、７２の組み込み作業を容易に行うことができる。 According to the configuration shown in FIGS. 1 and 5, since the insulating covers 71 and 72 are provided in the rod-shaped conductor portions 511 and 521, the assembling work of the insulating covers 71 and 72 in the high voltage feedthrough capacitor can be easily performed. it can.
次に、図６を参照し、高電圧貫通型コンデンサのもう一つの実施形態を説明する。図６は、本発明のもう一つの実施形態に係る高電圧貫通型コンデンサについて一部を拡大して示す図である。図６において、図１乃至図５に現れた構成部分に相当する部分については、同一の参照符号を付してある。 Next, another embodiment of the high-voltage feedthrough capacitor will be described with reference to FIG. FIG. 6 is an enlarged view showing a part of a high-voltage feedthrough capacitor according to another embodiment of the present invention. In FIG. 6, parts corresponding to the constituent parts appearing in FIGS. 1 to 5 are denoted by the same reference numerals.
図６の実施形態では、絶縁カバー７１、７２の一端と、絶縁チューブ６１、６２の一端との連続部分が、段部７１０、７２０により嵌合されており、両者の連続部分が、第１の絶縁樹脂４１の内部に埋設されている点では、図５の実施形態と同じであるが、図５の実施形態と異なって、段部７１０、７２０が、絶縁カバー７１、７２の一端の外周側に備えられている。すなわち、図６の実施形態において、段部７１０、７２０は、絶縁チューブ６１、６２の一端の内周に密着して嵌め込まれ、絶縁カバー７１、７２の一端が、絶縁チューブ６１、６２の一端により外側から部分的に覆われている。このような構造であっても、図１乃至図５に示した実施形態と同程度の作用効果が得られる。 In the embodiment of FIG. 6, a continuous portion between one end of the insulating covers 71 and 72 and one end of the insulating tubes 61 and 62 is fitted by the step portions 710 and 720, and both continuous portions are the first portion. The embodiment is the same as the embodiment of FIG. 5 in that it is embedded in the insulating resin 41, but unlike the embodiment of FIG. 5, the stepped portions 710 and 720 are on the outer peripheral side of one end of the insulating covers 71 and 72. Is provided. That is, in the embodiment of FIG. 6, the step portions 710 and 720 are fitted in close contact with the inner periphery of one end of the insulating tubes 61 and 62, and one end of the insulating covers 71 and 72 is inserted by one end of the insulating tubes 61 and 62. It is partially covered from the outside. Even with such a structure, the same effect as the embodiment shown in FIGS. 1 to 5 can be obtained.
図７は本発明のさらにもう一つの実施形態に係る高電圧貫通型コンデンサの平面図、図８は図７の８−８線に沿った一部断面図、図９は図７の９−９線に沿った一部断面図である。図７乃至図９において、図１乃至図６に現れた構成部分に相当する部分については、同一の参照符号を付してある。 7 is a plan view of a high-voltage feedthrough capacitor according to still another embodiment of the present invention, FIG. 8 is a partial cross-sectional view taken along line 8-8 in FIG. 7, and FIG. 9 is 9-9 in FIG. It is a partial sectional view along a line. 7 to 9, parts corresponding to those shown in FIGS. 1 to 6 are given the same reference numerals.
図７乃至図９に示す実施形態に係る高電圧貫通型コンデンサの特徴は、図１乃至図６を参照して説明した高電圧貫通型コンデンサの構成を前提として、絶縁ケース３０の構造と、これに対する貫通導体５１、５２の相対関係について工夫を加えた点にある。即ち、本実施形態において、絶縁ケース３０は、内面側に支持部３１〜３４を備え、支持部３１〜３４により、貫通導体５１、５２のタブ端子部５１２、５２２が固定されている。 The features of the high-voltage feedthrough capacitor according to the embodiment shown in FIGS. 7 to 9 are based on the structure of the insulating case 30 based on the configuration of the high-voltage feedthrough capacitor described with reference to FIGS. This is in that a device is added to the relative relationship between the through conductors 51 and 52. That is, in this embodiment, the insulating case 30 includes support portions 31 to 34 on the inner surface side, and the tab terminal portions 512 and 522 of the through conductors 51 and 52 are fixed by the support portions 31 to 34.
具体的には、タブ端子部５１２の幅方向の両側に位置する絶縁ケース３０の内面に、その上端面から間隔をおいて、支持部３１、３２を設け、支持部３１、３２により、タブ端子部５１２の幅方向の両側を、厚み方向の両面、及び、側端面から支持するようになっている。タブ端子部５２２に関しても、その幅方向の両側に位置する絶縁ケース３０の内面に、その上端面から間隔をおいて、支持部３３、３４を設け、支持部３３、３４により、タブ端子部５２２の幅方向の両側を、厚み方向の両面、及び、側端面から支持するようになっている。 Specifically, support portions 31 and 32 are provided on the inner surface of the insulating case 30 located on both sides in the width direction of the tab terminal portion 512 at a distance from the upper end surface. Both sides in the width direction of the portion 512 are supported from both sides in the thickness direction and side end faces. Also with respect to the tab terminal portion 522, support portions 33 and 34 are provided on the inner surface of the insulating case 30 located on both sides in the width direction at a distance from the upper end surface, and the tab terminal portion 522 is provided by the support portions 33 and 34. Both sides in the width direction are supported from both sides in the thickness direction and side end faces.
図７乃至図９に示す実施形態では、絶縁カバー７１、７２の一端と、絶縁チューブ６１、６２の一端とが相互に連続して嵌合されている点では、図１乃至図６の実施形態と同じであるから、図１乃至図６に示した実施形態と同程度の作用効果が得られる。 In the embodiment shown in FIGS. 7 to 9, the embodiment of FIGS. 1 to 6 is such that one end of the insulating covers 71 and 72 and one end of the insulating tubes 61 and 62 are continuously fitted to each other. Therefore, the same effects as those of the embodiment shown in FIGS. 1 to 6 can be obtained.
さらに、図７乃至図９に示す実施形態では、絶縁ケース３０は、内面側に支持部３１〜３４を備え、支持部３１〜３４によりのタブ端子部５１２、５２２が固定されているから、マグネトロン側の接続子が接続されるタブ端子部５１２、５２２の機械的強度を、絶縁ケース３０の内面側に設けられた支持部３１〜３４によって、確保することができる。このため、絶縁ケース３０の内部において、コンデンサ部１０の周りに充填される第２の絶縁樹脂４２の充填量を低減した場合でも、貫通導体５１、５２に関しては、十分な機械的強度を確保し得る。したがって、貫通導体５１、５２に対する機械的補強作用を増大させながら、第２の絶縁樹脂４２の充填量を低減させ、充填量削減に伴う応力の緩和、信頼性の向上、更には、コストダウンを図ることが可能になる。 Further, in the embodiment shown in FIGS. 7 to 9, the insulating case 30 includes support portions 31 to 34 on the inner surface side, and the tab terminal portions 512 and 522 by the support portions 31 to 34 are fixed. The mechanical strength of the tab terminal portions 512 and 522 to which the side connector is connected can be ensured by the support portions 31 to 34 provided on the inner surface side of the insulating case 30. Therefore, even when the filling amount of the second insulating resin 42 filled around the capacitor unit 10 is reduced inside the insulating case 30, sufficient mechanical strength is ensured for the through conductors 51 and 52. obtain. Therefore, while increasing the mechanical reinforcing action on the through conductors 51 and 52, the filling amount of the second insulating resin 42 is reduced, the stress accompanying the reduction of the filling amount is reduced, the reliability is improved, and the cost is reduced. It becomes possible to plan.
具体的には、通常、第２の絶縁樹脂４２は、図１乃至図６に示したように、タブ端子部５１２、５１３において、かしめ５１３、５２３を覆う程度の位置まで充填する必要があったが、図７乃至図９に示す実施形態によれば、第２の絶縁樹脂４２は、表面位置が、かしめ５１３、５２３が露出する位置まで低減することができる。 Specifically, normally, as shown in FIGS. 1 to 6, the second insulating resin 42 has to be filled up to a position that covers the caulking 513 and 523 in the tab terminal portions 512 and 513. However, according to the embodiment shown in FIGS. 7 to 9, the surface position of the second insulating resin 42 can be reduced to a position where the caulking 513, 523 is exposed.
図１乃至図９を参照して説明した高電圧貫通型コンデンサは、陰極ステムや、フィルタボックス等と組み合わされて、マグネトロンを構成する。次に、本発明の一実施形態に係る高電圧貫通型コンデンサを用いたマグネトロンについて説明する。図１０は本発明の一実施形態に係るマグネトロンの一途を破断して示す図、図１１は図１０に示したマグネトロンの電気回路図である。図１０は、例えば、電子レンジ用のマグネトロンを示し、高電圧貫通型コンデンサ１と、陰極ステム８１と、フィルタボックス９１とを含む。 The high-voltage feedthrough capacitor described with reference to FIGS. 1 to 9 constitutes a magnetron in combination with a cathode stem, a filter box, and the like. Next, a magnetron using a high voltage feedthrough capacitor according to an embodiment of the present invention will be described. FIG. 10 is a partially broken view showing a magnetron according to an embodiment of the present invention, and FIG. 11 is an electric circuit diagram of the magnetron shown in FIG. FIG. 10 shows a magnetron for a microwave oven, for example, and includes a high-voltage feedthrough capacitor 1, a cathode stem 81, and a filter box 91.
フィルタボックス９１は、陰極ステム８１を覆うように配置され、接地電極ＧＮＤ（図１１参照）に接続されている。フィルタボックス９１には、冷却フィン９２、ガスケット９３、ＲＦ出力端９４、及び、磁石９５が備えられている。 The filter box 91 is disposed so as to cover the cathode stem 81 and is connected to the ground electrode GND (see FIG. 11). The filter box 91 includes a cooling fin 92, a gasket 93, an RF output end 94, and a magnet 95.
高電圧貫通型コンデンサ１は、フィルタボックス９１の側面板９１０に設けた貫通孔を貫通して設けられ、接地金具２０が側面板９１０と電気的、機械的に接続されている。 The high-voltage feedthrough capacitor 1 is provided through a through-hole provided in the side plate 910 of the filter box 91, and the ground metal fitting 20 is electrically and mechanically connected to the side plate 910.
インダクタ８２、８３は、フィルタボックス９１の内部において、陰極ステム８１の陰極端子、及び、高電圧貫通型コンデンサ１と接続されている。 The inductors 82 and 83 are connected to the cathode terminal of the cathode stem 81 and the high-voltage feedthrough capacitor 1 inside the filter box 91.
図１１において、高電圧貫通型コンデンサ１は、インダクタ８１、８２と共にフィルタを構成している。先の図面に表れた構成部分に対応する部分には同一の参照符号を付してある。参照符号９６は発振器、ＧＮＤは接地電極である。インダクタ８１、８２のそれぞれは、一端側が発振器９６に導かれ、他端側が分割電極１２、１３のそれぞれに導かれている。 In FIG. 11, the high-voltage feedthrough capacitor 1 constitutes a filter together with inductors 81 and 82. Parts corresponding to those shown in the previous drawings are given the same reference numerals. Reference numeral 96 is an oscillator, and GND is a ground electrode. One end of each of the inductors 81 and 82 is led to the oscillator 96, and the other end is led to each of the divided electrodes 12 and 13.
マグネトロンには、貫通導体５１、５２に、例えば、商用周波数、又は、２０ｋＨｚ〜４０ｋＨｚ程度の周波数を持つ４ｋＶ0-P程度の高電圧が印加される。これにより、マグネトロンが発振動作をするわけであるが、このとき、ノイズが発生する。発生したノイズは、高電圧貫通型コンデンサ１のフィルタ作用により低減される。 In the magnetron, for example, a commercial frequency or a high voltage of about 4 kV 0-P having a frequency of about 20 kHz to 40 kHz is applied to the through conductors 51 and 52. As a result, the magnetron oscillates, but at this time, noise is generated. The generated noise is reduced by the filter action of the high-voltage feedthrough capacitor 1.
以上、好ましい実施例を参照して本発明の内容を具体的に説明したが、本発明の基本的技術思想及び教示に基づいて、当業者であれば、種種の変形態様を採り得ることは自明である。 Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.
１ 高電圧貫通型コンデンサ
１０ コンデンサ部
１２、１３ 分割電極
１４ 共通電極
２０ 接地金具
４１、４２ 第１及び第２の絶縁樹脂
５１、５２ 貫通導体
５１１、５２１ 棒状導体部
６１、６２ 絶縁チューブ
７１、７２ 絶縁カバー
DESCRIPTION OF SYMBOLS 1 High voltage feedthrough capacitor 10 Capacitor part 12, 13 Divided electrode 14 Common electrode 20 Grounding metal fittings 41, 42 First and second insulating resins 51, 52 Through conductors 511, 521 Bar-shaped conductor parts 61, 62 Insulating tubes 71, 72 Insulation cover
Claims (3)
前記コンデンサ部は、一面側に２つの分割電極を有し、他面側に共通電極を有し、前記接地金具の一面上に搭載され、前記共通電極が前記接地金具の前記一面に接続されており、
前記絶縁樹脂は、前記コンデンサ部の内部に充填されており、
前記貫通導体は、２つであって、それぞれは、前記接地金具、及び、前記コンデンサ部の内部を貫通する棒状導体部を有し、前記分割電極に接続されており、
前記絶縁チューブは、少なくとも一部が前記コンデンサ部の内部において、前記棒状導体部に装着されており、
前記絶縁カバーは、前記棒状導体部に装着され、その一端が、前記絶縁チューブの一端に連続する、
高電圧貫通型コンデンサであって、
前記接地金具は、浮き上り部と、貫通孔とを有し、
前記浮き上り部は、一面側に立ち上がり、
前記貫通孔は、前記浮き上り部の面内において、一面側から他面側に貫通しており、
前記コンデンサ部は、前記浮き上がり部の面上に搭載されており、
前記絶縁カバーの前記一端と、前記絶縁チューブの前記一端は、互いに密着して嵌合されており、
前記絶縁樹脂は、前記コンデンサ部の内部から、前記接地金具の前記貫通孔の内部まで充填され、前記絶縁チューブの一端と、前記絶縁カバーの一端との嵌合部分を覆う、
高電圧貫通型コンデンサ。 Including a grounding metal fitting, a capacitor part, an insulating resin, a through conductor, an insulating cover, and an insulating tube ;
The capacitor unit has two divided electrodes on one surface side, a common electrode on the other surface side, is mounted on one surface of the grounding metal fitting, and the common electrode is connected to the one surface of the grounding metal fitting. And
The insulating resin is filled inside the capacitor portion,
There are two through conductors, each of which has a rod-shaped conductor portion that penetrates the grounding metal fitting and the capacitor portion, and is connected to the divided electrode,
The insulating tube is attached to the rod-shaped conductor portion at least partially inside the capacitor portion,
The insulating cover is attached to the rod-shaped conductor portion, and one end thereof is continuous with one end of the insulating tube.
A high voltage feedthrough capacitor,
The grounding metal has a floating portion and a through hole,
The floating part rises to one side,
The through hole penetrates from the one surface side to the other surface side within the surface of the raised portion,
The capacitor part is mounted on the surface of the raised part,
The one end of the insulating cover and the one end of the insulating tube are fitted in close contact with each other;
The insulating resin is filled from the inside of the capacitor portion to the inside of the through hole of the grounding metal fitting, and covers a fitting portion between one end of the insulating tube and one end of the insulating cover.
High voltage feedthrough capacitor.
前記絶縁カバーは、ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）または変性メラミンで構成されている、
高電圧貫通型コンデンサ。 The high-voltage feedthrough capacitor according to claim 1,
The insulating cover is made of polyethylene terephthalate (PET), polybutylene terephthalate (PBT) or modified melamine,
High voltage feedthrough capacitor.
前記高電圧貫通型コンデンサは、請求項１又は２に記載されたものであり、フィルタとして組み込まれている、The high-voltage feedthrough capacitor is the one described in claim 1 or 2, and is incorporated as a filter.
マグネトロン。Magnetron.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005247238A JP4433198B2 (en) | 2005-08-29 | 2005-08-29 | High-voltage feedthrough capacitor and magnetron |
| US11/444,493 US7184256B1 (en) | 2005-08-29 | 2006-06-01 | High-voltage feed-through capacitor and magnetron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005247238A JP4433198B2 (en) | 2005-08-29 | 2005-08-29 | High-voltage feedthrough capacitor and magnetron |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007066950A JP2007066950A (en) | 2007-03-15 |
| JP4433198B2 true JP4433198B2 (en) | 2010-03-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005247238A Expired - Fee Related JP4433198B2 (en) | 2005-08-29 | 2005-08-29 | High-voltage feedthrough capacitor and magnetron |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7184256B1 (en) |
| JP (1) | JP4433198B2 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11183336B2 (en) | 2005-04-07 | 2021-11-23 | Amrad Manufacturing, Llc | Capacitor with multiple elements for multiple replacement applications |
| US11183338B2 (en) | 2005-04-07 | 2021-11-23 | Amrad Manufacturing, Llc | Capacitor with multiple elements for multiple replacement applications |
| US11183337B1 (en) | 2005-04-07 | 2021-11-23 | Amrad Manufacturing, Llc | Capacitor with multiple elements for multiple replacement applications |
| US7203053B2 (en) | 2005-04-07 | 2007-04-10 | American Radionic Company, Inc. | Capacitor for multiple replacement applications |
| US9412521B2 (en) | 2005-04-07 | 2016-08-09 | American Radionic Company, Inc. | Capacitor with multiple elements for multiple replacement applications |
| US7423861B2 (en) | 2005-04-07 | 2008-09-09 | American Radionic Company, Inc. | Capacitor with multiple elements for multiple replacement applications |
| USD818959S1 (en) | 2005-12-23 | 2018-05-29 | American Radionic Company, Inc. | Capacitor |
| US7952854B2 (en) | 2006-12-29 | 2011-05-31 | American Radionic Company, Inc. | Electrolytic capacitor |
| US8325461B2 (en) * | 2008-08-08 | 2012-12-04 | Hamilton Sundstrand Corporation | Printed wiring board feed-through capacitor |
| US9318261B2 (en) | 2013-05-21 | 2016-04-19 | American Radionic Company, Inc. | Power factor correction capacitors |
| US9337786B1 (en) * | 2014-12-18 | 2016-05-10 | General Electric Company | Multi-layer decoupling capacitor for a tube amplifier assembly |
| US11195663B2 (en) | 2017-05-12 | 2021-12-07 | Amrad Manufacturing, Llc | Capacitor with multiple elements for multiple replacement applications |
| US11424077B1 (en) | 2017-12-13 | 2022-08-23 | Amrad Manufacturing, Llc | Hard start kit for multiple replacement applications |
| US10586655B1 (en) | 2018-12-28 | 2020-03-10 | American Radionic Company, Inc. | Capacitor with multiple elements for multiple replacement applications |
| GB201901384D0 (en) * | 2019-01-31 | 2019-03-20 | Teledyne E2V Uk Ltd | Magnetrons |
| USD906247S1 (en) | 2019-07-11 | 2020-12-29 | American Radionic Company, Inc. | Capacitor |
| CA3157689A1 (en) | 2021-04-30 | 2022-10-30 | Amrad Manufacturing, Llc | Hard start kit for multiple replacement applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4370698A (en) * | 1979-10-08 | 1983-01-25 | Tdk Electronics Co., Ltd. | Through type high-withstand-voltage ceramic |
| DE3781752T2 (en) * | 1986-09-11 | 1993-01-07 | Tdk Corp | PERFORMANCE TYPE CAPACITOR AND ITS USE IN A MAGNETRON. |
| JPH0399414A (en) * | 1989-09-12 | 1991-04-24 | Murata Mfg Co Ltd | Manufacture of feedthrough capacitor |
| US5142436A (en) * | 1990-02-27 | 1992-08-25 | Samsung Electro-Mechanics Co., Ltd. | Piercing through type capacitor |
| JP2756416B2 (en) | 1994-05-27 | 1998-05-25 | 大宇電子株式會▲社▼ | Noise shielding device of magnetron for microwave oven |
| JP3248619B2 (en) * | 1999-03-05 | 2002-01-21 | ティーディーケイ株式会社 | High voltage feedthrough capacitors and magnetrons |
| JP3803258B2 (en) * | 2000-04-03 | 2006-08-02 | Ｔｄｋ株式会社 | High-voltage feedthrough capacitor and magnetron |
| JP2005109006A (en) * | 2003-09-29 | 2005-04-21 | Tdk Corp | High-voltage feed-through capacitor and magnetron |
| JP2005217296A (en) * | 2004-01-30 | 2005-08-11 | Tdk Corp | High-voltage feeding capacitor, high-voltage feed-through capacitor device, and magnetron |
-
2005
- 2005-08-29 JP JP2005247238A patent/JP4433198B2/en not_active Expired - Fee Related
-
2006
- 2006-06-01 US US11/444,493 patent/US7184256B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007066950A (en) | 2007-03-15 |
| US7184256B1 (en) | 2007-02-27 |
| US20070047174A1 (en) | 2007-03-01 |
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