JP4398287B2 - Surface coated cutting tool - Google Patents

Description

  The present invention relates to a surface-coated cutting tool having a coating layer on a substrate surface. In particular, it relates to a surface-coated cutting tool that excels in both toughness and wear resistance even under cutting conditions where the cutting edge temperature is extremely high, such as high-efficiency cutting and dry machining represented by intermittent cutting, heavy cutting, and high-speed cutting. It is.

  Recent trends in cutting tools include the need for dry machining that does not require cutting fluids from the viewpoint of global environmental conservation, the diversification of work materials, and the cutting speed has been increased to further improve machining efficiency. The tool tip temperature tends to be higher due to the higher speed. As a result, the tool life is shortened, and the characteristics required for the tool material are becoming stricter.

  Therefore, in order to improve wear resistance and surface protection function, AlTiSi is applied to the base material surface made of WC-based cemented carbide, cermet, cubic boron nitride sintered body, high-speed steel, etc. as a cutting tool or wear-resistant tool. Those having a coating layer made of a system nitride or carbonitride are known (see Patent Document 1). The coating layer made of this AlTiSi compound has higher heat resistance than conventional TiN or TiCN. However, in the case of high-speed and high-efficiency cutting that is currently required, the temperature at the cutting point reaches nearly 900 ° C. Under such an extremely high temperature environment, even the above-described AlTiSi-based compound film may be oxidized and deteriorate in hardness and strength.

  In order to cope with the extremely high temperature environment as described above, a tool in which α-type alumina (aluminum oxide) is coated on the substrate surface by a chemical vapor deposition method (CVD method) has been proposed (for example, Patent Documents). 2). Since α-type alumina has a stable crystal structure even at a temperature of 1000 ° C. or higher, it has excellent heat resistance. However, in the CVD method, film formation is performed in a temperature environment close to 1000 ° C, so the damage to the substrate is large (the strength of the substrate is extremely deteriorated), and (2) the tensile residual stress in the film Therefore, there is a problem that the film strength and fracture toughness value are low and chipping and chipping are likely to occur. Such a tool is particularly unsuitable for intermittent cutting in which a large impact is repeatedly applied.

  In order to solve the above problem, it is conceivable to form an alumina film by a PVD method capable of imparting compressive residual stress to the coating (see, for example, Patent Document 3). In the example of Patent Document 3, the film forming temperature is set to 780 ° C. or higher, and the film forming temperature is lower than the CVD method in which the film forming temperature is set to 1000 ° C. or higher. Therefore, the occurrence of chipping and chipping can be reduced.

Japanese Unexamined Patent Publication No. 7-310174 European Patent Application No. 693574 Japanese Unexamined Patent Publication No. 7-41963

  As described above, the technique disclosed in Patent Document 3 is excellent in heat resistance by covering alumina by the PVD method, and can also reduce damage to the base material and decrease in toughness to some extent. However, in recent years, cutting conditions have become increasingly severe, and the above-described conventional technology does not sufficiently meet market demands, and further improvements are desired.

  Therefore, the main object of the present invention is to have a good balance between toughness and wear resistance even under severe cutting conditions such as high-speed cutting, dry processing, and heavy cutting, and excellent cutting performance even in high heat generation cutting. It is an object of the present invention to provide a surface-coated cutting tool.

  That is, the present invention is a surface-coated cutting tool comprising a coating layer on a substrate, and the coating layer further comprises one or more oxide layers containing oxygen atoms formed using a solid evaporation source. Yeah. And at least one of the oxide layers has a surface roughness within the reference length of Rmax of less than 0.3 μm when the reference length is 30 μm on the surface away from the substrate. Features.

As a result of various investigations by the inventors, when an oxide film is provided using a solid evaporation source and there is microscopic unevenness on the surface of the oxide film away from the base material, film peeling is promoted. As a result, cutting edge damage is suppressed, and cutting performance, especially wear resistance, can be achieved even when cutting materials such as steel under severe cutting conditions such as high-speed cutting, dry machining, and heavy cutting. The knowledge that it is excellent was obtained. Specifically, for example, in cutting conditions such as dry machining and intermittent machining at a cutting speed of 200 m / min or more and 250 m / min or less commonly used in turning, toughness and wear resistance can be exhibited in a balanced manner. And gained knowledge. Based on this knowledge, the present invention provides a cutting tool having an excellent balance between wear resistance and toughness.

  The exact reason for the above is unknown, but is presumed as follows. An oxide film containing oxygen atoms, such as an alumina film, is excellent in heat resistance and has an extremely low reactivity with iron often used for a work material, and thus functions effectively as a coating layer. However, compared with the case of vapor phase synthesis as in the CVD method, a film coated with a solid evaporation source is inferior in terms of adhesion to a substrate or another film because the film forming temperature is low. In view of this, the present inventors have studied to make microscopic unevenness on the surface of the oxide film away from the base material to reduce the cutting resistance with the work material and to increase the adhesion effect by the unevenness. However, if the microscopic irregularities are excessively present, the adhesion strength becomes too high, and when the coating itself is impacted and cracks occur, it acts as a notch effect, and the cutting edge may be damaged. . Therefore, if the microscopic unevenness is within a specific range, it is considered that the coating peeled off before the notch effect was generated, and as a result, chipping of the blade edge could be suppressed.

Hereinafter, the present invention will be described in more detail.
(Coating layer)
<Oxide layer>
The coating layer provided on the substrate includes one or more oxide layers containing oxygen atoms. That is, the coating layer may be a single layer including only one oxide layer or a plurality of layers including a plurality of oxide layers. Moreover, it is good also as a multiple layer which provided the film other than an oxide layer in addition to an oxide layer so that it may mention later.

  In the present invention, at least one of the oxide layers on the surface away from the substrate has a reference length of 30 μm, and the surface roughness within the reference length is less than 0.3 μm in Rmax. And The present inventors have investigated by forming various uneven states in the oxide layer, and when the surface roughness is satisfied, the cutting edge of the steel (work material) such as high-speed cutting or dry processing becomes hot. It was found that the cutting edge was not easily damaged under excellent cutting conditions and showed excellent wear resistance.

  The surface roughness is not a macro unevenness formed by a surface treatment (scratching treatment) with a diamond grindstone or diamond abrasive grains, but a fine unevenness in a minute section. As a method of observing Rmax, for example, after coating, a cross-section of the coating layer is observed by wrapping observation, and a photograph is taken. When the oxide layer is the outermost layer, on the surface, and when the oxide layer is the inner layer, the oxide layer It is possible to calculate the surface roughness at the boundary surface between the other film coated on the oxide layer and the oxide layer. At this time, the macroscopic swell may be calculated by linear approximation. Also, when the oxide layer is the outermost layer, the surface roughness can be calculated in the same manner as when the oxide layer is the inner layer after the TiN film is artificially coated on the oxide layer at a low temperature. Good.

  The surface roughness is, for example, the film thickness of the coating layer (especially the oxide layer), the film formation conditions of the coating layer (particularly the oxide layer), specifically, the film formation temperature, bias voltage, sample ( It can be controlled by changing the distance between the base material) and the target (solid evaporation source). In order to make the surface roughness less than 0.3 μm, for example, the film thickness can be made thinner, the film formation temperature can be made lower, or the distance between the sample and the target can be made longer. In the present invention, it is assumed that there are microscopic irregularities. Accordingly, the surface roughness is Rmax exceeding 0 μm. Moreover, the smaller the surface roughness, the better the toughness.

  When there is only one oxide layer, it is sufficient that the layer satisfies the surface roughness. Further, when there are a plurality of oxide layers, it is sufficient that at least one of the oxide layers satisfies the surface roughness. When all the oxide layers satisfy the surface roughness, cutting performance can be further improved. It is preferable.

  In the present invention, the oxide layer is formed using a solid evaporation source. Since the film formation method using a solid evaporation source can lower the film formation temperature as compared with the vapor phase synthesis such as the CVD method, damage to the substrate can be reduced. As a more specific film formation method, it is preferable to use a method including a film formation process capable of forming a high-strength film, particularly a film containing oxygen, for example, a physical vapor deposition method (PVD method). is there. PVD methods include sputtering and ion plating, but especially unbalanced magnetron sputtering with high ion ratio of raw material elements (see Kobe Steel Technical Report Vol.50 No.2 (Sep.2000)). (Hereinafter referred to as UBM sputtering method), dual magnetron sputtering method and cathode arc ion plating were found to be suitable. Note that the coating by the PVD method can be identified by, for example, examining the morphology of the film surface or by X-ray diffraction.

  The oxide layer preferably contains at least one of Al, Zr, Si, Cr, Ti, and B. At this time, it turned out that the especially outstanding cutting performance is shown. The reason is presumed as follows. When Zr is included, it is considered that the Zr oxide has poor thermal conductivity, so that the heat blocking property of the coating is improved, and deformation of the substrate at high temperature is suppressed. When Si and Ti are included, the coating hardness is improved, and as a result, the wear resistance is considered to be improved. In the case where Cr and B are contained, it is considered that the welding resistance of the coating is improved, and in particular, the peelability of the coating is improved. And when Al is included, since Al oxide (alumina) is excellent in heat resistance, it is thought that it has the outstanding abrasion resistance even in the high heat generation environment.

  The structure of the oxide layer may be an α-type structure, but a γ-type structure or an amorphous structure is preferable because of excellent toughness. In particular, when γ-type alumina or amorphous alumina is contained in a part of the oxide layer, it has very excellent toughness. The inclusion of γ-type alumina or amorphous alumina may be partially included in one oxide layer, or all of the layers may be γ-type alumina or amorphous alumina. In the former case, for example, a mixture of γ-type alumina and amorphous alumina or a mixture of γ-type alumina and amorphous alumina may be used. Accordingly, when the coating layer includes a plurality of oxide layers, all the oxide layers may be γ-type alumina or amorphous alumina, or γ-type alumina or amorphous alumina may be partially formed in all oxide layers. Some oxide layers may be γ-type alumina or amorphous alumina, and some oxide layers may partially contain γ-type alumina or amorphous alumina. Also good. The tissue structure can be formed by a known method. The tissue structure can be measured by, for example, TEM observation or X-ray diffraction.

  The thickness of the oxide layer that satisfies the surface roughness is preferably 0.01 to 5 μm. If the thickness is less than 0.01 μm, it is difficult to improve the wear resistance, and if it exceeds 5 μm, the residual stress in the coating becomes too large, and the oxide layer peels off at the beginning of cutting, making it difficult to obtain the desired effect. Become. Particularly preferably, it is 0.2 μm or more. The thickness can be controlled by changing the film formation time. In addition, when there are a plurality of oxide layers that satisfy the surface roughness, it is preferable that the total thickness satisfies the above range (0.01 to 5 μm).

<Compound membrane>
The coating layer may include other coatings in addition to the oxide layer. Specifically, nitrides of at least one element of periodic table IVa, Va, VIa, Al, Si, and B, at least one of periodic table IVa, Va, VIa, Al, Si, and B Examples thereof include a compound film made of any of elemental carbides and carbonitrides of at least one element of periodic table IVa, Va, VIa, Al, Si, and B. In particular, a compound film containing Ti is preferable because of excellent wear resistance. Specific examples include TiAlSiN, TiSiN, TiCN, TiAlN, TiAlCN, TiSiCrN, TiZrN, and TiN.

  Although the above compound film has high hardness, the oxidation resistance at high temperature is inferior to that of the above oxide layer, but when it is provided between the base material and the oxide layer, the crystal grains of the oxide layer grow. Therefore, when the oxide layer is provided on the oxide layer as an inner layer, for example, when the outermost layer is used, oxygen from the surface of the compound film can be suppressed. Diffusion is suppressed, and excellent wear resistance can be maintained even at high temperatures, which is preferable. Of course, the compound film may be formed both between the base material and the oxide layer and on the oxide layer.

  These compound films are also preferably formed by the PVD method, in particular, the unbalanced magnetron sputtering method or the arc ion plating method, like the oxide layer. The thickness of the compound film can be controlled by changing the film formation time.

  The total thickness of the coating layer is preferably 0.01 to 15 μm. In particular, when the coating layer includes the oxide layer and the compound film, the total thickness is preferably 0.1 to 15 μm or less. If it is less than 0.1 μm, it is difficult to obtain the effect provided with the compound film, specifically, improvement in wear resistance, and if it exceeds 15 μm, the residual stress in the coating layer becomes too large and the adhesion strength to the substrate is reduced. In addition, the coating layer is easily peeled off at the beginning of cutting. Particularly preferably, it is 1 μm or more and 5 μm or less.

(Base material)
The base material is a WC base cemented carbide, cermet, high speed steel, ceramics, cubic boron nitride sintered body, diamond sintered body, silicon nitride sintered body, sintered body containing aluminum oxide and titanium carbide. Those composed of either are preferred. You may utilize the thing of a well-known composition. Examples of the ceramic include silicon carbide, silicon nitride, aluminum nitride, and aluminum oxide.

  The tool of the present invention is suitable for use in one type selected from a drill, an end mill, a cutting edge replacement type tip for milling, a cutting edge replacement type tip for turning, a metal saw, a gear cutting tool, a reamer, and a tap.

  The surface-coated cutting tool of the present invention having the above-described configuration can have a cutting performance, particularly high wear resistance, by providing a coating layer having excellent heat resistance and toughness while reducing a decrease in base material strength. There is a unique effect. Therefore, the cutting tool of the present invention is excellent in both toughness and wear resistance and can be processed for a long time even in cutting conditions where the cutting edge temperature becomes very high, such as interrupted cutting, heavy cutting, high speed cutting and dry processing. Can do.

  Embodiments of the present invention will be described below.

  JIS standard: SNG432 shape, JIS standard: P30 cemented carbide cutting tip (Sumitomo Electric Hardmetal Co., Ltd. A30N) is prepared, and the tip replacement type with the coating layer shown in Table 1 on the surface of this chip substrate A chip was produced.

In this example, the formation of the coating layer is conducted by unbalanced magnetron sputtering (UBM sputtering), or the like may be a cold cathode arc ion plating method or a dual magnetron sputtering method. The specific formation procedure is as follows.

FIG. 1 is a schematic diagram showing a schematic configuration of a film forming apparatus. A plurality of arc evaporation sources 1 and 2 and unbalanced magnetron sputtering evaporation sources (hereinafter referred to as UBM sputtering sources) 3 and 4 are arranged in the film forming apparatus 5 shown in FIG. The base material 9 (the above-mentioned cutting tip) is mounted on the base material holder 8 that can rotate between the evaporation sources 1 to 4 around the point C. In this example, a predetermined metal material (e.g., Ti, Cr, Al, etc.) is set in the arc evaporation sources 1 and 2, Al (aluminum) is set in the UBM sputter source 3, and a predetermined metal material (e.g., in the UBM sputter source 4 is used). , Al, Zr, Si, Cr, Ti, TiB ₂ etc.) were set.

While heating the substrate 9 to 480 ° C. with the heater 6, the inside of the film forming apparatus 5 is evacuated to a vacuum degree of 1 × 10 ⁻³ Pa or less. Thereafter, Ar (argon) gas was introduced from the gas introduction port 7a, and a voltage of −1100 V was applied to the base material 9 while keeping the inside of the film forming apparatus 5 at a vacuum of 3 Pa, and glow discharge was generated in the Ar gas. The surface of the substrate 9 is cleaned with Ar ions. Thereafter, Ar gas is exhausted, and a bias voltage of −40 V is continuously applied to the substrate 9 while at least one reaction gas of N ₂ (nitrogen) gas, CH ₄ (methane) gas, and O ₂ (oxygen) gas is applied. In a state where the gas is introduced from the gas inlet 7b, the arc evaporation sources 1 and 2 are subjected to vacuum arc discharge at an arc current of 100 A to ionize a predetermined metal material, and an inner layer (in the case of sample No. 20 Outer layer). In the sample without the inner layer, the inner layer forming step is not performed after Ar gas exhaust.

Next, an oxide layer is formed under the film formation temperature environment shown in Table 1. Pulsed DC of -100V as a substrate bias (pulse frequency 250 kHz, with ON time and OFF time 2 .mu.sec.) While applying a, O ₂ gas is introduced and 380SCCM Ar gas of 55SCCM the film forming apparatus 5, formed In a state where the pressure in the film apparatus 5 is 1.2 Pa, at least one of the UBM sputtering sources 3 and 4 is discharged to form an oxide layer shown in Table 1. The power source of the UBM sputtering source was pulse DC (pulse frequency 100 kHz, ON time: 8 μsec. And OFF time: 2 μsec.), And the sputtering power was 2.8 kW.

Furthermore, the samples provided with the outer layer, after the oxide layer formed, similarly to the inner layer forming step, while applying a bias voltage of -40V to the substrate 9, N ₂ (nitrogen) gas, and CH ₄ (methane) In a state in which at least one kind of reaction gas is introduced from the gas inlet 7b, the arc evaporation sources 1 and 2 are subjected to vacuum arc discharge at an arc current of 100 A to ionize a predetermined metal material, and appropriately on the substrate 9 An outer layer was formed. By the film forming step, a coated chip having a coating layer on the substrate was obtained.

  About each obtained covering chip | tip, the thickness and composition of each layer which comprise a coating layer were investigated. Further, the surface roughness (Rmax) and the structure of the oxide layer of each coated chip on the side away from the substrate were examined. The results are shown in Table 1. The thickness of each layer was determined by observing the cross section with a micrograph. The composition of each layer was measured by XPS. In this example, the microstructure of the oxide layer was identified by obtaining an X-ray diffraction pattern by a thin film method using an X-ray diffractometer and fixing the X-ray incident angle at 1 °. A diffraction pattern may be obtained and identified. In Table 1, the amorphous structure is “amorphous”, the α-type structure is “α-type”, the γ-type structure is “γ-type”, and the α-type structure and the γ-type structure are mixed. A structure having a structure in which an amorphous structure and a γ-type structure are mixed is referred to as “amorphous + γ type”. For the surface roughness of the oxide layer, after cutting each coated chip, mirror lapping is performed, and the reference length is set to 30 μm on the surface away from the substrate, and the Rmax of minute irregularities within this reference length is measured. I got it. The macroscopic swell was ignored.

  The thickness of each layer constituting the coating layer of each sample was changed by changing the film formation time (discharge time). In the oxide layer, the structure of the surface was changed by changing the film formation temperature, and the surface roughness of the surface on the side away from the substrate was changed by changing the film thickness and the film formation temperature.

(Test Example 1)
The coated chip was attached to a commonly used holder, and cutting evaluation of these tools was performed. The evaluation was performed by performing a continuous cutting test and an intermittent cutting test under the following cutting conditions, and measuring the flank wear width (wear amount) of the cutting edge in the continuous cutting test and the chipping rate of the cutting edge in the intermittent cutting test. Table 2 shows cutting conditions, and Table 3 shows flank wear width and defect rate. Note that the defect rate was determined by preparing 10 coated chips each having the respective coating layers shown in Table 1, and examining the presence or absence of defects for each of these 10 chips, and calculating the average.

  As is clear from Table 3, the coated tips of Sample Nos. 1 to 16 whose oxide layer has a predetermined surface roughness are excellent in fracture resistance even in high heat generation cutting such as dry processing and interrupted cutting. It can be seen that it has high wear resistance. Therefore, it was confirmed that sample Nos. 1 to 16 have a good balance between wear resistance and toughness. Moreover, since these samples had a relatively low film formation temperature, damage to the substrate could be reduced. Further, it can be seen that the oxide layer is more excellent in toughness when it has a γ-type structure or an amorphous structure.

(Test Example 2)
The base material was changed to the following, a coating layer similar to that in Table 1 was formed to produce a coated chip, and a cutting test was performed under the same cutting conditions as in Test Example 1.
1 JIS standard: P20 cermet cutting tip (Sumitomo Electric Hardmetal Co., Ltd. T1200A)
2 Cutting tip made of alumina-TiC sintered body (Sumitomo Electric Hardmetal Corporation NB90S)
3 Cutting tip made of alumina (Sumitomo Electric Hardmetal Co., Ltd. W80)
4 Cutting tips made of silicon nitride (Sumitomo Electric Hardmetal Corp. NS260)
As a result, coated chips with an oxide layer with a surface roughness of less than 0.3 μm have toughness and wear resistance under severe cutting conditions such as dry machining and interrupted cutting, compared to coated chips of 0.3 μm or more. It was confirmed that both had a good balance. From this, it can be seen that the tool life can be improved as described above.

(Test Example 3)
The base material was changed to a cutting tip made of a diamond sintered body (Sumitomo Electric Hardmetal Co., Ltd. DA2200), and the same coating layer as in Table 1 was formed to produce a coated tip, and a cutting test was performed. The cutting conditions were the same as in Test Example 1 except that the work material was changed to an aluminum silicon alloy (A390). Then, the flank wear width of the cutting edge was measured in the same manner as in Test Example 1. As a result, similar to Test Examples 1 and 2 above, the coated tip whose surface roughness of the oxide layer is less than 0.3 μm is more severe than dry coated and interrupted cutting compared to the coated tip of 0.3 μm or more. Even under the cutting conditions, it was confirmed that both toughness and wear resistance were well balanced. From this, it can be seen that the tool life can be improved as described above.

(Test Example 4)
Change the substrate to a cutting tip made of cubic boron nitride sintered body (Sumitomo Electric Hardmetal Co., Ltd., BN250), form a coating layer similar to Table 1 and make a coated tip, and perform a cutting test did. The cutting conditions are shown below.
Work material: Peripheral cutting of SUJ2 round bar (HRC62), a kind of hardened steel Cutting speed: 200m / min
Feed 0.1mm / rev.
Cutting depth: 0.18mm
Cutting time: 50 minutes Cutting oil: None (dry type)
Then, the flank wear width of the cutting edge was measured in the same manner as in Test Example 1. As a result, as in Test Examples 1 to 3 above, the coated chip whose surface roughness of the oxide layer is less than 0.3 μm is more tough than the coated chip of 0.3 μm or more even in dry processing. In addition, it was confirmed that it was excellent in both wear resistance. From this, it can be seen that the tool life can be improved as described above.

  By the same manufacturing method as in Example 1, the coating layer shown in Table 1 was formed on the base material of the drill (JISK10 cemented carbide) to produce a coated drill. For each of these coated drills, carbon steel (S50C) was drilled and the cutting was evaluated. Cutting conditions were a drill diameter of 12 mm, a cutting speed of 100 m / min, a feed of 0.3 mm / blade, a cutting depth of 25 mm, and wet processing (with cutting oil (water-soluble emulsion)). In the evaluation, the amount of flank cutting edge wear at the time of completion of 100 hole drilling and the drill breakage rate when drilling a maximum of 100 holes by tilting the work material by 10 ° were obtained. Ten drill breakage rates were prepared for each coated drill, and the average was obtained.

  As a result, it was confirmed that the coated drill whose surface roughness of the oxide layer was less than 0.3 μm was excellent in both toughness and wear resistance as compared with the coated drill having the same thickness of 0.3 μm or more. Specifically, the breakage rate of the coated drill in which the surface roughness of the oxide layer was less than 0.3 μm was 3/5 or less of that of the coated drill having the same 0.3 μm or more. From this, it can be seen that the tool life can be improved as described above.

  The present invention is particularly suitable for cutting under cutting conditions in which the cutting edge temperature is high, such as high speed, dry machining, interrupted cutting, and heavy cutting. In particular, the present invention exhibits a good balance between wear resistance and toughness in, for example, dry machining and intermittent cutting at a cutting speed of 250 m / min or less, which is widely used in turning.

It is a schematic diagram which shows schematic structure of the film-forming apparatus.

Explanation of symbols

1,2 Arc evaporation source 3,4 UBM sputtering source 5 Deposition system 6 Heater
7a, 7b Gas inlet 8 Base material holder 9 Base material

Claims (10)

A surface-coated cutting tool comprising a coating layer on a substrate,
The coating layer is
Including one or more oxide layers containing oxygen atoms formed by physical vapor deposition using a solid evaporation source;
At least one of the oxide layers is
On the surface away from the substrate, when the reference length is 30 μm, the surface roughness within this reference length is less than 0.3 μm in Rmax,
This oxide layer has any one of a γ-type structure, an amorphous structure, and a mixed structure of a γ-type structure and an amorphous structure, and is composed of at least one of alumina, Zr, Si, Cr, Ti, and B. A surface-coated cutting tool comprising a seed oxide .   2. The surface-coated cutting tool according to claim 1, wherein the oxide layer contains at least one of Al, Zr, Si, Cr, Ti, and B. The surface-coated cutting tool according to claim 1 or 2 thickness of the oxide layer satisfying the surface roughness is characterized by a 0.01 to 5 [mu] m. The coating layer includes a compound film made of any one of nitrides of the elements of the periodic tables IVa, Va, VIa, Al, Si, and B, carbides of the same elements, and carbonitrides of the same elements. ,
The surface-coated cutting tool according to any one of claims 1 to 3 , wherein the compound film is coated between a base material and an oxide layer. 5. The surface-coated cutting tool according to claim 4 , wherein the compound film is coated on the oxide layer. The surface-coated cutting tool according to any one of claims 1 to 5, the total thickness of the coating layer is characterized by a 0.01 to 15 micrometers. The base material is a WC-based cemented carbide, cermet, high speed steel, ceramics, cubic boron nitride sintered body, diamond sintered body, silicon nitride sintered body, and sintered body containing aluminum oxide and titanium carbide. The surface-coated cutting tool according to any one of claims 1 to 6 , wherein the surface-coated cutting tool is one selected from the group consisting of: The surface-coated cutting tool is one type selected from a drill, an end mill, a milling blade-exchangeable tip, a turning blade-tip-changing tip, a metal saw, a gear cutting tool, a reamer, and a tap. The surface-coated cutting tool according to any one of 1 to 7 . The surface-coated cutting tool according to any one of claims 1 to 8, physical vapor deposition is characterized by a unbalanced magnetron sputtering or arc ion plating method. Oxide layer satisfying the surface roughness, the surface coating according to any one of claims 1 to 9, characterized in that it is deposited by pulsed DC to the power of the substrate bias and the solid evaporation source Cutting tools.

Images