JP4360588B2 - Metallized film capacitors - Google Patents

Metallized film capacitors Download PDF

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Publication number
JP4360588B2
JP4360588B2 JP2001130778A JP2001130778A JP4360588B2 JP 4360588 B2 JP4360588 B2 JP 4360588B2 JP 2001130778 A JP2001130778 A JP 2001130778A JP 2001130778 A JP2001130778 A JP 2001130778A JP 4360588 B2 JP4360588 B2 JP 4360588B2
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JP
Japan
Prior art keywords
resin case
resin
capacitor element
metallized film
terminal
Prior art date
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JP2001130778A
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Japanese (ja)
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JP2002329637A (en
Inventor
孝雄 吉原
和夫 室賀
秀樹 小平
和也 高橋
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日立エーアイシー株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/145Organic dielectrics vapour deposited

Description

[0001]
[Industrial application fields]
The present invention relates to a metallized film capacitor in which a capacitor element is housed in a case and sealed with a resin, and more particularly to a chip-type metallized film capacitor.
[0002]
[Prior art]
Various electronic components are made into chips in order to reduce the size and increase the functionality of electronic devices. There are two types of metallized film capacitors: a cased type and a molded type.
[0003]
The former cased type metallized film capacitor 20 has a structure as shown in FIG. That is, a metallized film is laminated, wound and provided with a metallicon layer 21 on the end face to form a capacitor element 22. The capacitor element 22 having the lead frame processed terminal 23 connected to the metallicon layer 21 is housed in a resin case 24, and the resin case 24 is filled with an insulating resin 25 and resin-sealed. The terminal 23 is pulled out along the side wall of the resin case 24 and bent.
[0004]
The metallized film capacitor 20 makes the position of the capacitor element 22 in the resin case 24 accurately constant when the capacitor element 22 after the connection of the terminal 23 is accommodated in the resin case 24 and resin-sealed. For this purpose, the lead frame-shaped terminals 23 and the resin case 24 are fixed with a jig. In this state, the resin case 24 is filled with the insulating resin 25 and sealed with resin.
[0005]
[Problems to be solved by the invention]
However, the operation of incorporating the capacitor element 22 and the resin case 24 into the jig before resin sealing is usually a manual operation and is difficult to automate. And since it is a manual work, the position of the capacitor element 22 in the resin case 24 tends to vary. For this reason, even if the resin sealing process is performed, it is easy to be exposed from the resin filled with the capacitor element, and there is a defect that the insulation defect, the dimension defect, and the appearance defect are easily caused.
[0006]
An object of the present invention is to provide a metallized film capacitor that improves the above-described drawbacks, facilitates the automation of the manufacturing process, can prevent insulation failure, dimensional failure, and appearance failure, and can improve characteristics. .
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention of claim 1 is a metallized film capacitor in which a capacitor element is housed in a resin case and resin-sealed. The tongue piece is pulled out toward the opening end side of the resin case, and the spring action is maintained to contact the inner side surface , and the angle at which the tongue piece contacts the inner side surface of the resin case is set. A terminal larger than 40 degrees is connected to the capacitor element.
[0008]
That is, according to the present invention, the terminal is provided with a tongue piece at a position facing the inner surface of the resin case, and the tongue piece is pulled out toward the opening end side of the resin case and the spring action is maintained. The angle at which the tongue comes into contact with the inner side surface of the resin case and the inner side surface of the resin case (hereinafter referred to as “inclination angle”) is larger than 40 degrees. The tongue piece is caught on the inner surface against the force to be protruded to the outside, and a large resistance force works. Therefore, after storing the capacitor element after connecting the terminal in the resin case, the capacitor element is not exposed from the resin case even if it is transported to the specified position by holding only the terminal with a jig. Can be held in a predetermined position. Even if the resin case is filled with resin, insulation failure, dimensional failure, and appearance failure can be prevented.
[0010]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A and 1B, reference numeral 1 denotes a capacitor element formed by laminating, winding, and flattening a metallized film. The metallized film is made of a polymer film such as a polypropylene film, a polyethylene terephthalate film, a polyphenylene sulfide film, a polyparaphenylene phthalamide film, and a metal such as Al or Zn with a margin at one end in the longitudinal direction. A metal thin film is formed by vapor deposition to a thickness. Then, two metallized films are laminated with the margin portions reversed from each other, wound, and sealed with a sealing film on the outermost periphery for heat sealing.
In addition, a capacitor element 1 is formed on the end face of the wound element by providing a metallicon layer 2 made of a metal such as Sn alloy or solder as an extraction electrode.
[0011]
The metallicon layer 2 is connected to a terminal 3 made of an elongated metal plate such as Fe with solder plating on the surface. The terminal 3 is pulled out along the side surface of the resin case 4 and bent.
The terminal 3 is provided with a tongue piece 6 at a position facing the inner side surface 5 of the resin case 4. The tongue piece 6 is pulled out toward the opening end 7 side of the resin case 4, has an inclination angle θ of 0 ° <θ <90 °, and maintains a spring action to the inner side surface 5. In contact. Note that the inclination angle θ is preferably larger than 40 degrees, and the resistance to the force that causes the capacitor element 1 to protrude out of the resin case 4 can be increased.
In addition, a rectangular hole 8 is provided in front of the tongue piece 6 of the terminal 3 to facilitate the operation of connecting the terminal 3 to the metallicon layer 2 by welding or the like.
The resin case 4 is filled with an insulating resin 10 such as an epoxy resin and sealed with resin.
[0012]
As shown in FIG. 1 (B), the resin case 4 has two sides 9 in the longitudinal direction of the capacitor element 1 obliquely chamfered. Therefore, when the flat capacitor element 1 is housed, the shape of the capacitor element 1 is more similar to that of the case without chamfering, and the amount of insulating resin to be filled can be reduced, and the size and weight can be further reduced.
Further, by providing a minute protrusion on the inner side surface 5 with which the tongue piece 6 of the resin case 4 contacts, or by providing a groove into which the tip of the tongue piece 6 can be fitted, the tip of the tongue piece 6 can be easily caught on the inner side surface 5. . For this reason, the resistance force with respect to the force which makes the capacitor | condenser element 1 project outside the resin case 4 can be enlarged.
The resin case 4 is filled with an insulating resin 10 such as an epoxy resin and sealed with resin.
[0013]
Next, the manufacturing method of said metallized film capacitor 11 is demonstrated.
First, two metallized films are stacked and wound into a flat shape. Next, a metal alloy layer 2 is formed by spraying an Sn alloy or the like on the end face of the wound element, thereby forming the capacitor element 1. After the metallicon layer 2 is formed, the capacitor element 1 is heat-treated at a temperature of about 100 to 150 ° C. for about 1 to 2 hours to heat-shrink the metallized film. After the heat treatment, burrs on the metallicon layer 2 are removed. After this deburring operation, a voltage is applied to the capacitor element 1 to perform self-healing. After this voltage processing, the capacity is checked.
[0014]
The terminal 3 is formed by processing a lead frame. That is, a lead frame 12 provided with two or more pairs of terminals 3 facing each other is formed as shown in FIG. During this punching step, as shown in FIG. 2 (b), a portion of the capacitor element 1 used as the terminal 3 is cut downward to form a tongue piece 6, and this tongue piece. A square-shaped hole 8 is formed ahead of 6. Thereafter, as shown in FIG. 2C, the portion of the terminal 3 including at least the tongue piece 6 and the portion connected to the capacitor element 1 is bent downward at a right angle.
[0015]
Then, as shown in FIG. 3A, the capacitor element 1 is connected to the bent portion of the lead frame 12 by soldering, welding or the like at the location of the metallicon layer 2.
[0016]
Next, as shown in FIG. 3B, the capacitor element 1 is housed in the resin case 4 together with a part of the lead frame 12.
[0017]
After the capacitor element 1 is housed in the resin case 4, the lead frame 12 is held by a jig, and the capacitor element 1 is transported together with the resin case 4 to a predetermined position of the resin casting apparatus. Then, as shown in FIG. 3C, the resin case 4 is filled with an insulating resin 10 such as an epoxy resin up to the height of the capacitor element 1 by a casting apparatus.
After filling the insulating resin 10, a defoaming process is performed, and the gas in the insulating resin 10 and the capacitor element 1 is released out of the resin case 4.
After the defoaming treatment, the filled insulating resin 10 is thermoset.
[0018]
After the thermosetting process, the lead frame 12 is cut to disassemble the capacitors individually.
[0019]
After cutting the lead frame 12, as shown in FIG. 1, the insulating resin 10 is filled again up to the edge of the opening end 7 of the resin case 4 and thermally cured. By the second filling process of the insulating resin 10, holes generated in the insulating resin 10 filled in the first time during the defoaming process are embedded.
[0020]
Thereafter, the terminal 3 drawn out of the resin case 4 is bent along the outer surface of the resin case 4 to form the metallized film capacitor 11.
[0021]
【Example】
Below, about the Example of this invention, the tensile force when pulling out the capacitor | condenser element before resin sealing out of a resin case is measured.
The sample used for the measurement is rated 500 V, 0.68 μF, and is a metallized film capacitor that is not encapsulated with an insulating resin just by housing the capacitor element in a resin case.
In addition, the measuring method is that when the terminal connected to the capacitor element is fixed with a jig with the lead-out side of the terminal facing up, and the resin case is gripped with another jig and pulled downward, the inner surface of the resin case is The tensile force when the contact of the tongue piece is released and the capacitor element is pulled out of the resin case is measured.
Further, the conditions of each example are as follows.
[0022]
(Example 1)
Capacitor element: A metallized polyethylene terephthalate film having a thickness of 4.4 μm is wound and flattened, and a metallicon layer made of Sn alloy is formed on the end face. The length is 10.0 mm and the longer diameter is 11.2 mm. The shorter diameter is 7.2 mm.
Terminal: 0.2mm thick, 11.2mm long, 4.5mm wide, solder-plated iron plate, tongue 1.2mm long, 1.3mm wide, cut and raised (wall thickness) The average value is 0.98 mm (σ = 0.01 mm), and the inclination angle is about 40.5 degrees.
Resin case: As shown in FIG. 1, the thickness is 0.7 mm, the length in the longitudinal direction is 13.0 mm, and the height is 9.6 mm.
Number of samples: 19 [0023]
( Comparative Example 1 )
In Example 1, the same conditions are used except that the height of the cut-and-raft of the tongue of the terminal is 0.73 mm (σ = 0.01 mm) on average and the inclination angle is about 26.4 degrees.
[0024]
The tensile forces of Example 1 and Comparative Example 1 are 954 g (σ = 182 g) and 285 g (σ = 392 g), respectively, on average. That is, within the range in which the drawing direction is directed toward the opening end side of the resin case, the cut-and-raised height of the tongue piece is high, and the larger the inclination angle, the harder it is to pull the capacitor element out of the resin case. Increases resistance.
[0025]
【The invention's effect】
As described above, according to the first aspect of the present invention, in the metallized film capacitor in which the capacitor element is housed in the resin case and resin-sealed, the tongue is provided at a position facing the inner side surface of the resin case. The tongue piece is pulled out toward the opening end side of the resin case and the spring action is maintained to contact the inner side surface , and the angle at which the tongue piece contacts the inner side surface of the resin case is more than 40 degrees. Since the enlarged terminal is connected to the capacitor element, it is possible to position the capacitor element without using a jig for positioning the capacitor element in the resin case. A metallized film capacitor can be obtained that can prevent insulation failure, dimensional failure, and appearance failure due to exposure of the element from the resin case, and can improve characteristics.
[Brief description of the drawings]
FIG. 1 shows a front sectional view and a side sectional view of an embodiment of the present invention.
FIG. 2 is a process chart of a lead frame used for manufacturing the embodiment of the present invention.
FIG. 3 is a process chart of manufacturing according to the embodiment of the present invention.
FIG. 4 shows a front cross-sectional view of a conventional metallized film capacitor.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Capacitor element 3 ... Terminal 4 ... Resin case 5 ... Inner side surface,
6 ... tongue piece, 7 ... open end, 11 ... metallized film capacitor.
Reference number P2570

Claims (1)

  1. In a metallized film capacitor in which a capacitor element is housed in a resin case and resin-sealed, a tongue piece is provided at a position opposite to the inner side surface of the resin case. And connecting the terminal to the capacitor element with an angle larger than 40 degrees in contact with the inner side surface of the resin case and with the tongue contacting the inner side surface of the resin case. Features metallized film capacitors.
JP2001130778A 2001-04-27 2001-04-27 Metallized film capacitors Active JP4360588B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001130778A JP4360588B2 (en) 2001-04-27 2001-04-27 Metallized film capacitors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001130778A JP4360588B2 (en) 2001-04-27 2001-04-27 Metallized film capacitors

Publications (2)

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JP2002329637A JP2002329637A (en) 2002-11-15
JP4360588B2 true JP4360588B2 (en) 2009-11-11

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4569246B2 (en) * 2004-09-27 2010-10-27 パナソニック株式会社 Multilayer capacitors and molded capacitors
JP4862900B2 (en) 2009-01-28 2012-01-25 Tdk株式会社 Multilayer capacitor and multilayer capacitor manufacturing method
JP2010245153A (en) * 2009-04-02 2010-10-28 Panasonic Corp Metallized film capacitor, and method of manufacturing the same
JP5796155B2 (en) * 2011-01-21 2015-10-21 パナソニックIpマネジメント株式会社 case mold type capacitor
JP6393026B2 (en) * 2013-08-09 2018-09-19 日立エーアイシー株式会社 Metallized film capacitors

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