JP4344899B2 - Sealing method of electronic parts - Google Patents

Sealing method of electronic parts Download PDF

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Publication number
JP4344899B2
JP4344899B2 JP32046099A JP32046099A JP4344899B2 JP 4344899 B2 JP4344899 B2 JP 4344899B2 JP 32046099 A JP32046099 A JP 32046099A JP 32046099 A JP32046099 A JP 32046099A JP 4344899 B2 JP4344899 B2 JP 4344899B2
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Japan
Prior art keywords
caulking
gasket
case
over
lid
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Expired - Fee Related
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JP32046099A
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Japanese (ja)
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JP2001143958A (en
Inventor
孝樹 美根
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Nok Corp
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Nok Corp
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Description

【0001】
【発明の属する技術分野】
本発明は、電池またはコンデンサー等の電子部品において、有底状のケースの開口部に蓋体およびガスケットを挿入してカシメ固定する電子部品の封口方法に関するものである。
【0002】
【従来の技術】
電池またはコンデンサー等の電子部品の封口部のシールは、一般的にガスケットを介したカシメ方法により行なわれている。ガスケットの材質は、炭化水素系高分子材料が用いられ、樹脂ではポリプロピレンが、ゴムではブチルゴム、エチレンプロピレンゴム、水素添加スチレン−ブタジエンゴム、水素添加スチレン−イソプレンゴム等の高飽和系ゴムや熱可塑性エラストマーが主に使われている。
【0003】
このうち先ず、樹脂製ガスケットでは、そのシール性を確保するために、カシメ時にカシメ力が残留するほど強くカシメる必要がある。しかし、あまり強くカシメし過ぎると、ガスケットに極端に薄い部分ができてガスケットが破損する虞があるために、厳密なカシメ度合いの管理が必要とされる。
【0004】
一方、ゴム製ガスケットにおいては、カシメ度合いの管理をそれほど厳密に行なわなくてもシール性を確保することが可能であるが、カシメによる変形が大きいために、やはりあまり強くカシメし過ぎると、ガスケットに極端に薄い部分ができてガスケットが破損し、シール性の低下となることがある。また、寸法が安定しない。したがって、これを防止するため、やはりカシメ度合いの管理が必要とされる。
【0005】
【発明が解決しようとする課題】
本発明は以上の点に鑑みて、カシメ度合いの管理を比較的容易に行なうことができ、もってシールの信頼性を向上させることが可能な電子部品の封口方法を提供することを目的とする。
【0006】
【課題を解決するための手段】
上記目的を達成するため、本発明の請求項1による電子部品の封口方法は、有底状のケースの開口部に蓋体およびガスケットを挿入してカシメ固定する電子部品の封口方法において、前記ケースの内部底面とカシメ部との間に挟まれてカシメ量を一定量に制限する高剛性の過カシメ防止用部品を前記蓋体およびガスケットとともに挿入してカシメ工程を行なうことを特徴とするものである。
【0007】
また、本発明の請求項2による電子部品の封口方法は、上記した請求項1の電子部品の封口方法において、過カシメ防止用部品を蓋体およびガスケットとともにケースの開口部に挿入したときに前記過カシメ防止用部品とケースの内部底面との間に、前記過カシメ防止用部品のカシメ時のストローク量を制限する間隙を設定し、前記間隙の大きさaと支え面側ガスケットの初期厚さH との寸法関係および前記間隙の大きさaと押え面側ガスケットの初期厚さH との寸法関係を、a/H およびa/H がそれぞれ0.1〜0.6となるように設定することを特徴とするものである。
【0008】
上記構成を備えた本発明の請求項1による電子部品の封口方法のように、ケースの周縁部をカシメるのに先立って、ケースの内部底面とカシメ部との間に挟まれてカシメ量を一定量までに制限する高剛性の過カシメ防止用部品を蓋体およびガスケットとともに挿入してからカシメ工程を行なうようにすると、過カシメ防止用部品が一種のスペーサー機能を発揮するために、カシメ量を事前の設定どおりに制限することが可能となる。制限の具体的内容は、請求項2に記載したように、過カシメ防止用部品を蓋体およびガスケットとともにケースの開口部に挿入したときに過カシメ防止用部品とケースの内部底面との間に、過カシメ防止用部品のカシメ時のストローク量を制限する間隙を設定し、この間隙の大きさaと支え面側ガスケットの初期厚さH との寸法関係およびこの間隙の大きさaと押え面側ガスケットの初期厚さH との寸法関係を、a/H およびa/H がそれぞれ0.1〜0.6となるように設定するのが好適である。
【0009】
尚、本発明の電子部品の封口方法はこれを換言すると、有底ケースの開放端から電子部品の素子部を挿入し、ガスケットを介して蓋体を被せ、有底ケースの開放端をカシメによってシールする封口方法であって、ガスケットを蓋体に嵌め込み、有底ケースの開放端から挿入し、ガスケット底部を支える面に設置し、ガスケットの支え面にカシメのストローク範囲を限定する隙間が空くような寸法の高剛性の過カシメ防止用部品をケースとガスケットの間に挿入したものである。
【0010】
【発明の実施の形態】
つぎに本発明の実施例を図面にしたがって説明する。
【0011】
図1は、当該実施例に係る電子部品の封口方法によって製作される、または製作された電子部品1の要部断面を示しており、同図(A)がカシメ前の状態、同図(B)がカシメ後の状態を示している。この電子部品1は、上記したようにボタン電池等の電池またはコンデンサーであって、以下のように構成されている。
【0012】
すなわち、同図(B)に示すように先ず、一方が開口した有底状のケース2が設けられており、このケース2の内部に電子部品1の素子部(図示せず)が挿入されており、ケース2の開口部が蓋体3によって閉塞されている。ケース2は所謂正極缶であり、蓋体3は所謂負極缶または封口板である。ケース2に対する蓋体3の固定は、ケース2の周縁部2bをカシメによって内側に折り曲げることにより行なわれており、このカシメ部であるケース2の周縁部2bと蓋体3の周縁部3bとの間に樹脂製またはゴム製のガスケット4が装着されており、更にケース2の周縁部2bとガスケット4との間に高剛材製の過カシメ防止用部品5が装着されている。
【0013】
同図(A)に示すように、カシメ前の状態において、ケース2は、円板状の平面部(底面部とも称する)2aと、この円板状の平面部2aの周縁から垂直に立ち上げられた筒状の周縁部(側面部とも称する)2bとを一体に有しており、同図(B)に示すように、上方からカシメ荷重が加えられると周縁部2bの先端部(カシメ部とも称する)2cが全周に亙って内側に折り曲げられ、過カシメ防止用部品5をスライドさせ、ガスケット4を圧縮し、蓋体3を押さえ込んで固定する。
【0014】
蓋体3は、円板状の平面部(上面部とも称する、図示せず)と、この円板状の平面部の周縁に一体成形された環状の斜面部3aと、この斜面部3aの周縁に一体成形された断面U字形を呈する環状の周縁部(被カシメ部とも称する)3bとを一体に有しており、断面略U字形を呈する周縁部3bにおいてケース2にカシメ固定される。
【0015】
また、ガスケット4は、蓋体3の周縁部3bとケース2の平面部2aとの間に上下に挾まれる環状の部分(ガスケット支え部または支え面側ガスケットとも称する)4aと、蓋体3の周縁部3bとケース2の周縁部2bとの間に過カシメ防止用部品5とともに左右に挾まれる環状の部分4bと、蓋体3の周縁部3bとケース2のカシメ部2cとの間に過カシメ防止用部品5とともに上下に挾まれる環状の部分(押え面側ガスケットとも称する)4cとを一体に有して、断面コ字形に成形されている。
【0016】
また、過カシメ防止用部品5は、ガスケット4とケース2の周縁部2bとの間に左右に挾まれる筒状の部分5aと、同図(B)に示したように、カシメ後にガスケット4とケース2のカシメ部2cとの間に上下に挾まれる環状の部分5bとを一体に有して、断面L字形の環状体として成形されている。筒状部分5aの下端部は、ケース2における平面部2aと周縁部2bとの境のアール(丸み)に応じて、断面円弧形に形成されている。
【0017】
また、この過カシメ防止用部品5は、金属材料または繊維補強高分子材料等の高剛性材料によって成形されている。金属材料にあっては、電解液または高誘電率液体に対して耐性の良い材料あるいは電極として用いる材料あるいはケース2の金属材と同一種類のものが好ましく、高分子材料にあっては、フェノール樹脂またはポリフェニレンスルフィド、ポリアミドイミド、ポリエーテルエーテルケトン、ポリイミド、シンジオタクチックポリスチレン、フッ素樹脂、芳香族ポリアミド、サーモトロピック液晶高分子系樹脂、ポリエーテルイミド等のエンジニアリングプラスチックスが好ましい。
【0018】
また、同図(A)に示したように、カシメ前の状態において、この過カシメ防止用部品5を蓋体3およびガスケット4とともにケース2の開口部に挿入したときに、この過カシメ防止用部品5とケース2の平面部2a(内部底面)との間にこの過カシメ防止用部品5のカシメ時のストローク量を制限する間隙6が設定されており、この間隙6の大きさaとガスケット4の支え面側ガスケット4aのカシメ前における初期厚さH との寸法関係が、
a/H =0.1〜0.6・・・(1)式
を充足し、かつこの間隙6の大きさaとガスケット4の押え面側ガスケット4cのカシメ前における初期厚さH との寸法関係が、
a/H =0.1〜0.6・・・(2)式
を充足するように設定されている。
【0019】
上記構成の電子部品1を製作するに際しては、同図(A)に示したように先ずケース2の開口部から内部に電子部品1の素子部を挿入し、次いで、ガスケット4を蓋体3に嵌め込んで両者をケース2の開口部から内部に挿入し、同時にまたは引き続き、過カシメ防止用部品5をケース2の開口部から内部に挿入し、次いで、上方からカシメ荷重を加えてケース2の周縁部2bを折り曲げて、同図(B)に示したように、各部品をカシメ固定する。このカシメは、過カシメ防止用部品5がケース2のカシメ部2cに押されて下方にスライドし、ケース2の平面部2aに到達した時点で一律に停止せしめられ、よってこの方法によれば、カシメ量を一定量に制限することが可能である。したがって、強くカシメし過ぎてガスケット4が破損するのを未然に防止することができ、シールの信頼性を向上させることができる。
【0020】
尚、上記(1)式および(2)式は、以下の試験の結果から得たものである。
【0021】
すなわち、図1(A)および(B)に示したように、ガスケット4全体の高さをH、支え面側ガスケット4aの高さ(初期厚さ)をH 、カシメ後の支え面側ガスケット4aの高さ(厚さ)をH'、押え面側ガスケット4cの高さ(初期厚さ)をH 、カシメ後の押え面側ガスケット4cの高さ(厚さ)をH'、上記間隙6の大きさをaとし、ガスケット4の材質をブチルゴム架橋物(JIS硬度75)とし、H のつぶし率を
(H −H')/H ・・・(3)式
から求め、H のつぶし率を
(H −H')/H ・・・(4)式
から求めて、図2の表図に示すように各寸法を設定してシール性の良否判定(ガスケットの割れ発生判定)を行なったところ(シール性 良:○、可:△、不可(NG):×)、H /H =0.75〜1.5の場合、a/H =0.13でシール性が可であり、a/H =0.8で割れが発生した。したがって、この試験結果から上記(1)式および(2)式のとおりとしたもので、これによりガスケット4のつぶし量を適量に保つことができる。尚、シール性の試験結果を全て良の範囲に収めるには、
a/H =0.3〜0.6・・・(5)式
a/H =0.3〜0.6・・・(6)式
とするのが一層好適である。
【0022】
【発明の効果】
本発明は、以下の効果を奏する。
【0023】
すなわち、上記構成を備えた本発明の請求項1または2による電子部品の封口方法によれば、過カシメ防止用部品が発揮するスペーサー機能によってカシメ量を事前の設定どおりに制限することが可能となる。したがって、本方法によれば強くカシメし過ぎてガスケットが破損するのを未然に防止することができ、これによりシールの信頼性を向上させることができる。
【図面の簡単な説明】
【図1】本発明の実施例に係る電子部品の封口方法の工程説明図であって、(A)はカシメ前の状態を示す説明図、(B)はカシメ後の状態を示す説明図
【図2】カシメ後のつぶし率とシール性の結果を示す表図
【符号の説明】
1 電子部品
2 ケース
2a 平面部
2b,3b 周縁部
2c カシメ部
3 蓋体
3a 斜面部
4 ガスケット
4a 支え面側ガスケット
4b,5b 環状部分
4c 押え面側ガスケット
5 過カシメ防止用部品
5a 筒状部分
6 間隙
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for sealing an electronic component such as a battery or a capacitor in which a lid and a gasket are inserted into an opening of a bottomed case and fixed by caulking.
[0002]
[Prior art]
Sealing of a sealing portion of an electronic component such as a battery or a capacitor is generally performed by a caulking method using a gasket. The material of the gasket is a hydrocarbon polymer material. Polypropylene is used for the resin, and butyl rubber, ethylene propylene rubber, hydrogenated styrene-butadiene rubber, hydrogenated styrene-isoprene rubber, etc. are used for the rubber. Elastomers are mainly used.
[0003]
Of these, first, in order to ensure the sealing performance of the resin gasket, it is necessary to crimp the resin gasket so strongly that the crimping force remains during crimping. However, if the crimping is too strong, there is a risk that the gasket will be extremely thin and the gasket may be damaged.
[0004]
On the other hand, in rubber gaskets, it is possible to ensure sealing performance without the need to manage the degree of caulking so closely, but due to the large deformation caused by caulking, if the caulking is too strong, An extremely thin part may be formed and the gasket may be damaged, resulting in a decrease in sealing performance. Also, the dimensions are not stable. Therefore, in order to prevent this, it is still necessary to manage the degree of crimping.
[0005]
[Problems to be solved by the invention]
In view of the above, it is an object of the present invention to provide an electronic component sealing method capable of relatively easily managing the degree of caulking and thus improving the reliability of the seal.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the electronic component sealing method according to claim 1 of the present invention is the electronic component sealing method in which a lid and a gasket are inserted into the opening of the bottomed case and fixed by caulking. The caulking process is performed by inserting a high-rigidity over-caulking prevention part sandwiched between the inner bottom surface and the caulking portion of the material together with the lid and the gasket to limit the caulking amount to a certain amount. is there.
[0007]
The electronic component sealing method according to claim 2 of the present invention is the electronic component sealing method according to claim 1, wherein the over-caulking prevention component is inserted into the opening of the case together with the lid and the gasket. A gap is set between the over-caulking prevention part and the inner bottom surface of the case to limit the stroke amount during caulking of the over-caulking prevention part, and the gap size a and the initial thickness of the support surface side gasket are set. With respect to the dimensional relationship with H 1 and the dimensional relationship between the gap size a and the initial thickness H 2 of the pressing surface side gasket, a / H 1 and a / H 2 are 0.1 to 0.6, respectively. It is characterized by setting as follows.
[0008]
As in the electronic component sealing method according to claim 1 of the present invention having the above-described configuration, prior to caulking the peripheral portion of the case, the amount of caulking is sandwiched between the inner bottom surface of the case and the caulking portion. When the caulking process is performed after inserting the rigid and over-caulking parts that are limited to a certain amount together with the lid and gasket, the over-caulking parts perform a kind of spacer function, Can be restricted as previously set. The specific content of the restriction is that, as described in claim 2, when the over-caulking prevention part is inserted into the opening of the case together with the lid and the gasket, the over-caulking prevention part and the inner bottom surface of the case are interposed. , a gap set to limit the stroke amount at the time of caulking parts for excessive caulking prevention magnitude a and the pressing dimensional relationship and the gap between the initial thickness H 1 of size a and bearing surface side gasket of the gap the dimensional relationship between the initial thickness H 2 of the side gasket, it is preferable to set such a / H 1 and a / H 2 respectively become 0.1 to 0.6.
[0009]
In other words, the sealing method of the electronic component of the present invention, in other words, inserts the element part of the electronic component from the open end of the bottomed case, covers the lid through the gasket, and crimps the open end of the bottomed case by caulking. It is a sealing method that seals, inserts the gasket into the lid, inserts it from the open end of the bottomed case, installs it on the surface that supports the bottom of the gasket, so that there is a gap on the support surface of the gasket that limits the stroke range of crimping A high-rigidity over-caulking prevention part with various dimensions is inserted between the case and the gasket.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings.
[0011]
FIG. 1 shows a cross section of the main part of an electronic component 1 manufactured or manufactured by an electronic component sealing method according to the embodiment. FIG. 1 (A) shows a state before crimping, FIG. ) Shows the state after crimping. The electronic component 1 is a battery such as a button battery or a capacitor as described above, and is configured as follows.
[0012]
That is, as shown in FIG. 2B, first, a bottomed case 2 having one opening is provided, and an element portion (not shown) of the electronic component 1 is inserted into the case 2. The opening of the case 2 is closed by the lid 3. The case 2 is a so-called positive electrode can, and the lid 3 is a so-called negative electrode can or sealing plate. The lid 3 is fixed to the case 2 by bending the peripheral edge 2b of the case 2 inwardly by caulking. The caulking edge 2b of the case 2 and the peripheral edge 3b of the lid 3 are fixed. A resin or rubber gasket 4 is mounted between them, and a high-rigid material over-caulking prevention component 5 is mounted between the peripheral edge 2 b of the case 2 and the gasket 4.
[0013]
As shown in FIG. 2A, in the state before crimping, the case 2 is vertically raised from a disk-shaped flat surface portion (also referred to as a bottom surface portion) 2a and the periphery of the disk-shaped flat surface portion 2a. And a cylindrical peripheral edge portion (also referred to as a side surface portion) 2b, and as shown in FIG. 5B, when a caulking load is applied from above, the tip end portion (caulking portion) of the peripheral edge portion 2b 2c is bent inward over the entire circumference, the over-caulking prevention component 5 is slid, the gasket 4 is compressed, and the lid 3 is pressed and fixed.
[0014]
The lid 3 includes a disk-shaped flat surface portion (also referred to as an upper surface portion, not shown), an annular inclined surface portion 3a integrally formed on the periphery of the disk-shaped flat surface portion, and a peripheral edge of the inclined surface portion 3a. Are integrally formed with an annular peripheral portion (also referred to as a crimped portion) 3b having a U-shaped cross section, and is fixed to the case 2 by a peripheral portion 3b having a substantially U-shaped cross section.
[0015]
The gasket 4 includes an annular portion (also referred to as a gasket support portion or a support surface side gasket) 4a sandwiched between the peripheral portion 3b of the lid 3 and the flat portion 2a of the case 2, and the lid 3 Between the peripheral edge portion 3b of the lid 3 and the caulking portion 2c of the case 2 between the peripheral edge portion 3b and the peripheral edge portion 2b of the case 2 and the annular portion 4b sandwiched between the peripheral edge portion 3b and the peripheral edge portion 2b of the case 2 In addition, an annular portion (also referred to as a pressing surface side gasket) 4c that is sandwiched up and down together with the over-caulking prevention component 5 is integrally formed and formed into a U-shaped cross section.
[0016]
Further, the over-caulking prevention component 5 includes a cylindrical portion 5a sandwiched between the gasket 4 and the peripheral edge 2b of the case 2, and a gasket 4 after crimping as shown in FIG. And an annular portion 5b sandwiched vertically between the crimping portion 2c of the case 2 and an annular body having an L-shaped cross section. The lower end portion of the cylindrical portion 5a is formed in a cross-sectional arc shape according to the round (roundness) of the boundary between the flat surface portion 2a and the peripheral edge portion 2b in the case 2.
[0017]
The over-caulking prevention part 5 is formed of a highly rigid material such as a metal material or a fiber-reinforced polymer material. The metal material is preferably the same material as the material that is resistant to the electrolyte or the high dielectric constant liquid, the material used as the electrode, or the metal material of the case 2, and the polymer material is a phenol resin. Alternatively, engineering plastics such as polyphenylene sulfide, polyamideimide, polyetheretherketone, polyimide, syndiotactic polystyrene, fluororesin, aromatic polyamide, thermotropic liquid crystal polymer resin, and polyetherimide are preferable.
[0018]
Further, as shown in FIG. 5A, when this over-caulking prevention part 5 is inserted into the opening of the case 2 together with the lid 3 and the gasket 4 in the state before caulking, A gap 6 is set between the part 5 and the flat portion 2a (inner bottom face) of the case 2 to limit the stroke amount when the over-caulking prevention part 5 is caulked. The size a of the gap 6 and the gasket dimensional relationship between the initial thickness H 1 4 before crimping bearing surface side gasket 4a of,
a / H 1 = 0.1 to 0.6 (1) is satisfied, and the size a of the gap 6 and the initial thickness H 2 of the holding surface side gasket 4c of the gasket 4 before caulking The dimensional relationship of
It is set so as to satisfy the a / H 2 = 0.1~0.6 ··· ( 2) expression.
[0019]
When manufacturing the electronic component 1 having the above-described configuration, first, the element portion of the electronic component 1 is inserted from the opening of the case 2 into the interior as shown in FIG. The two parts are inserted into the case 2 from the opening, and simultaneously or subsequently, the over-caulking prevention part 5 is inserted into the case 2 from the opening, and then the caulking load is applied from above to apply the case 2 The peripheral edge 2b is bent and each part is caulked and fixed as shown in FIG. This caulking is stopped uniformly when the over-caulking prevention part 5 is pushed by the caulking part 2c of the case 2 and slides downward and reaches the flat part 2a of the case 2, and according to this method, It is possible to limit the amount of caulking to a certain amount. Therefore, it is possible to prevent the gasket 4 from being damaged due to excessive crimping, and to improve the reliability of the seal.
[0020]
The above formulas (1) and (2) are obtained from the results of the following tests.
[0021]
That is, as shown in FIGS. 1A and 1B, the overall height of the gasket 4 is H, the height (initial thickness) of the support surface side gasket 4a is H 1 , and the support surface side gasket after crimping. The height (thickness) of 4a is H 1 ', the height (initial thickness) of the pressing surface side gasket 4c is H 2 , and the height (thickness) of the pressing surface side gasket 4c after crimping is H 2 ', the size of the gap 6 is a, the material of the rubber cross-linked product of the gasket 4 and (JIS hardness 75), the compression rate of an H 1 from (H 1 -H 1 ') / H 1 ··· (3) formula determined, the compression rate between H 2 (H 2 -H 2 ' ) / H 2 ··· (4) determined from equation quality determination of sealability by setting the dimensions as shown in Table of FIG 2 (Decision of occurrence of cracking in gasket) (Sealability: Good, ○: Acceptable: Δ, Impossible (NG): x), H 1 / H 2 = In the case of 0.75 to 1.5, sealability was acceptable when a / H 1 = 0.13, and cracking occurred when a / H 1 = 0.8. Therefore, the test results are as shown in the above formulas (1) and (2), whereby the collapse amount of the gasket 4 can be kept at an appropriate amount. In addition, in order to keep all the test results of sealing performance within the good range,
a / H 1 = 0.3 to 0.6 (5) Formula a / H 2 = 0.3 to 0.6 (6) is more preferable.
[0022]
【The invention's effect】
The present invention has the following effects.
[0023]
That is, according to the electronic component sealing method according to claim 1 or 2 of the present invention having the above-described configuration, it is possible to limit the caulking amount as set in advance by the spacer function exhibited by the over-caulking prevention component. Become. Therefore, according to this method, it is possible to prevent the gasket from being excessively caulked and being damaged, thereby improving the reliability of the seal.
[Brief description of the drawings]
1A and 1B are process explanatory views of a method for sealing an electronic component according to an embodiment of the present invention, where FIG. 1A is an explanatory view showing a state before caulking, and FIG. 1B is an explanatory view showing a state after caulking; Fig. 2 Table showing the crushing rate and sealing results after crimping
DESCRIPTION OF SYMBOLS 1 Electronic component 2 Case 2a Flat surface part 2b, 3b Peripheral part 2c Crimp part 3 Lid 3a Slope part 4 Gasket 4a Support surface side gasket 4b, 5b Annular part 4c Holding surface side gasket 5 Over-caulking prevention part 5a Cylindrical part 6 gap

Claims (2)

有底状のケース(2)の開口部に蓋体(3)およびガスケット(4)を挿入してカシメ固定する電子部品(1)の封口方法において、
前記ケース(2)の内部底面とカシメ部(2c)との間に挟まれてカシメ量を一定量に制限する高剛性の過カシメ防止用部品(5)を前記蓋体(3)およびガスケット(4)とともに挿入してカシメ工程を行なうことを特徴とする電子部品の封口方法。
In the sealing method of the electronic component (1) in which the lid (3) and the gasket (4) are inserted into the opening of the bottomed case (2) and fixed by caulking,
A highly rigid over-caulking prevention part (5) which is sandwiched between the inner bottom surface of the case (2) and the caulking part (2c) and restricts the caulking amount to a certain amount is attached to the lid (3) and the gasket ( 4) A method for sealing an electronic component, which is performed together with a caulking process.
請求項1の電子部品の封口方法において、
過カシメ防止用部品(5)を蓋体(3)およびガスケット(4)とともにケース(2)の開口部に挿入したときに前記過カシメ防止用部品(5)とケース(2)の内部底面との間に、前記過カシメ防止用部品(5)のカシメ時のストローク量を制限する間隙(6)を設定し、
前記間隙(6)の大きさaと支え面側ガスケット(4a)の初期厚さH との寸法関係および前記間隙(6)の大きさaと押え面側ガスケット(4c)の初期厚さH との寸法関係を、a/H およびa/H がそれぞれ0.1〜0.6となるように設定することを特徴とする電子部品の封口方法。
In the electronic component sealing method according to claim 1,
When the over-caulking prevention part (5) is inserted into the opening of the case (2) together with the lid (3) and the gasket (4), the over-caulking prevention part (5) and the inner bottom surface of the case (2) In the meantime, a gap (6) for limiting the stroke amount during caulking of the over-caulking prevention part (5) is set,
The initial thickness H of the gap size a and the pressing surface gasket (4c) of the dimensional relationship and the gap between the initial thickness H 1 of the (6) the size of a and bearing surface gasket (4a) (6) 2 is set such that a / H 1 and a / H 2 are 0.1 to 0.6, respectively.
JP32046099A 1999-11-11 1999-11-11 Sealing method of electronic parts Expired - Fee Related JP4344899B2 (en)

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JP4931480B2 (en) * 2006-06-05 2012-05-16 三洋電機株式会社 ELECTROCHEMICAL ELEMENT AND ELECTRONIC DEVICE HAVING THE SAME
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JP4785681B2 (en) * 2006-09-05 2011-10-05 三洋電機株式会社 ELECTROCHEMICAL ELEMENT AND ELECTRONIC DEVICE HAVING THE SAME
JP2009289968A (en) * 2008-05-29 2009-12-10 Sanyo Electric Co Ltd Coin type cell
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