JP4325523B2 - Wiring board, electronic device using the same, and manufacturing method thereof - Google Patents

Wiring board, electronic device using the same, and manufacturing method thereof Download PDF

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JP4325523B2
JP4325523B2 JP2004281793A JP2004281793A JP4325523B2 JP 4325523 B2 JP4325523 B2 JP 4325523B2 JP 2004281793 A JP2004281793 A JP 2004281793A JP 2004281793 A JP2004281793 A JP 2004281793A JP 4325523 B2 JP4325523 B2 JP 4325523B2
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wiring pattern
conductive
conductive resin
resin
insulating substrate
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JP2006100371A (en
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内田  修
法人 塚原
大輔 櫻井
和宏 西川
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パナソニック株式会社
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Description

  The present invention relates to a wiring board in which a wiring pattern is formed using a conductive resin on an insulating substrate, an electronic device using the wiring board, and a method for manufacturing the same.

  In recent years, as electronic devices such as mobile terminals such as mobile phones and PDAs have become smaller and higher in density, wiring boards used in these devices require high-density wiring and form highly precise fine patterns. Is required to do.

  Usually, as a method of forming a wiring pattern using a conductive resin on an insulating substrate, a method using a wiring pattern forming sheet or a method using a transfer mold is used. When the wiring pattern formed by these methods is miniaturized, the distribution of conductive particles, which are conductive components in the conductive resin, and the variation in adhesion to the insulating substrate occur. For this reason, the conductive resistance of the wiring pattern may increase or the conductive resistance may vary. Further, peeling may occur partially due to variations in the adhesive strength of the wiring pattern. Furthermore, generally, the outer surface of the wiring pattern made of a conductive resin tends to form a coating film of a resin component, and the conduction resistance tends to increase.

  On the other hand, in the development of electronic devices as described above, the use of multilayer wiring boards capable of mounting semiconductor chips and the like at high density is also increasing. In this case, an inner via hole connection method in which an arbitrary electrode of a wiring board can be interlayer-connected at an arbitrary wiring pattern position is often used. In the inner via hole connection method, when the conductive resin filled in the via hole is connected by the screen printing method, the same problem occurs when the size of the inner via hole is reduced in order to realize high-density interlayer connection.

  That is, in any of the wiring pattern and the inner via hole, the printability and the conductivity are in conflict with each other when viewed from the material constitution side of the conductive resin. That is, if the component ratio of the conductive component, that is, the conductive particles is increased in order to improve the conductivity, the viscosity of the conductive resin is increased and the fluidity and adhesiveness are deteriorated, so that printing becomes difficult. Further, when the composition ratio of the conductive particles is decreased in order to improve the printability, the contact area between the conductive particles is reduced, and there is a problem in connection reliability due to an increase in conduction resistance.

  Under such circumstances, in order to solve the problem of the inner via hole, a method of manufacturing a wiring board as described below has been proposed (for example, Patent Document 1).

  Hereinafter, a method for manufacturing a wiring board will be described with reference to FIGS.

  FIG. 9 is a cross-sectional view for explaining a method of manufacturing a wiring board, in which FIG. 10 (a) is a plan view of a conductive resin separating and filling facility, and FIG. 9 (b) is a front view.

  First, as shown in FIG. 9A, a cover film 1030 is bonded to the surface of an insulating substrate 1020 to which a wiring material 1010 such as a copper foil is bonded. Thereafter, as shown in FIG. 9B, a via hole 1040 is formed by laser processing or the like through the cover film 1030 and the insulating substrate 1020.

  Next, as shown in FIG. 9C, a print mask 1050 is bonded, and the via hole 1040 is filled with conductive resin 1060 through the print mask 1050 by screen printing. Then, the print mask 1050 is removed, and a work-in-process substrate 1070 shown in FIG.

  Next, using the separation and filling equipment for conductive resin shown in FIG. 10, centrifugal separation is performed so that centrifugal force acts in the bottom direction of the via hole 1040, and the conductive resin 1060 is filled into the via hole 1040. Centrifugation is performed by attaching a holder 1090 having the wiring material 1010 outside and fixing the work substrate 1070 to the rotary stage 1080, rotating the drive unit 1100, and applying centrifugal force.

  As a result, in the state after centrifugation shown in FIG. 9 (e), conductive holes having a large specific gravity, which is a conductive component in the conductive resin 1060, are preferentially filled in the bottoms of the via holes 1040. As a result, the conductive resin 1060 is separated into conductive particles and a resin component, the density of the conductive particles in the via hole 1040 is high, and a large amount of the resin component exists on the surface of the cover film 1030.

  Next, as shown in FIG. 9 (f), the conductive resin 1060 containing a large amount of the resin component remaining on the surface of the cover film 1030 is scraped off with a squeegee 1110 to peel off the cover film 1030. As a result, as shown in FIG. 9G, a state in which the conductive resin 1060 protrudes from the surface of the insulating substrate 1020 is obtained.

  Next, as shown in FIG. 9H, when a wiring material 1120 such as a copper foil is laminated and heated and pressed to adhere the wiring material 1120 to the insulating substrate 1020, the state of FIG. 9I is obtained. It is done.

  Finally, the wiring materials 1010 and 1120 on the surface are patterned by etching to obtain a double-sided wiring board 1130 shown in FIG.

By the above method, a method of manufacturing a wiring board that can fill the via hole 1040 with the conductive component of the conductive resin 1060 with high density and has stable interlayer connection characteristics has been proposed.
JP 2001-345528 A

  However, the inner via hole manufacturing method disclosed in Patent Document 1 uses a printing mask 1050 to create a space for collecting resin components during printing of the conductive resin 1060, and the resin collected in this space by centrifugation. The ingredients are scraped off with a squeegee. Therefore, as compared with the conventional manufacturing method, a centrifugal separation process is necessary, and a process of attaching the print mask 1050 or scraping the conductive resin 1060 on the surface of the cover film 1030 is necessary. Further, an extra conductive resin 1060 is required for the amount to be scraped off.

  On the other hand, there is no good solution for miniaturization of wiring patterns.

  The present invention has been made to solve the problems of such wiring patterns, and an object thereof is to provide a wiring pattern having a low conduction resistance and at the same time excellent in adhesion to an insulating substrate, and a method for manufacturing the same.

In order to achieve the above object, a method of manufacturing a wiring board according to the present invention includes a step of attaching a wiring pattern forming sheet having a wiring pattern-shaped through hole on an insulating substrate, and a penetration of the attached wiring pattern forming sheet A step of filling a hole with a paste-like conductive resin, a step of attaching a release sheet on the wiring pattern forming sheet, a conductive resin in the through hole, a conductive component on the release sheet side and an insulating substrate The resin component on the side includes a separation step of separating along the thickness direction of the wiring pattern, a step of peeling the wiring pattern forming sheet and the release sheet from the insulating substrate, and a step of curing the conductive resin.

  By this manufacturing method, since the density of the conductive component is high in the surface portion of the wiring pattern made of the conductive resin, it is possible to realize a wiring board with low conduction resistance and small variation in conduction resistance. Furthermore, since the adhesive portion of the wiring pattern close to the insulating substrate has a high resin component density and excellent adhesion to the insulating substrate, it is possible to stably manufacture a wiring substrate having a wiring pattern advantageous for miniaturization. it can.

  In addition, the method for manufacturing a wiring board according to the present invention includes a step of filling a wiring pattern-shaped recess formed in a transfer mold with a paste-like conductive resin, and a conductive resin in the recess on the side close to the bottom of the recess. The separation process of separating the conductive component and the resin component on the side away from the bottom of the recess along the depth direction of the recess, and the transfer mold is inverted and brought into close contact with the insulating substrate, and then the transfer mold is insulated. The step of transferring the conductive resin away from the conductive substrate and the step of curing the conductive resin may be provided.

  With this manufacturing method, it is possible to apply a transfer printing method with a high degree of freedom in selecting a transfer material and the type of insulating substrate to be printed. Furthermore, since the density of the conductive component is high in the surface portion of the wiring pattern made of conductive resin, a wiring board with low conduction resistance and small variation in conduction resistance can be realized. In addition, since the adhesive portion of the wiring pattern close to the insulating substrate has a high resin component density and excellent adhesion, the wiring substrate is manufactured on various insulating substrates having a wiring pattern advantageous for miniaturization. Can do.

  Further, the method for manufacturing a wiring board according to the present invention includes a step of filling a recess in a wiring pattern shape formed on an insulating substrate with a paste-like conductive resin, a step of attaching a cover sheet on the insulating substrate, A separation step of separating the conductive resin in the recess into a conductive component on the cover sheet side and a resin component on the side near the bottom of the recess along the depth direction of the recess, and peeling the cover sheet from the insulating substrate You may make it provide the process and the process of hardening a conductive resin.

  With this manufacturing method, the surface portion of the wiring pattern made of a conductive resin has a high density of conductive components, so that it is possible to realize a wiring board having a low conduction resistance and a small variation in conduction resistance. In addition, the vicinity of the bottom of the wiring pattern recess has a high density of resin components and excellent adhesion to the insulating substrate, so it is possible to stably manufacture a wiring substrate having a highly accurate fine pattern inside the insulating substrate recess. can do.

  In the method for manufacturing a wiring board according to the present invention, the separating step may cause the centrifugal force to act on the conductive resin filled in the through holes or the recesses of the wiring pattern shape.

  By this manufacturing method, the conductive component and the resin component in the conductive resin constituting the wiring pattern are efficiently converted into the conductive component on the surface side of the wiring pattern and the resin component on the insulating substrate side using the difference in specific gravity. Can be reliably separated. As a result, it is possible to simultaneously reduce the conduction resistance of the wiring pattern and improve the adhesion with the insulating substrate.

  Moreover, the manufacturing method of the wiring board of this invention may apply a predetermined voltage between the both ends of the formed wiring pattern, and may melt-bond the conductive component in conductive resin.

  By this manufacturing method, conductive particles made of metal powder or the like as a conductive component in the conductive resin separated on the surface side of the wiring pattern in the separation step are melt-bonded by the applied voltage. As a result, the conduction resistance on the surface of the wiring pattern can be further reduced. Further, since the variation in characteristics of the conductive resistance is further reduced, it is advantageous for miniaturization of the wiring pattern, and a wiring board having excellent high frequency characteristics can be realized because the conductive resistance on the surface of the wiring pattern is small.

  According to the present invention, since the density of the conductive component is high in the surface portion of the wiring pattern made of the conductive resin formed on the insulating substrate, the conduction resistance is low and the variation of the conduction resistance can be reduced. Furthermore, since the portion of the wiring pattern close to the insulating substrate has a high resin component density and excellent adhesion to the insulating substrate, it has a great effect that a wiring substrate having a wiring pattern advantageous for miniaturization can be realized. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view of a wiring board according to a first embodiment of the present invention. The cross-sectional view shows a state in which a plurality of elongated wiring patterns arranged in a direction perpendicular to the length direction are cut.

  In FIG. 1, a wiring substrate 100 is made of a conductive resin on an insulating substrate 110 made of a resin substrate such as a glass epoxy resin in which a glass cloth is impregnated with a resin, a thermosetting resin such as PET (polyethylene terephthalate) resin or polyimide. A wiring pattern 120 made of 130 is provided at a predetermined position.

  The conductive resin 130 is configured by mixing, for example, a metal powder excellent in conductivity such as silver powder having a particle diameter of about 3 μm as a conductive component in a thermosetting resin such as an epoxy resin as a resin component. Has been. The component of the conductive resin 130 in the thickness direction of the wiring pattern 120 is separated from the insulating substrate 110 into a layer (hereinafter referred to as a high-density conductive component layer) 140 having a higher conductive component density as the distance from the insulating substrate 110 increases. As it approaches 110, it has a gradient so as to become a layer (hereinafter referred to as a high density resin component layer) 150 having a higher resin component density.

  Then, by forming the surface portion of the wiring pattern 120 away from the insulating substrate 110 as the high-density conductive component layer 140, it is possible to realize the wiring substrate 100 having low conduction resistance and small characteristic variation. Further, by making the portion close to the insulating substrate 110 the high-density resin component layer 150, the wiring pattern 120 can be firmly bonded to the surface of the insulating substrate 110.

  That is, the wiring pattern 120 according to the first embodiment of the present invention has a low conduction resistance and a strong adhesion to the insulating substrate 110. Therefore, the wiring pattern 120 is extremely resistant to an increase in conduction resistance and a reduction in adhesion due to miniaturization. This is advantageous. Further, since the conduction resistance on the surface of the wiring pattern 120 can be reduced, the wiring substrate 100 having excellent frequency characteristics can be provided by realizing connection with another wiring pattern or connection with low contact resistance with an electronic component or the like.

  Next, a method for manufacturing a wiring board according to the first embodiment of the present invention will be described with reference to FIG. FIG. 2 is a cross-sectional view illustrating a method for manufacturing a wiring board in the order of steps.

  First, as shown in FIG. 2A, a wiring pattern forming sheet 200 having a through hole 200 </ b> A having a wiring pattern shape is bonded onto the insulating substrate 110. It is desirable that the adhesive force between the wiring pattern forming sheet 200 and the insulating substrate 110 has an adhesive strength that can be easily peeled later.

  Next, as shown in FIG. 2 (b), the paste-like conductive resin 130 is filled in the through holes 200A via the wiring pattern forming sheet 200 by a screen printing method or the like, and the state shown in FIG. 2 (c). And In this state, the conductive component and the resin component of the conductive resin 130 are almost uniformly mixed.

  Next, as shown in FIG. 2D, a release sheet 210 made of, for example, PET (polyester), PP (polypropylene), PE (polyethylene) film or the like is attached to the upper surface of the wiring pattern forming sheet 200, and the work is started. A substrate 220 is produced. The release sheet 210 preferably has an adhesive force with respect to the wiring pattern forming sheet 200 and does not affect the characteristics of the conductive resin 130. In the case where the release sheet 210 is brought into close contact with the wiring pattern forming sheet 200 using, for example, a jig, an adhesive force is not particularly required.

  Next, as a separation step, the in-process substrate 220 is mounted between the first fixing jig 300A and the second fixing jig 300B of the conductive resin separation apparatus shown in the plan view of FIG. Then, as indicated by the arrows in FIG. 3, the rotating stage 310 is rotated so that centrifugal force acts in the direction of the release sheet 210 of the work-in-process substrate 220 in the outer peripheral direction of the rotating stage 310. Due to this centrifugal force, the high density conductive component layer 140 is placed on the release sheet 210 side, and the high density resin component layer 150 is placed on the release sheet 210 side by utilizing the specific gravity difference between the metal powder that is the conductive component of the conductive resin 130 and the resin component. The conductive resin 130 in the through hole 200A is separated so as to be on the insulating substrate 110 side, and the state shown in FIG.

  That is, by this separation step, the conductive resin 130 in the through hole 200A has the high-density conductive component layer 140 on the side away from the insulating substrate 110 and the high-density resin component layer 150 on the side close to the insulating substrate 110. The wiring pattern 120 has a gradient that increases each.

  In the separation apparatus for the conductive resin 130 described above, a conventional conductive resin separation and filling facility can be used for the configuration of the drive unit and the like.

  Next, as shown in FIG. 2F, the wiring pattern forming sheet 200 and the release sheet 210 of the work-in-process substrate 220 are peeled off. In this case, the wiring pattern forming sheet 200 and the release sheet 210 may be separated separately or simultaneously.

  Next, when the conductive resin 130 is cured by heating to a temperature equal to or higher than the curing temperature of the thermosetting resin that is a resin component of the conductive resin 130, the wiring substrate 100 shown in FIG. 1 is manufactured. At this time, the conductive resin 130 is firmly bonded to the insulating substrate 110 because the side close to the insulating substrate 110 is the high-density resin component layer 150.

  In addition, you may perform the hardening process of the wiring pattern 120 which consists of the said conductive resin 130 before peeling the release sheet 210 and the wiring pattern formation sheet 200. FIG.

  By this manufacturing method, since the surface portion of the wiring pattern 120 made of the conductive resin 130 becomes the high-density conductive component layer 140, the conductive resistance is low, and variation in the conductive resistance due to the presence of the resin component can be suppressed. Furthermore, since the adhesion portion close to the insulating substrate 110 becomes the high-density resin component layer 150, the adhesion of the wiring pattern 120 to the insulating substrate 110 is improved. As a result, it is possible to stably manufacture the wiring substrate 100 including the wiring pattern 120 that has a low conduction resistance and does not reduce the adhesive force even with respect to miniaturization.

  In the above manufacturing method, the wiring pattern 120 is formed on the insulating substrate 110 using the wiring pattern forming sheet 200. However, the present invention is not limited to this.

  Hereinafter, a method for forming the wiring pattern 120 using a transfer mold will be described.

  FIG. 4 is a cross-sectional view for explaining a method of manufacturing a wiring board according to another example of the first embodiment of the present invention.

  First, as shown in FIG. 4A, the conductive resin 130 is filled into the wiring pattern-shaped depressions 400A formed in the transfer mold 400 by screen printing or the like. Thereafter, the cover sheet 410 is attached to the upper surface 400B of the transfer mold 400, and the transfer mold 420 including the conductive resin 130 as shown in FIG.

  Next, as in the first embodiment, the transfer mold 420 including the conductive resin 130 is attached to a conductive resin separator (not shown). And a rotation stage (not shown) is rotated so that centrifugal force may work toward the bottom 400C direction of the hollow 400A. Due to this centrifugal force, the high-density conductive component layer 140 is formed on the bottom 400C side of the recess 400A using the specific gravity difference between the metal powder, which is a conductive component of the conductive resin 130, and the resin component. The conductive resin 130 in the dent 400A is separated so that is on the cover sheet 410 side, and has a gradient as shown in FIG. If a density gradient is generated not only in the thickness direction of the wiring pattern but also in the rotation direction depending on the rotation direction, the density gradient in the rotation direction may be reduced by rotating the rotation direction forward and backward.

  Next, after the cover sheet 410 of the transfer mold 420 containing the conductive resin 130 is peeled off, the transfer mold 400 is inverted as shown in FIG. 4D to bring the transfer mold 400 into close contact with the insulating substrate 110. .

  Next, as shown in FIG. 4E, the transfer mold 400 is separated from the insulating substrate 110, and the conductive resin 130 filled in the depression 400A is transferred to the insulating substrate 110.

  Lastly, the conductive resin 130 is cured by heating to a temperature equal to or higher than the curing temperature of the thermosetting resin that is a resin component of the conductive resin 130, so that the wiring substrate 100 shown in FIG. 1 is formed. At this time, since the side close to the insulating substrate 110 of the conductive resin 130 is the high-density resin component layer 150, the adhesive strength to the insulating substrate 110 is excellent as in the first embodiment. A wiring pattern 120 is formed.

  With this manufacturing method, it is possible to use a transfer printing method with a high degree of freedom in selecting the material of the transfer mold 400 and the material of the insulating substrate 110 to be transferred. Further, since the surface portion of the wiring pattern 120 made of the conductive resin 130 has a high density of conductive components, it is possible to form the wiring pattern 120 having low conduction resistance and suppressing variation in conduction resistance due to the presence of the resin component. Furthermore, since the high-density resin component layer 150 having a high resin component density is formed in a portion close to the insulating substrate 110, the adhesiveness to the insulating substrate 110 is excellent. As a result, it is possible to stably manufacture the wiring substrate 100 in which the wiring pattern 120 having a low conduction resistance and excellent adhesive force even when miniaturized is easily formed on various insulating substrates 110.

  In the case of the manufacturing method using the transfer mold 400, the wiring board 100 can be manufactured without using the cover sheet 410. However, since the conductive resin 130 may adhere to a fixing jig (not shown) of the separation device, it is preferable to use the cover sheet 410 for continuous production.

  In the first embodiment, the high density conductive component layer and the high density resin component layer are separated. The wiring pattern can be formed separately in two layers, a high-density conductive component layer and a high-density resin component layer, but usually a density gradient in which the density of the high-density conductive component layer and the high-density resin component layer gradually changes. have. However, the drawings are schematically shown for easy understanding. The same applies to the following embodiments.

  A wiring pattern formed with a conductive resin containing 80 wt% of an Ag conductive component and 20 wt% of an epoxy resin resin using a PET (polyethylene terephthalate) substrate by the above manufacturing method and having a thickness of 25 μm is rotated, for example. The conduction resistance when rotated for 1 minute at several thousand rpm could be reduced to about ½ compared to the conduction resistance of the conventional wiring pattern.

  Needless to say, conditions such as the number of rotations and the rotation time vary depending on the constituent components and viscosity of the conductive resin.

(Second Embodiment)
FIG. 5 is a cross-sectional view of a wiring board according to the second embodiment of the present invention.

  In FIG. 5, the insulating substrate 510 is made of, for example, a resin substrate such as a glass epoxy material or a PET resin in which a glass cloth is impregnated with a resin. Then, the conductive resin 130 is filled into the recess 510A that forms the wiring pattern 520 provided at a predetermined position on the upper surface 510B of the insulating substrate 510, whereby the wiring substrate 500 is configured.

  The conductive resin 130 is a mixture of a highly conductive metal powder as a conductive component in a thermosetting resin as a viscous resin component, similar to that described in the first embodiment. Made of paste. The conductive resin 130 in the thickness direction in the recess 510A has the high-density conductive component layer 140 as it approaches the top surface 510B of the insulating substrate 510, and the high-density resin component layer 150 as it approaches the bottom 510C of the recess 510A. , Each has a component density gradient that increases.

  With this configuration, the wiring pattern 520 made of the conductive resin 130 disposed in the recess 510A of the insulating substrate 510 has a high conductive component density in the surface portion, so that the conduction resistance is low and the resin component intervenes. It is possible to reduce the variation of the conduction resistance due to. Furthermore, since the resin component density is high in the vicinity of the bottom 510C surface of the recess 510A, the adhesive force of the wiring pattern 520 to the insulating substrate 510 is improved. As a result, even when the fine wiring pattern 120 with high accuracy is formed, the wiring substrate 500 having low reliability such as low conduction resistance and no peeling from the insulating substrate 510 can be manufactured.

  A method for manufacturing a wiring board according to the second embodiment of the present invention will be described below. FIG. 6 is a cross-sectional view for explaining a method of manufacturing a wiring board according to the second embodiment of the present invention.

  First, as shown in FIG. 6A, a conductive resin 130 is filled in a recess 510A having a wiring pattern shape formed on an insulating substrate 510 by screen printing or the like. Then, a cover sheet 530 is attached to the upper surface 510B of the insulating substrate 510 to produce a work-in-process substrate 600 as shown in FIG.

  Next, the in-process substrate 600 is mounted on a conductive resin separation device (not shown) so that centrifugal force works toward the cover sheet 530 side, and the rotary stage (not shown) is rotated. By this centrifugal force, the high-density conductive component layer 140 is recessed on the cover sheet 530 side and the high-density resin component layer 150 is recessed by utilizing the specific gravity difference between the metal powder that is the conductive component of the conductive resin 130 and the resin component. The conductive resin 130 is separated in the depth direction of the recess 510A so as to be on the bottom 510C side of 510A, and a state having a gradient as shown in FIG.

  Next, after the cover sheet 530 of the work-in-process substrate 600 is peeled off, the conductive resin 130 is cured by heating to a temperature equal to or higher than the curing temperature of the thermosetting resin that is the resin component of the conductive resin 130, as shown in FIG. A wiring substrate 500 is produced. At the time of this curing, the conductive resin 130 becomes the high-density resin component layer 150 on the side close to the bottom 510C of the recess 510A of the insulating substrate 510. Therefore, the conductive resin 130 is very much with respect to the bottom 510C surface of the recess 510A and the surrounding side walls. Bonded firmly.

  With this manufacturing method, even when a fine wiring pattern with high accuracy is formed, a wiring board with excellent reliability such as low conduction resistance and no peeling of the wiring pattern from the insulating substrate can be easily manufactured.

(Third embodiment)
FIG. 7 is a plan view of a wiring board according to the third embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along the line P-P in FIG.

  The wiring board 800 according to the third embodiment of the present invention has a predetermined voltage between the lands 700A and 700B shown in FIG. 7 in the wiring pattern 120 of the wiring board 100 shown in FIG. 1 of the first embodiment. (Pulse voltage) is applied.

  That is, an insulating film such as a resin component formed on the surface of conductive particles made of metal powder such as silver powder or copper powder of about 3 μm in the high-density conductive component layer 140 of the wiring pattern 120 by applying voltage. A conductive layer 810 is formed by bonding the conductive particles by dielectric breakdown or melting. Here, the predetermined voltage is a voltage higher than the dielectric breakdown of the insulating coating between the conductive particles, and a voltage equal to or lower than a voltage that does not cause dielectric breakdown in the wiring pattern at a connection portion to which a voltage described later is applied.

  By this method, as shown in FIG. 8, the wiring pattern 700 having the conductive layer 810 has a smaller conduction resistance and a smaller characteristic variation than the wiring pattern 120 shown in FIG. Therefore, it is possible to obtain a wiring board 800 that is more effective for miniaturization of the wiring pattern 700 and is advantageous for a high-frequency device or the like in which a current easily flows on the surface of the wiring pattern 700.

  Specifically, for example, when a voltage of 50 V is applied to the wiring pattern of the first embodiment in a pulse manner about three times per second, the conduction resistance can be further reduced to about ½. .

  The present invention can also be applied to a wiring pattern made of a conventional conductive resin, but the effect is particularly great in a wiring pattern having a high-density conductive component layer on the surface. The reason for this is that the surface of a normal wiring pattern has a higher conduction resistance due to a larger amount of resin components than the wiring pattern of the present invention, and the contact resistance of a connection portion to which a voltage is applied is also higher. For this reason, it is difficult to control the voltage to be applied, for example, dielectric breakdown is likely to occur at the connection portion to which the voltage is applied, and it is also necessary to apply a high voltage. On the other hand, in the case of the wiring pattern according to the present invention, the conductive resistance on the surface is low and the contact resistance is small due to the high-density conductive component layer, so that the conductive resistance can be easily lowered by simple control of the applied voltage. .

  Note that the magnitude of the voltage applied between the lands 700A and 700B of the wiring pattern 120 needs to be experimentally determined according to the conditions of the electronic device using the wiring substrate 100, the width, length, thickness, etc. of the wiring pattern. In general, it is preferable to apply a pulse voltage that can be applied with a high voltage, can suppress heat generation due to energization, and can easily adjust the energization time.

  In addition, when a plurality of wiring patterns 120 are formed on the insulating substrate 110, a predetermined voltage is applied only to the necessary wiring pattern 700, so that the high-density conductive component layer 140 is a conductive layer 810 having a low conduction resistance. Alternatively, it may be formed selectively.

  In the above description, a predetermined voltage is applied to the wiring pattern 120 formed on the insulating substrate 110 in the wiring substrate 100 according to the first embodiment. Needless to say, this is applicable to such a wiring board.

  Further, by using the wiring board in each of the above embodiments for a portable device, a portable terminal, or the like, it is possible to realize an electronic device that is further reduced in size, weight, and thickness.

  The wiring board of the present invention has a low conduction resistance, can reduce characteristic variations, and can form a wiring pattern with excellent adhesion to an insulating substrate. This is useful in electronic devices such as portable terminals and portable devices.

Sectional drawing of the wiring board which concerns on the 1st Embodiment of this invention Sectional drawing explaining the manufacturing method of the wiring board which concerns on the 1st Embodiment of this invention The top view of the separation apparatus of the conductive resin of the wiring board which concerns on the 1st Embodiment of this invention Sectional drawing explaining the manufacturing method of the wiring board which concerns on another example of the 1st Embodiment of this invention. Sectional drawing of the wiring board which concerns on the 2nd Embodiment of this invention. Sectional drawing explaining the manufacturing method of the wiring board which concerns on the 2nd Embodiment of this invention. The top view of the wiring board which concerns on the 3rd Embodiment of this invention PP sectional view of FIG. Sectional drawing explaining the manufacturing method of the conventional wiring board (A) Plan view of separation and filling equipment for conductive resin in a conventional method of manufacturing a wiring board (b) Front view of the separation and filling equipment

Explanation of symbols

100, 500, 800 Wiring substrate 110, 510 Insulating substrate 120, 520, 700 Wiring pattern 130 Conductive resin 140 High density layer of conductive component (high density conductive component layer)
150 High density resin component layer (high density resin component layer)
200 wiring pattern forming sheet 200A through-hole 210 release sheet 220,600 work-in-process substrate 300A first fixing jig 300B second fixing jig 310 rotating stage 400 transfer mold 400A, 510A depression 400B, 510B upper surface 400C, 510C bottom 410, 530 cover sheet 420 Transfer Type 700A, 700B Land 810 Conductive Layer Encapsulating Conductive Resin

Claims (5)

  1. A step of attaching a wiring pattern forming sheet having a wiring pattern-shaped through hole on an insulating substrate;
    A step of filling a paste-like conductive resin into the through hole of the pasted wiring pattern forming sheet;
    A step of attaching a release sheet on the wiring pattern forming sheet;
    A separation step of separating the conductive resin in the through hole into a conductive component on the release sheet side and a resin component on the insulating substrate side along the thickness direction of the wiring pattern;
    Peeling the wiring pattern forming sheet and the release sheet from the insulating substrate;
    And a step of curing the conductive resin.
  2. A step of filling a conductive resin in the form of a paste into a recess in a wiring pattern shape formed in a transfer mold;
    A separation step of separating the conductive resin in the depression along a depth direction of the depression into a conductive component on the side near the bottom of the depression and a resin component on the side away from the bottom of the depression;
    Reversing the transfer mold and bringing it into intimate contact with an insulating substrate, and then transferring the conductive resin by separating the transfer mold from the insulating substrate;
    And a step of curing the conductive resin.
  3. Filling a conductive resin in the form of a paste into a recess in a wiring pattern shape formed on an insulating substrate;
    Attaching a cover sheet on the insulating substrate;
    A separation step of separating the conductive resin in the depression into a conductive component on the cover sheet side and a resin component on the side near the bottom of the depression along the depth direction of the depression;
    Peeling the cover sheet from the insulating substrate;
    And a step of curing the conductive resin.
  4. 4. The method according to claim 1, wherein the separating step causes a centrifugal force to act on the conductive resin filled in the through holes or the depressions of the wiring pattern shape. 5. Method of manufacturing a wiring board.
  5. The wiring according to any one of claims 1 to 3, wherein a predetermined voltage is applied between both ends of the formed wiring pattern to melt bond the conductive component in the conductive resin. A method for manufacturing a substrate.
JP2004281793A 2004-09-28 2004-09-28 Wiring board, electronic device using the same, and manufacturing method thereof Expired - Fee Related JP4325523B2 (en)

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JP4694735B2 (en) * 2001-08-21 2011-06-08 住友ゴム工業株式会社 Method for producing conductive pattern
WO2008009779A1 (en) * 2006-07-21 2008-01-24 Valtion Teknillinen Tutkimuskeskus Method for manufacturing conductors and semiconductors
DE102007058094A1 (en) * 2007-12-03 2009-06-04 Robert Bosch Gmbh Method for producing a printed circuit board layer (circuit plane) for a multilayer printed circuit board in particular (ceramic substrate)
KR20140051312A (en) * 2011-08-19 2014-04-30 후지필름 가부시키가이샤 Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same
JP2013042090A (en) * 2011-08-19 2013-02-28 Fujifilm Corp Conductive pattern, method for forming the same, printed board and method for manufacturing the same
JP5677911B2 (en) * 2011-08-19 2015-02-25 富士フイルム株式会社 Conductive pattern, method for forming the same, printed wiring board, and method for manufacturing the same
JP2014017397A (en) * 2012-07-10 2014-01-30 Ricoh Co Ltd Method for forming metal thin film, metal thin film, and metal thin film laminate, conductive pattern and antenna including the metal thin film
WO2015056825A1 (en) * 2013-10-15 2015-04-23 박찬후 Method for manufacturing flexible printed circuit board through high-temperature heat treatment on heat-resistant substrate and flexible printed circuit board thereof

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