JP4322890B2 - Undulation inspection device, undulation inspection method, control program of undulation inspection device, recording medium - Google Patents

Undulation inspection device, undulation inspection method, control program of undulation inspection device, recording medium Download PDF

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JP4322890B2
JP4322890B2 JP2006162891A JP2006162891A JP4322890B2 JP 4322890 B2 JP4322890 B2 JP 4322890B2 JP 2006162891 A JP2006162891 A JP 2006162891A JP 2006162891 A JP2006162891 A JP 2006162891A JP 4322890 B2 JP4322890 B2 JP 4322890B2
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light
imaging
color filter
filter substrate
inspection
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JP2007024873A (en
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多聞 井殿
健二 伊藤
豪 村上
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シャープ株式会社
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  The present invention relates to a technique for inspecting the undulation state of an object having fine undulations on a surface.

  In recent years, the demand for liquid crystal display devices such as liquid crystal televisions and liquid crystal monitors has increased, and the demand for cost reduction has been increasing year by year. In particular, in the liquid crystal display device, the specific cost of manufacturing the color filter is high, and it is required to reduce the manufacturing cost of the color filter.

  By the way, when a film thickness difference of several tens of nanometers occurs between the picture elements in this color filter, a difference in transmittance and cell gap occurs, and defects such as color unevenness occur when the color filter is panelized. Therefore, inspection is performed at the time when the color filter is generated, and the yield is improved by not causing defective products to flow in the subsequent process.

On the other hand, even if there is a film thickness difference of several tens of nanometers between the picture elements of the color filter, the difference in transmittance between the picture elements is only less than about 1%. That is, even if direct transmitted light is imaged, there is almost no change in luminance, and it is difficult to detect a film thickness difference of several tens of nm as a defect. Therefore, in Patent Document 1, the coherent light beam of the light source is divided into two, one light beam is irradiated to the color filter at an angle close to horizontal, the other is used as a reference light beam, and the reflected light beam and the reference light beam are interfered with each other. A method has been proposed in which a film thickness of a color filter is measured from a signal indicating the phase to detect streaks.
JP 2000-121323 (release date: May 15, 2000)

  However, the transparent substrate (mother glass) for generating the color filter has been increasing year by year (for example, 2 m square) in order to reduce the manufacturing cost per panel. As a result, the technology disclosed in Patent Document 1 It is difficult to adjust each imaging system so that the reflected light beam and the reference light beam interfere with each other.

  In addition, a method of inspecting with a visual inspection device that can be reviewed by moving the substrate up and down, left and right has been incorporated, but the visual inspection device becomes larger with the increase in the size of the mother glass, and the film thickness is several tens of nm visually. It was difficult to detect the difference, and there were differences in inspection accuracy among people, leading to a decrease in yield.

  The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a simple and highly accurate surface undulation (film thickness difference), for example, even for a 2 m square large substrate (color filter substrate, etc.). The present invention is to provide a undulation inspection apparatus capable of inspecting.

  In order to solve the above problems, the undulation inspection apparatus of the present invention is a undulation inspection apparatus that determines the state of undulations formed on the surface of the object to be inspected (for example, surface undulations due to differences in film thickness of each part), Irradiation means for irradiating the inspection object with light, light intensity acquisition means for acquiring light intensity distribution of light from the surface of the inspection object in response to the light irradiation, and predetermined light among the light from the surface of the inspection object An imaging unit that acquires only light, an adjustment unit that adjusts the irradiation unit or the imaging unit based on a light intensity distribution obtained from the light intensity acquisition unit, and an imaging result of the imaging unit after performing the adjustment And determining means for determining the state of undulations formed on the surface of the object to be inspected.

  According to the above configuration, the adjustment unit adjusts the irradiation unit or the imaging unit based on the light intensity distribution obtained from the light intensity acquisition unit. Therefore, the imaging unit can acquire only desired light (light suitable for determining the undulation state) among various lights coming from the surface of the inspection object. Thereby, the said determination means can determine the undulation state of the to-be-inspected object surface easily and with high precision based on the acquisition result of this imaging means. Furthermore, since this undulation inspection apparatus has a very simple configuration, it is suitable for inspection of, for example, a 2 m square large substrate (color filter substrate or the like).

  In addition, by judging the defect of the inspection object (for example, color filter substrate), it is possible to promptly feed back to the manufacturing apparatus, and the flow of only non-defective products to the subsequent manufacturing line improves the manufacturing yield. And cost reduction.

  Further, the adjusting means identifies light that is suitable for identifying the regular reflection area, the irregular reflection area, and the low reflection area based on the light intensity distribution and that determines the undulation state, that is, the imaging means includes the irregular reflection area and the irregular reflection area. It is preferable to adjust the irradiating means or the imaging means so that light in the region near the boundary of the low reflection region can be acquired.

  Moreover, it is preferable that the said light intensity acquisition means is provided with the area sensor which acquires the light from the to-be-inspected object surface in area shape. According to this configuration, it is possible to acquire the light intensity distribution by one imaging with the area sensor, and it is possible to shorten the tact.

  Further, it is preferable that the irradiating means is line illumination that irradiates light in a line shape, and the imaging means includes a line sensor that acquires light from the surface of the inspection object in a line shape. According to this configuration, it is possible to reduce the size of the apparatus (light intensity acquisition means and imaging means) while ensuring inspection accuracy, and it is also possible to reduce tact time.

  Moreover, it is preferable that a quartz rod is used for the line illumination. According to this configuration, it is possible to make the irradiation luminance on the surface of the inspection object uniform and improve the inspection accuracy.

  In the undulation inspection apparatus, the light from the surface of the inspection object may be reflected light from the surface of the inspection object (that is, the irradiation means may be arranged on the surface side of the inspection object). Absent. Further, if the inspection object has light transmittance, the light from the surface of the inspection object is transmitted from the back surface of the inspection object to the surface and reflected from the surface. (That is, a configuration in which the irradiation means is disposed on the back side of the object to be inspected).

  Moreover, it is preferable that the said adjustment means adjusts the relative positional relationship of both by moving (including rotation) an irradiation means or an imaging means. According to this configuration, the adjustment of the irradiation unit or the imaging unit is easy.

  The undulation inspection apparatus of the present invention is a undulation inspection apparatus for determining the state of undulation formed on the surface of an object to be inspected in order to solve the above-described problem, and is an irradiation for irradiating the inspection object with light. Light intensity distribution of light from the surface of the inspection object by performing imaging by the imaging means while moving the irradiation means, and imaging means for acquiring only predetermined light from the light from the surface of the inspection object And setting means for setting the relative positional relationship between the irradiating means and the imaging means based on the light intensity distribution, and on the surface of the object to be inspected based on the imaging result of the imaging means after performing the setting. Determining means for determining the state of the undulations formed.

  According to the above configuration, the setting unit adjusts the irradiation unit or the imaging unit based on the light intensity distribution obtained from the light intensity acquisition unit. Therefore, the imaging unit can acquire only desired light (light suitable for determining the undulation state) among various lights coming from the surface of the inspection object. Thereby, the said determination means can determine the undulation state of the to-be-inspected object surface easily and with high precision based on the acquisition result of this imaging means. Furthermore, since the undulation inspection apparatus has a very simple configuration that does not particularly require light intensity acquisition means, the apparatus can be reduced in size and the manufacturing cost can be reduced. Therefore, it is more suitable for inspection of a large substrate (color filter substrate or the like).

  Here, the setting unit identifies the regular reflection region, the irregular reflection region, and the low reflection region based on the light intensity distribution, and the imaging unit can acquire light in a region near the boundary between the irregular reflection region and the low reflection region. In addition, it is preferable to set a relative positional relationship between the irradiation unit and the imaging unit.

  Further, it is preferable that the irradiating means is line illumination that irradiates light in a line shape, and the imaging means includes a line sensor that acquires light from the surface of the inspection object in a line shape.

  Moreover, it is preferable that the undulation inspection apparatus is provided with a light beam adjusting means for narrowing the light beam of the irradiation light. In this way, light from points other than the point to be observed is reduced, and the light intensity distribution can be acquired with high accuracy. Thereby, the arrangement of at least one of the irradiation unit and the imaging unit can be adjusted (set) with high accuracy, and the undulation state formed on the surface of the inspection object can be determined with high accuracy. In this case, the light flux adjusting means may include a slit. In addition, if at least one of the position and width of the slit can be adjusted, the surface of the object to be inspected can be irradiated with the necessary amount of light even if the position of the irradiation means or the imaging means changes.

  Further, in order to solve the above problems, the undulation inspection method of the present invention includes an irradiating means for irradiating the inspection object with light, and an imaging means for acquiring only predetermined light out of the light from the surface of the inspection object. Is a undulation inspection method for determining the state of undulations formed on the surface of an inspection object, wherein the inspection object is irradiated with light, and the light intensity of light from the surface of the inspection object in response to the light irradiation A light intensity acquisition step of acquiring a distribution, an adjustment step of adjusting the irradiating means or the imaging means based on the light intensity distribution obtained in the light intensity acquisition step, and imaging of the imaging means after performing the adjustment And a determination step of determining a undulation state formed on the surface of the inspection object based on the result.

  In the adjustment step, the regular reflection area, the irregular reflection area, and the low reflection area are identified based on the light intensity distribution, so that the imaging means can acquire light in the vicinity of the boundary between the irregular reflection area and the low reflection area. It is preferable to adjust the irradiation means or the imaging means.

Further, the control program for the undulation inspection apparatus of the present invention controls the undulation inspection apparatus,
A step of calculating a light intensity distribution of light from the surface of the object to be inspected, a step of adjusting at least one of the irradiating means and the imaging means based on the light intensity distribution, and an imaging means after performing the adjustment. And causing the computer to execute a step of determining the undulation state formed on the surface of the inspection object based on the imaging result.

  Further, the recording medium stores the undulation inspection program in a computer-readable manner.

  As described above, according to the undulation inspection apparatus, the adjustment unit adjusts the irradiation unit or the imaging unit based on the light intensity distribution obtained from the light intensity acquisition unit. Therefore, the imaging unit can acquire only desired light (light suitable for determining the undulation state) among various lights coming from the surface of the inspection object. Thereby, the said determination means can determine the undulation state of the to-be-inspected object surface easily and with high precision based on the acquisition result of this imaging means. Furthermore, since this undulation inspection apparatus has a very simple configuration, it is suitable for inspection of a large substrate (color filter substrate or the like).

  The undulation inspection apparatus of the present invention can be used as an inspection target as long as it has an object having fine undulations on its surface. Examples of the inspection target include a color filter substrate (particularly, a substrate formed using an ink jet method), a semiconductor wafer on which an exposure resist is formed, a TFT substrate, and the like. Below, the case where a color filter board | substrate is made into inspection object is demonstrated as one embodiment of the undulation inspection apparatus of this invention.

  FIG. 1 is a schematic view showing a main part of the undulation inspection apparatus of the present invention, and FIG. 2 is a block diagram of the undulation inspection apparatus. As shown in FIGS. 1 and 2, the undulation inspection apparatus 1 includes a substrate driving stage 5, a line illumination 2, an area sensor 3, a line sensor 4, an illumination driving stage 6, a control device 8, a storage unit 19, and a display monitor 9. Prepare. The control device 8 includes an image processing unit 20, an illumination drive control unit 21, a substrate drive control unit 22, and a defect determination processing unit 23.

  The substrate driving stage 5 supports the color filter substrate 10 to be inspected and moves it in the direction along the substrate surface (in the direction of the arrow in the figure, hereinafter referred to as the substrate scanning direction). The line illumination 2 irradiates the color filter substrate 10 on the substrate driving stage 5 with light. Note that a quartz rod is preferably used for the line illumination 2. In the quartz rod, since light is totally reflected and transmitted through the quartz rod, the light can be irradiated to the outside of the quartz rod by uniformly applying a diffusion member to the back surface of the quartz rod on the line. Therefore, uniformity can be maintained as compared with fiber type line illumination. The illumination driving stage 6 moves the line illumination 2 to an appropriate position in the substrate scanning direction. The area sensor 3 acquires various reflected lights on the surface of the color filter substrate 10 of the irradiation light from the line illumination 2 (images the color filter substrate 10 illuminated by the line illumination 2 in an area shape). The line sensor 4 acquires predetermined reflected light on the surface of the color filter substrate 10 of the irradiation light from the line illumination 2 (images the color filter substrate 10 illuminated by the line illumination 2 in a line shape).

  The substrate drive control unit 22 drives the substrate drive stage 5 based on the data from the storage unit 19 and transports the color filter substrate 10 to a predetermined position. The image processing unit 20 analyzes the area sensor image obtained from the area sensor 3 (detailed later). The illumination drive control unit 21 determines the line illumination 2 based on the analysis data of the area sensor image by the image processing unit 20 and the data read from the storage unit 19 (for example, the initial setting positions of the line illumination 2 and the line sensor 4). An appropriate position is calculated, and the illumination driving stage 6 is operated based on this. As a result, the line illumination 2 is moved by a predetermined distance in the substrate scanning direction, and as a result, the relative positional relationship between the line illumination 2 and the line sensor 4 is set to an appropriate value.

  In response to this, the substrate drive control unit 22 scans the color filter substrate 10 at a constant speed via the substrate drive stage 5. At the same time, the line sensor 4 images the color filter substrate 10. The image processing unit 20 analyzes the line sensor image captured by the line sensor 4. The defect determination processing unit 23 determines the undulation state (the presence or absence of defects) on the surface of the color filter substrate 10 based on the data read from the storage unit 19 and the analysis data of the line sensor image by the image processing unit 20. The display monitor 9 displays the determination result (defect information) of the defect determination processing unit 23 and makes the apparatus manager (operator) recognize this.

  It is also possible to connect the control device 8 to a factory information network or the like (not shown) and send the defect information to a server that collectively manages the defect information.

  FIG. 3 schematically shows an image (area sensor image) of the surface of the color filter substrate 10 imaged by the area sensor 3. When the line illumination (line-shaped illumination) 2 is used, the area sensor image includes a regular reflection light region 110, a scattered light region 111 (111a and 111b), and a low reflection light region 112 (see FIG. 3). 112a and 112b). That is, with the belt-like region 110 (regular reflection light region) as the center, the belt-like regions 111a and 111b (diffuse reflection light regions) are located on both sides thereof, and outside the regions 111a and 111b (opposite to the region 110 side). The band-like regions 112a and 112b (low reflection light regions) are located in the region.

  Here, even if there is a film thickness difference between the respective picture elements of the color filter substrate 10, the brightness difference due to the film thickness difference hardly appears in the regular reflection light region 110, and the film thickness difference (defect) can be determined. It is very difficult. On the other hand, in the scattered light region 111, the brightness difference due to the film thickness difference becomes more significant as the distance from the specular reflection light region 110 increases, and the brightness difference due to the film thickness difference becomes maximum in the end regions SRa and SRb of the scattered light regions 111a and 111b. . That is, if the end portions SRa and SRb of the scattered light region are imaged, the film thickness difference (defect) can be determined easily and with high accuracy.

  The image processing unit 20 analyzes the captured image of the area sensor 3 (area sensor image, see FIG. 3), and extracts the specularly reflected light region 110 and the scattered light region 111 as the intensity distribution of the reflected light. An example of the extraction method will be described below.

  FIG. 4 is a graph showing the luminance of the area sensor image as a histogram. A peak 113 in the high luminance region indicates that the luminance of the regular reflection light region 110 is concentrated. A peak 114 on the lower luminance side than the peak 113 indicates that the luminance of the scattered light region 111 is concentrated. Therefore, by determining the threshold value (luminance) A and the threshold value (luminance) B from this histogram, the regular reflection light region 110 and the scattered light region 111 can be distinguished. The threshold value B can be determined by a method such as a discriminant analysis method because there are two peaks in the histogram, and the threshold value A is preferably set so that the noise level is a luminance value that can be cut. The threshold value A and the threshold value B are ternarized, and the width W of the scattered light region (111a or 111b) is calculated by image processing.

  Here, the illumination drive control unit 21 determines an optimum position of the line illumination 2 using the width W of the scattered light region, that is, a position where the line sensor 4 can image the end (SRa or SRb) of the scattered light region. Then, the amount of movement of the line illumination 2 (distance distance in the substrate scanning direction) is determined.

  The positional relationship between the width W of the scattered light region (111a or 111b) and the line illumination 2 is evaluated based on the shape of the film thickness of the color filter substrate 10 in advance, and conversion data is stored in a database. The optimum position of the line illumination 2 can also be obtained from the converted data in the database from the width W of the scattered light region (111a or 111b).

  It should be noted that the intensity distribution of the reflected light applied to the color filter substrate 10 is measured using a luminance meter or the like without using the area sensor 4, the position of the end (SRa or SRb) of the scattered light region is extracted, and the line sensor It is also possible to obtain an appropriate positional relationship between 4 and the line illumination 2. However, since the error will increase if the incident angle is not kept constant, it is necessary to move the luminance meter while adjusting the incident light so that the reflected light is incident at a constant incident angle and acquire the intensity distribution. is there. In consideration of this point, it is more effective for shortening the tact to capture an area sensor image instantaneously by the area sensor 4 and to obtain an optimum positional relationship between the line sensor 4 and the line illumination 2.

  When distinguishing between the regular reflection light region 110 and the scattered light region 111 and extracting an end (SRa or SRb) of the scattered light region, spot illumination or the like may be used instead of line illumination (line illumination). it can. FIG. 5 shows an area sensor image (image by the area sensor 3) when this spot illumination is used. As shown in the figure, there is also an elliptical scattered light region 111 around the elliptical regular reflection light region 110, and by obtaining the width w of the scattered light region in the direction of scanning the color filter substrate 10, An appropriate positional relationship between the line sensor 4 and the line illumination 2 can be determined.

  The light applied to the color filter substrate 10 may be applied from the back side of the color filter substrate 10 and the transmitted light may be imaged by the area sensor 3 and the line sensor 4. FIG. 6 is a schematic diagram showing this configuration. Even if the line illumination 2 is irradiated from the back side of the color filter substrate 10 and the light transmitted through the color filter substrate 10 is imaged by the area sensor 3, an area sensor image similar to FIG. An image in which the scattered light region is located can be obtained. Thus, by extracting the end position of the scattered light region, it is possible to determine an appropriate positional relationship between the line sensor 4 and the line illumination 2.

  In setting the relative positional relationship between the line illumination 2 and the line sensor 4, the imaging angle of the line sensor 4 can also be adjusted. A schematic diagram of this configuration (undulation inspection device 1x) is shown in FIG. 7, and a block diagram is shown in FIG. Here, if the surface of the color filter substrate 10 is imaged from the line sensor 4 at the same angle as the incident angle from the line illumination 2 to the color filter substrate 10, an image of specular reflection light is obtained. That is, the luminance difference due to the film thickness difference of each picture element of the color filter substrate 10 does not appear in the image. Therefore, the relationship between the incident angles is obtained in advance from the width W of the scattered light region obtained by the area sensor 3, and the incident angle of the line sensor 4 is determined based on this, whereby each picture of the color filter substrate 10 is determined. It is possible to capture an image in which a luminance difference due to a difference in the film thickness of the element appears. Specifically, the image processing unit 20x of the control device 8x analyzes the area sensor image, and the line sensor drive control unit 29 calculates the relationship of the incident angles based on the analysis result, and based on this, the line sensor The drive control unit 29 rotates the line sensor 4x in an appropriate direction via the line sensor drive stage 30.

  Further, when setting the relative positional relationship between the line illumination 2 and the line sensor 4, the line illumination 2 can be kept still (as it is) and the line sensor 4 can be moved in the substrate scanning direction.

  FIG. 9 is a flowchart showing a specific example of the processing steps of the undulation inspection apparatus 1.

  In this processing step, first, a substrate transport unit (not shown) carries the color filter substrate 10 into the apparatus (S1). The substrate transport unit transmits the substrate information of the color filter substrate 10 that has been loaded to the control device 8. The substrate information includes lot information, the size of the color filter substrate 10 being generated, the size of a picture element, and the like. Since the color filter substrate 10 is positioned on the substrate driving stage 5 that conveys the substrate, the control device 8 grasps the formation position of the color filter.

  Next, the substrate drive stage 5 moves the color filter substrate 10 to a place where the light from the line illumination 2 can be irradiated at the position where the color filter is formed and the area sensor 3 can image this (S2). In step S1, the control device 8 (substrate drive control unit 22) recognizes the formation position of the color filter, and the substrate drive control unit 22 operates the substrate drive stage 5 on the basis of this to determine a predetermined substrate position ( The color filter substrate 10 is moved to a position where the area sensor 3 can image the color filter formation position on the color filter substrate 10. The predetermined position is stored in the storage unit 19 in advance, and the substrate drive control unit 22 reads this information and operates the substrate drive control unit 22 to move the color filter substrate 10 to the predetermined position.

  Next, the area sensor 3 images the color filter substrate 10, and the control device 8 (the image processing unit 20 and the illumination drive control unit 21) calculates the movement amount of the line illumination 2 (S3). Here, the image processing unit 20 analyzes an image (area sensor image) captured by the area sensor 3, and the illumination drive control unit 21 uses the line sensor 4 to scatter the scattered light region of the area sensor image based on the analysis result. The amount of movement of the line illumination 2 (the amount of movement in the substrate scanning direction) is calculated so that the end portion 111 can be imaged. The relative positional relationship between the image position of the area sensor 3 and the imaging position of the line sensor 4 is calculated in advance by the control device 8 or read from the storage unit 19.

  Next, in order to perform imaging with the line sensor 4, the illumination driving stage 6 moves the line illumination 2 to an appropriate position (S4). That is, the illumination drive control unit 21 operates the illumination drive stage 6 based on the movement amount of the line illumination 2 calculated in S3.

  Next, as a preparation for imaging by the line sensor 4, the substrate driving stage 5 moves the color filter substrate 10 to the imaging start position (S5).

  Next, the color filter substrate 10 on the substrate drive stage 5 is imaged by the line sensor 4 while scanning the color filter substrate 10 from the imaging start position (S6). During imaging by the line sensor 4, the substrate drive control unit 22 operates the substrate drive stage 5 at a constant speed, whereby the color filter substrate 10 moves at a constant speed. Note that the substrate drive control unit 22 stops the substrate drive stage 5 when the line sensor 4 finishes imaging for the length of the substrate.

  Next, the image processing unit 20 analyzes the line sensor image captured by the line sensor 4, and the defect determination processing unit 23 determines the defect of the color filter substrate 10 based on the analysis result (S7). FIG. 10 is a schematic diagram showing a line sensor image. In a color filter with a picture element with a film thickness difference of several tens of nanometers, the brightness of the light reflected by the defective picture element is different from the light reflected by the surrounding picture element due to the film thickness difference. Imaged. That is, when the film thickness is thicker than the surrounding picture elements, the brightness is high, and when the film thickness is thinner than the surrounding picture elements, the brightness is low.

  Here, the principle of detecting the film thickness difference of the color filter will be described below with reference to FIGS. FIGS. 13A and 13B are diagrams showing the amount of reflected light on the surface of the color filter when the film thickness of a certain color filter is thinner than the film thickness of other color filters. FIGS. 14A and 14B are diagrams showing the amount of reflected light on the surface of the color filter when the film thickness of a certain color filter is thicker than the film thickness of other color filters. FIG. 15 is a graph showing the relationship between the luminance difference and the film thickness difference. FIG. 14B shows a defective color filter (CF) whose film thickness has been reduced for some reason. When the film thickness difference is small, the inclination angle at the BM (black matrix) interface of the color filter is smaller than that of the peripheral color filter. Therefore, as shown in FIG. 13A, the amount of reflected light of the color filter having a small film thickness is smaller than that of the peripheral color filter. In FIG. 13 (b), CF is exaggerated for easy understanding of the difference in inclination angle. Specifically, the maximum inclination angle of the BM end face is about 1 to 4 degrees. Yes, when the inclination is corrected, the inclination is about 10 to 50 μm / mm. On the other hand, the case of the defect CF having a large film thickness can be explained in the same manner as the case of the defect CF having a small film thickness. As the film thickness increases, the tilt angle increases compared to the peripheral CF. Therefore, as shown in FIG. 14A, the amount of reflected light from the CF having a large film thickness is larger than that of the peripheral CF. Based on this principle, the difference in film thickness (value indicating whether the film thickness is larger or smaller than the reference film thickness) is the difference in brightness of the captured image (the reflected light amount of the reference film thickness and the reflected light amount of the defect film thickness). (Absolute value of the difference between the two). Therefore, by capturing a sample of the film thickness difference in advance and evaluating the relationship between the film thickness difference and the brightness difference of the captured image in advance, the film thickness difference of the defect CF can be determined from the captured image. Can be estimated. For example, it is conceivable to use a graph as shown in FIG. 15, that is, a graph in which the relationship between the film thickness difference and the luminance difference is evaluated in advance. If this is utilized, the film thickness difference can be easily estimated from the luminance difference obtained from the defect CF.

  Further, when a defect (film thickness difference) occurs due to a manufacturing apparatus, a defect often occurs in a continuous picture element. As a result, defects such as streaks 117 are observed in the line sensor image 116 shown in FIG. If the difference in the film thickness of each picture element is several tens of nanometers, it becomes a defective product having stripes (defects) even when a liquid crystal panel is constructed. In order to extract the stripe unevenness 117 with higher accuracy (determine a defect), it is preferable to use illumination using a quartz rod as the line illumination 2. Thereby, the influence of illumination unevenness is reduced and the accuracy of defect determination is increased. It is also possible to use fiber illumination for the line illumination 2.

  Finally, the color filter substrate 10 is unloaded from the undulation inspection apparatus 1 (S8). That is, the substrate drive stage 5 moves the color filter substrate 10 to the substrate carry-in / out position according to the control of the substrate drive control unit 22, and the substrate transport unit transports the color filter substrate 10 to the outside.

  As described above, according to the undulation inspection apparatus 1, a series of color filter substrates 10 are automatically inspected, and non-defective / defective products (presence of defects) of the color filter substrate 10 are determined with high accuracy and ease. be able to. As a result, when defective products are generated (particularly frequently), it is possible to immediately notify the operator of an abnormality in the color filter forming apparatus. Further, by transmitting the defect inspection information of the substrate to the information system of the factory, it is possible to improve the yield at the time when the non-defective product is flowed to the second half process and the liquid crystal panel is manufactured. In addition, if defective products are frequently generated when the color filter substrate is generated, immediate feedback can be given to the color filter manufacturing apparatus.

  When the relative positional relationship between the line illumination 2 and the line sensor 4 is the same for each substrate lot or model, the color filter substrate of the target lot is put in the undulation inspection apparatus 1 in advance, and the line illumination 2 By managing and changing the relative positional relationship between the line sensor 4 and the line sensor 4 in units of lots or models, the subsequent steps S2 and S3 can be omitted for the color filter substrate, and the tact of the device can be improved. It becomes.

  In addition, this undulation inspection apparatus can also be comprised without using an area sensor. A schematic diagram of this configuration (undulation inspection device 1y) is shown in FIG. 11, and a block diagram is shown in FIG. That is, after S <b> 1 in FIG. 9, the color filter substrate 10 is imaged by the line sensor 4 while moving the line illumination 2 instead of S <b> 2 and 3. Specifically, the illumination drive stage 6 moves the line illumination 2 in accordance with the control of the illumination drive control unit 21y, and sequentially captures the color filter substrate 10 with the line sensor 4 to obtain one image.

  Thereby, an image equivalent to the area sensor image shown in FIG. 3 can be obtained. Next, the control device 8 (the image processing unit 20y and the illumination drive control unit 21y) calculates an appropriate position of the line illumination 2. Specifically, the image processing unit 20y analyzes the image captured by the line sensor 4, and based on the analysis result, the illumination drive control unit 21y uses the line sensor 4 to detect the end 111 (see FIG. 3) is calculated (position in the substrate scanning direction) such that the line illumination 2 can be imaged. The subsequent steps are the same as those in S4 to FIG.

  According to this configuration, it is possible to construct an apparatus (system) with only a line sensor without preparing an area sensor, and particularly when inspecting the entire surface of a large substrate, the size and cost of the apparatus can be reduced or adjusted. It is easy and very effective.

  Note that if the light flux from the line illumination 2 has a large width, reflected light other than the point to be acquired is also imaged, so that an error is likely to occur when determining the difference in the inclination angle of the color filter substrate end face. Therefore, as shown in FIG. 16A, a light beam adjusting unit 70 (light beam adjusting means) for narrowing the light beam from the line illumination 2 may be provided in FIGS. The light flux adjusting unit 70 has a slit 71 and is provided on the color filter substrate side of the line illumination 2. In this way, the width of the light beam is narrowed as shown in FIG. 16A (see FIG. 16A, the two-dot broken line in the figure indicates the light beam when there is no slit), and reflection from other than the point to be imaged Light can be limited. Thereby, the error at the time of judging the difference in inclination angle (undulation state) can be reduced, and the defect detection accuracy can be improved. In this case, the light beam adjusting unit 70 may be configured such that the width and position of the slit 71 are variable. In this way, even if the line illumination 2 moves, it is possible to irradiate the light amount necessary for the point to be imaged by changing the width and position of the slit 71 according to this (see FIG. 16B). . The light flux adjusting unit 70 is controlled by the illumination drive control unit (21 · 21x) as shown in FIG.

  Moreover, directivity can be given to the light from the line illumination 2. For example, as shown in FIG. 18, in FIGS. 1, 6, 7, 11, etc., a convex cylindrical lens 77 is arranged between the line illumination 2 and the observation point (color filter substrate 10), thereby Increase directivity. As a result, the reflected light from other than the point to be imaged can be limited, and the defect detection accuracy can be improved. Note that the light applied to the observation point (color filter substrate 10) does not necessarily have to be parallel light, and may be light that converges somewhat toward the observation point.

  Further, as shown in FIG. 19, the directivity of the illumination light is increased by providing a directional filter 80 (directivity adjusting means) on the color filter substrate side of the line illumination 2 in FIGS. May be. The filter orientation 80 has a configuration in which a lattice (vertical lattice) 81 perpendicular to the extending direction (line direction) of line illumination is provided on the frame. By providing the vertical lattice (partition perpendicular to the line direction) 81 in this manner, the directivity of the irradiated light in the line direction can be improved, and reflected light from points other than the point to be imaged can be limited. Thereby, defect detection accuracy can be improved. Furthermore, as shown in FIG. 20, a directional filter 90 having a horizontal lattice (partition in the line direction) 91 can be superimposed on a directional filter 80 having a vertical lattice 81. In this way, the directivity in both the line direction and the direction perpendicular to the line direction is improved, and the defect detection accuracy can be further increased. Further, as shown in FIG. 21, the vertical lattice (partition) 81 may be provided with mobility (for example, mobility in the line direction) so that the angle of transmitted light of the directional filter 80 can be adjusted. Of course, the angle of transmitted light may be adjusted by changing the installation angle of the directional filter 80 itself.

  In addition, in order to adjust the luminous flux of the irradiation light or to provide directivity to the irradiation light, it is possible to arrange a transmission type liquid crystal panel between the line illumination 2 and the observation point (color filter substrate 10). . For example, if a slit is displayed on the liquid crystal panel, this functions in the same manner as the light flux adjusting unit (see FIGS. 16A and 16B). Since it is a liquid crystal panel, it is possible to freely change the arrangement of slits (display) and the slit width.

  In addition, the control apparatus 8 (8x * 8y) may be comprised by a hardware logic, and may be implement | achieved by software using CPU as follows. That is, the control device 8 (8x, 8y) includes a CPU (central processing unit) that executes instructions of a control program (control program of the undulation inspection device) that realizes each function (function of each part in the control device), The storage unit 19 includes a ROM (read only memory) that stores the program, a RAM (random access memory) that expands the program, a storage device (recording medium) such as a memory that stores the program and various data, and the like. Yes. An object of the present invention is to provide a recording medium in which a program code (execution format program, intermediate code program, source program) of an undulation inspection program, which is software that realizes the functions described above, is recorded in a computer-readable manner. This can also be achieved by supplying the apparatus 1 and reading and executing the program code recorded on the recording medium by the computer (or CPU or MPU).

  As a storage medium for supplying the program code, for example, a floppy (registered trademark) disk, a hard disk, an optical disk, a magneto-optical disk, a magnetic tape, a nonvolatile memory card, and the like can be used.

  When the present invention is applied to the storage medium, the storage medium stores program codes corresponding to the flowcharts described above.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The undulation inspection apparatus of the present invention can easily inspect the fine undulation state of the object surface. Therefore, it is suitable for surface inspection of a color filter substrate (particularly a substrate formed using an ink jet method), a semiconductor wafer on which an exposure resist is formed, a TFT substrate, and the like.

It is a schematic diagram which shows one Embodiment of this undulation inspection apparatus. It is a block diagram which shows the structure of the undulation inspection apparatus shown in FIG. It is a schematic diagram which shows the image (area sensor image) which imaged the color filter board | substrate with the area sensor using line illumination. It is a histogram which shows the luminance distribution of an area sensor image. It is a schematic diagram which shows the image (area sensor image) which imaged the color filter board | substrate with the area sensor using spot illumination. It is a schematic diagram which shows the other structure (structure which arrange | positions line illumination in the back surface side of a color filter board | substrate) of this undulation inspection apparatus. It is a schematic diagram which shows other structure (structure which performs position adjustment of a line sensor) of this undulation inspection apparatus. It is a block diagram which shows the structure of the undulation inspection apparatus shown in FIG. It is a flowchart which shows the process example of a undulation inspection apparatus shown in FIG. It is a schematic diagram which shows the image (line sensor image) which imaged the color filter board | substrate with the line sensor. It is a schematic diagram which shows other structure (structure which does not use an area sensor) of this undulation inspection apparatus. It is a block diagram which shows the structure of the undulation inspection apparatus shown in FIG. (A) is a graph which shows the relationship between the color filter and the reflected light quantity for demonstrating the principle of a defect determination process, (b) is a figure which shows the state of the color filter at the time of (a). (A) is a graph which shows the relationship between the color filter and the reflected light quantity for demonstrating the principle of a defect determination process, (b) is a figure which shows the state of the color filter at the time of (a). It is a graph which shows the relationship between the brightness | luminance difference and film thickness difference for demonstrating the principle of a defect determination process. (A) (b) is a schematic diagram which shows the structure of this undulation inspection apparatus provided with a light beam adjustment part. It is a block diagram which shows the control relationship of a light beam adjustment part. It is a schematic diagram which shows the structure of this undulation inspection apparatus provided with a cylindrical lens. It is a perspective view which shows a partial structure of this undulation inspection apparatus provided with a directional filter. It is a perspective view which shows a partial structure of this undulation inspection apparatus provided with two directional filters. It is a perspective view which shows the directional filter whose grating | lattice (partition) is variable.

Explanation of symbols

1 × 1 × 1y undulation inspection device 2 line illumination 3 area sensor 4 line sensor 5 substrate drive stage 6 illumination drive stage 8 / 8x / 8y control device 9 display monitor 10 color filter substrate 19 storage unit 20 20x image processing unit 21 21x illumination Drive control unit 22 Substrate drive control unit 23 Defect determination processing unit 70 Light flux adjusting unit 71 Slit 77 Cylindrical lens 80 Directional filter (vertical lattice)
90 Directional filter (horizontal lattice)
110 Regular reflection area 111 Diffuse reflection area 112 Low reflection area

Claims (15)

  1. A undulation inspection apparatus for determining a film thickness difference between picture elements formed on the surface of a color filter substrate,
    An irradiation means for irradiating the color filter substrate with light;
    Light intensity acquisition means for acquiring the light intensity distribution of the light from the color filter substrate surface with respect to the light irradiation;
    Imaging means for obtaining only predetermined light out of light from the color filter substrate surface;
    An adjusting means for adjusting at least one of the irradiation means and the imaging means based on the light intensity distribution obtained from the light intensity acquisition means;
    A determination unit that determines a film thickness difference between picture elements formed on the surface of the color filter substrate based on an imaging result of the imaging unit after performing the adjustment;
    The adjusting means identifies the regular reflection area, the irregular reflection area, and the low reflection area based on the light intensity distribution, and allows the imaging means to acquire the light in the vicinity of the boundary between the irregular reflection area and the low reflection area. Adjust the irradiation means or imaging means,
    The undulation inspection apparatus, wherein the imaging means starts imaging after the adjustment is completed.
  2. The undulation inspection apparatus according to claim 1, wherein the light intensity acquisition unit includes an area sensor that acquires light from the surface of the color filter substrate in an area shape.
  3. 2. The undulation inspection according to claim 1, wherein the irradiating means is line illumination for irradiating light in a line shape, and the imaging means includes a line sensor for acquiring light from the surface of the color filter substrate in a line shape. apparatus.
  4.   The undulation inspection apparatus according to claim 1, wherein a quartz rod is used for the irradiation means.
  5. Light from the color filter substrate surface, undulation inspection apparatus according to claim 1, characterized in that the light reflected by the color filter substrate surface.
  6. 2. The color filter substrate according to claim 1, wherein the color filter substrate is light transmissive, and light from the surface of the color filter substrate is transmitted from the back surface of the color filter substrate to the surface and reflected by the surface. The undulation inspection device described.
  7.   The undulation inspection apparatus according to claim 1, wherein the adjustment unit adjusts the relative positional relationship between the irradiation unit and the imaging unit by moving the irradiation unit or the imaging unit.
  8. A undulation inspection apparatus for determining a film thickness difference between picture elements formed on the surface of a color filter substrate ,
    An irradiation means for irradiating the color filter substrate with light;
    Imaging means for acquiring only predetermined light out of light from the surface of the color filter substrate ;
    The light intensity distribution of the light from the color filter substrate surface is obtained by performing imaging by the imaging means while moving the irradiation means, and the relative positional relationship between the irradiation means and the imaging means is obtained based on the light intensity distribution. Setting means for setting;
    A determination unit that determines a film thickness difference between picture elements formed on the surface of the color filter substrate based on an imaging result of the imaging unit after performing the setting;
    The setting means identifies the regular reflection area, the irregular reflection area, and the low reflection area based on the light intensity distribution, and allows the imaging means to acquire the light in the vicinity of the boundary between the irregular reflection area and the low reflection area. Set the relative positional relationship between the irradiation means and the imaging means ,
    The undulation inspection apparatus, wherein the imaging means starts imaging after the setting is completed.
  9. 9. The undulation inspection according to claim 8, wherein the irradiating means is line illumination for irradiating light in a line shape, and the imaging means includes a line sensor for acquiring light from the surface of the color filter substrate in a line shape. apparatus.
  10. Used in a color filter substrate and an imaging means for obtaining a predetermined light among the light from the irradiation means and the color filter substrate surface to perform light irradiation, the thickness between the picture elements which are formed on the surface of the color filter substrate A relief inspection method for determining a difference ,
    Perform light irradiation on the color filter substrate, and the light intensity obtaining step of obtaining the light intensity distribution for from the color filter substrate surface to the light irradiation,
    An adjustment step of adjusting the irradiation means or the imaging means based on the light intensity distribution obtained in the light intensity acquisition step;
    A determination step of determining a film thickness difference between picture elements formed on the color filter substrate surface based on an imaging result of the imaging means after performing the adjustment,
    In the adjustment step, the regular reflection area, the irregular reflection area, and the low reflection area are identified based on the light intensity distribution, and the imaging unit can acquire the light in the vicinity of the boundary between the irregular reflection area and the low reflection area. Adjust the irradiation means or imaging means,
    The undulation inspection method, wherein the imaging means starts imaging after the adjustment step is completed.
  11.   9. The undulation inspection apparatus according to claim 1, further comprising a light beam adjusting unit that narrows a light beam of the irradiation light of the irradiation unit.
  12.   12. The undulation inspection apparatus according to claim 11, wherein the light flux adjusting means has a slit.
  13.   The undulation inspection apparatus according to claim 12, wherein at least one of the position and the width of the slit is variable.
  14. A control program for a undulation inspection apparatus for controlling the undulation inspection apparatus according to claim 1,
    Calculating the light intensity distribution of light from the color filter substrate surface;
    Based on the light intensity distribution, the irradiating means and the illuminating means and the low reflection area are identified so that the imaging means can acquire light in the vicinity of the boundary between the irregular reflection area and the low reflection area. Adjusting at least one of the imaging means;
    And causing the computer to execute a step of determining a film thickness difference between picture elements formed on the surface of the color filter substrate based on an imaging result of an imaging unit that starts imaging after the adjustment is completed. Control program for undulation inspection equipment.
  15.   15. A computer-readable recording medium in which a control program for the undulation inspection apparatus according to claim 14 is recorded.
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JP2006162891A JP4322890B2 (en) 2005-06-13 2006-06-12 Undulation inspection device, undulation inspection method, control program of undulation inspection device, recording medium
PCT/JP2007/061841 WO2007145223A1 (en) 2006-06-12 2007-06-12 Undulation inspection device, unduation inspecting method, control program for unduation inspection device, and recording medium
CNA200780021550XA CN101466997A (en) 2006-06-12 2007-06-12 Undulation inspecting device, undulation inspecting method, control program of undulation inspecting device, and recording medium
US12/308,241 US20090303468A1 (en) 2006-06-12 2007-06-12 Undulation Inspection Device, Undulation Inspecting Method, Control Program for Undulation Inspection Device, and Recording Medium

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JP6038434B2 (en) * 2011-08-11 2016-12-07 株式会社ヒューテック Defect inspection equipment
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