JP4288077B2 - デバイスの処理方法 - Google Patents

デバイスの処理方法 Download PDF

Info

Publication number
JP4288077B2
JP4288077B2 JP2002586693A JP2002586693A JP4288077B2 JP 4288077 B2 JP4288077 B2 JP 4288077B2 JP 2002586693 A JP2002586693 A JP 2002586693A JP 2002586693 A JP2002586693 A JP 2002586693A JP 4288077 B2 JP4288077 B2 JP 4288077B2
Authority
JP
Japan
Prior art keywords
exposed
processing method
potential
exposed connection
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002586693A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004525008A5 (https=
JP2004525008A (ja
Inventor
パン，アルフレッド・イ‐ツン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2004525008A publication Critical patent/JP2004525008A/ja
Publication of JP2004525008A5 publication Critical patent/JP2004525008A5/ja
Application granted granted Critical
Publication of JP4288077B2 publication Critical patent/JP4288077B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2002586693A 2001-04-27 2002-04-26 デバイスの処理方法 Expired - Fee Related JP4288077B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/844,377 US6588095B2 (en) 2001-04-27 2001-04-27 Method of processing a device by electrophoresis coating
PCT/US2002/013272 WO2002089543A1 (en) 2001-04-27 2002-04-26 Protection of conductive connection by electrophoresis coating and structure formed thereof

Publications (3)

Publication Number Publication Date
JP2004525008A JP2004525008A (ja) 2004-08-19
JP2004525008A5 JP2004525008A5 (https=) 2005-12-22
JP4288077B2 true JP4288077B2 (ja) 2009-07-01

Family

ID=25292566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002586693A Expired - Fee Related JP4288077B2 (ja) 2001-04-27 2002-04-26 デバイスの処理方法

Country Status (5)

Country Link
US (1) US6588095B2 (https=)
EP (1) EP1382232B1 (https=)
JP (1) JP4288077B2 (https=)
DE (1) DE60232648D1 (https=)
WO (1) WO2002089543A1 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6262895B1 (en) 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
US20030234443A1 (en) 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7202555B2 (en) * 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US20060255446A1 (en) 2001-10-26 2006-11-16 Staktek Group, L.P. Stacked modules and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US6914324B2 (en) * 2001-10-26 2005-07-05 Staktek Group L.P. Memory expansion and chip scale stacking system and method
US7310458B2 (en) 2001-10-26 2007-12-18 Staktek Group L.P. Stacked module systems and methods
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7053478B2 (en) 2001-10-26 2006-05-30 Staktek Group L.P. Pitch change and chip scale stacking system
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6877840B2 (en) * 2003-04-30 2005-04-12 Hewlett-Packard Development Company, L.P. Fluid-ejection assembly
US7542304B2 (en) 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
US7229152B2 (en) 2003-10-31 2007-06-12 Hewlett-Packard Development Company, L.P. Fluid ejection device with insulating feature
US7606040B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US7446410B2 (en) * 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7522421B2 (en) 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7606049B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7511968B2 (en) 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US20060053345A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US7579687B2 (en) * 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7309914B2 (en) 2005-01-20 2007-12-18 Staktek Group L.P. Inverted CSP stacking system and method
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7417310B2 (en) 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
GB0919404D0 (en) 2009-11-05 2009-12-23 Xennia Technology Ltd Inkjet printer
JP5405425B2 (ja) * 2010-09-30 2014-02-05 富士フイルム株式会社 液体吐出ヘッド及びインクジェット記録装置並びに給電配線基板の乾燥方法
GB2503482A (en) 2012-06-28 2014-01-01 Ibm Tape head system with electrostatic element
CN112719065A (zh) * 2020-12-23 2021-04-30 成都宏明双新科技股份有限公司 一种改善产品在落料时下层电泳漆层保留量的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4208261A (en) * 1978-06-02 1980-06-17 Shinto Paint Co., Ltd. Continuous method for cathodic electrodeposition
SE435343B (sv) 1978-12-05 1984-09-24 Thams Johan Petter B Forfarande vid beleggning vid skarpa kanter pa metallforemal
GB2117794B (en) 1982-04-06 1986-05-21 Standard Telephones Cables Ltd Electrocoating electrical components
JPS63301591A (ja) 1987-05-30 1988-12-08 Nissha Printing Co Ltd プリント基板用カバ−レイの形成方法
JPH024892A (ja) * 1988-06-22 1990-01-09 Canon Inc 接着性被着材および接着工法
DE3826715A1 (de) * 1988-08-05 1990-02-22 Fraunhofer Ges Forschung Verfahren zum beschichten von substraten mit einem isolierenden ueberzug
JPH02267992A (ja) 1989-04-07 1990-11-01 Mitsubishi Electric Corp 配線板の製造方法
JPH0521680A (ja) 1991-07-10 1993-01-29 Hitachi Cable Ltd 樹脂封止半導体装置の表面処理法
US5442386A (en) 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead
US5855753A (en) * 1996-11-26 1999-01-05 The Trustees Of Princeton University Method for electrohydrodynamically assembling patterned colloidal structures
US5830340A (en) * 1997-03-05 1998-11-03 Trumem International Llc Method for making a composite filter

Also Published As

Publication number Publication date
DE60232648D1 (de) 2009-07-30
US20020157856A1 (en) 2002-10-31
EP1382232A1 (en) 2004-01-21
US6588095B2 (en) 2003-07-08
WO2002089543A1 (en) 2002-11-07
JP2004525008A (ja) 2004-08-19
EP1382232B1 (en) 2009-06-17

Similar Documents

Publication Publication Date Title
JP4288077B2 (ja) デバイスの処理方法
CN1982066B (zh) 液体排出头以及该液体排出头的制造方法
JP2004525008A5 (https=)
JPH071739A (ja) 印刷ヘッドの製造方法および印刷ヘッド
JP2013032002A (ja) インクジェット記録装置及びインクジェットヘッド
CN108724941B (zh) 液体喷出头
CN114604003B (zh) 热敏打印头及其制造方法和热敏打印机
JP5587268B2 (ja) インクジェットヘッド及びその製造方法
JP2015128863A (ja) 配線基板、液滴吐出ヘッド、印刷装置、電子機器および配線基板の製造方法
CN102837501B (zh) 用于形成喷墨打印头的设备
JP2916213B2 (ja) サーマルヘッドおよびその製造方法
US20170190176A1 (en) Liquid ejection head and method for manufacturing the same
JP3945838B2 (ja) チャージ板の製造方法
JP5800738B2 (ja) インクジェットプリントヘッド
CN114940027A (zh) 蓄热层的形成方法、热敏打印头及制造方法和热敏打印机
JP2003326710A (ja) 保護膜形成方法およびこれを用いたインクジェットヘッド
JP2007001192A (ja) ヘッドモジュールの製造方法、液体吐出ヘッドの製造方法、及び液体吐出装置の製造方法
JP2007251084A (ja) 電極配線構造体及びその製造方法
JP6804328B2 (ja) サーマルプリントヘッドおよびその製造方法
JP2730508B2 (ja) 印刷配線板の製造方法
US20050248617A1 (en) Methods for forming and protecting electrical interconnects and resultant assemblies
JP6844444B2 (ja) インクジェットヘッドの製造方法
US20140300667A1 (en) Liquid discharge head and method for manufacturing the same
JP2023076895A (ja) 積層体、サーマルプリントヘッド、サーマルプリンタ、蓄熱層の形成方法、及びサーマルプリントヘッドの製造方法
JP2023115544A (ja) サーマルプリントヘッド、サーマルプリンタ、及びサーマルプリントヘッドの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050421

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050421

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080204

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080208

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080507

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080514

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080605

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090303

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090330

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120403

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees