JP4284142B2 - Piezoelectric oscillator - Google Patents

Piezoelectric oscillator Download PDF

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JP4284142B2
JP4284142B2 JP2003336312A JP2003336312A JP4284142B2 JP 4284142 B2 JP4284142 B2 JP 4284142B2 JP 2003336312 A JP2003336312 A JP 2003336312A JP 2003336312 A JP2003336312 A JP 2003336312A JP 4284142 B2 JP4284142 B2 JP 4284142B2
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wiring board
wiring
sealing
piezoelectric
piezoelectric oscillator
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JP2005109575A (en
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利夫 中澤
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京セラ株式会社
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本発明は、携帯用通信機器等の電子機器に用いられる圧電発振器に関するものである。   The present invention relates to a piezoelectric oscillator used in an electronic device such as a portable communication device.
従来より、携帯用通信機器等の電子機器に温度補償型水晶発振器等の圧電発振器が幅広く用いられている。   Conventionally, piezoelectric oscillators such as temperature-compensated crystal oscillators have been widely used in electronic devices such as portable communication devices.
かかる従来の圧電発振器としては、例えば図4に示す如く、上面に凹部25を有し、下面に複数個の外部端子22が設けられている配線基板21の前記凹部25内に、圧電振動素子としての水晶振動素子24と該水晶振動素子24の発振出力を制御するIC素子26とを収容し、前記凹部25の開口部を金属製の蓋体27で従来周知のシーム溶接(抵抗溶接)等によって気密封止した構造のものが知られている(例えば、特許文献1参照。)。   As such a conventional piezoelectric oscillator, for example, as shown in FIG. 4, a concave portion 25 is provided on the upper surface, and a plurality of external terminals 22 are provided on the lower surface. The crystal resonator element 24 and the IC element 26 for controlling the oscillation output of the crystal resonator element 24 are accommodated, and the opening of the recess 25 is formed by a conventionally known seam welding (resistance welding) or the like with a metal lid 27. An airtightly sealed structure is known (for example, see Patent Document 1).
尚、前記配線基板21の凹部25は、その内周に階段状の段差が設けられており、下段に前記IC素子26を、上段に水晶振動素子24を搭載して両素子を凹部25内で一部重なり合うように配置させることによって、両素子を凹部25内で並設させる場合に比し、圧電発振器を小型に構成するようにしている。   The concave portion 25 of the wiring board 21 has a stepped step on its inner periphery, and the IC element 26 is mounted on the lower stage and the crystal vibration element 24 is mounted on the upper stage, and both elements are placed in the concave section 25. By arranging the elements so as to partially overlap each other, the piezoelectric oscillator is configured to be smaller than when both elements are arranged in parallel in the recess 25.
また、このような従来の圧電発振器においては、その組み立てを終えた後、水晶振動素子24の検査と、IC素子26の検査と、水晶発振器全体の動作確認とが行なわれるようになっており、各検査における判定結果に基いて良品・不良品の選別がなされていた。
特開2003−101348号公報(図1、図3、図5)
Further, in such a conventional piezoelectric oscillator, after the assembly is completed, the inspection of the crystal resonator element 24, the inspection of the IC element 26, and the operation check of the entire crystal oscillator are performed. Non-defective / defective products were selected based on the results of each inspection.
Japanese Unexamined Patent Publication No. 2003-101348 (FIGS. 1, 3, and 5)
ところで、上述した水晶振動素子24の検査に際して水晶振動素子24に不具合が発見された場合、水晶振動素子24を取り外して別の水晶振動素子24と交換するには極めて煩雑な作業を伴ない、かかる交換作業によって生産効率が大幅に低下してしまうことから、通常、水晶振動素子24を良品と交換することは行なわずに、水晶振動素子24が搭載されている配線基板21をそのまま廃棄するようにしている。   By the way, when a defect is found in the crystal resonator element 24 during the inspection of the crystal resonator element 24 described above, it is extremely complicated to remove the crystal resonator element 24 and replace it with another crystal resonator element 24. Since the production efficiency is greatly reduced by the replacement work, the wiring substrate 21 on which the crystal resonator element 24 is mounted is usually discarded without replacing the crystal resonator element 24 with a non-defective product. ing.
しかしながら、上述した従来の圧電発振器においては、水晶振動素子24の下方にIC素子26が配置されているため、水晶振動素子24の検査において水晶振動素子24に不具合が発見された場合に水晶振動素子24が搭載されている配線基板21をそのまま廃棄すると、水晶振動素子24の下方に配置されている正常なIC素子26まで廃棄されて、部品の無駄を生じることとなり、その分、製造コストの上昇を招く欠点を有していた。   However, in the conventional piezoelectric oscillator described above, the IC element 26 is disposed below the crystal resonator element 24. Therefore, when a defect is found in the crystal resonator element 24 in the inspection of the crystal resonator element 24, the crystal resonator element If the wiring board 21 on which the circuit board 24 is mounted is discarded as it is, the normal IC element 26 disposed below the crystal vibrating element 24 is discarded, and parts are wasted, which increases the manufacturing cost. Had the disadvantage of incurring.
本発明は上記欠点に鑑み案出されたもので、その目的は、圧電振動素子とIC素子とを配線基板上に搭載した後、各素子の検査に際して不具合が発見された場合であっても、正常な素子を無駄にすることなく製品の組み立てに有効に利用することができる生産性に優れた圧電発振器を提供することにある。   The present invention has been devised in view of the above-described drawbacks, and its purpose is to mount a piezoelectric vibration element and an IC element on a wiring board, and then to find out if a defect is found during inspection of each element. An object of the present invention is to provide a piezoelectric oscillator excellent in productivity that can be effectively used for assembling products without wasting normal elements.
本発明の圧電発振器は、上面に開口する凹部と該凹部の開口部を囲支持部を有する第1の配線基板上に、第2の配線基板載置させるとともに、前記第1の配線基板の凹部内面と前記第2の配線基板の下面とで囲まれる収納領域内に圧電振動素子と発振制御用のIC素子とを配置させてなる圧電発振器において、前記圧電振動素子及びIC素子のうちいずれか一方の素子を前記凹部の底面に、他方の素子を前記第2の配線基板の下面に搭載するとともに、両素子に接続される第1の配線基板の配線導体と第2の配線基板の配線導体とを導電性接着剤による接続部で電気的に接続し、前記支持部と前記第2の配線基板の下面とを、前記第1の配線基板の外周に沿って前記接続部よりも外側位置に配され、導体材料から成り、且つ、前記第1の配線基板及び/又は第2の配線基板の配線導体を介して外部接続用のグランド端子に接続される封止材で接合することにより前記収納領域を気密封止せしめたことを特徴とするものである。 The piezoelectric oscillator of the present invention, the first wiring board having enclose supporting portion opening of the recess and the recess which is open to the upper surface, causes mounting the second wiring board, the first wiring board A piezoelectric oscillator in which a piezoelectric vibration element and an oscillation control IC element are disposed in a storage region surrounded by an inner surface of the recess and a lower surface of the second wiring board. One element is mounted on the bottom surface of the recess, and the other element is mounted on the lower surface of the second wiring board, and the wiring conductor of the first wiring board connected to both elements and the wiring of the second wiring board A conductor is electrically connected by a connection portion using a conductive adhesive, and the support portion and the lower surface of the second wiring board are positioned outside the connection portion along the outer periphery of the first wiring board. disposed, made of conductive material, and said first Characterized in that the allowed hermetically sealing the housing area by joining a sealing material which is connected to the ground terminal for external connection via a line substrate and / or the wiring conductors of the second wiring board is there.
更に本発明の圧電発振器は、前記IC素子が、基材を単結晶シリコンにより形成したフリップチップ型ICから成り、該IC素子の実装面と反対側の主面のグランド導体層が被着されていることを特徴とするものである。   Furthermore, in the piezoelectric oscillator of the present invention, the IC element is formed of a flip chip type IC in which a base material is formed of single crystal silicon, and a ground conductor layer on a main surface opposite to the mounting surface of the IC element is attached. It is characterized by being.
また更に本発明の圧電発振器は、前記第1の配線基板の下面、第2の配線基板の上面のうちいずれか一方の面に外部接続用の複数個の端子が並設され、他方の面にシールド導体層が被着されていることを特徴とするものである。   Furthermore, in the piezoelectric oscillator according to the present invention, a plurality of terminals for external connection are arranged in parallel on one surface of the lower surface of the first wiring substrate and the upper surface of the second wiring substrate, and the other surface is disposed on the other surface. The shield conductor layer is deposited.
更にまた本発明の圧電発振器は、前記第1の配線基板の上面と側面との間の角部、及び/又は、前記第2の配線基板の下面と側面との間の角部に切り欠きが形成されており、該切り欠きの形成領域内に前記封止材の一部が収容されていることを特徴とするものである。   Furthermore, in the piezoelectric oscillator of the present invention, the corner between the upper surface and the side surface of the first wiring substrate and / or the corner between the lower surface and the side surface of the second wiring substrate are notched. It is formed, and a part of the sealing material is accommodated in the formation region of the notch.
本発明の圧電発振器によれば、凹部を有した第1の配線基板の上面に第2の配線基板を載置させて、凹部内面と第2の配線基板の下面とで囲まれる収納領域に圧電振動素子及び発振制御用のIC素子を配置させるとともに、圧電振動素子及びIC素子のうちいずれか一方の素子を第1の配線基板の凹部底面に、他方の素子を第2の配線基板の下面に分けて搭載するようにしたことから、圧電振動素子及びIC素子の検査をそれぞれ別個に行ない、検査に合格したもののみを用いて圧電発振器を組み立てることができ、また仮に圧電発振器を組み立てた後に不具合が発見された場合であっても、第2の配線基板を第1の配線基板より取り外す作業は比較的簡単であることから、全体の生産効率を大きく低下させることなく正常な素子が搭載されている配線基板に付け替えることができる。したがって、不具合のない正常な素子が無駄に廃棄されることはなく、圧電発振器の製造コストを低く抑えることが可能となる。   According to the piezoelectric oscillator of the present invention, the second wiring board is placed on the upper surface of the first wiring board having the recess, and the piezoelectric region is piezoelectrically surrounded by the inner surface of the recess and the lower surface of the second wiring board. The vibration element and the IC element for oscillation control are disposed, and one of the piezoelectric vibration element and the IC element is disposed on the bottom surface of the concave portion of the first wiring board, and the other element is disposed on the lower surface of the second wiring board. Since the piezoelectric vibration element and the IC element are separately inspected because they are mounted separately, it is possible to assemble a piezoelectric oscillator using only those that have passed the inspection. Even if the problem is discovered, it is relatively easy to remove the second wiring board from the first wiring board, so that normal elements are mounted without significantly reducing the overall production efficiency. It is possible to replace the wiring board you are. Therefore, normal elements without defects are not wasted, and the manufacturing cost of the piezoelectric oscillator can be kept low.
しかも本発明の圧電発振器によれば、第1の配線基板と第2の配線基板との間に設けられる圧電振動素子やIC素子の収容領域が環状の封止材でもって気密封止されており、かかる封止材を第1の配線基板と第2の配線基板とを電気的に接続する接続部よりも外側に配置させるようになっていることから、封止材を第1の配線基板と第2の配線基板との間より外部に露出させておくことができる。したがって、前記封止材による第1の配線基板−第2の配線基板間の接合状態を目視等によって容易に確認することができ、これによって製品の検査等にかかる作業性を良好となすことができる。   In addition, according to the piezoelectric oscillator of the present invention, the accommodation area of the piezoelectric vibration element and the IC element provided between the first wiring board and the second wiring board is hermetically sealed with the annular sealing material. Since the sealing material is arranged outside the connecting portion that electrically connects the first wiring board and the second wiring board, the sealing material is connected to the first wiring board. It can be exposed to the outside from between the second wiring board. Therefore, the bonding state between the first wiring board and the second wiring board by the sealing material can be easily confirmed by visual observation or the like, thereby improving the workability for product inspection and the like. it can.
更に本発明の圧電発振器によれば、前記封止材を導体材料により形成し、且つ該封止材を第1の配線基板及び/又は第2の配線基板の配線導体を介して外部接続用のグランド端子に接続させておくことにより、圧電発振器の使用時、圧電振動素子やIC素子の収納領域はグランド電位に保持された封止材で取り囲まれた形となることから、外部からのノイズが収納領域に侵入しようとするのを前記封止材でもって良好に遮蔽し、収納領域内に配設されている圧電振動素子やIC素子を常に安定して動作させることができるようになる。   Furthermore, according to the piezoelectric oscillator of the present invention, the sealing material is formed of a conductive material, and the sealing material is used for external connection via the wiring conductors of the first wiring board and / or the second wiring board. By connecting to the ground terminal, when the piezoelectric oscillator is used, the storage area of the piezoelectric vibration element and IC element is surrounded by the sealing material held at the ground potential, so that noise from the outside is not generated. It is possible to satisfactorily shield the entry into the storage area with the sealing material, and to stably operate the piezoelectric vibration element and the IC element disposed in the storage area.
また更に本発明の圧電発振器によれば、前記IC素子を単結晶シリコンから成るフリップチップ型ICで構成するとともに、該IC素子の実装面と反対側の主面にグランド導体層を被着させておくことにより、IC素子の電子回路と圧電振動素子とがグランド導体層で仕切られる形となるため、IC素子の発するノイズの一部はグランド導体層で良好に吸収されるようになり、IC素子の発するノイズによって圧電振動素子の電気的特性が不安定になるのを有効に防止することができる。   Furthermore, according to the piezoelectric oscillator of the present invention, the IC element is composed of a flip-chip IC made of single crystal silicon, and a ground conductor layer is attached to the main surface opposite to the mounting surface of the IC element. Since the IC element electronic circuit and the piezoelectric vibration element are partitioned by the ground conductor layer, part of the noise generated by the IC element is absorbed well by the ground conductor layer. It is possible to effectively prevent the electrical characteristics of the piezoelectric vibration element from becoming unstable due to the noise generated by.
更にまた本発明の圧電発振器によれば、前記第1の配線基板の下面、第2の配線基板の上面のうちいずれか一方の面に外部接続用の複数個の外部端子を並設し、他方の面にシールド導体層を被着させておくことにより、外部からのノイズが圧電振動素子やIC素子の収納領域に侵入しようとするのを前記シールド導体層でもって良好に遮蔽し、これによっても収納領域内に配設されている圧電振動素子やIC素子を常に安定して動作させることができるようになる。   Furthermore, according to the piezoelectric oscillator of the present invention, a plurality of external terminals for external connection are arranged in parallel on either one of the lower surface of the first wiring board and the upper surface of the second wiring board. By adhering the shield conductor layer to the surface of the substrate, it is possible to satisfactorily shield the external noise from entering the storage area of the piezoelectric vibration element or the IC element with the shield conductor layer. It becomes possible to always stably operate the piezoelectric vibration element and the IC element disposed in the storage area.
また更に本発明の圧電発振器によれば、前記第1の配線基板の上面と側面との間の角部、及び/又は、前記第2の配線基板の下面と側面との間の角部に切り欠きを形成するとともに、該切り欠きの形成領域内に封止材の一部が収容されるようになしておくことにより、封止材の接合状態をより一層確認し易くなるとともに、各配線基板に対する接合強度を向上させることができる。   Furthermore, according to the piezoelectric oscillator of the present invention, it is cut into a corner portion between the upper surface and the side surface of the first wiring substrate and / or a corner portion between the lower surface and the side surface of the second wiring substrate. By forming a notch and allowing a part of the sealing material to be accommodated in the notch formation region, it becomes easier to confirm the bonding state of the sealing material, and each wiring board The joint strength with respect to can be improved.
以下、本発明を添付図面に基づいて詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
図1は本発明の一実施形態に係る圧電発振器を表面実装型の水晶発振器に適用した例を示す分解斜視図、図2は図1の水晶発振器の断面図であり、これらの図に示す水晶発振器は、大略的に、第1の配線基板1と、第2の配線基板4と、圧電振動素子としての水晶振動素子7と、発振制御用のIC素子8とで構成されている。   FIG. 1 is an exploded perspective view showing an example in which a piezoelectric oscillator according to an embodiment of the present invention is applied to a surface-mount type crystal oscillator, and FIG. 2 is a cross-sectional view of the crystal oscillator of FIG. The oscillator is generally composed of a first wiring board 1, a second wiring board 4, a crystal vibration element 7 as a piezoelectric vibration element, and an IC element 8 for oscillation control.
前記第1の配線基板1は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料から成る複数個のセラミック層を積層してなり、その表面や隣接するセラミック層間には所定の配線導体2が形成され、また内部には配線導体同士を電気的に接続するためのビアホール導体等が埋設され、更に下面には略全面にわたりシールド導体層6が被着・形成されている。   The first wiring board 1 is formed by laminating a plurality of ceramic layers made of a ceramic material such as glass-ceramic or alumina ceramic, and a predetermined wiring conductor 2 is formed between the surface and adjacent ceramic layers. In addition, a via-hole conductor or the like for electrically connecting the wiring conductors is embedded in the interior, and a shield conductor layer 6 is deposited and formed on the lower surface over substantially the entire surface.
このような第1の配線基板1の上面には、凹部3と、該凹部3の開口部を囲繞する環状の支持部1aとが設けられており、前記凹部3の内部に水晶振動素子7及びIC素子8を収容するようになっている。このため、前記凹部3の底面には、水晶振動素子7の対応する振動電極7aに導電性接続材9を介して電気的に接続される一対の搭載パッド2aが設けられている。   On the upper surface of the first wiring substrate 1, a recess 3 and an annular support portion 1 a surrounding the opening of the recess 3 are provided. The IC element 8 is accommodated. For this reason, a pair of mounting pads 2 a that are electrically connected to the corresponding vibration electrodes 7 a of the crystal resonator element 7 via the conductive connecting material 9 are provided on the bottom surface of the recess 3.
また、前記支持部1aは、後述する第2の配線基板4を支持するための支持面として機能するものであり、該支持部1aの内周側には、第2の配線基板4の対応する接続パッド5bと半田等の導電性接続材を介して電気的に接続される複数個の接続パッド2bが設けられている。   The support portion 1a functions as a support surface for supporting a second wiring board 4 to be described later, and the second wiring board 4 corresponds to the inner peripheral side of the support portion 1a. A plurality of connection pads 2b are provided which are electrically connected to the connection pads 5b via a conductive connection material such as solder.
かかる第1の配線基板1は、ガラス−セラミック等のセラミック材料から成る場合、例えば、セラミック材料粉末に適当な有機溶剤等を添加・混合して得たセラミックグリーンシートの表面等に配線導体2となる導体ペースト等を所定パターンに印刷・塗布するとともに、これを複数枚積層してプレス成形した後、高温で焼成することによって製作される。また前記凹部3は、第1の配線基板1の製作に使用されるセラミックグリーンシートのうち上部領域に配されるセラミックグリーンシートの中央部等に矩形状の貫通孔を穿設しておくことにより形成される。   When the first wiring board 1 is made of a ceramic material such as glass-ceramic, the wiring conductor 2 and the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent or the like to the ceramic material powder, for example. The conductor paste or the like is printed and applied in a predetermined pattern, and a plurality of these are laminated and press-molded, followed by firing at a high temperature. The recess 3 is formed by forming a rectangular through-hole in the center of the ceramic green sheet disposed in the upper region of the ceramic green sheet used for manufacturing the first wiring board 1. It is formed.
そして、上述した第1の配線基板1の凹部底面に搭載されている水晶振動素子7は、所定の結晶軸でカットした水晶片の両主面に一対の振動電極7aを被着・形成してなり、外部からの変動電圧が一対の振動電極7aを介して水晶片に印加されると、所定の周波数で厚みすべり振動を起こすようになっている。   The crystal resonator element 7 mounted on the bottom surface of the concave portion of the first wiring substrate 1 described above has a pair of vibration electrodes 7a attached and formed on both main surfaces of a crystal piece cut along a predetermined crystal axis. Thus, when an externally varying voltage is applied to the crystal piece via the pair of vibrating electrodes 7a, thickness-shear vibration is caused at a predetermined frequency.
前記水晶振動素子7は、一対の振動電極7aを導電性接着材9を介して凹部底面の対応する搭載パッド2aに電気的に接続させることによって第1の配線基板1の凹部底面に搭載され、第1の配線基板1の配線導体2や後述する第2の配線基板4の配線導体5を介してIC素子8の対応する接続端子に電気的に接続される。   The crystal resonator element 7 is mounted on the bottom surface of the concave portion of the first wiring board 1 by electrically connecting the pair of vibration electrodes 7a to the corresponding mounting pads 2a on the bottom surface of the concave portion through the conductive adhesive 9. It is electrically connected to the corresponding connection terminal of the IC element 8 via the wiring conductor 2 of the first wiring board 1 and the wiring conductor 5 of the second wiring board 4 described later.
このような第1の配線基板1は、その下面にシールド導体層6を有していることから、このシールド導体層6を第1の配線基板1の配線導体2や後述する第2の配線基板4の配線導体5を介して外部接続用のグランド端子10aに接続させておくことにより、水晶発振器の使用に際してシールド導体層6がグランド電位に保持されるようになる。これにより、外部からのノイズが水晶振動素子7やIC素子8の収納領域に侵入しようとするのをシールド導体層6でもって良好に遮蔽するとともに、収納領域内に配設される水晶振動素子7やIC素子8を外部からの不要な電気的作用より良好に保護し、これらの素子7,8を常に安定して動作させることができる。したがって、第1の配線基板1の下面にはシールド導体層6を被着させておくことが好ましい。   Since such a first wiring board 1 has a shield conductor layer 6 on its lower surface, the shield conductor layer 6 is used as the wiring conductor 2 of the first wiring board 1 or a second wiring board described later. When the crystal oscillator is used, the shield conductor layer 6 is held at the ground potential by being connected to the ground terminal 10a for external connection via the four wiring conductors 5. Thereby, it is possible to satisfactorily shield the external noise from entering the storage area of the crystal resonator element 7 and the IC element 8 with the shield conductor layer 6 and to arrange the crystal resonator element 7 disposed in the storage area. Further, it is possible to protect the IC element 8 better than unnecessary electric action from the outside, and to always operate these elements 7 and 8 stably. Therefore, the shield conductor layer 6 is preferably attached to the lower surface of the first wiring board 1.
一方、前記第2の配線基板4は、先に述べた第1の配線基板1と同様のセラミック材料、例えばアルミナセラミックス等から成る単一のセラミック層、もしくは、複数個のセラミック層を積層してなり、その上面には電源電圧端子、グランド端子、発振出力端子、発振制御端子等の外部端子10が、下面には上述した第1の配線基板1の接続パッド2bと対向する位置に接続パッド5bが、凹部3と対向する位置にIC素子搭載用の搭載パッド5aが設けられている。   On the other hand, the second wiring board 4 is formed by laminating a single ceramic layer or a plurality of ceramic layers made of the same ceramic material as the first wiring board 1 described above, for example, alumina ceramics. An external terminal 10 such as a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal is formed on the upper surface, and the connection pad 5b is disposed on the lower surface so as to face the connection pad 2b of the first wiring board 1 described above. However, a mounting pad 5 a for mounting an IC element is provided at a position facing the recess 3.
前記第2の配線基板4は、その下面でIC素子8を、上面で複数個の外部端子10を支持するとともに、凹部3の開口部を塞ぐためのものであり、このような第2の配線基板4の下面と凹部3の内面とで囲まれる収納領域内に水晶振動素子7とIC素子8とが配設されている。   The second wiring board 4 is for supporting the IC element 8 on the lower surface and a plurality of external terminals 10 on the upper surface and closing the opening of the recess 3. A crystal resonator element 7 and an IC element 8 are disposed in a storage area surrounded by the lower surface of the substrate 4 and the inner surface of the recess 3.
そして、上述した第2の配線基板4の下面に搭載されるIC素子8としては、例えば、実装面に複数個の接続端子を有したフリップチップ型のIC素子が用いられ、該IC素子8は、その回路形成面に、周囲の温度状態を検知する感温素子(サーミスタ)、水晶振動素子7の温度特性を補償する温度補償データを格納し該温度補償データに基づいて水晶振動素子7の振動特性を温度変化に応じて補正する温度補償回路、該温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられており、該発振回路で生成された発振出力は、外部に出力された後、例えば、クロック信号等の基準信号として利用される。   As the IC element 8 mounted on the lower surface of the second wiring board 4 described above, for example, a flip chip type IC element having a plurality of connection terminals on the mounting surface is used. A temperature sensing element (thermistor) for detecting the ambient temperature state and temperature compensation data for compensating the temperature characteristics of the crystal vibration element 7 are stored on the circuit forming surface, and the vibration of the crystal vibration element 7 is based on the temperature compensation data. There are provided a temperature compensation circuit that corrects the characteristics according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the oscillation output generated by the oscillation circuit is externally provided. After being output, it is used as a reference signal such as a clock signal, for example.
また前記IC素子8の上面に設けられる複数個の接続端子は、第2の配線基板4の下面に設けた搭載パッド5aと1対1に対応するように配置されており、これらの接続端子を対応する搭載パッド5aに対して、Au、Au−Sn合金、半田、導電性接着剤等の導電性接続材を介して個々に接合させることによってIC素子7が第2の配線基板4に取着され、これと同時にIC素子8の接続端子が外部端子10に電気的に接続される。   The plurality of connection terminals provided on the upper surface of the IC element 8 are arranged so as to correspond to the mounting pads 5a provided on the lower surface of the second wiring board 4, and these connection terminals are connected to each other. The IC element 7 is attached to the second wiring substrate 4 by individually bonding to the corresponding mounting pad 5a via a conductive connecting material such as Au, Au—Sn alloy, solder, or conductive adhesive. At the same time, the connection terminal of the IC element 8 is electrically connected to the external terminal 10.
このような第2の配線基板4は、先に述べた第1の配線基板1と同様の方法によって製作され、これを第1の配線基板1上に取着させるには、まず第2の配線基板4を、その下面に取着させたIC素子8が第1の配線基板1の凹部3内に位置し、かつ両配線基板1,4の対応する接続パッド同士が導電性接続材を介して対向するようにして第1の配線基板1上に載置させ、しかる後、前記導電性接続材に熱等を印加して、これを双方の接続パッドに接合させることにより行なわれ、これによって水晶振動素子7の振動電極が配線基板1,4の配線導体2,5等を介してIC素子8の接続端子等に電気的に接続される。   Such a second wiring board 4 is manufactured by a method similar to that of the first wiring board 1 described above, and in order to attach it to the first wiring board 1, first the second wiring board 1 is used. The IC element 8 having the substrate 4 attached to the lower surface thereof is located in the recess 3 of the first wiring substrate 1, and the corresponding connection pads of both the wiring substrates 1 and 4 are connected to each other through the conductive connection material. It is placed on the first wiring board 1 so as to face each other, and then, heat or the like is applied to the conductive connecting material to bond it to both connection pads. The vibration electrode of the vibration element 7 is electrically connected to the connection terminal or the like of the IC element 8 via the wiring conductors 2 and 5 of the wiring boards 1 and 4.
尚、本実施形態においては、第2の配線基板4の上面が、水晶発振器をマザーボード等の外部配線基板上に実装する際の実装面として機能するようになしてあり、外部端子10を半田等の導電性接続材を介して外部配線基板の対応する回路配線と電気的に接続させることによって水晶発振器が外部配線基板上に実装されることとなる。   In the present embodiment, the upper surface of the second wiring board 4 functions as a mounting surface when the crystal oscillator is mounted on an external wiring board such as a mother board, and the external terminals 10 are soldered or the like. The crystal oscillator is mounted on the external wiring board by being electrically connected to the corresponding circuit wiring of the external wiring board via the conductive connecting material.
このように、本実施形態においては、水晶振動素子7を第1の配線基板1の凹部底面に、IC素子8を第2の配線基板4の下面にそれぞれ搭載するようにしたことから、水晶振動素子7及びIC素子8の検査をそれぞれ別個に行ない、検査に合格したもののみを用いて水晶発振器を組み立てることができるようになる。   As described above, in the present embodiment, since the crystal resonator element 7 is mounted on the bottom surface of the concave portion of the first wiring substrate 1 and the IC element 8 is mounted on the lower surface of the second wiring substrate 4, The inspection of the element 7 and the IC element 8 is performed separately, and the crystal oscillator can be assembled using only those that have passed the inspection.
また、仮に水晶発振器を組み立てた後に水晶振動素子7もしくはIC素子8に不具合が発見された場合であっても、第2の配線基板4を第1の配線基板1より取り外す作業は、水晶振動素子7やIC素子8を配線基板より取り外す場合に比べて簡単であることから、全体の生産効率を大きく低下させることなく正常な素子が搭載されている配線基板に付け替えることができる。したがって、不具合のない正常な水晶振動素子7やIC素子8が無駄に廃棄されることはなく、水晶発振器の製造コストの低く抑えることが可能となる。   Even if a defect is found in the crystal resonator element 7 or the IC element 8 after the crystal oscillator is assembled, the operation of removing the second wiring board 4 from the first wiring board 1 is not limited to the crystal resonator element. 7 and the IC element 8 are simpler than the case where they are removed from the wiring board, and can be replaced with a wiring board on which normal elements are mounted without greatly reducing the overall production efficiency. Therefore, the normal crystal resonator element 7 and the IC element 8 having no defects are not wasted, and the manufacturing cost of the crystal oscillator can be kept low.
更に本実施形態においては前記IC素子8がフリップチップ型ICによって構成されており、その実装面と反対側の主面にはグランド導体層8aが被着されている。このため、IC素子8の電子回路と水晶振動素子7とがグランド導体層8aで仕切られる形となっており、これによってIC素子8の発するノイズの一部をグランド導体層8aによって良好に吸収し、IC素子8の発するノイズによって水晶振動素子7の電気的特性が不安定になるのを有効に防止することができる。したがって、水晶振動素子7の電気的特性を安定化するには、IC素子8をフリップチップ型ICによって構成するとともに、該IC素子8の実装面と反対側の主面にグランド導体層8aを被着させておくことが好ましい。   Furthermore, in the present embodiment, the IC element 8 is constituted by a flip chip type IC, and a ground conductor layer 8a is attached to the main surface opposite to the mounting surface. For this reason, the electronic circuit of the IC element 8 and the crystal resonator element 7 are partitioned by the ground conductor layer 8a, whereby a part of noise generated by the IC element 8 is absorbed well by the ground conductor layer 8a. Thus, it is possible to effectively prevent the electrical characteristics of the crystal resonator element 7 from becoming unstable due to noise generated by the IC element 8. Therefore, in order to stabilize the electrical characteristics of the crystal resonator element 7, the IC element 8 is constituted by a flip chip IC, and the ground conductor layer 8 a is covered on the main surface opposite to the mounting surface of the IC element 8. It is preferable to keep it on.
尚、前記IC素子8の温度補償回路に温度補償データを書き込むための書込制御端子(図示せず)は、例えば、第1の配線基板1の側面、第2の配線基板4の上面等に設けられ、これらの書込制御端子にデータ書込装置のプローブ針を当て、IC素子8の温度補償回路内に設けられているメモリに水晶振動素子7の温度特性に応じた温度補償データを書き込むことによって温度補償回路内に温度補償データが格納される。このような書込制御端子は、その製造時、配線基板1,4等と一体的に設けられる外部の捨代部に配置させておき、温度補償データの書き込みが終了した後でこの捨代部を書込制御端子と共に配線基板1,4等から切り離すようにすれば水晶発振器の小型化に供することができる利点もある。   Note that a write control terminal (not shown) for writing temperature compensation data to the temperature compensation circuit of the IC element 8 is, for example, on the side surface of the first wiring board 1, the upper surface of the second wiring board 4, and the like. The probe needle of the data writing device is applied to these write control terminals, and temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 7 is written in the memory provided in the temperature compensation circuit of the IC element 8 Thus, the temperature compensation data is stored in the temperature compensation circuit. Such a writing control terminal is arranged in an external spare part provided integrally with the wiring boards 1 and 4 at the time of manufacture, and after the temperature compensation data has been written, the spare part is provided. If it is separated from the wiring boards 1 and 4 together with the write control terminal, there is an advantage that the crystal oscillator can be miniaturized.
そして、上述した第1の配線基板1と第2の配線基板4との間、より具体的には、第1の配線基板1の支持部1aと第2の配線基板4の下面との間には、両配線基板1,4の接続部よりも外側に、第1の配線基板1の外周に沿って環状に配された封止材11が介在されており、該封止材11でもって凹部内面と第2の配線基板4の下面とで囲まれている両素子7,8の収納領域を気密封止するようにしている。   And between the first wiring board 1 and the second wiring board 4 described above, more specifically, between the support portion 1 a of the first wiring board 1 and the lower surface of the second wiring board 4. Has a sealing material 11 disposed in an annular shape along the outer periphery of the first wiring board 1 outside the connecting portion between the wiring boards 1 and 4. The storage area of both elements 7 and 8 surrounded by the inner surface and the lower surface of the second wiring board 4 is hermetically sealed.
前記封止材11の材質としては、Au−Sn合金や半田等の接合材料が好適に使用され、かかる接合材料を用いて両配線基板1,4を接合する場合、第1の配線基板1の支持部1a、第2の配線基板4の下面の双方の面には、封止材11を各配線基板1,4に対して強固に接合させるべく環状のメタライズ層(図示せず)がそれぞれ設けられ、かかる封止材11で気密封止された収納領域内には、水晶振動素子7等の電気的特性を安定させるために、NガスやArガス等の不活性ガスが充填される。 As the material of the sealing material 11, a bonding material such as an Au—Sn alloy or solder is preferably used, and when both the wiring boards 1 and 4 are bonded using such a bonding material, An annular metallized layer (not shown) is provided on both the support portion 1a and the lower surface of the second wiring board 4 in order to firmly bond the sealing material 11 to the wiring boards 1 and 4, respectively. The storage area hermetically sealed with the sealing material 11 is filled with an inert gas such as N 2 gas or Ar gas in order to stabilize the electrical characteristics of the crystal resonator element 7 and the like.
このように、第1の配線基板1と第2の配線基板4との間に設けられる両素子7,8の収容領域を環状の封止材11でもって気密封止するとともに、該封止材11を第1の配線基板1と第2の配線基板4とを電気的に接続する接続部よりも外側に配置させるようにしたことから、前記封止材11を第1の配線基板1と第2の配線基板4との間より外部に露出させておくことができる。したがって、封止材11による第1の配線基板1−第2の配線基板4間の接合状態を目視等によって容易に確認することができ、これによって製品の検査等にかかる作業性が良好となる。   As described above, the housing regions of the elements 7 and 8 provided between the first wiring board 1 and the second wiring board 4 are hermetically sealed with the annular sealing material 11, and the sealing material 11 is arranged outside the connecting portion that electrically connects the first wiring board 1 and the second wiring board 4, the sealing material 11 is connected to the first wiring board 1 and the first wiring board 1. It can be exposed to the outside from between the two wiring boards 4. Therefore, the joining state between the first wiring board 1 and the second wiring board 4 by the sealing material 11 can be easily confirmed by visual observation or the like, thereby improving the workability for product inspection and the like. .
また、前記封止材11がAu−Sn合金や半田等の導体材料から成る場合、封止材11を第2の配線基板4等の配線導体5を介して外部接続用のグランド端子10aに接続させておくことにより、水晶発振器の使用時、水晶振動素子7やIC素子8の収納領域はグランド電位GNDに保持された封止材11で取り囲まれた形となる。それ故、外部からのノイズが第1の配線基板1と第2の配線基板4との間に設けられている前記収納領域内に侵入しようとするのを封止材11でもって良好に遮蔽するとともに、収納領域内に配設されている水晶振動素子7やIC素子8を外部からの不要な電気的作用より良好に保護し、これらの素子7,8を常に安定的に動作させることができる。したがって、前記封止材11を導体材料により形成するとともに、該封止材11を第1の配線基板1や第2の配線基板4等の配線導体2,5等を介して外部接続用のグランド端子10aに接続させておくことが好ましい。   Further, when the sealing material 11 is made of a conductor material such as an Au—Sn alloy or solder, the sealing material 11 is connected to the ground terminal 10 a for external connection via the wiring conductor 5 such as the second wiring substrate 4. Thus, when the crystal oscillator is used, the storage area of the crystal resonator element 7 and the IC element 8 is surrounded by the sealing material 11 held at the ground potential GND. Therefore, the sealing material 11 satisfactorily shields external noise from entering the storage area provided between the first wiring board 1 and the second wiring board 4. At the same time, it is possible to better protect the crystal resonator element 7 and the IC element 8 disposed in the storage area from unnecessary electrical action from the outside, and to always operate these elements 7 and 8 stably. . Therefore, the sealing material 11 is formed of a conductive material, and the sealing material 11 is grounded for external connection via the wiring conductors 2, 5, etc. of the first wiring board 1 and the second wiring board 4. It is preferable to connect to the terminal 10a.
尚、前記封止材11は、第2の配線基板4を第1の配線基板1上に取り付ける際に、例えば、第1の配線基板1の支持部1a上、もしくは、第2の配線基板4の下面のいずれか一方にAu−Sn合金等を所定の環状パターンをなすように被着させておき、しかる後、前記環状パターンを高温で加熱・溶融させて他方の配線基板のメタライズ層に接合させることにより第1の配線基板1及び第2の配線基板4間に介在される。また、接続パッド2a,5a間の接続と同時に封止材11を両配線基板1,4に対して接合させる場合は、封止材11と導電性接続材の双方をAu−Sn合金で形成しておくことが好ましい。   When the second wiring board 4 is mounted on the first wiring board 1, the sealing material 11 is, for example, on the support portion 1 a of the first wiring board 1 or the second wiring board 4. An Au—Sn alloy or the like is applied to one of the lower surfaces of the wiring board so as to form a predetermined annular pattern, and then the annular pattern is heated and melted at a high temperature to be bonded to the metallized layer of the other wiring board. By interposing, it is interposed between the first wiring board 1 and the second wiring board 4. Further, when the sealing material 11 is bonded to both the wiring boards 1 and 4 simultaneously with the connection between the connection pads 2a and 5a, both the sealing material 11 and the conductive connection material are formed of an Au—Sn alloy. It is preferable to keep it.
更に、第1の配線基板1の支持部表面や第2は配線基板4の下面で、封止材11の介在領域と接続部との間に、Al等の無機質材料から成る流動防止膜や溝,凸部等を、封止材11を囲繞するように形成しておけば、封止材11をAu−Sn合金や半田等の導体材料で形成した場合に、接合に際して溶融した封止材11が接続部側に流れて短絡しようとするのを有効に防止することができる利点がある。したがって、第1の配線基板1の支持部表面や第2は配線基板4の下面で、封止材11の介在領域と接続部との間に、Al等の無機質材料から成る流動防止膜や溝,凸部等を、封止材11を囲繞するように形成しておくことが好ましい。 Further, a flow prevention made of an inorganic material such as Al 2 O 3 between the support region of the first wiring substrate 1 and the second lower surface of the wiring substrate 4 and between the intervening region of the sealing material 11 and the connection portion. If a film, a groove, a convex portion, or the like is formed so as to surround the sealing material 11, when the sealing material 11 is formed of a conductor material such as an Au—Sn alloy or solder, There is an advantage that it is possible to effectively prevent the stopping material 11 from flowing toward the connecting portion and attempting to short-circuit. Therefore, the flow prevention made of an inorganic material such as Al 2 O 3 between the support region of the first wiring substrate 1 and the second lower surface of the wiring substrate 4 and between the intervening region of the sealing material 11 and the connection portion. It is preferable to form a film, a groove, a convex portion or the like so as to surround the sealing material 11.
かくして上述した水晶発振器は、水晶振動素子7に外部から所定の電圧を印加し、水晶振動素子7を所定の共振周波数で振動させるとともに、該水晶振動素子7の共振周波数に対応した所定の発振信号を前記IC素子8にて発生・増幅せしめ、得られた信号を外部端子10を介して外部へ出力することによって水晶発振器として機能する。本実施形態の水晶発振器においては、IC素子8の内部に温度補償回路等が設けられているため、その使用時、外部へ出力される発振信号の周波数は水晶振動素子7の温度状態に応じて補正されることとなる。   Thus, the crystal oscillator described above applies a predetermined voltage to the crystal resonator element 7 from the outside to vibrate the crystal resonator element 7 at a predetermined resonance frequency, and a predetermined oscillation signal corresponding to the resonance frequency of the crystal resonator element 7. Is generated and amplified by the IC element 8 and the obtained signal is output to the outside via the external terminal 10 to function as a crystal oscillator. In the crystal oscillator according to the present embodiment, a temperature compensation circuit or the like is provided inside the IC element 8, and therefore the frequency of the oscillation signal output to the outside depends on the temperature state of the crystal oscillator 7 when used. It will be corrected.
尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。   In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
例えば、上述した実施形態において、例えば図3に示すように、第2の配線基板4の下面と側面との間の角部に切り欠き12を形成するとともに、該切り欠き12の形成領域内に接合用メタライズ層の一部を延在させた上、封止材11の一部を切り欠き12の形成領域内に収容させておくようにすれば、封止材11が切り欠き12の形成領域内でフィレットを形成することにより、封止材11の接合状態をより一層確認し易くなるとともに、第2の配線基板4に対する封止材11の接合強度を向上させることができる。このような切り欠き12は第1の配線基板1の上面と側面との間の角部に形成しておいても良いし、第1の配線基板1、第2の配線基板4の双方に形成しておいても良い。したがって、第1の配線基板1の上面と側面との間の角部、及び/又は、第2の配線基板4の下面と側面との間の角部に切り欠き12を形成するとともに、該切り欠き12の形成領域内に封止材11の一部が収容されるようになしておくことが好ましい。   For example, in the above-described embodiment, as shown in FIG. 3, for example, the notch 12 is formed at the corner between the lower surface and the side surface of the second wiring substrate 4, and the notch 12 is formed in the formation region. If a part of the joining metallized layer is extended and a part of the sealing material 11 is accommodated in the formation region of the cutout 12, the sealing material 11 is formed in the formation region of the cutout 12. By forming the fillet inside, it becomes easier to confirm the bonding state of the sealing material 11, and the bonding strength of the sealing material 11 to the second wiring substrate 4 can be improved. Such a notch 12 may be formed at a corner between the upper surface and the side surface of the first wiring substrate 1 or formed in both the first wiring substrate 1 and the second wiring substrate 4. You can keep it. Therefore, the notch 12 is formed at the corner between the upper surface and the side surface of the first wiring substrate 1 and / or the corner between the lower surface and the side surface of the second wiring substrate 4, and It is preferable that a part of the sealing material 11 is accommodated in the formation region of the notch 12.
また上述した実施形態においては、第1の配線基板1の凹部3内に水晶振動素子7を搭載し、第2の配線基板4の下面にIC素子8を搭載するようにしたが、これに代えて、第1の配線基板1の凹部3内にIC素子8を搭載し、第2の配線基板4の下面に水晶振動素子等の圧電振動素子を搭載するようにしても構わない。   In the embodiment described above, the crystal resonator element 7 is mounted in the recess 3 of the first wiring board 1 and the IC element 8 is mounted on the lower surface of the second wiring board 4. Then, the IC element 8 may be mounted in the recess 3 of the first wiring board 1, and a piezoelectric vibration element such as a crystal vibration element may be mounted on the lower surface of the second wiring board 4.
更に上述した実施形態においては、第2の配線基板4の上面に外部端子10を設けるようにしたが、これに代えて、第1の配線基板1の下面に外部端子10を設けるようにしても良い。その場合、シールド導体層6の形成には第2の配線基板4の上面が用いられる。   Further, in the above-described embodiment, the external terminals 10 are provided on the upper surface of the second wiring board 4, but instead, the external terminals 10 may be provided on the lower surface of the first wiring board 1. good. In that case, the upper surface of the second wiring board 4 is used to form the shield conductor layer 6.
また更に上述した実施形態においては、IC素子8としてフリップチップ型ICを用いるようにしたが、それ以外のIC素子、例えば従来周知のワイヤボンディング等によって配線基板の搭載パッドにボンディングされるタイプのIC素子を用いて圧電発振器を構成するようにしても構わない。   Further, in the above-described embodiment, the flip chip type IC is used as the IC element 8, but other IC elements, for example, a type of IC that is bonded to the mounting pad of the wiring board by a conventionally known wire bonding or the like. You may make it comprise a piezoelectric oscillator using an element.
更にまた上述した実施形態においては、圧電振動素子として水晶振動素子を用いた表面実装型の水晶発振器を例にとって説明したが、これに代えて、圧電振動素子としてSAWフィルタ等の他の圧電振動素子を用いる場合にも本発明は適用可能である。   Furthermore, in the above-described embodiments, the surface-mount type crystal oscillator using the crystal resonator element as the piezoelectric resonator element has been described as an example, but instead of this, another piezoelectric resonator element such as a SAW filter is used as the piezoelectric resonator element. The present invention is also applicable when using.
本発明の一実施形態に係る圧電発振器を水晶発振器に適用した例を示す分解斜視図である。It is a disassembled perspective view which shows the example which applied the piezoelectric oscillator which concerns on one Embodiment of this invention to the crystal oscillator. 図1の水晶発振器の断面図である。It is sectional drawing of the crystal oscillator of FIG. 本発明の他の実施形態に係る圧電発振器を水晶発振器に適用した例を示す断面図である。It is sectional drawing which shows the example which applied the piezoelectric oscillator which concerns on other embodiment of this invention to the crystal oscillator. 従来の圧電発振器の断面図である。It is sectional drawing of the conventional piezoelectric oscillator.
符号の説明Explanation of symbols
1・・・第1の配線基板
1a・・・支持部
2・・・第1の配線基板の配線導体
2a・・・圧電振動素子用の搭載パッド
2b・・・第1の配線基板の接続パッド
3・・・凹部
4・・・第2の配線基板
5・・・第2の配線基板の配線導体
5a・・・IC素子用の搭載パッド
5b・・・第2の配線基板の接続パッド
6・・・シールド導体層
7・・・圧電振動素子(水晶振動素子)
8・・・IC素子
8a・・・グランド導体層
9・・・導電性接続材
10・・・外部端子
10a・・・グランド端子
11・・・封止材
12・・・切り欠き
DESCRIPTION OF SYMBOLS 1 ... 1st wiring board 1a ... Support part 2 ... Wiring conductor of 1st wiring board 2a ... Mounting pad for piezoelectric vibration elements 2b ... Connection pad of 1st wiring board DESCRIPTION OF SYMBOLS 3 ... Concave part 4 ... 2nd wiring board 5 ... Wiring conductor of 2nd wiring board 5a ... Mounting pad for IC elements 5b ... Connection pad of 2nd wiring board 6. ..Shield conductor layer 7 ... Piezoelectric vibration element (crystal vibration element)
DESCRIPTION OF SYMBOLS 8 ... IC element 8a ... Ground conductor layer 9 ... Conductive connection material 10 ... External terminal 10a ... Ground terminal 11 ... Sealing material 12 ... Notch

Claims (4)

  1. 上面に開口する凹部と該凹部の開口部を囲支持部を有する第1の配線基板上に、第2の配線基板載置させるとともに、前記第1の配線基板の凹部内面と前記第2の配線基板の下面とで囲まれる収納領域内に圧電振動素子と発振制御用のIC素子とを配置させてなる圧電発振器において、
    前記圧電振動素子及びIC素子のうちいずれか一方の素子を前記凹部の底面に、他方の素子を前記第2の配線基板の下面に搭載するとともに、両素子に接続される第1の配線基板の配線導体と第2の配線基板の配線導体とを導電性接着剤による接続部で電気的に接続し、
    前記支持部と前記第2の配線基板の下面とを、前記第1の配線基板の外周に沿って前記接続部よりも外側位置に配され、導体材料から成り、且つ、前記第1の配線基板及び/又は第2の配線基板の配線導体を介して外部接続用のグランド端子に接続される封止材で接合することにより前記収納領域を気密封止せしめたことを特徴とする圧電発振器。
    The opening of the recess and the recess which is open to the first wiring board having enclose supporting portion on the upper surface, causes mounting the second wiring board, wherein a concave inner surface of the first wiring substrate and the second In a piezoelectric oscillator in which a piezoelectric vibration element and an oscillation control IC element are arranged in a storage region surrounded by the lower surface of the wiring board,
    One of the piezoelectric vibration element and the IC element is mounted on the bottom surface of the recess, and the other element is mounted on the lower surface of the second wiring board, and the first wiring board connected to both elements Electrically connecting the wiring conductor and the wiring conductor of the second wiring board at a connecting portion using a conductive adhesive;
    The support portion and the lower surface of the second wiring board are arranged on the outer side of the connection portion along the outer periphery of the first wiring board, are made of a conductive material, and are formed of the first wiring board. A piezoelectric oscillator characterized in that the storage region is hermetically sealed by bonding with a sealing material connected to a ground terminal for external connection via a wiring conductor of a second wiring board .
  2. 前記IC素子が、基材を単結晶シリコンにより形成したフリップチップ型ICから成り、該IC素子の実装面と反対側の主面のグランド導体層が被着されていることを特徴とする請求項1に記載の圧電発振器。2. The IC element according to claim 1, wherein the IC element is formed of a flip chip IC having a base material made of single crystal silicon, and a ground conductor layer on a main surface opposite to a mounting surface of the IC element is attached. The piezoelectric oscillator according to 1.
  3. 前記第1の配線基板の下面、第2の配線基板の上面のうちいずれか一方の面に外部接続用の複数個の端子が並設され、他方の面にシールド導体層が被着されていることを特徴とする請求項1又は請求項2に記載の圧電発振器。A plurality of terminals for external connection are arranged in parallel on one of the lower surface of the first wiring substrate and the upper surface of the second wiring substrate, and a shield conductor layer is attached to the other surface. The piezoelectric oscillator according to claim 1 or 2, wherein
  4. 前記第1の配線基板の上面と側面との間の角部、及び/又は、前記第2の配線基板の下面と側面との間の角部に切り欠きが形成されており、該切り欠きの形成領域内に前記封止材の一部が収容されていることを特徴とする請求項1乃至請求項3のいずれかに記載の圧電発振器。A notch is formed in a corner between the upper surface and the side surface of the first wiring board and / or a corner between the lower surface and the side surface of the second wiring board. The piezoelectric oscillator according to claim 1, wherein a part of the sealing material is accommodated in the formation region.
JP2003336312A 2003-09-26 2003-09-26 Piezoelectric oscillator Expired - Fee Related JP4284142B2 (en)

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