JP4275931B2 - Processing method of ultra fine wire - Google Patents

Processing method of ultra fine wire Download PDF

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Publication number
JP4275931B2
JP4275931B2 JP2002342473A JP2002342473A JP4275931B2 JP 4275931 B2 JP4275931 B2 JP 4275931B2 JP 2002342473 A JP2002342473 A JP 2002342473A JP 2002342473 A JP2002342473 A JP 2002342473A JP 4275931 B2 JP4275931 B2 JP 4275931B2
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Prior art keywords
wire
processing
polishing
processed
polishing body
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JP2004174639A (en
Inventor
芳之 佐藤
俊弥 荻原
峰晴 鈴木
清田  茂男
友安 菊地
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NTT Advanced Technology Corp
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NTT Advanced Technology Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、電気抵抗検査装置の探針プローブや医療用のカテーテル等の超微細径のワイヤの一端を超精密(μmオーダ)にマイクロ加工する超微細径ワイヤーの加工方法に関する。
【0002】
【従来の技術】
従来の超微細径ワイヤーの加工方法は、ワイヤーの一端を研削による面取り加工を行い。この1次加工をした後に、バレル研磨の2次加工をするものがある。(例えば、特許文献1参照。)。
【0003】
なお、本出願人は、本明細書に記載した先行技術文献情報で特定される先行技術文献以外に、本発明に密接に関連する先行技術文献を出願時までに発見するには至らなかった。
【0004】
【特許文献1】
特開平8−104015号公報(段落0009、図1)
【0005】
【発明が解決しようとする課題】
上述した従来の超微細径ワイヤーの加工方法では、研削による面取り加工をするときに、ワイヤーが撓まないようにするために、支持部によってワイヤーの一端近傍を回転自在に支持した上でワイヤーを回転させ、支持部から露呈し突出した一端に研削砥石を押し付け拡大鏡で観察しながら研削している。この方法では、直径が1mm程度までのワイヤーを加工することはできるが、直径が100μm程度かそれ以下の直径の超微細径ワイヤーを加工しようとすると、ワイヤーの剛性が小さくなるため、支持部を加工する部位に近づける必要がある。しかしながら、支持部を加工する部位に近づけると研削砥石に接触してしまうため、支持部を加工する部位に近づけるのには自ずと限界があった。このため、加工中にワイヤーの一端部が研削砥石の押し付けによって撓んでしまい、加工精度が低下するというだけではなく、ワイヤーの一端部が折れ曲がるという問題があった。また、1次加工として研削砥石で研削し、2次加工としてバレル研磨で加工するというように、いずれも機械的な加工によって行っているために、一端部の仕上げ精度にばらつきがあり精度が不安定であった。特に、硬い材料によって形成されたワイヤーを加工する場合には、材料が硬いために破損が起こりやすく、破損を防止しながら行うために加工時間が長くなるといった問題もあった。
【0006】
本発明は上記した従来の問題に鑑みなされたものであり、第1の目的は加工精度を向上させることにある。また、第2の目的はワイヤーの折れ曲がりを防止し歩留まりを向上させることにある。また、第3の目的は加工時間の短縮を図ることにある。
【0007】
【課題を解決するための手段】
この目的を達成するために、請求項1に係る発明は、タングステンカーバイド製のワイヤーの一端を電解研磨によって曲面状に1次加工し、しかる後、ワイヤーを軸心周りに回転させながらワイヤーの一端にワイヤーの剛性よりも小さい剛性を有する弾性変形可能な研磨体を押し付けてワイヤーの一端を略円錐形に2次加工する。
したがって、1次加工の作業時間が短縮される。また、ワイヤーに押し付けられた研磨体が弾性変形する。
【0008】
また、請求項2に係る発明は、請求項1に係る発明において、前記研磨体の研磨材をダイヤモンドの粒子とし、この研磨体でワイヤーを研磨した後に、ワイヤーに付着したダイヤモンドの粒子を除去する後処理加工を行う。
したがって、ワイヤーの加工された部位が洗浄される。
【0009】
【発明の実施の形態】
以下、本発明の実施の形態を図に基づいて説明する。図1は本発明に係る超微細径ワイヤーの加工方法における1次加工を説明するためのモデル図であって、同図(a)は加工する前のワイヤーを固定用の治具に取り付けた状態の断面図、同図(b)は電解研磨装置を示し、同図(c)は加工後のワイヤーを示す。図2は同じく2次加工に用いる研磨装置のモデル図で、同図(a)は平面図、同図(b)は正面図、図3は同じくワイヤーガイドを拡大して示したもので、同図(a)は正面図、同図(b)は側面図、同図(c)は加工されたワイヤーの一端の偏心量を説明するための図である。図4は同じく2次加工によって加工されたワイヤー1の一端を、倍率が1500倍の顕微鏡写真機によって撮影した写真である。
【0010】
先ず、図1を用いて1次加工の電解研磨について説明する。
同図(a)において、1は外径が50μmの極細径の円柱状に形成された被加工物であるタングステンカーバイド製のワイヤーであって、このワイヤー1の一端1aを後述する加工によって曲面状に形成する。2は剛性の比較的小さいアルミニウム管によって円筒状に形成された固定用の治具であって、中心に設けた貫通孔2aの内径はワイヤー1の外径よりもわずかに大きい60μmに形成されている。したがって、同図(a)に示すように、この治具2の貫通孔2aにワイヤー1を係入すると、ワイヤー1はこの貫通孔2aに隙間なく取り付けられ、かつ取り付け、取り外し自在である。貫通孔2aに係入されたワイヤー1は一端1aが貫通孔2aから露呈している。
【0011】
このように治具2に取り付けたワイヤー1の一端1aを、同図(b)に示すように、電解槽5内の電解液6に浸し、治具2と電解液6に浸した電極板7とを低周波交流電源8によって印加する。実験の結果、電解液として30%の苛性ソーダを用い、低周波交流として、50Hz、100V、1Aを2〜3分間印加することによって、同図(c)に示すように、ワイヤー1の一端1aを曲率が約25μmの曲面を加工することができた。治具2の貫通孔2aからワイヤー1を抜き取ることにより1次加工が終了する。このように、1次加工に電解研磨を用いたことにより、機械加工に比べて加工時間を短縮することができ、特にかたい材料によって形成されたワイヤーの加工時間を大幅に短縮することが可能になる。
【0012】
次に、図2および図3を用いて2次加工に用いる研磨装置について説明する。
図2に示すように、全体を9で示す研磨装置には、ワイヤー1の先端1aを研磨するための作業台10が備えられており、この作業台10は図示を省略した案内手段によって図中X方向およびY方向に移動自在に支持されている。この作業台10は、一側部に突設されたつまみ11を把持することによりY方向への位置を調整することができるとともに、他側部に突設されたつまみ12を把持することによりX方向への位置を調整することができる。
【0013】
作業台10の中央部には、回転自在に支持されたポール14が立設され、このポール14の外周面の一部には研磨体15がポール14の軸線方向と直交して突設するように取り付けられている。また、ポール14の外周面の研磨体15が取り付けられた位置から円周方向の反対側の位置には、レバー16が軸線方向と直交して突設するように取り付けられている。したがって、レバー16を把持してポール14を同図(a)に示すように、時計方向または反時計方向に回動操作することにより、研磨体15をワイヤー1の一端1aに所定の押圧力によって押し付けることができる。
【0014】
研磨体15は弾性変形が可能なエンジニアリングプラスチックによって扁平な直方体状に形成されており、この研磨体15の研磨面15aには、研磨材としての多数のダイヤモンドの微粒子が研磨体15の表面から露呈するように圧入されている。この研磨体15の剛性は、加工するワイヤー1の剛性よりも小さくなるように形成されている。17はワイヤー1の一端1aの加工状態を観察するためのカメラである。
【0015】
18は回転するワイヤー1が偏心しないように回転自在に支持するワイヤーガイドであって、図3に示すように、共に直方体に形成された台座20と蓋体21とによって構成されている。台座20の両端部にはねじ孔20a,20aが螺設され、上面の中央部には断面が台形に形成された溝20bが設けられている。この溝20bの深さTは、同図(b)に示すように、ワイヤー1の直径よりも僅かに小さく形成され、かつ溝20b内にワイヤー1を係入すると、溝20bの底部と両側部とにワイヤー1の周面が3点接触するように形成されている。蓋体21の両端部には、通しねじ22を挿通させる挿通孔21a,21aが設けられている。
【0016】
このような構成のワイヤーガイド18は、台座20が作業台10に固定されており、台座20の溝20bにワイヤー1を係入し、蓋体21を台座20の上面に載置する。通しねじ22を蓋体21の挿通孔21aに挿通させ、台座20のねじ孔20aに螺合させることにより、台座20の溝20bと蓋体21の下面とによってガイド孔19が形成される。
【0017】
このガイド孔19は、溝20bにワイヤー1の周面が3点接触していることにより、通しねじ22のねじ孔20aへのねじ込み量を調整し、台座20の上面と蓋体21の下面との間隔δを調整することにより、ワイヤー1がガイド孔19に隙間なく回転自在に支持される。したがって、ワイヤー1が図示を省略したモータによって回転するとワイヤー1の偏心回転が規制される。また、このガイド孔19がモータの回転中心と同軸上となるように位置付けられているとともに、研磨体15の近傍に位置付けられている。
【0018】
このように構成されていることにより、上述した1次加工によって加工されたワイヤー1の他端部を固定用の治具2の貫通孔2aに係入し、モータのモータ軸と一体的に回転するチャック部材(いずれも図示せず)によって治具2を締め付ける。このとき、治具2が剛性の比較的小さいアルミニウム管によって形成されているために、チャック部材の締め付けによって治具2が塑性変形して貫通孔2aとワイヤー1との間の隙間が取り除かれ貫通孔2aにワイヤー1が固着する。したがって、モータの回転がワイヤー1に一体的に伝達されてワイヤー1が軸心周りに回転する。
【0019】
ワイヤー1の一端側がワイヤーガイド18のガイド孔19によって回転自在に支持されることにより、このワイヤーガイド18によって、ワイヤー1とモータの回転軸とが同軸上に位置付けられる。したがって、モータの回転によって回転するワイヤー1は偏心回転するようなことがない。
【0020】
このような状態としてから、カメラ17でワイヤー1の一端1aの位置を確認しながら、つまみ11,12を把持して作業台10をY方向またはX方向に移動させることにより、研磨体15の位置を調整する。モータを駆動してワイヤー1を軸心周りに回転させ、レバー16を操作してポール14を、同図(a)に示すように反時計方向に回動させることにより、研磨体15の研磨面15aをワイヤー1の一端1aに押し付ける。このとき、研磨体15の剛性がワイヤー1の剛性よりも小さく形成され、かつ研磨体15が弾性変形可能な部材によって形成されているため、ワイヤー1には必要以上の押圧力が加わることがない。このため、ワイヤー1が折れ曲がるようなことがないとともに、ワイヤー1の一端側が偏心回転するようなこともないので、加工精度を向上させることができる。
【0021】
図4はこの2次加工によって加工されたワイヤー1の一端1aを、倍率が1500倍の顕微鏡写真機によって撮影したものであって、一端1aの半径が10.343μmに加工されていることが実測された。なお、本出願人が実験した結果、半径が5μm程度まで加工できることが確かめられた。また、撮影された図4から、直径50μmのワイヤー1の加工された一端1aの偏心量γが1μm以内に納められたことが実測された。すなわち、図3(c)において、中心線Cからワイヤー1の両端までの距離をそれぞれd1,d2とすると、
γ=|d1−d2|≦1μm
となった。このように、本発明においては、ワイヤーの一端をマイクロ加工するのに適しており、特に直径が100μm以下のワイヤーの一端をμmオーダで超精密加工するのに適している。
【0022】
この2次加工によって、ワイヤー1の一端1aの加工面にダイヤモンドの微粒子が付着した場合には、ポール14に研磨体15の替わりにダイヤモンドの微粒子を払い落とすための後処理用の研磨体を取り付け、この後処理用の研磨体によってワイヤー1の一端の加工面を清掃してもよい。この後処理用の研磨体としては、セラミックス製の研磨体に研磨布を覆ったものでもよいし、硬度の低い研磨材を用いてもよく、付着したダイヤモンドの付着状態に応じて種々の選択が可能である。このように、硬度が相対的に高いダイヤモンドの微粒子によって研磨することにより、加工時間を短縮できるとともに、後処理用の研磨体によってワイヤー1の一端1aの加工面の品質を向上させることができる。
【0023】
【実施例】
ワイヤー1を、微少領域の電気抵抗測定用4探針プローブの探針加工に適用したところ、探針の直径が50μm、探針間のピッチが100μmのファインピッチの4探針プローブが製作された。また、研磨体15の厚みを30〜40μmとした。電解研磨においては、被加工物の材料によって電極板7が異なるが、本発明ではワイヤー1がタングステンカーバイドによって形成されていることにより、電極板7をニッケル製とした。
【0024】
なお、本実施例では、本発明の超微細径ワイヤー加工によって探針プローブを加工した例を示したが、医療用のステンレス製のカテーテルまたはドットプリンタ用ワイヤー等を加工することもでき、種々の用途のものの加工に適用できる。
【0025】
【発明の効果】
以上説明したように、請求項1に係る発明によれば、加工精度を向上させることができるばかりではなく、ワイヤーの折れ曲がりを防止し歩留まりを向上させることができ、かつ加工時間の短縮を図ることができる。
【0026】
また、請求項2に係る発明によれば、加工時間を短縮することができるとともに、ワイヤーの一端の加工面の品質を向上させることができる。
【図面の簡単な説明】
【図1】 本発明に係る超微細径ワイヤーの加工方法における1次加工を説明するためのモデル図であって、同図(a)は加工する前のワイヤーを固定用の治具に取り付けた状態の断面図、同図(b)は電解研磨装置を示し、同図(c)は加工後のワイヤーを示す。
【図2】 本発明に係る超微細径ワイヤーの加工方法における2次加工に用いる研磨装置のモデル図で、同図(a)は平面図、同図(b)は正面図である。
【図3】 本発明に係る超微細径ワイヤーの加工方法に用いる研磨装置におけるワイヤーガイドを拡大して示したもので、同図(a)は正面図、同図(b)は側面図、同図(c)は加工されたワイヤーの一端の偏心量を説明するための図である。
【図4】 本発明に係る超微細径ワイヤーの加工方法において、2次加工によって加工されたワイヤー1の一端を、倍率が1500倍の顕微鏡写真機によって撮影した写真である。
【符号の説明】
1…ワイヤー、1a…一端、2…固定用の治具、6…電解液、7…電極板、8…低周波交流電源、9…研磨装置、10…作業台、15…研磨体、15a…研磨面、18…ワイヤーガイド、19…ガイド孔。
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a processing method of an ultrafine diameter wire in which one end of an ultrafine diameter wire such as a probe probe of an electrical resistance test apparatus or a medical catheter is micromachined to ultraprecision (μm order).
[0002]
[Prior art]
The conventional method for processing ultra-fine diameter wires is to chamfer one end of the wire by grinding. After the primary processing, there is a secondary processing for barrel polishing. (For example, refer to Patent Document 1).
[0003]
In addition, the present applicant has not found any prior art documents closely related to the present invention by the time of filing other than the prior art documents specified by the prior art document information described in the present specification.
[0004]
[Patent Document 1]
JP-A-8-104015 (paragraph 0009, FIG. 1)
[0005]
[Problems to be solved by the invention]
In the conventional ultrafine diameter wire processing method described above, in order to prevent the wire from being bent when chamfering by grinding, the wire is supported after the end portion of the wire is rotatably supported by the support portion. Grinding is performed while rotating and observing with a magnifying glass by pressing a grinding stone against one end exposed and protruding from the support. In this method, it is possible to process a wire having a diameter of about 1 mm. However, if an ultrafine wire having a diameter of about 100 μm or less is processed, the rigidity of the wire is reduced, so that the support portion is It needs to be close to the part to be processed. However, when the support part is brought close to the part to be processed, the grinding wheel is brought into contact with the grinding part. Therefore, there is a limit to bringing the support part close to the part to be processed. For this reason, the one end part of the wire was bent by the pressing of the grinding wheel during processing, and not only the processing accuracy was lowered, but also the one end part of the wire was bent. In addition, since both are performed by mechanical processing, such as grinding with a grinding wheel as the primary processing and barrel polishing as the secondary processing, the finishing accuracy at one end varies and the accuracy is poor. It was stable. In particular, when a wire formed of a hard material is processed, there is a problem that the material is hard and therefore breakage is likely to occur, and the processing time is increased to prevent damage.
[0006]
The present invention has been made in view of the above-described conventional problems, and a first object is to improve machining accuracy. The second object is to prevent the wire from being bent and to improve the yield. The third purpose is to shorten the machining time.
[0007]
[Means for Solving the Problems]
In order to achieve this object, the invention according to claim 1 is characterized in that one end of a tungsten carbide wire is first processed into a curved surface by electrolytic polishing, and then one end of the wire is rotated while the wire is rotated around an axis. An elastically deformable polishing body having rigidity smaller than the rigidity of the wire is pressed against the wire, and one end of the wire is secondarily processed into a substantially conical shape.
Therefore, the work time of primary processing is shortened. Moreover, the polishing body pressed against the wire is elastically deformed.
[0008]
The invention according to claim 2 is the invention according to claim 1, wherein the abrasive of the abrasive body is diamond particles, and after the wire is polished with the abrasive body, the diamond particles attached to the wire are removed. Perform post-processing.
Therefore, the processed part of the wire is washed.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a model diagram for explaining primary processing in a processing method of an ultrafine wire according to the present invention, and FIG. 1 (a) shows a state in which a wire before processing is attached to a fixing jig. FIG. 4B shows the electropolishing apparatus, and FIG. 3C shows the wire after processing. 2A and 2B are model views of a polishing apparatus used for secondary processing. FIG. 2A is a plan view, FIG. 2B is a front view, and FIG. 3 is an enlarged view of a wire guide. (A) is a front view, (b) is a side view, and (c) is a diagram for explaining the eccentricity of one end of the processed wire. FIG. 4 is a photograph of one end of the wire 1 processed by the secondary processing, taken with a microscope with a magnification of 1500 times.
[0010]
First, the primary processing electropolishing will be described with reference to FIG.
In FIG. 1 (a), reference numeral 1 denotes a tungsten carbide wire, which is a workpiece formed in an extremely thin cylindrical shape having an outer diameter of 50 μm, and one end 1a of the wire 1 is curved by processing described later. To form. Reference numeral 2 denotes a fixing jig formed in a cylindrical shape by a relatively small aluminum tube, and the inner diameter of the through hole 2a provided in the center is formed to be 60 μm which is slightly larger than the outer diameter of the wire 1. Yes. Therefore, as shown in FIG. 5A, when the wire 1 is inserted into the through hole 2a of the jig 2, the wire 1 is attached to the through hole 2a without any gap and can be attached and detached. One end 1a of the wire 1 engaged with the through hole 2a is exposed from the through hole 2a.
[0011]
One end 1a of the wire 1 thus attached to the jig 2 is immersed in the electrolytic solution 6 in the electrolytic bath 5 and the electrode plate 7 immersed in the jig 2 and the electrolytic solution 6 as shown in FIG. Are applied by a low-frequency AC power supply 8. As a result of the experiment, 30% caustic soda was used as the electrolytic solution, and 50 Hz, 100 V, and 1 A were applied as low-frequency alternating current for 2 to 3 minutes. As shown in FIG. A curved surface with a curvature of about 25 μm could be processed. By removing the wire 1 from the through hole 2a of the jig 2, the primary processing is completed. In this way, by using electropolishing for primary processing, processing time can be reduced compared to machining, and the processing time for wires made of particularly hard materials can be greatly reduced. become.
[0012]
Next, a polishing apparatus used for secondary processing will be described with reference to FIGS. 2 and 3.
As shown in FIG. 2, the polishing apparatus shown as a whole by 9 is provided with a work table 10 for polishing the tip 1 a of the wire 1, and this work table 10 is shown in the figure by guide means (not shown). It is supported so as to be movable in the X and Y directions. The work table 10 can be adjusted in position in the Y direction by gripping a knob 11 protruding from one side, and can be adjusted by gripping a knob 12 protruding from the other side. The position in the direction can be adjusted.
[0013]
A pole 14 that is rotatably supported is erected at the center portion of the work table 10, and a polishing body 15 protrudes perpendicularly to the axial direction of the pole 14 on a part of the outer peripheral surface of the pole 14. Is attached. In addition, a lever 16 is attached at a position opposite to the circumferential direction from the position where the polishing body 15 is attached on the outer peripheral surface of the pole 14 so as to protrude perpendicular to the axial direction. Therefore, by holding the lever 16 and rotating the pole 14 clockwise or counterclockwise as shown in FIG. 5A, the polishing body 15 is applied to the one end 1a of the wire 1 by a predetermined pressing force. Can be pressed.
[0014]
The polishing body 15 is formed into a flat rectangular parallelepiped shape by an engineering plastic that can be elastically deformed. A large number of diamond fine particles as an abrasive are exposed from the surface of the polishing body 15 on the polishing surface 15a of the polishing body 15. It is press-fitted to do. The rigidity of the polishing body 15 is formed to be smaller than the rigidity of the wire 1 to be processed. Reference numeral 17 denotes a camera for observing the processing state of the one end 1 a of the wire 1.
[0015]
Reference numeral 18 denotes a wire guide that rotatably supports the rotating wire 1 so as not to be eccentric. As shown in FIG. 3, the wire guide 18 includes a pedestal 20 and a lid 21 that are formed in a rectangular parallelepiped shape. Screw holes 20a and 20a are screwed into both ends of the pedestal 20, and a groove 20b having a trapezoidal cross section is provided in the center of the upper surface. The depth T of the groove 20b is slightly smaller than the diameter of the wire 1 as shown in FIG. 5B, and when the wire 1 is engaged in the groove 20b, the bottom and both sides of the groove 20b are formed. And the peripheral surface of the wire 1 is formed in contact with three points. Insertion holes 21 a and 21 a through which the through screws 22 are inserted are provided at both ends of the lid body 21.
[0016]
In the wire guide 18 having such a configuration, the pedestal 20 is fixed to the work table 10, the wire 1 is engaged in the groove 20 b of the pedestal 20, and the lid 21 is placed on the upper surface of the pedestal 20. A guide hole 19 is formed by the groove 20 b of the pedestal 20 and the lower surface of the lid 21 by inserting the through screw 22 into the insertion hole 21 a of the lid 21 and screwing it into the screw hole 20 a of the pedestal 20.
[0017]
The guide hole 19 adjusts the screwing amount of the through screw 22 into the screw hole 20a by contacting the groove 20b with the circumferential surface of the wire 1 at three points, and the upper surface of the base 20 and the lower surface of the lid 21 By adjusting the interval δ, the wire 1 is supported in the guide hole 19 so as to be freely rotatable without a gap. Therefore, when the wire 1 is rotated by a motor (not shown), the eccentric rotation of the wire 1 is restricted. The guide hole 19 is positioned so as to be coaxial with the rotation center of the motor, and is positioned in the vicinity of the polishing body 15.
[0018]
With this configuration, the other end of the wire 1 processed by the primary processing described above is engaged with the through hole 2a of the fixing jig 2, and rotates integrally with the motor shaft of the motor. The jig 2 is tightened by a chuck member (both not shown). At this time, since the jig 2 is formed of an aluminum tube having a relatively small rigidity, the jig 2 is plastically deformed by tightening the chuck member, and the gap between the through hole 2a and the wire 1 is removed and penetrated. The wire 1 is fixed to the hole 2a. Therefore, the rotation of the motor is integrally transmitted to the wire 1 and the wire 1 rotates around the axis.
[0019]
When one end side of the wire 1 is rotatably supported by the guide hole 19 of the wire guide 18, the wire guide 18 positions the wire 1 and the rotation shaft of the motor on the same axis. Therefore, the wire 1 rotated by the rotation of the motor does not rotate eccentrically.
[0020]
In this state, the position of the polishing body 15 is determined by grasping the knobs 11 and 12 and moving the work table 10 in the Y direction or the X direction while confirming the position of the one end 1a of the wire 1 with the camera 17. Adjust. The motor 1 is driven to rotate the wire 1 around the axis, and the lever 16 is operated to rotate the pole 14 counterclockwise as shown in FIG. 15 a is pressed against one end 1 a of the wire 1. At this time, since the rigidity of the polishing body 15 is formed to be smaller than the rigidity of the wire 1 and the polishing body 15 is formed of a member that can be elastically deformed, the wire 1 is not subjected to excessive pressing force. . For this reason, since the wire 1 is not bent and the one end side of the wire 1 is not eccentrically rotated, the processing accuracy can be improved.
[0021]
FIG. 4 is an image of one end 1a of the wire 1 processed by the secondary processing, taken with a microscope with a magnification of 1500 times, and it is actually measured that the radius of the one end 1a is processed to 10.343 μm. It was done. As a result of experiments by the present applicant, it was confirmed that the radius could be processed to about 5 μm. Also, from the photographed FIG. 4, it was actually measured that the eccentric amount γ of the processed end 1a of the wire 1 having a diameter of 50 μm was within 1 μm. That is, in FIG. 3C, when the distance from the center line C to both ends of the wire 1 is d1 and d2, respectively.
γ = | d1-d2 | ≦ 1 μm
It became. Thus, the present invention is suitable for micro-processing one end of a wire, and particularly suitable for ultra-precision processing one end of a wire having a diameter of 100 μm or less on the order of μm.
[0022]
When diamond fine particles adhere to the processed surface of the one end 1a of the wire 1 by this secondary processing, a post-treatment polishing body is attached to the pole 14 in order to remove the diamond fine particles instead of the polishing body 15. The processed surface at one end of the wire 1 may be cleaned with this post-treatment polishing body. As a polishing body for this post-treatment, a polishing body covered with a polishing cloth may be used, or a polishing material with low hardness may be used, and various selections may be made depending on the adhesion state of the adhered diamond. Is possible. Thus, by polishing with diamond fine particles having a relatively high hardness, the processing time can be shortened, and the quality of the processed surface of the one end 1a of the wire 1 can be improved by the post-processing polishing body.
[0023]
【Example】
When the wire 1 was applied to probe processing of a four-probe probe for measuring electrical resistance in a minute region, a four-probe probe having a fine pitch with a probe diameter of 50 μm and a pitch between the probes of 100 μm was produced. . The thickness of the polishing body 15 was set to 30 to 40 μm. In the electropolishing, the electrode plate 7 differs depending on the material of the workpiece, but in the present invention, the electrode 1 is made of nickel because the wire 1 is formed of tungsten carbide.
[0024]
In this embodiment, an example in which the probe probe is processed by the ultrafine diameter wire processing of the present invention has been shown. However, a medical stainless steel catheter or a wire for a dot printer can also be processed, Applicable to processing of intended use.
[0025]
【The invention's effect】
As described above, according to the invention according to claim 1, not only the machining accuracy can be improved, but also the yield of the wire can be prevented by preventing the wire from being bent, and the machining time can be shortened. Can do.
[0026]
Moreover, according to the invention which concerns on Claim 2, while processing time can be shortened, the quality of the process surface of the end of a wire can be improved.
[Brief description of the drawings]
FIG. 1 is a model diagram for explaining primary processing in a processing method of an ultrafine wire according to the present invention, in which FIG. 1 (a) is attached to a fixing jig before processing; Sectional drawing of a state, the figure (b) shows an electropolishing apparatus, and the figure (c) shows the wire after a process.
FIGS. 2A and 2B are model views of a polishing apparatus used for secondary processing in the method for processing an ultrafine wire according to the present invention, in which FIG. 2A is a plan view and FIG. 2B is a front view.
FIG. 3 is an enlarged view of a wire guide in a polishing apparatus used in a method for processing an ultrafine diameter wire according to the present invention. FIG. 3 (a) is a front view, FIG. 3 (b) is a side view, and FIG. FIG. 3C is a diagram for explaining the amount of eccentricity at one end of the processed wire.
FIG. 4 is a photograph of one end of a wire 1 processed by secondary processing in a method for processing an ultrafine wire according to the present invention, taken with a microscope photographer with a magnification of 1500 times.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Wire, 1a ... One end, 2 ... Fixing jig, 6 ... Electrolyte, 7 ... Electrode plate, 8 ... Low frequency alternating current power supply, 9 ... Polishing apparatus, 10 ... Work table, 15 ... Polishing body, 15a ... Polishing surface, 18 ... wire guide, 19 ... guide hole.

Claims (2)

タングステンカーバイド製のワイヤーの一端を電解研磨によって曲面状に1次加工し、しかる後、ワイヤーを軸心周りに回転させながらワイヤーの一端にワイヤーの剛性よりも小さい剛性を有する弾性変形可能な研磨体を押し付けてワイヤーの一端を略円錐形に2次加工することを特徴とする超微細径ワイヤーの加工方法。One end of a tungsten carbide wire is first processed into a curved surface by electrolytic polishing, and then the elastically deformable polishing body having a rigidity smaller than the rigidity of the wire at one end of the wire while rotating the wire around the axis. And processing one end of the wire into a substantially conical shape by pressing the wire. 請求項1記載の超微細径ワイヤーの加工方法において、前記研磨体の研磨材をダイヤモンドの粒子とし、この研磨体でワイヤーを研磨した後に、ワイヤーに付着したダイヤモンドの粒子を除去する後処理加工を行うことを特徴とする超微細径ワイヤーの加工方法。  2. The ultrafine diameter wire processing method according to claim 1, wherein after the polishing material of the abrasive body is diamond particles and the wire is polished by the abrasive body, the post-processing process is performed to remove the diamond particles attached to the wire. A method of processing an ultrafine diameter wire characterized by being performed.
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JPH0672319B2 (en) * 1988-11-15 1994-09-14 工業技術院長 Platinum probe processing method
JPH02247951A (en) * 1989-03-20 1990-10-03 Denki Kagaku Kogyo Kk Electric field-discharge type ion source
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