JP4265001B2 - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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Publication number
JP4265001B2
JP4265001B2 JP27723598A JP27723598A JP4265001B2 JP 4265001 B2 JP4265001 B2 JP 4265001B2 JP 27723598 A JP27723598 A JP 27723598A JP 27723598 A JP27723598 A JP 27723598A JP 4265001 B2 JP4265001 B2 JP 4265001B2
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Japan
Prior art keywords
copper foil
gnd
back surface
front surface
inner layer
Prior art date
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Expired - Fee Related
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JP27723598A
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Japanese (ja)
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JP2000114728A (en
Inventor
信夫 亀岡
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Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP27723598A priority Critical patent/JP4265001B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、多層フレキシブルプリント基板に関する。
【0002】
【従来の技術】
従来、パソコン本体内の回路と、液晶ユニットを含み開閉できる表示部内の回路との接続に、片面、または、両面のフレキシブルプリント基板(以下、FPCと称する)を使用していた。この場合、表示部の開閉に伴い、FPCが伸縮や屈曲するので、柔軟で耐久性の高いFPCが要求される。
【0003】
図2、パソコン本体内の回路と表示部内の回路と接続するFPCの形状例を示す斜視図である。
【0004】
図2において、一枚のFPCは、表示部の回路に接続する端子部分1と、巻いた部分2と、屈曲部3と、パソコン本体の回路に接続する端子部分4を備えている。端子部分1と端子部分4は、表示部の回動に応じて移動する。この移動を吸収してFPCの耐久性を強化しまた表示部の開閉動作を円滑にするのが巻いた部分2である。例えば、端子部分1と端子部分4が引っ張り合う場合、巻いた部分2がより小さい直径の巻きになり、端子部分1と端子部分4が押し合う場合、巻いた部分2はより大きい直径の巻きになる。
【0005】
従って、表示部の回路と本体の回路を接続するFPC、特に巻いた部分2や屈曲部3には、柔軟な屈曲性能及び屈曲の高い耐久性が要求される。
【0006】
さらに、表示部の回路と本体の回路を接続するFPCは、クロック信号などの高周波電流が流れるために不要輻射や配線間クロストークを低減するシールド性能が要求される。特に巻いた部分2や屈曲部3から強い不要輻射やクロストークが発生しやすい。
【0007】
図3は、従来のFPCの構成を説明するための断面斜視図である。
図3に示したように、前述の屈曲性能と不要輻射やクロストークを改善するために、FPCの回路面5の裏面6に、少なくとも屈曲される部分に、シールドパターンを格子状に設けた両面FPCが、例えば、実開平5−41171号公報に提案されている。裏面6の全面を銅箔にすると、不要輻射やクロストークの低減に効果的であるが、柔軟で耐久性の高い屈曲性能が得られないので、格子の目7の銅箔を除去している。
【0008】
ところが、上記従来例の両面FPCでも、クロック信号などの周波数がさらにより高い周波数になってくると、巻いた部分や屈曲部分から不要輻射やクロストークが増加する。
【0009】
また、パソコンの小型化に伴い、図2で示したFPCの巻いた部分の巻径が小さくなり、また、図2に示したAの部分とBの部分が近接し密着するので、不要輻射やクロストークの低減が困難になり、さらに、屈曲部3の屈曲角度が小さくなって、柔軟で耐久性のある屈曲性能を得ることが困難になっていた。
【0010】
【発明が解決しようとする課題】
本発明は、かかる点に鑑みてなされたもので、特に、屈曲部分および巻いた部分でのクロストークおよび不要輻射を低減し、かつ、柔軟で耐久性の高い屈曲性能が得られるFPCを提供することを目的とする。
【0011】
【課題を解決するための手段】
本発明のFPCは、格子状のシールドパターンが信号線層の表面及び裏面の両面に設けられ、且つ、シールドパターンの銅箔が除去された格子の目(銅箔除去部分)が表面と裏面で重複しないようにずらして配置されていることを特徴とする。
【0012】
【発明の実施の形態】
本発明は、格子状のシールドパターン、すなわち、GND銅箔が信号銅箔層の表面及び裏面に設けられ、且つ、そのシールドパターンの銅箔除去部分が表面と裏面で重複しないようにずらして配置されたことを特徴とするフレキシブルプリント基板であり、柔軟で耐久性の高い屈曲性と不要輻射やクロストークの低減という作用が得られる。
【0013】
また、本発明は、前記信号銅箔の両側にGND銅箔を沿わせたものであり、高品質の不要輻射やクロストークの低減という作用が得られる。
【0014】
また、本発明は、前記表面と前記裏面のシールドパターンの銅箔部分が、相互に複数のスルーホールで接続され、これにより表面と裏面の接地電位がより等しくなり、シールド効果が向上するという作用が得られる。
【0015】
以下に、本発明のフレキシブルプリント基板(FPC)の実施の形態を説明する。
【0016】
(実施の形態1)
図1(a)は本発明のFPCの実施の形態1の断面斜視図、図1(b)は本発明のFPCの実施の形態1の表面と裏面のシールドパターンの透視図である。
【0017】
図1(a)において、FPCは、配線された内層11をシールドパターンを備えた表面12と、表面12と同様のシールドパターンを備えた裏面13とで内層11を挟む3層構成である。
【0018】
表面12は、銅箔を除去した格子の目の部分(銅箔除去部分)14と格子状のGND銅箔15とGND銅箔15にスルーホール16を有する、格子状のシールドパターンを備えている。GND銅箔15は接地電位に保持されている。
【0019】
内層11は、スルーホール16と接続されたGND銅箔17に近接して挟まれた高周波の信号銅箔18を備えている。
【0020】
裏面13は、銅箔を除去した格子の目の部分(銅箔除去部分)20と格子状のGND銅箔19とGND銅箔19にスルーホール21を有する、格子状のシールドパターンを備えている。GND銅箔19はGNDパターンである。
【0021】
スルーホール21は、内層11のGND銅箔17に接続され、さらに、スルーホール16で表面12のGND銅箔15にも接続されている。
【0022】
スルーホール16、21は複数個設けられており、表面12と内層11と裏面13の3層の各GND銅箔15、17、19を接続する。従って、信号銅箔18は隣接するGND銅箔17と表面12のGND銅箔15と裏面13のGND銅箔19及び導電性のスルーホール16、21に囲まれているので不要輻射やクロストークが低減する。
【0023】
図1(b)は表面12の銅箔除去部分14と裏面13の銅箔除去部分20の関係を示す説明図である。
【0024】
図1(b)において、実線の大きい円は表面12の銅箔除去部分14、点線の大きい円は裏面13の銅箔除去部分20、小さい円は、表面12のスルーホール16と裏面13のスルーホール21を示す。
【0025】
図1(b)に示すように、表面12の銅箔除去部分14と裏面13の銅箔除去部分20の位置を重複しないようにずらすことにより、FPCの柔軟で耐久性のよい屈曲性と不要輻射やクロストークの低減が得られる。
【0026】
ここで、表面12の銅箔除去部分14と裏面13の銅箔除去部分20の位置が重複すれば、内層11の信号銅箔18の上下にシールドパターンのGND銅箔がない場合が生じて不要輻射やクロストークが増加する。
【0027】
表面12の隣接し合う銅箔除去部分14の円の中心点を結ぶ正3角形の中点に裏面13の銅箔除去部分20の円の中心点を配置することで、裏面と表面をずらし、屈曲性を高める。
【0028】
銅箔除去部分14、20は、屈曲性と不要輻射およびクロストークの両性能が得られるように最適寸法や最適形状を設計する。図1(b)に示すように少し重複しても効果があるが、銅箔除去部分を小さく重複部分がないように配置する方が屈曲性能が少し低下するけれども不要輻射およびクロストークの両性能が向上する。
【0029】
信号銅箔18に流れる高周波信号から生じる輻射電磁波は、隣接するGND銅箔17と、高周波の信号銅箔18の真上の表面12のGND銅箔15と斜め下の裏面13のGND銅箔19または高周波の信号銅箔18の斜め上の表面12のGND銅箔15と真下の裏面13のGND銅箔19に吸収されて、他の信号銅箔へのクロストークや不要輻射が低減する。さらに近接して設けられたスルーホール16、21によってもクロストークや不要輻射が低減する。
【0030】
なお、本発明のFPCの実施の形態1で、銅箔除去部分は円形で説明したが他の形状でもよい。表面と裏面で銅箔除去部分が重複しないようにずらし、内層の信号銅箔の上または下の少なくとも一方にGND銅箔があるような配置であれば本発明に含まれる。
【0031】
【発明の効果】
上述のように本発明のFPCによれば、小型で巻径が小さくまた角度の小さい屈曲に対しても、柔軟で耐久性の高い屈曲性とクロストークおよび不要輻射の低減が実現できる。
【0032】
また、折り曲げが自由自在なため、同軸ケーブルや、シールド線よりも省スペース化を実現できる。
【図面の簡単な説明】
【図1】 (a)本発明のFPCの実施の形態1の断面斜視図
(b)本発明のFPCの実施の形態1の表面と裏面のシールドパターンの平面透視図
【図2】 パソコン本体内の回路と表示部内の回路と接続するFPCの形状例を説明する斜視図
【図3】 従来のFPCの構成を説明するための断面斜視図
【符号の説明】
11 内層
12 表面
13 裏面
14 銅箔除去部分
15 GND銅箔
16 スルーホール
17 GND銅箔
18 信号銅箔
19 GND銅箔
20 銅箔除去部分
21 スルーホール
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer flexible printed circuit board.
[0002]
[Prior art]
Conventionally, a single-sided or double-sided flexible printed circuit board (hereinafter referred to as FPC) has been used to connect a circuit in a personal computer body to a circuit in a display unit that includes a liquid crystal unit and can be opened and closed. In this case, since the FPC expands and contracts and bends as the display unit is opened and closed, a flexible and highly durable FPC is required.
[0003]
FIG. 2 is a perspective view showing an example of the shape of the FPC connected to the circuit in the personal computer main body and the circuit in the display unit .
[0004]
In FIG. 2, one FPC includes a terminal portion 1 connected to the circuit of the display portion, a wound portion 2, a bent portion 3, and a terminal portion 4 connected to the circuit of the personal computer body. The terminal portion 1 and the terminal portion 4 move according to the rotation of the display unit. The wound portion 2 absorbs this movement to enhance the durability of the FPC and smooth the opening / closing operation of the display portion. For example, when the terminal part 1 and the terminal part 4 are pulled together, the wound part 2 becomes a smaller diameter winding, and when the terminal part 1 and the terminal part 4 are pressed together, the wound part 2 becomes a larger diameter winding. Become.
[0005]
Therefore, the FPC that connects the circuit of the display portion and the circuit of the main body, particularly the wound portion 2 and the bent portion 3, are required to have flexible bending performance and high durability of bending.
[0006]
Further, the FPC that connects the circuit of the display portion and the circuit of the main body is required to have a shielding performance that reduces unnecessary radiation and crosstalk between wires because a high-frequency current such as a clock signal flows. In particular, strong unnecessary radiation and crosstalk are likely to occur from the wound portion 2 and the bent portion 3.
[0007]
FIG. 3 is a cross-sectional perspective view for explaining the configuration of a conventional FPC .
As shown in FIG. 3, in order to improve the above-described bending performance and unnecessary radiation and crosstalk, both sides of the back surface 6 of the circuit surface 5 of the FPC are provided with a shield pattern in a lattice shape at least at the bent portion. FPC is proposed in Japanese Utility Model Laid-Open No. 5-41171, for example. When the entire back surface 6 is made of copper foil, it is effective in reducing unwanted radiation and crosstalk, but since flexible and durable bending performance cannot be obtained, the copper foil of the grid eyes 7 is removed. .
[0008]
However, even in the above-described conventional double-sided FPC, when the frequency of the clock signal or the like becomes even higher, unnecessary radiation and crosstalk increase from the wound part and the bent part.
[0009]
Further, as the personal computer is downsized, the winding diameter of the FPC wound portion shown in FIG. 2 is reduced, and the portion A and the portion B shown in FIG. It has been difficult to reduce crosstalk, and the bending angle of the bent portion 3 has been reduced, making it difficult to obtain flexible and durable bending performance .
[0010]
[Problems to be solved by the invention]
The present invention has been made in view of the above points, and in particular, provides an FPC that can reduce crosstalk and unnecessary radiation at a bent portion and a wound portion, and can obtain a flexible and highly durable bending performance. For the purpose.
[0011]
[Means for Solving the Problems]
In the FPC of the present invention, a grid-like shield pattern is provided on both the front and back surfaces of the signal line layer , and the grid eyes (copper foil removed portions) from which the copper foil of the shield pattern is removed are on the front and back surfaces. It is characterized by being shifted so as not to overlap.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a grid-like shield pattern, that is, a GND copper foil is provided on the front and back surfaces of the signal copper foil layer, and the copper foil removed portions of the shield pattern are arranged so as not to overlap on the front and back surfaces. The flexible printed circuit board is characterized in that it is flexible and highly flexible, and has the effect of reducing unnecessary radiation and crosstalk.
[0013]
In the present invention, the GND copper foil is provided on both sides of the signal copper foil, and an effect of reducing high-quality unnecessary radiation and crosstalk can be obtained.
[0014]
Further, the present invention is such that the copper foil portions of the shield pattern on the front surface and the back surface are connected to each other through a plurality of through holes , thereby making the ground potential on the front surface and the back surface more equal and improving the shielding effect. Is obtained.
[0015]
Hereinafter, embodiments of the flexible printed circuit board (FPC) of the present invention will be described.
[0016]
(Embodiment 1)
FIG. 1A is a cross-sectional perspective view of the first embodiment of the FPC of the present invention, and FIG. 1B is a perspective view of the front and back shield patterns of the first embodiment of the FPC of the present invention.
[0017]
In FIG. 1A, the FPC has a three-layer configuration in which the wired inner layer 11 is sandwiched between a front surface 12 having a shield pattern and a back surface 13 having a shield pattern similar to the front surface 12.
[0018]
The surface 12 includes a grid-like shield pattern having a through-hole 16 in a grid-eye portion (copper foil-removed portion) 14 from which the copper foil has been removed, a grid-like GND copper foil 15 and a GND copper foil 15 portion. Yes. The GND copper foil 15 is held at the ground potential.
[0019]
The inner layer 11 includes a high-frequency signal copper foil 18 sandwiched between a GND copper foil 17 connected to the through hole 16.
[0020]
The back surface 13 is provided with a grid-like shield pattern having through-holes 21 in a grid eye portion (copper foil removed portion) 20 from which copper foil has been removed, a grid-like GND copper foil 19 and a GND copper foil 19 portion. Yes. The GND copper foil 19 is a GND pattern.
[0021]
The through hole 21 is connected to the GND copper foil 17 of the inner layer 11, and is further connected to the GND copper foil 15 of the surface 12 through the through hole 16.
[0022]
A plurality of through-holes 16 and 21 are provided, and the GND copper foils 15, 17 and 19 of the three layers of the front surface 12, the inner layer 11 and the back surface 13 are connected. Therefore, the signal copper foil 18 is surrounded by the adjacent GND copper foil 17, the GND copper foil 15 on the front surface 12, the GND copper foil 19 on the back surface 13, and the conductive through holes 16 and 21. To reduce.
[0023]
FIG. 1B is an explanatory diagram showing the relationship between the copper foil removed portion 14 on the front surface 12 and the copper foil removed portion 20 on the back surface 13.
[0024]
In FIG. 1B, a circle with a large solid line indicates a copper foil removed portion 14 on the front surface 12, a circle with a large dotted line indicates a copper foil removed portion 20 on the back surface 13, and a small circle indicates a through hole 16 on the front surface 12 and a through hole on the back surface 13. Hall 21 is shown.
[0025]
As shown in FIG. 1B, the flexible and durable flexibility of the FPC is unnecessary by shifting the positions of the copper foil removing portion 14 on the front surface 12 and the copper foil removing portion 20 on the back surface 13 so as not to overlap. Reduction of radiation and crosstalk can be obtained.
[0026]
Here, if the positions of the copper foil removal portion 14 on the front surface 12 and the copper foil removal portion 20 on the back surface 13 overlap, there may be cases where there is no GND copper foil of the shield pattern above and below the signal copper foil 18 of the inner layer 11. Radiation and crosstalk increase.
[0027]
By disposing the center point of the circle of the copper foil removed portion 20 of the back surface 13 at the midpoint of a regular triangle connecting the center points of the circles of the adjacent copper foil removed portions 14 of the surface 12, the back surface and the surface are shifted, Increase flexibility.
[0028]
The copper foil removal portions 14 and 20 are designed to have optimum dimensions and shapes so as to obtain both flexibility and unnecessary radiation and crosstalk performance. Although a slight overlap as shown in FIG. 1B is effective, it is effective to arrange the copper foil removed portion so as not to have a small overlap portion, but both bending radiation performance and crosstalk performance are slightly reduced. Will improve.
[0029]
The radiated electromagnetic wave generated from the high frequency signal flowing in the signal copper foil 18 includes the adjacent GND copper foil 17, the GND copper foil 15 on the top surface 12 of the high frequency signal copper foil 18, and the GND copper foil 19 on the back surface 13 obliquely below. Alternatively, it is absorbed by the GND copper foil 15 on the diagonally upper surface 12 of the high-frequency signal copper foil 18 and the GND copper foil 19 on the lower back surface 13 to reduce crosstalk and unnecessary radiation to other signal copper foils. Furthermore, crosstalk and unwanted radiation are also reduced by the through holes 16 and 21 provided close to each other.
[0030]
In addition, although Embodiment 1 of FPC of this invention demonstrated the copper foil removal part circular, other shapes may be sufficient. The present invention includes any arrangement in which the copper foil removal portion is shifted so that it does not overlap between the front surface and the back surface, and the GND copper foil is disposed on at least one of the upper and lower signal copper foils .
[0031]
【The invention's effect】
As described above, according to the FPC of the present invention, it is possible to realize a flexible and highly durable bendability and a reduction in crosstalk and unnecessary radiation even with respect to a bend with a small size, a small winding diameter, and a small angle.
[0032]
In addition, since it can be bent freely, it is possible to save space compared to coaxial cables and shielded wires.
[Brief description of the drawings]
1A is a cross-sectional perspective view of an FPC according to Embodiment 1 of the present invention. FIG. 1B is a plan perspective view of a shield pattern on the front and back surfaces of Embodiment 1 of the FPC according to the present invention. FIG. 3 is a perspective view for explaining an example of the shape of an FPC connected to the circuit in the display unit and the circuit in the display unit. FIG. 3 is a cross-sectional perspective view for explaining the configuration of a conventional FPC.
DESCRIPTION OF SYMBOLS 11 Inner layer 12 Front surface 13 Back surface 14 Copper foil removal part 15 GND copper foil 16 Through hole 17 GND copper foil 18 Signal copper foil 19 GND copper foil 20 Copper foil removal part 21 Through hole

Claims (2)

信号銅箔とその信号銅箔を挟むように配されたGND銅箔を備える内層と、複数個の銅箔除去部分の形成により格子状に形成されたGND銅箔を備えた表面と、複数個の銅箔除去部分の形成により格子状に形成されたGND銅箔を備えた裏面と、前記表面及び裏面の各GND銅箔部に設けた複数個のスルーホールとを備え、
前記内層を前記表面と裏面により挟み、前記表面の各隣接し合う銅箔除去部分の中心点を結ぶ正3角形の中点に前記裏面の銅箔除去部分の中心点をそれぞれ配置することにより、表面の銅箔除去部分と裏面の銅箔除去部分が重複しないように配置して3層に構成し、かつ、前記表面及び裏面の各GND銅箔部に設けたスルーホールによりその各GND銅箔を前記内層のGND銅箔に接続し、該表面と裏面及び内層の各GND銅箔が複数個のスルーホールにより接続された状態においては、前記内層の信号銅箔は当該内層のGND銅箔と前記表面及び裏面の各GND銅箔とスルーホールにより囲まれるように構成したことを特徴とするフレキシブルプリント基板。
An inner layer comprising a signal copper foil and a GND copper foil arranged so as to sandwich the signal copper foil, a surface comprising a GND copper foil formed in a lattice shape by forming a plurality of copper foil removal portions, and a plurality of A back surface provided with a GND copper foil formed in a lattice shape by forming a copper foil removal portion, and a plurality of through holes provided in each of the GND copper foil portions of the front surface and the back surface,
By sandwiching the inner layer between the front surface and the back surface and arranging the center point of the copper foil removed portion on the back surface at the midpoint of a regular triangle connecting the center points of the adjacent copper foil removed portions on the surface, It arranges so that the copper foil removal part on the front surface and the copper foil removal part on the back surface do not overlap, and is configured in three layers, and each GND copper foil by a through hole provided in each GND copper foil part on the front surface and the back surface Is connected to the GND copper foil of the inner layer, and the signal copper foil of the inner layer is connected to the GND copper foil of the inner layer in a state where the GND copper foil of the front surface, the back surface and the inner layer are connected by a plurality of through holes. A flexible printed circuit board configured to be surrounded by GND copper foils and through holes on the front surface and the back surface .
表面及び裏面の各GND銅箔に形成された各銅箔除去部分は円形からなることを特徴とする請求項1に記載のフレキシブルプリント基板。 The flexible printed circuit board according to claim 1, wherein each copper foil removal portion formed on each GND copper foil on the front surface and the back surface has a circular shape .
JP27723598A 1998-09-30 1998-09-30 Flexible printed circuit board Expired - Fee Related JP4265001B2 (en)

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KR101051491B1 (en) * 2009-10-28 2011-07-22 삼성전기주식회사 Manufacturing method of multilayer flexible printed circuit board and multilayer flexible printed circuit board
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JP7126878B2 (en) 2018-06-26 2022-08-29 新光電気工業株式会社 wiring board
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