JP4240555B2 - 樹脂モールド装置 - Google Patents
樹脂モールド装置 Download PDFInfo
- Publication number
- JP4240555B2 JP4240555B2 JP26967797A JP26967797A JP4240555B2 JP 4240555 B2 JP4240555 B2 JP 4240555B2 JP 26967797 A JP26967797 A JP 26967797A JP 26967797 A JP26967797 A JP 26967797A JP 4240555 B2 JP4240555 B2 JP 4240555B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- ejector pin
- ejector
- plate
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 117
- 239000011347 resin Substances 0.000 title claims description 117
- 238000000465 moulding Methods 0.000 title claims description 60
- 238000004891 communication Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 13
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- DSCFFEYYQKSRSV-KLJZZCKASA-N D-pinitol Chemical compound CO[C@@H]1[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@H]1O DSCFFEYYQKSRSV-KLJZZCKASA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26967797A JP4240555B2 (ja) | 1996-10-03 | 1997-10-02 | 樹脂モールド装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-262974 | 1996-10-03 | ||
| JP26297496 | 1996-10-03 | ||
| JP26967797A JP4240555B2 (ja) | 1996-10-03 | 1997-10-02 | 樹脂モールド装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10156898A JPH10156898A (ja) | 1998-06-16 |
| JPH10156898A5 JPH10156898A5 (enrdf_load_stackoverflow) | 2005-06-23 |
| JP4240555B2 true JP4240555B2 (ja) | 2009-03-18 |
Family
ID=26545796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26967797A Expired - Fee Related JP4240555B2 (ja) | 1996-10-03 | 1997-10-02 | 樹脂モールド装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4240555B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5102327B2 (ja) * | 2010-04-23 | 2012-12-19 | 株式会社日本製鋼所 | エジェクタ装置 |
| KR101476309B1 (ko) * | 2013-03-12 | 2014-12-26 | (주)인터메카트로닉스 | 몰드 클로즈 리테이닝 구조 및 몰딩 머신 |
| KR101487870B1 (ko) * | 2013-03-12 | 2015-01-30 | (주)인터메카트로닉스 | 몰딩 머신 |
| CN115871139B (zh) * | 2022-11-16 | 2023-12-01 | 苏州晴森模具有限公司 | 汽车内饰模具自动顶出装置及基于互联网的控制系统 |
-
1997
- 1997-10-02 JP JP26967797A patent/JP4240555B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10156898A (ja) | 1998-06-16 |
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