JP4205664B2 - 脆性材料のスクライブ方法及びスクライブヘッド並びにこのスクライブヘッドを備えたスクライブ装置 - Google Patents

脆性材料のスクライブ方法及びスクライブヘッド並びにこのスクライブヘッドを備えたスクライブ装置 Download PDF

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Publication number
JP4205664B2
JP4205664B2 JP2004522756A JP2004522756A JP4205664B2 JP 4205664 B2 JP4205664 B2 JP 4205664B2 JP 2004522756 A JP2004522756 A JP 2004522756A JP 2004522756 A JP2004522756 A JP 2004522756A JP 4205664 B2 JP4205664 B2 JP 4205664B2
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Japan
Prior art keywords
brittle material
scribing
scribe
cutter
support shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2004522756A
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English (en)
Japanese (ja)
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JPWO2004009311A1 (ja
Inventor
治雄 若山
敏行 酒井
敬子 林
仁孝 西尾
潤一 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of JPWO2004009311A1 publication Critical patent/JPWO2004009311A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2004522756A 2002-07-18 2003-07-17 脆性材料のスクライブ方法及びスクライブヘッド並びにこのスクライブヘッドを備えたスクライブ装置 Expired - Fee Related JP4205664B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002209823 2002-07-18
JP2002209823 2002-07-18
PCT/JP2003/009127 WO2004009311A1 (ja) 2002-07-18 2003-07-17 脆性材料のスクライブ方法及びスクライブヘッド並びにこのスクライブヘッドを備えたスクライブ装置

Publications (2)

Publication Number Publication Date
JPWO2004009311A1 JPWO2004009311A1 (ja) 2005-11-17
JP4205664B2 true JP4205664B2 (ja) 2009-01-07

Family

ID=30767701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004522756A Expired - Fee Related JP4205664B2 (ja) 2002-07-18 2003-07-17 脆性材料のスクライブ方法及びスクライブヘッド並びにこのスクライブヘッドを備えたスクライブ装置

Country Status (6)

Country Link
JP (1) JP4205664B2 (https=)
KR (1) KR100647456B1 (https=)
CN (1) CN1668431B (https=)
AU (1) AU2003281461A1 (https=)
TW (1) TW200403192A (https=)
WO (1) WO2004009311A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017024349A (ja) * 2015-07-27 2017-02-02 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005024497B4 (de) * 2005-05-27 2008-06-19 Schott Ag Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material
KR101272455B1 (ko) * 2005-12-01 2013-06-07 미쓰보시 다이야몬도 고교 가부시키가이샤 팁홀더 교환 방법
US8051681B2 (en) * 2007-05-09 2011-11-08 Corning Incorporated Constant force scoring device and method for using same
CN104149211B (zh) * 2007-06-06 2016-12-07 三星钻石工业株式会社 手动气割切削器用刀片保持器以及具有该刀片保持器的手动气割切削器
JP5450964B2 (ja) * 2008-02-29 2014-03-26 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
KR100941080B1 (ko) * 2008-04-30 2010-02-10 세메스 주식회사 스크라이빙 장치 및 방법과, 이를 이용한 기판 절단 장치
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method
CN107775825A (zh) * 2016-08-30 2018-03-09 三星钻石工业股份有限公司 金刚石刀具及其划线方法
JP2018051945A (ja) * 2016-09-29 2018-04-05 三星ダイヤモンド工業株式会社 ダイヤモンドツール及びそのスクライブ方法
TWI819626B (zh) * 2022-05-25 2023-10-21 矽品精密工業股份有限公司 超音波裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0857846A (ja) * 1994-08-19 1996-03-05 Hitachi Ltd ダイヤモンド・ポイントスクライブ装置
JP4191304B2 (ja) * 1999-03-03 2008-12-03 三星ダイヤモンド工業株式会社 チップホルダー
JP4249373B2 (ja) * 2000-05-16 2009-04-02 三星ダイヤモンド工業株式会社 脆性材料のクロススクライブ方法
TW555706B (en) * 2001-07-18 2003-10-01 Mitsuboshi Diamond Ind Co Ltd Scribe head, scribe apparatus and scribe method using the scribe head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017024349A (ja) * 2015-07-27 2017-02-02 三星ダイヤモンド工業株式会社 脆性材料基板における垂直クラックの形成方法および脆性材料基板の分断方法

Also Published As

Publication number Publication date
WO2004009311A1 (ja) 2004-01-29
TW200403192A (en) 2004-03-01
TWI296612B (https=) 2008-05-11
KR100647456B1 (ko) 2006-11-23
AU2003281461A1 (en) 2004-02-09
CN1668431A (zh) 2005-09-14
JPWO2004009311A1 (ja) 2005-11-17
CN1668431B (zh) 2010-06-09
KR20050013220A (ko) 2005-02-03

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