JP4105900B2 - Stamper manufacturing method - Google Patents

Stamper manufacturing method Download PDF

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Publication number
JP4105900B2
JP4105900B2 JP2002158219A JP2002158219A JP4105900B2 JP 4105900 B2 JP4105900 B2 JP 4105900B2 JP 2002158219 A JP2002158219 A JP 2002158219A JP 2002158219 A JP2002158219 A JP 2002158219A JP 4105900 B2 JP4105900 B2 JP 4105900B2
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Japan
Prior art keywords
stamper
mold
central
glass master
substrate
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JP2002158219A
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JP2004005806A (en
Inventor
一広 小鷹
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株式会社リコー
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632Stampers; Mountings thereof
    • B29C2045/264Holders retaining the inner periphery of the stamper

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for eliminating an adhesion failure at a central portion in an optical information recording medium configured by bonding two molded substrates, and specifically, a mold apparatus, a stamper, and a stamper manufacturing method for manufacturing the molded substrate. The present invention relates to a method, a glass master for manufacturing a stamper, a molded substrate, and an optical information recording medium.
[0002]
[Prior art]
A disc-shaped optical information recording medium such as an optical disk is manufactured by injection molding a resin material using a mold apparatus. The mold apparatus includes a fixed mold and a movable mold, and a stamper for transferring information to a recording surface of an optical information recording medium is disposed in a cavity formed between the two molds. Molding is performed by filling the cavity with molten resin and transferring pits and grooves formed on the stamper surface corresponding to the recorded information to the molten resin side.
By the way, conventionally, an optical information recording medium in which two molded substrates obtained by injection molding are bonded is known. In this type of optical information recording medium, the quality of the bonded state of the central portion is medium. In order to affect the mechanical strength and long-term reliability of the central portion, various considerations have been made to increase the adhesive strength of the central portion when two molded substrates are bonded.
That is, in order to increase the reliability of the optical information recording medium, it is known that a method of bonding from the inner periphery thereof is effective. However, in the conventional mold apparatus, the stamper is mechanically disposed in the cavity. The shape of the member for holding (stamper inner holder) appears as the shape of the molded substrate, and as a result, it is difficult to expand the adhesion region to the innermost peripheral portions of both molded substrates.
8A and 8B are a perspective view and a XX cross-sectional view showing the shape of a conventional stamper, and FIG. 9 is a schematic cross-sectional view of the entire structure of a conventional mold apparatus. 10 is an enlarged schematic view of a central portion showing a state where a molded substrate is formed by the mold apparatus of FIG. 9, and FIG. 11 is an enlarged view of the central portion of an optical information recording medium in which two molded substrates are bonded together ( An unfilled part enlarged view) is shown.
[0003]
The stamper 100 shown in FIG. 8 is a metal disk-shaped transfer mold manufactured by a mastering process using a glass master (not shown), and minute pits and grooves corresponding to recorded information are formed on the surface thereof. ing.
In FIG. 9, reference numeral 120 denotes a fixed base block that supports the fixed mirror block 106, 121 denotes a movable base block that supports the movable mirror block 107, 122 denotes a resin introduction member that supplies molten resin into the cavity 110, and 123 denotes It is a cutting rod for punching out the center part of the shaping | molding board | substrate shape | molded in a cavity.
A mold apparatus 105 shown in FIG. 10 includes a fixed mirror surface block 106 constituting a fixed mold, a movable mirror surface block 107 constituting a movable mold, and a surface recording area 101 on the fixed mirror surface block 106. And a stamper inner holder 107 that is disposed in the central hole 106a of the fixed mirror surface block 106 and that locks the inner peripheral edge of the stamper 100 at the locking portion 107a. Yes. By introducing a molten resin from a molten resin introducing portion (not shown) into a cavity 110 formed between the blocks 106 and 107 and performing molding, the unevenness of the recording area 101 of the stamper 110 is transferred to the molten resin side, One mold substrate 115 is formed by releasing after cooling. At the center of the molded substrate 115, a recess 115a formed corresponding to the locking portion 107a of the stamper inner holder 107 is formed as shown.
FIG. 11 is a cross-sectional view of the central portion of an optical information recording medium 116 formed by bonding the two molded substrates 115 manufactured in this manner with an adhesive 111.
[0004]
In the optical information recording medium 116 obtained by bonding the molded substrate 115 shown in FIG. 10, a space is formed in a portion corresponding to the recess 115a as shown in FIG. Then, an unfilled portion of the adhesive 111 is generated in this space, resulting in a problem that the mechanical strength at the center of the optical information recording medium is lowered and the long-term reliability is lowered.
In order to solve such a problem, various stamper holding methods have been proposed in order to obtain a molded substrate 115 having a completely flat adhesive surface, in other words, a completely flat information recording surface over the entire adhesive surface. Has been.
As such prior art, Japanese Patent Application Laid-Open No. 2000-322781 “Molding apparatus and disk substrate manufacturing method” replaces a method of mechanically holding a stamper inner peripheral portion on one mold using a stamper inner holder. In addition, there is disclosed a method of holding a mold by using vacuum suction or magnetic force, and performing positioning on the mold by a protrusion provided on a surface to which a stamper is attached.
[0005]
FIG. 12 is a schematic cross-sectional view of the overall structure of a mold apparatus that does not use a mechanical holder such as a stamper inner holder, and FIG. 13 is an enlarged schematic view of the central portion thereof.
In FIG. 12, the same parts as those in FIG. The fixed mirror surface block 106 that supports the stamper 100 has a stamper seating surface 106b on the molding surface side, and an annular protrusion 106c for positioning the inner peripheral portion of the stamper is provided on the inner diameter side of the stamper seating surface 106b. ing. Further, a suction hole 106d for introducing a negative pressure and fixing the stamper to the stamper seating surface 106b is formed in the thickness of the fixed mirror surface block 106.
When the molded substrate 115 is formed by injection molding using the mold apparatus having the above configuration, a flat substrate is surely obtained over the entire bonding surface at the substrate shape level, and the two substrates 115 are bonded together. In some cases, it seemed that the adhesion area could be expanded to the inner periphery without any problems. However, when the two substrates 115 thus obtained were actually bonded, various problems such as destabilization of the range of the adhesion region or destabilization of the thickness of the adhesive layer were revealed. .
As a result of investigating the cause of such problems, it has been found that the above-mentioned mold apparatus (mold apparatus for forming a flat substrate) has a fatal problem. That is, as shown in the enlarged view of FIG. 13B, the filling resin enters the clearance 125 that is intentionally formed between the outer periphery of the annular protrusion 106c and the inner diameter portion of the stamper, and the burr 115b is formed. It has occurred. The presence of the burr 115b becomes an obstacle in the bonding between the substrates, causing deterioration of the adhesion quality (FIG. 14).
[0006]
By the way, in the conventional mold apparatus as shown in FIG. 12, the clearance 125 located between the annular protrusion 106c and the stamper portion inner diameter portion is an indispensable component for facilitating the attaching / detaching operation of the stamper. It was. As a general example, when a numerical value is shown, a clearance of about 10 μm is required in order to smoothly attach and detach the stamper. When the clearance below this value is set, there is a slight inclination in the posture of the stamper with respect to the annular protrusion 106c, and a sticking phenomenon due to contact between the stamper and the annular protrusion occurs, commonly referred to as a “cattle” phenomenon. As a result, there is a risk that the stamper will become unremovable.
Furthermore, in the thin substrate 115 manufactured on the premise of bonding with an adhesive, the molding condition is set so that the viscosity of the molten filling resin is low in order to ensure good substrate quality. The molded state was easy to enter the part. From this, it has been found that it is extremely difficult to eliminate burrs with a conventional mold.
[0007]
[Problems to be solved by the invention]
The present invention has been made in view of the above, and when an optical information recording medium is manufactured by laminating two resin-molded substrates molded by injection molding using a mold apparatus, an inner peripheral portion is used. In order to prevent poor adhesion, there is no clearance between the inner periphery of the stamping stamper and the mold, and there is a clearance formed between the stamper inner periphery and the mold for attachment and detachment. It is an object of the present invention to solve the problem that burrs are generated due to this, and that the bonding failure of two molded substrates occurs due to the burrs.
[0008]
[Means for Solving the Problems]
To solve the above problem, The present invention In a mold apparatus for injection molding a molded substrate by filling a molten resin material into a cavity formed between the molding surfaces of two molds, at least for transferring the surface shape to the molded substrate surface A stamper fixed to one mold, wherein the stamper includes a stamper body having a data recording area, and a central member connected to an inner peripheral portion of the stamper body, the central member being And a protrusion that protrudes toward the back surface and that fits into a fitting hole provided in the one mold.
In order to adopt a configuration in which the inner periphery of the stamper is not supported by the stamper inner holder when the doughnut-shaped stamper is supported by the mold, conventionally, the inner periphery of the stamper is supported by the outer periphery of the annular protrusion provided on the inner periphery of the mold. In addition, the stamper is adsorbed and held on the support surface of the mold by negative pressure or the like. For this reason, burrs are generated when the resin enters the clearance between the annular protrusion and the inner periphery of the stamper, and a defective joint occurs when two molded substrates are bonded together by the burrs. In the present invention, the stamper is composed of an annular stamper main body and a central member integrated with the central hole of the stamper main body, and the protruding portion protruding from the back side of the central member is fitted into the fitting hole of the mold. On the other hand, since the stamper surface side is configured so that the surface of the stamper body and the surface of the central member are continuously stepped, the molten resin in the cavity contacts the mold on the stamper side. There was no room for contact and only the surface of the stamper was contacted and the shape was transferred. For this reason, it is possible to manufacture a molded substrate that is not affected by the clearance or the like. Even if the clearance between the protrusion of the center member and the fitting hole of the mold is sufficiently large to ensure sufficient detachability, there is no room for molten resin to enter the clearance. Therefore, even a stamper used in a mold for forming a flat substrate can provide a stamper that does not generate burrs in the inner periphery of the substrate.
The present invention The material of the central member of the stamper is the same as that of the stamper body.
According to the present invention, it is possible to obtain a stamper that is stable in the long term without causing problems such as peeling at the joint surface due to a difference in thermal expansion coefficient.
[0009]
The present invention The central member includes the protrusion and a base that supports the protrusion, and the longitudinal cross-sectional shape of the base is a tapered shape in which the outer diameter gradually decreases from the front side to the back side. It is characterized by being.
According to the present invention, the bonding area between the central member and the stamper main body is greatly expanded, so that the bonding strength is further increased and a stamper with high durability can be obtained.
The present invention The center member is made of a magnetic material.
Since the stamper can be stably supported on the seating surface of the mold without using any special suction means or the like, the working efficiency is improved in the injection molding of the molded substrate by the mold apparatus.
The present invention The manufacturing method related to Said In the stamper manufacturing method for manufacturing a stamper by a mastering process using a glass master, the mastering process corresponds to a step of forming a conductive transfer layer in an annular shape on the glass master surface and a central portion of the conductive transfer layer. Forming a plating layer by performing metal plating in a state where the surface-side flat surface of the central member is placed on the glass substrate surface, and on the surface of the glass master in contact with the surface-side flat surface of the central member Further, an annular recess is provided.
According to the stamper manufacturing method of the present invention, Said A concave portion for filling the adhesive is formed in an annular shape in advance at an appropriate position of the glass master used for manufacturing the stamper, and the surface side flat surface of the central member is stepped on the glass master using the adhesive in the concave. Since the surface contact is made without any problem, it is possible to prevent the occurrence of a shape defect when the central member and the stamper body are integrally formed by forming a plating layer.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described based on the embodiments shown in the drawings.
1A and 1B are a perspective view and a cross-sectional view taken along line AA of a stamper according to an embodiment of the present invention.
This stamper 1 is a mold for injection molding a molding substrate (optical disk substrate) by filling a molten resin material into a cavity formed between molding surfaces of two molds (a fixed mold and a movable mold). In the mold apparatus, it is a disk-shaped (donut-shaped) mold for molding that is fixed to at least one mold in order to transfer the surface shape onto the molding substrate surface, and is usually made of nickel or other metal.
The stamper 1 includes a stamper body 2 having a data recording area 3 on the front surface side, and an annular central member 11 that is connected and fixed to the inner periphery of the stamper body 2.
The material of the stamper main body 2 and the material of the central member 11 may be the same as will be described later. Moreover, you may comprise from a permanent magnet or a magnetic body so that it may mention later.
[0012]
A characteristic configuration of the stamper 1 of this embodiment is that the central member 11 is provided in a base 12 fixed to the inner peripheral portion of the stamper body 2 and a mold that protrudes from the base 12 to the back side and supports the stamper. It is having the projection part 13 fitted to a fitting hole. Accordingly, the surface on the surface side (cavity side) of the base portion 12 is continuously connected to the stamper surface (data recording area 3) in a continuous flat surface shape (stepless shape = no clearance). The back surface side of the base portion 12, that is, the protruding portion 13 protrudes from the back surface of the stamper.
The center member 11 has a taper shape in which the longitudinal cross-sectional shape of the base portion 12 that supports the protruding portion 13 gradually decreases in outer diameter from the front surface side to the back surface side. For this reason, the contact area of the inner peripheral part of the stamper main body 2 and the outer periphery of the central member 11 is large, and a stamper structure excellent in durability and stability that can withstand long-term use can be achieved. In addition, although the base 12 in the illustrated example has a tapered shape in which the outer diameter gradually decreases linearly, it may be configured such that the outer diameter gradually decreases in an R shape.
As will be described later, the metal thin film constituting the conductive transfer layer formed on the glass master is actually attached to the data recording area 3 of the stamper body 2, but it is a thin film of several tens of meters. 1 is omitted in FIG. 1 (shown in FIG. 6C).
[0013]
FIG. 2 is a cross-sectional view showing an outline of a mold apparatus for mounting a stamper according to the present invention, and FIGS. 3A and 3B are cross-sectional views showing a main part of a stamper mounting procedure. In this example, a stamper is mounted on the fixed side.
The mold apparatus 20 includes a fixed mold 21 on the fixed side and a movable mold 41 that operates in the vertical direction. The fixed mold 21 includes a fixed mirror surface block 22 that mounts the stamper 1 on a support surface 22a on the cavity C side, a fixed mold base block 23 that supports the fixed mirror surface block 22, and a resin introduction member 24 that fills the cavity C with molten resin. Etc. Movable The mold 41 includes a movable mirror surface block 42 having a molding surface facing the stamper 1, a movable mold base block 43 that supports the movable mirror surface block 42, and a cutting rod for punching the center portion of the molding substrate molded in the cavity C. 44. A resin introduction space formed between the molding surfaces of the fixed mirror surface block 22 and the movable mirror surface block 42 is a cavity C.
The resin introduction member 24 is positioned and supported by the center hole of the fixed-side base block 23, and its cylindrical discharge end 24 a is positioned in the center hole 11 a of the center member 11 of the stamper 1 and melted in the cavity C. It is comprised so that resin can be supplied. By filling the cavity with the molten resin, the unevenness of the recording area 3 of the stamper 1 is transferred to the molten resin side, and a molded substrate is formed by releasing after cooling.
[0014]
A fitting hole 30 is formed at the center of the annular fixed mirror surface block 22, and the protrusion 13 of the stamper 1 is fitted into the fitting hole 30. The support surface 22a of the fixed mirror block 22 is formed flat so that it can be in surface contact with and supported by the flat lower surface of the stamper 1. When positioning the stamper 1 on the fixed mirror surface block 22, the mounting is completed by guiding the center hole 11a of the center member 11 of the stamper by the outer peripheral surface of the discharge end portion 24a of the resin introduction member 24. After completion of the stamper mounting, molding is started by closing the movable mold 41 on the fixed mold 21 to form a cavity C as a closed space and filling the molten resin from the resin introduction member 24.
In addition, the protrusion 13 to the back side provided in the center part of the fixed mirror surface block 22 of one mold which fixed the stamper for transferring the surface shape onto the molding substrate surface, that is, the fixed mold 21. The structure provided with the fitting hole 30 for fitting and supporting is also one of the features of the mold apparatus of the present invention. By configuring in this way, the conventionally existing clearance is not exposed to the cavity side as will be described later, and there is no room for burr formation.
In this embodiment, as a method for holding the stamper 1 on the fixed mirror block 22 (particularly, the support surface 22a), an adsorption method using magnetic force is employed. Therefore, the central member 11 of the stamper and the stamper body 2 are made of a permanent magnet or a magnetic material, and at least a part of the fixed mirror surface block 22 is made of a magnetic material or a permanent magnet. Thus, by holding the stamper 1 by the magnetic force by the fixed mirror surface block 22, the work efficiency of attaching / detaching the stamper can be improved.
[0015]
FIG. 4 is a cross-sectional view of the central portion of an optical information recording medium 50 formed by laminating a molded substrate 51 formed by a mold apparatus according to an embodiment of the present invention with two adhesives 52.
As is apparent from FIGS. 2 and 3, the lower surface of the cavity C (the molding surface on the fixed mold side) that determines the shape of the molded substrate is completely flat except for the stamper center hole due to the presence of the stamper 11. It becomes. Further, the clearance between the mold body and the stamper existing in the conventional mold for forming a flat substrate no longer exists on the cavity surface. That is, in the conventional mold apparatus, as shown in FIG. 12, the inner peripheral portion of the fixed mirror surface block 106 is provided with an annular projection 106c projecting to the surface side, and this annular projection 106c is provided at the inner periphery of the stamper central hole. And the resin introduction member 122, the molten resin entered the clearance between the outer periphery of the annular projection 106c and the stamper center hole, forming a burr. However, in the present invention, the fitting hole 30 of the fixed mirror block 22 is formed to have a larger diameter than the conventional one, and no projection such as an annular projection is provided, and the projection of the central member 11 of the stamper is provided in the fitting hole 30. 13 was fitted through a sufficient gap S. Therefore, the upper surface (molding surface) of the fixed mirror member 22 is concealed by the stamper 1 over the entire surface, and the upper surface of the fixed mirror member 22 is not exposed at all in the cavity C. On the other hand, the resin introduction member 24 is fitted into the center hole 11a of the center member 11 integrated with the center portion of the stamper body 2, and the molten resin is discharged from the center portion of the stamper into the cavity.
Thus, according to the mold apparatus and the stamper of the present embodiment, there is room for a clearance to be formed between the inner periphery of the stamper center hole and a part of the fixed mirror surface block 22 (the annular protrusion 106c). Since it has disappeared, no burr is formed. In addition, since a gap S sufficient for attaching / detaching the stamper can be secured between the inner wall of the fitting hole 30 of the fixed mirror surface block 22 and the outer periphery of the protrusion 13 fitted therein, there is a problem in attaching / detaching. There is nothing.
In addition, when the material of the central member 11 and the stamper body 2 is the same, even when the temperature is affected in actual molding, the members 11 and 2 do not exhibit different behaviors. It could be handled in the same way as a stamper.
As described above, the molded substrate 51 formed by the mold apparatus 20 according to the present embodiment has no burrs at the central part of the substrate, which is a problem in the conventional mold apparatus. Therefore, as shown in FIG. 4, it is possible to manufacture a good bonded medium (optical information recording medium) 50 in which the adhesive layer (adhesive) 52 spreads to the vicinity of the inner peripheral portion of the molded substrate 51.
[0016]
Next, the manufacturing process of the stamper of the present invention using the mastering process will be described with reference to the process explanatory diagrams shown in FIGS.
In order to manufacture the stamper 1 of the present invention, a glass master 60 having a shape different from the conventional one is used (FIG. 5A). That is, this glass master 60 is characterized in that it has a configuration in which an annular recess 61 having a uniform groove width is formed concentrically at the center of the surface of the disk-shaped glass master body 61. The annular recess 61 is formed by applying a mask on the glass master surface and removing only a portion corresponding to the annular recess 61 into a required shape by etching. For convenience of explanation, the height of the upper surface of the inner diameter side portion 61a and the upper surface of the outer diameter side portion 61b with the annular recess 61 as a boundary is slightly smaller in the inner diameter side portion 61a (the thickness of the conductive transfer layer 65). However, this is only a step for exaggerating the thickness of the conductive transfer layer 65 in the description, and the thickness of the conductive transfer layer 65 is actually about several inches. Therefore, the heights of the upper surfaces of the inner diameter side portion 61a and the outer diameter side portion 61b are substantially equal.
[0017]
The central member 11 having the protruding portion 13 which is a feature of the stamper 1 of the present invention manufactured by the mastering process using the glass master 60 is formed in a plating layer forming step performed to constitute the stamper. Instead, it is formed by the procedure of integrally forming the plating layer on the central member 11 prepared in advance as a separate member.
That is, in the present invention, the central member 11 is manufactured in a separate process in advance, and the mastering process (exposure, development, etc.) is completed and bonded before or after the conductive film is formed on the glass master.
In the mastering process, first, a photo resist film that has been applied to the surface of the glass master 60 with a uniform thickness is exposed and developed using a mask having minute holes arranged corresponding to the recorded information, thereby developing the developed photo A recording information portion composed of fine irregularities is formed on the resist film. Next, a conductive film made of an ultrathin conductive material is formed on the photoresist film including the recording information portion by sputtering or the like to form a conductive transfer layer 65 (information forming layer + conductive film). This conductive film is a thin film that does not affect the shape even if it is applied along a fine uneven surface. Next, metal stamping is performed on the conductive transfer layer 65 in a state where the surface side flat surface of the base portion 12 of the central member 11 is placed on the central portion of the conductive transfer layer 65 on the glass master 60.
[0018]
A characteristic configuration of the glass master 60 of the present invention is that an annular recess 62 is formed at the center of the disk surface. However, the glass master without the annular recess 62 has a projection as shown in FIG. Problems in manufacturing the stamper will be described with reference to FIG. That is, first, as shown in FIG. 7A, in a state where a doughnut-shaped conductive transfer layer 65 (information forming layer + conductive film) is formed on the flat surface of the glass master 60, the glass exposed at the center thereof is exposed. The surface side flat surface of the central member 11 is brought into contact with the original disk surface via the conductive adhesive 70 and positioned. When the electroforming is performed in this state, the plating layer 71 is formed on the conductive transfer layer 65 and the plating layer 71 is integrated with the central member 11 as shown in FIG. Thereafter, the plating layer 71 and the central member 11 are peeled off from the glass master together with the metal thin film constituting the conductive transfer layer 65 as shown in FIG. (D) shows a stamper as a finished product.
In this step, as is clear from FIG. 7B, the central member 11 is supported by the thickness of the adhesive 70 in a state of being lifted from the master surface, so that the flat surface of the central member 11 and the glass master surface Could not be adhered, and an unnecessary step was generated on the transfer target surface side of the stamper. When a molded substrate is molded by a mold apparatus using a stamper having such a level difference, as shown in FIG. 4, it is impossible to obtain a molded substrate 51 having a flat central bonding surface. Obviously.
Such a problem can be eliminated by using the glass master 60 of the present invention having the annular recess 62 at the center of the board surface.
[0019]
Next, the stamper manufacturing process after the conductive transfer layer 65 is formed on the glass master disk of the present invention will be described in more detail with reference to FIGS.
In the present embodiment, the problem of the floating of the central member 11 due to the presence of the adhesive described in FIG. 7 is that the conductive material is in the annular recess 62 provided on the surface of the master as shown in FIGS. This is solved by filling the adhesive 70 in an appropriate amount so that the adhesive 70 does not protrude from the surface of the conductive transfer layer 65. That is, as described above, for convenience of explanation, the upper surface of the inner diameter side portion 61a is shown to be higher than the upper surface of the outer diameter side portion 61b by an amount corresponding to the thickness of the conductive transfer layer 65. When the conductive transfer layer 65 is formed on the outer diameter side portion 61b of the stamper, the upper surface of the conductive transfer layer 65 and the upper surface of the inner diameter side portion 61a are located on the same plane (FIG. 5B). ). Actually, since the thickness of the conductive transfer layer 65 is negligibly thin, such a step does not exist on the glass master, and between the upper surface of the inner diameter side portion 61 a and the upper surface of the conductive transfer layer 65. There are almost no steps. Accordingly, the flat surface of the central member 11 can be in close contact with the upper surfaces of the inner diameter side portion 61a and the outer diameter side portion 61b (conductive transfer layer 65). That is, by filling the annular recess 62 with the conductive adhesive 70 and bringing the flat surface of the base 12 of the central member 11 into contact with the central portion of the glass master as shown in FIG. Fixing by the adhesive 70 is completed in a state of being in close contact with the glass master upper surfaces 61a and 61b (65).
[0020]
Next, the electroforming procedure will be described with reference to FIG. 6. In the state where the central member 11 is fixed on the glass master 60 as shown in FIG. 5C, it is put into an electroforming tank (not shown) and electroforming is started. The FIG. 6A shows a state in which electroforming is completed when the formation of the sufficiently thick plating layer 75 is completed, and the tapered outer peripheral surface of the base portion 12 of the center member 11 from the surface of the conductive transfer layer 65. As a result, a plated layer 75 having a uniform thickness made of metal is formed. The plated layer 75 is a portion that becomes the stamper body 2 by transferring the uneven shape on the conductive transfer layer 65. Further, as described above, the conductive transfer film 65 has a configuration in which the metal thin film 65a is laminated on the photoresist layer on the glass master, but when the plating layer 75 is formed, the unevenness of the metal thin film 65a is formed. It is integrated with the plating layer 75 in a state where the metal is filled in the part.
6B, when the stamper is peeled off from the surface of the glass master 60, the metal thin film 65a, the plating layer 75, and the central member 11 constituting the conductive transfer layer 65 are integrated. As a result, the stamper 1 is completed as shown in FIG. The photoresist layer from which the metal thin film 65a has been peeled remains on the glass master after peeling.
In the electroforming process shown in FIG. 6, since the shape of the base 12 of the center member 11 is a taper shape having a large diameter on the surface side, the bonding strength between the plating layer 75 serving as the stamper body 2 and the center member 11 Will increase dramatically. Due to this effect, the stamper structure can withstand long-term use.
The finished product of the stamper 1 shown in FIG. 6C is different from the finished product shown in FIG. 1 in that the conductive transfer layer 65 is shown for convenience of explanation, and the flat surfaces of the conductive transfer layer 65 and the central member 11 are shown. However, since the thickness of the conductive transfer layer 65 is actually thin enough to be ignored, this step can be practically treated as 0 (zero).
The stamper of the present invention is completed through the above steps.
In addition, the optical information recording manufactured by bonding the shaping | molding board | substrate 51 manufactured by the metal mold | die apparatus 20 using the stamper 1 demonstrated in each said embodiment, and the glass master 60, and the two shaping | molding board | substrates 51 are bonded together. Each medium (optical disk) belongs to the technical scope of the present invention.
[0021]
【The invention's effect】
As described above, according to the present invention, when an optical information recording medium is manufactured by laminating two resin-molded substrates molded by injection molding using a mold apparatus, an adhesion failure occurs in the inner peripheral portion. In order to prevent this, even if it is configured so that there is no step between the inner periphery of the molding stamper and the mold, it is caused by the clearance formed for detachment between the inner periphery of the stamper and the mold. Thus, it is possible to solve the problem that a burr is generated, and the burr causes a bonding failure between two molded substrates.
That is, The present invention In the above, the central member connected to the inner peripheral portion of the stamper main body is provided with a protruding portion that protrudes to the back surface side and fits into a fitting hole provided in one mold. For this reason, it is possible to manufacture a molded substrate that is not affected by the clearance or the like. Even if the clearance between the protrusion of the center member and the fitting hole of the mold is sufficiently large to ensure sufficient detachability, there is no room for molten resin to enter the clearance. Therefore, even a stamper used in a mold for forming a flat substrate can provide a stamper that does not generate burrs in the inner periphery of the substrate.
The present invention According to the above, it is possible to obtain a stamper that is stable in the long term without causing problems such as peeling at the joint surface due to a difference in thermal expansion coefficient.
The present invention According to the present invention, the shape of the central member provided in the central portion of the stamper body is tapered so that the transfer target surface side is on the large diameter side, so that even the mold and stamper have excellent long-term stability. The structure is obtained. That is, since the bonding area between the central member and the stamper body is greatly expanded, the bonding strength is further increased and a stamper with high durability can be obtained.
[0022]
The present invention Accordingly, the stamper can be stably supported on the seating surface of the mold without using special suction means or the like, so that the working efficiency is improved in the injection molding of the molded substrate by the mold apparatus.
The present invention According to the manufacturing method according to Said A concave portion for filling the adhesive is formed in an annular shape in advance at an appropriate position of the glass master used for manufacturing the stamper, and the surface side flat surface of the central member is stepped on the glass master using the adhesive in the concave. Since the surface contact is made without any problem, it is possible to prevent the occurrence of a shape defect when the central member and the stamper body are integrally formed by forming a plating layer.
[Brief description of the drawings]
1A and 1B are a perspective view and a cross-sectional view taken along line AA of a stamper according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing an outline of a mold apparatus on which a stamper according to the present invention is mounted.
FIGS. 3A and 3B are main part cross-sectional views showing a stamper mounting procedure; FIGS.
FIG. 4 is a central cross-sectional view of an optical information recording medium formed by bonding two molded substrates formed by a mold apparatus according to an embodiment of the present invention with an adhesive.
FIGS. 5A to 5C are diagrams illustrating a manufacturing procedure of a stamper according to an embodiment of the present invention.
FIGS. 6A to 6C are diagrams illustrating a manufacturing procedure of a stamper according to an embodiment of the present invention.
FIGS. 7A to 7D are diagrams illustrating a manufacturing procedure of a stamper having a problem.
FIGS. 8A and 8B are diagrams illustrating the configuration of a conventional stamper.
FIG. 9 is a cross-sectional view showing a configuration of a mold apparatus that performs injection molding using a conventional stamper.
10 is a view for explaining a defect of the mold apparatus of FIG. 9;
FIG. 11 is a cross-sectional view of a main part of an optical information recording medium on which a molded substrate is bonded.
FIG. 12 is a cross-sectional view of another conventional mold apparatus.
13A and 13B are cross-sectional views of the main part of the mold apparatus of FIG.
14 is a view for explaining a defect of a molded substrate obtained by the mold apparatus of FIG. 12;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Stamper, 2 Stamper main body, 3 Data recording area, 11 Center member, 11a Center hole, 12 Base part, 13 Protrusion part, 20 Mold apparatus, 21 Fixed mold, 22 Fixed mirror surface block, 22a Support surface, 23 Fixed side base Block, 24 Resin introduction member, 30 Fitting hole, 41 Movable mold, 42 Movable mirror block, 43 Movable base block, 44 Cutting rod, C cavity, 50 Optical information recording medium, 51 Molded substrate, 52 Adhesive, 60 Glass master disc, 61 annular recess, 61a inner diameter side portion, 61b outer diameter side portion, 65 conductive transfer layer

Claims (3)

  1. In a mold apparatus for injection molding a molded substrate by filling a molten resin material into a cavity formed between the molding surfaces of two molds, at least one of the surface shapes is transferred to the molded substrate surface. a stamper is fixed to the mold, comprising: a stamper body having a data recording area, and a central member that is integrated and is provided continuously to the inner peripheral portion of the stamper body, the said central member It has a projection portion for fitting hole and the fitting provided on the projecting and the one mold to the back side, mastering process the material of the central member the stamper was the stamper body of the same material, using the glass master In the manufacturing method of the stamper manufactured by
    The mastering process includes a step of forming a conductive transfer layer in a ring shape on the glass master surface, and a state in which the surface side flat surface of the central member is placed on the glass substrate surface corresponding to the central portion of the conductive transfer layer And forming a plating layer by performing metal plating with,
    A stamper manufacturing method, wherein an annular recess is provided on a surface of a glass master in contact with a surface-side flat surface of the central member.
  2. The central member includes the protruding portion and a base portion that supports the protruding portion, and the vertical cross-sectional shape of the base portion is a tapered shape in which the outer diameter gradually decreases from the front surface side to the back surface side. The method for manufacturing a stamper according to claim 1.
  3. 3. The stamper manufacturing method according to claim 1, wherein the central member is made of a magnetic material.
JP2002158219A 2002-05-30 2002-05-30 Stamper manufacturing method Expired - Fee Related JP4105900B2 (en)

Priority Applications (1)

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JP2002158219A JP4105900B2 (en) 2002-05-30 2002-05-30 Stamper manufacturing method

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Application Number Priority Date Filing Date Title
JP2002158219A JP4105900B2 (en) 2002-05-30 2002-05-30 Stamper manufacturing method

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JP4105900B2 true JP4105900B2 (en) 2008-06-25

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Publication number Priority date Publication date Assignee Title
JP4929262B2 (en) * 2008-09-29 2012-05-09 株式会社東芝 Manufacturing method of replication stamper

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