JP3969920B2 - Component mounting circuit formed body and method for recycling electrical product including the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting circuit formed body excellent in recycling efficiency, an electric product including the component mounting circuit forming body, and a method for recycling those wastes.
[0002]
[Prior art]
Usually, a large amount of lead is contained in a solder material used in a process of mounting a component such as an optical component and an electronic component on an article such as a casing on which a printed circuit board, a film substrate, and a circuit are formed.
Therefore, if a printed circuit board on which components are mounted using a solder material and an electrical product equipped with the printed circuit board are left outdoors as waste after use and left open, or crushed and landfilled, they will melt from the waste. There is a risk of contamination of groundwater by lead contained in the solder.
When this contaminated groundwater is used for drinking water, it has a negative effect on the human body, and in recent years, disposal methods for waste electrical products have become a major problem.
Conventionally, in order to prevent such contamination by lead, when disposing and recycling an electric product, the product is first disassembled, a circuit formed body such as a printed circuit board is taken out, and lead-containing solder is separated and collected. After that, the parts other than lead-containing solder are crushed, the materials are sorted, and landfilled in a management-type treatment plant designed to prevent leakage of contaminated water.
[0003]
In order to prevent environmental pollution due to lead as described above, it is also requested to completely recycle lead or stop using lead.
In order to realize a recycling-oriented economic society, it is scheduled that manufacturers will be required to collect and recycle used home appliances in 2001.
At present, as shown in FIG. 4, a circuit formed body using lead-containing solder and an electric product (hereinafter simply referred to as “lead-containing product”) using the solder and lead-free solder are used. When printed circuit board mounted products and electrical products incorporating the same (hereinafter simply referred to as “lead-free products”) are manufactured and sold, they are mixed in the market and recovered as they are. The collected product is used for a management-type treatment plant, a stable treatment plant, or recycling. Note that the printed circuit board and the film substrate are built in the electrical product.
In the management processing plant, the collected product is landed unprocessed, whereas in the stable processing plant, the collected product is landfilled to prevent scattering and outflow of the collected product.
[0004]
On the other hand, in the case of recycling, the collected product is disassembled, lead is separated and recovered and rendered harmless, and then the material is selected and recycled.
The method of landfilling mixed lead-containing and lead-free product waste in a management-type treatment plant is simple, but has a problem of high processing costs because the construction cost of the management-type treatment plant is high.
In addition, the method of landfilling without recycling the material has a problem in terms of effective use of resources. Furthermore, there is a problem that the treatment plant itself is becoming saturated with waste products.
In addition, it is not easy to separate and collect solder from waste products that contain both lead-containing products and lead-free products, and it is not easy to separate them, requiring capital investment and work processes for that. Therefore, the processing cost becomes high.
However, if only a lead-free product can be taken out of the mixed waste products, the lead-free product can be buried in a stable treatment plant with a low construction cost simply by crushing the lead-free product. Therefore, if the lead-free product and the lead-containing product can be easily selected from the collected waste products, the processing cost can be suppressed.
However, at present, it is very inefficient to sort the collected waste products into lead-free products and lead-containing products. Therefore, there is a demand for simple identification means between lead-free products and lead-containing products.
[0005]
[Problems to be solved by the invention]
An object of this invention is to provide the printed circuit board mounting goods which can identify easily whether it is lead free or containing lead, and an electric product including the same in view of the said problem.
Another object of the present invention is to provide a method for recycling these products.
[0006]
[Means for Solving the Problems]
Book The invention has a barcode or IC including identification information indicating that the component is mounted by a solder material not containing lead and does not contain lead, and the barcode or IC includes a kind and a mixing ratio of the solder material, The present invention relates to a component mounting circuit forming body including information on a component to be mounted and a material of the component circuit forming body.
[0007]
Book The present invention is an electrical product including a component mounting circuit formed body in which components are mounted by a solder material not containing lead and / or a housing including the component mounting circuit forming body, and the component mounting circuit forming body and / or Alternatively, the casing has a bar code or an IC including identification information indicating that it does not contain lead, and the bar code or the IC includes a solder material type and a mixing ratio, a component to be mounted, and a component mounting circuit formation. The present invention relates to an electrical product characterized in that it includes information on the material of the body.
Further, the present invention is a method for recycling waste including the component mounting circuit formed body, wherein the waste of the component mounting circuit forming body that does not contain lead is identified from the waste of the component mounting circuit formed body by the identification information. It is related with the recycling method of the waste characterized by including the process to carry out.
In this case, it is preferable to further include a step of separately separating the component mounting circuit formed body containing lead and the component mounting circuit forming body not containing lead, and treating the waste of the component mounting circuit forming body.
[0008]
The present invention is also a method for recycling waste containing the electrical product, wherein the electrical product waste containing no lead is identified from the electrical product waste by the identification information. Also related to recycling methods.
Furthermore, the present invention is a method for recycling waste containing the electrical product,
Identification provided in the component mounting circuit forming body information By separating the lead-free component mounting circuit formed body and the lead-containing component mounting circuit formed body,
The separated component mounting circuit formed bodies are separately collected, crushed and melted,
Sort the materials that make up the component mounting circuit forming body,
Recycle recyclable valuables from the materials,
There is also provided a method for recycling electrical product waste, characterized in that the component-mounted circuit-formed body after processing is shredded and disposed of by embedment or disposed of in a stable processing plant or a management processing plant.
In such a method, before separating the component mounting circuit formed bodies, the collected waste is classified for each type of electrical product,
Identification provided on each electrical product information To identify the presence or absence of lead, and separate lead-free and lead-containing products,
It is preferable to include a step of disassembling each electric product and taking out the component mounting circuit formed body.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
As described above, the present invention provides a circuit forming body such as a circuit board such as a printed board and a film board on which components are mounted using a lead-free solder material, an article such as a casing (frame) on which a circuit is formed, It is characterized in that identification information indicating that lead is not used is provided in a casing of an electrical product including a circuit formed body.
In this specification, the “component mounting circuit formed body” includes articles such as a printed circuit board, a circuit board such as a film board, and a housing (frame) in which a circuit is formed, on which a component is mounted using a lead-free solder material. It is a concept. Hereinafter, it is simply referred to as “circuit formed body”.
In the following, an embodiment of the present invention will be described by using an identification mark as a representative.
[0010]
With this identification mark, as shown in FIG. 5, waste products collected in a mixed state in the market can be easily sorted into lead-free products and lead-containing products.
Lead-free products have a very low content of lead harmful to the human body, and even if landfilled as it is, there is little effect on the human body. Therefore, lead-free products can be recycled by crushing and selecting raw materials without separating and collecting solder, and materials that cannot be recycled can be buried in inexpensive stable processing plants. .
Moreover, it is only necessary to carry out the detoxification treatment that decomposes and separates and removes lead. Furthermore, it is possible to reduce waste products that are landfilled in a management-type treatment plant that has a high treatment cost.
Thus, according to the present invention, it is possible to reduce the recycling cost and processing cost of the waste product.
[0011]
In addition, it is preferable that the component mounted in circuit formation bodies, such as a printed circuit board, is a lead-free electrode by which the electrode is coat | covered with the lead-free solder. This is because the lead contained in the circuit formed body can be reduced, the bonding strength between the electrode and the lead-free solder material can be improved, and the life of the product can be extended.
In addition, if the component to be mounted on the printed circuit board is a component constructed by soldering an IC chip or a capacitor to the substrate, such as a hybrid IC, the lead-free solder material for joining the IC chip or the like is also used. When a solder material is used, the circuit formed body can be completely lead-free. Such a lead-free component may be attached with an identification mark which is identification information similar to the above. In addition, examples of components mounted on the printed circuit board include semiconductors, resistors, capacitors, coils, switches, LEDs, oscillators, connectors, liquid crystal panels, and transformers.
[0012]
The method of attaching the identification mark is not particularly limited as long as it can be attached to a printed circuit board or a housing and can provide an identification mark that can be recognized without lapse of time. It is effective to use a label. Specifically, it may be appropriately selected depending on the material of the portion to which the identification mark is attached.
Here, the printed circuit board is made of, for example, a resin such as a phenol resin, an epoxy resin, a polyimide resin, or a polyester resin, a metal such as iron, copper, or an aluminum alloy, a ceramic such as alumina or glass, or a material such as paper. May contain glass cloth.
The casing is made of a material such as a metal such as iron, aluminum, or magnesium alloy, a resin such as polypropylene, polystyrene, ABS resin, or polycarbonate, ceramic, or wood.
[0013]
As printing, for example, painting, stamping, ink jet, or the like can be used. These are preferable because they can be integrated with a conventional marking process such as printing of a production number or appearance design printing. In particular, the print coating integrated with the external appearance design of the housing is preferable because it is difficult to disappear.
In addition, a fluorescent paint or the like is preferably used for the ink because a large amount of waste products can be easily and quickly identified using an optical sensor or the like.
The stamping can be performed simultaneously with the product design when the product casing is molded, or can be stamped in the final process. The stamp is suitable because it does not require a complicated process and is difficult to disappear.
The label is preferable in that it is easy to unify the identification mark among various electric products and manufacturers, and the identification in the recycling work process becomes easier.
[0014]
Note that the identification mark attached to the electrical product may be attached to either the printed circuit board mounting product or the housing, but at least the housing is not required to disassemble the product in a later process. It is convenient to attach an identification mark to the body.
Next, the present invention is a recycling method for the waste of the circuit forming body, including a step of identifying the lead-free circuit forming body by the identification mark from the waste of the circuit forming body, and There is also provided a recycling method of the electrical product waste, the method comprising a step of identifying electrical products not containing lead from the electrical product waste by the identification information.
In the following, the present invention will be described as a representative case where an identification mark having identification information is used.
[0015]
When recycling the circuit formed body with the identification mark as described above and the waste of electrical products containing it, remove only lead-free products from the mixed waste of lead-containing products and lead-free products. Can be identified and sorted.
Thus, sorting waste products with identification marks is preferable because the recycling work can be performed quickly.
Further, if only lead-free products can be selected by the identification mark attached to the casing of the electrical product, the subsequent disassembly process can be omitted.
In order to sort out the waste products, humans judge from the identification marks and divide them manually, or transport the waste products on a belt conveyor and use a sensor that can recognize the identification marks, such as a recognition camera. There are methods, such as dividing more.
[0016]
Here, as a method of the identification mark, the following methods can be mentioned.
(1) A method of attaching an identification label to a substrate
FIG. 6 is a top view of the substrate showing the identification label 10 attached to the substrate 11.
Place an identification label on the board or in the empty space between large parts on the board. When a fluorescent printing ink is used as the label printing ink, the presence or absence of the label can be easily automatically determined by combining the dark room and the recognition camera in the recycling process.
For example, by identifying the type of solder material such as Sn—Ag, Sn—Ag—Bi, Sn—Cu, or Sn—Zn on the identification label, the identification of the substrate using the lead-containing solder material, etc. In addition, the board can be identified and sorted for each type of solder material. By processing the substrate for each type of solder material in the solder material recovery process, the purity of the recovered solder material is increased, and valuable materials with high added value can be recovered. It is also effective to change the color of the identification label depending on the type of solder material.
If a color identification mark is provided, the type of solder material used can be classified. In addition, when waste products are collected and smelted for recycling, the metal materials to be used are classified in advance, so that the metal can be reused by highly precise smelting. This is because if a substrate containing various solder materials is refined at the same time, refined products containing various components are produced and are difficult to reuse. In addition, although the identification mark by a color was demonstrated here, symbols, such as (circle) and x, may be attached | subjected.
In this way, by configuring the identification mark with characters, colors, and symbols, it becomes possible to recycle the waste product with high accuracy in a short time, and the recycling efficiency is improved.
[0017]
(2) Method of printing on the substrate
FIG. 7 is a top view of the substrate showing a state in which the identification mark 13 is printed on the substrate using an inkjet, a stamp, or the like. As shown in FIG. 7, when ink jet is used, printing can be performed from above the component 12 on the substrate.
When inkjet is used, there are few restrictions such as the shape of the substrate and the arrangement of parts, and the type of characters can be freely selected. Therefore, as in the case of using the identification label as described above (1), the solder material An identification mark that can identify the type of the image can be printed.
Moreover, when using a stamp, it can print at low cost compared with the case where an inkjet is used.
Similarly to the above (1), when a fluorescent type ink is used, the presence or absence of a label can be easily automatically determined by combining a dark room and a recognition camera in the recycling process.
[0018]
(3) A method of printing an identification mark at the manufacturing stage of the substrate
This method has the advantage of reducing the cost because the marking process of component display in the normal substrate manufacturing process can be used as it is without a new process using an apparatus for providing an identification mark.
FIG. 8 is a top view of the substrate showing the identification mark 13 printed on the substrate itself. Since printing is performed on the substrate itself, a large identification mark that extends over the entire substrate can be printed regardless of the position of the component. This facilitates identification in the recycling process.
[0019]
(4) Method of changing the color of the substrate
Usually, the color of the substrate is green, which is the color of the resist for solder material. In the present invention, for example, a color other than green, such as blue, red, and black, is used for the resist, thereby facilitating identification in the recycling process. Since normal substrates and resists contain halogen-based elements that are environmentally hazardous substances, they become sources for generating dioxins by incineration. Accordingly, there is an urgent need for practical use of a substrate that does not contain a halogen element (halogen-free substrate). Since a green pigment of a normal resist for solder material contains a halogen-based element, it has been studied to use another color such as blue when changing to a halogen-free substrate.
Thus, by using a lead-free solder material and a halogen-free substrate in combination, it can be identified at a glance that it is an environmentally friendly substrate and can be subjected to a separation process.
[0020]
(5) A method of attaching a copper foil without letters
This method is similar to the method using the identification label described above, but uses a copper foil with characters removed in the substrate manufacturing process as an identification mark. This method is low in cost because it can be carried out in a normal substrate manufacturing process without providing a new marking facility for arranging the identification mark.
Here, FIG. 9 is a top view of the substrate 11 showing a state in which the copper foil 14 with characters omitted is attached.
[0021]
(6) Method of providing an identification barcode
In this method, a barcode label is affixed to the substrate or casing as an identification mark, or the barcode is printed directly on the substrate or casing. According to this method, it is possible to easily automatically determine whether or not the lead is free using a barcode reader. In addition, the amount of information can be increased as compared with the method of identifying by characters or colors.
In particular, when using a control system that controls the identification work of circuit formations and electrical products, a database can be provided in the control system and collation with the barcode number can be performed. If a two-dimensional bar code is used, the amount of information stored in the bar code itself can be increased, and more information can be managed.
[0022]
If the amount of information can be increased, detailed information such as the material of the casing, the material of the substrate, and the material of the mounted component can be processed in addition to the composition of the solder material and the blending ratio. If detailed information can be managed in this way, in the recycling process, not only the presence or absence of lead in the waste product but also the treatment method can be selected according to the type of harmful substances contained in the parts. That is, environmental pollution caused without knowing the presence of harmful substances can be prevented.
In addition, valuable materials such as precious metals contained in waste products can be collected without missing, or waste products can be separated according to the type of plastic used in the housing, etc., thereby increasing the value of recycled materials. While increasing, it also contributes to the improvement of the recycling rate.
Here, FIG. 10 shows a state in which the barcode 15 is provided on the housing 16 of the product including the substrate 11 including various components. FIG. 11 shows a state in which the barcode 15 is provided on the substrate 11 itself.
[0023]
(7) When using an identification IC
In this method, a non-contact reading type IC is attached to the circuit forming body as an identification mark. According to this method, it is possible to identify a lead-containing product simply by passing it in the vicinity of the data reader. Therefore, there are few restrictions on the attaching position, and it can be used for identification on either the substrate or the housing of the product. IC can be attached. That is, recycling management of the circuit formed body and the electric product including the circuit forming body is facilitated, and highly efficient recycling is possible in a short time. Further, compared to an optical reading method using a bar code or the like, it is not affected by dirt, so that the reliability of the identification process is excellent.
Further, the identification IC can be additionally provided when a component is mounted on the board, and there is an advantage that it does not have to be retrofitted like a barcode. For example, if it is RAM, it can be reused.
[0024]
In addition, the IC can store more information. If the amount of information can be increased, detailed information such as the material of the casing, the material of the substrate, and the material of the mounted component can be processed in addition to the composition of the solder material and the blending ratio. When detailed information can be managed in this way, in the circuit forming body recycling process, not only the presence / absence of lead but also the treatment method can be selected according to the type of harmful substance contained in the component. That is, environmental pollution caused without knowing the presence of harmful substances can be prevented.
In addition, valuable materials such as precious metals contained in circuit formed bodies are collected without missing, or recycled by sorting the circuit formed bodies according to the type of plastic used for the housing. In addition to increasing the value of materials, it also contributes to improving the recycling rate.
[0025]
FIG. 12 is a schematic diagram showing a state in which the identification IC 17 is attached to the housing 16 of the product including the substrate 11 on which various components are mounted. FIG. 13 is a top view of the substrate 11 showing a state in which the identification IC 17 is attached to the substrate 11 itself on which various components are mounted.
The recycling of the waste of the electric product including the circuit forming body of the present invention as described above is excellent in the following points. In other words, the circuit formed body can be recycled in a series of systems until the final processing, and the proper casing processing, substrate processing, circuit forming body processing, etc. can be performed by identification information such as barcodes and ICs. It becomes possible. For example, it is possible to reuse expensive ICs or extract materials (such as palladium) included in the plating of electrodes of various parts from the molten solder material.
The electrical products include, for example, home appliances such as AV equipment, refrigerators, air conditioners, washing machines, and lighting equipment, information-related OA equipment such as computers, telephones, copiers, and facsimile machines, automotive electrical equipment, and industrial machinery electrical equipment. Products, plant equipment electrical components, architectural electrical components and the like.
[0026]
Here, FIG. 14 shows a flowchart of an example of the circuit forming body and / or the recycling method of the electric product of the present invention. The recycling method according to the present invention will be described below along this flowchart.
The electrical product waste is collected (s-1), and the waste for each type of electrical product is classified (s-2). The subsequent steps are the same for each product, but in the following, a television which is one of the electrical products will be described.
The presence or absence of lead is identified by a product identification mark provided on the electrical product, and a lead-free product and a lead-containing product are classified (s-3).
Then, each product is disassembled and the printed board is taken out (s-4). At the time of this decomposition, it is preferable to separate and take out metal, glass, plastic, and the like constituting the electric product.
Next, since a substrate using a lead-free solder material may be used for the lead-containing product, the lead-free substrate and the lead-containing substrate are separated by the substrate identification mark provided on the printed circuit board (s). -5).
Next, the lead-containing substrate and the lead-free substrate are separately separated and recovered (s-6), crushed and melted (s-7), and then the materials are separated (s-8).
Recyclable valuables such as gold are reused (s-9), and lead-free or lead-containing substrates after processing are individually shredded (s-10), embedded, or stabilized Or disposed of at a site or a management-type treatment plant (s-11).
[0027]
An example of a recycling system used for the recycling method is the one shown in FIG. This recycling system has identification means 20 for recognizing and identifying identification information (such as identification marks and bar codes) of substrates and electrical products. Based on the information from the identification means 20, the control unit 21 obtains information for solder material processing (solder material recovery method, melting conditions, etc.) 22, component processing information (mounted component processing method, Condition etc.) 23 and the substrate processing information 24, etc., and the product disassembling device 25, the solder material recovering device and / or the material so as to perform the optimal recovery processing and dismantling processing according to the kind of solder material, component and substrate, etc. The sorting device 26 and the substrate disassembling device 27 are controlled. For example, an IC that is one of the mounted components is separated for reuse, or a material (such as palladium) contained in the plating of the electrode of the component is extracted from the molten solder material.
Hereinafter, the present invention will be described in more detail with reference to specific examples.
[0028]
【Example】
《 reference Example 1
FIG. 1 is a process diagram illustrating a method for mounting various components on a printed circuit board for a portable mini-disc player by a reflow soldering process.
First, the lead-free solder paste 2 was printed on the electrodes of the printed circuit board 1, and the various components 3 were arranged on the paste so that the electrodes 4 faced the substrate side. Then, using hot air or far infrared rays as the heat source 5, the solder was melted and the components were mounted (reflow soldering). Next, a label was attached to the printed circuit board 1 as an identification mark indicating that it was lead-free. Furthermore, the same label was affixed to the housing | casing 6 of the product in which this printed circuit board 1 was incorporated.
When the obtained portable mini disc player was collected after use, it was easily identified as a lead-free product by the attached label, and the subsequent recycling process could be simplified.
[0029]
《 reference Example 2
FIG. 2 is a process diagram showing a method of mounting various components on a printed circuit board for an electric rice cooker by a flow soldering process.
First, a component 12 having an electrode portion covered with a lead-free solder material was inserted into a printed board 11 at a predetermined position. And this board | substrate 11 was passed on the lead-free solder jet 13, and components were mounted (flow soldering). Next, an identification mark integrated with the product design was printed on the printed circuit board 11 as an identification mark indicating that it is lead-free. Further, the same mark was printed on the housing 14 of the product incorporating the printed board 11.
When this rice cooker was collected after use, it could be easily identified as a lead-free product by the printed mark, and the subsequent recycling process could be simplified.
[0030]
《 reference Example 3
FIG. 3 is a process diagram showing a method of mounting various components on a printed circuit board for control of an electronic component automatic placement machine by a reflow and flow mixed process.
The lead-free component 22 was mounted on the printed circuit board 21 by the same reflow and flow processes as described above, and an identification mark was imprinted on the obtained printed circuit board 21.
When this substrate was collected after use, it could be easily identified as a lead-free substrate by the stamped identification mark, and the recycling process could be simplified.
[0031]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a printed circuit board mounted product and an electrical product that can easily select those containing lead harmful to the human body and those not containing lead.
Moreover, 20 million home appliances with built-in printed circuit board products are produced each year, even if they are limited to four large home appliances (TV, washing machine, refrigerator, vacuum cleaner). Therefore, if one million lead-free products are collected and collected in the recycling of discarded household electrical appliances from 2001, the lead-free products are sorted by identification mark and excluded from the target of solder separation and collection. can do. As a result, a cost reduction effect of approximately 5 billion yen / year can be expected.
Furthermore, since the mixture ratio of lead-containing products and lead-free products is expected to increase year by year, the effect amount is expected to increase in proportion.
[Brief description of the drawings]
FIG. 1 is a process diagram for explaining a method of mounting various components on a printed circuit board for a portable mini-disc player by a reflow soldering process.
FIG. 2 is a process diagram showing a method of mounting various components on a printed circuit board for an electric rice cooker by a flow soldering process.
FIG. 3 is a process diagram illustrating a method of mounting various components on a printed circuit board for control of an electronic component automatic placement machine by a reflow and flow mixed process;
FIG. 4 is a flowchart showing a process of manufacturing, selling, collecting, and disposing of a conventional product.
FIG. 5 is a flowchart showing a process of manufacturing, selling, collecting and discarding a product according to the present invention.
FIG. 6 is a top view of a substrate on which an identification label is attached.
FIG. 7 is a top view of a substrate on which an identification mark is printed.
FIG. 8 is a top view of a substrate on which an identification mark is printed.
FIG. 9 is a top view of a substrate on which a copper foil without letters is attached as an identification mark.
FIG. 10 is a cross-sectional view conceptually showing an electrical product including a housing provided with a barcode as an identification mark.
FIG. 11 is a top view of a substrate provided with a barcode as an identification mark.
FIG. 12 is a cross-sectional view conceptually showing an electrical product including a housing provided with an identification IC as an identification mark.
FIG. 13 is a top view of a substrate on which an identification IC is provided as an identification mark.
FIG. 14 is a flowchart for explaining an electrical product recycling method of the present invention.
FIG. 15 is a configuration diagram of an example of a recycling apparatus that can be used in the recycling method of the present invention.
[Explanation of symbols]
1 Printed circuit board
2 Lead-free solder paste
3 parts
4 Component electrodes
5 heat sources
6 Case
10 Identification label
11 Substrate
12 parts
13 Identification mark
14 Copper foil
15 Barcode
17 IC for identification

Claims (7)

  The component is mounted by a solder material not containing lead, and has a barcode or IC including identification information indicating that it does not contain lead, and the barcode or IC is mounted in the kind and the mixture ratio of the solder material. A component mounting circuit forming body comprising information on a material of the component and the component mounting circuit forming body. An electrical product including a component mounting circuit formed body in which components are mounted by a solder material not containing lead and / or a housing including the component mounting circuit forming body,
The component mounting circuit formed body and / or the housing has a barcode or IC including identification information indicating that it does not contain lead, and the barcode or IC is mounted with the kind and the mixture ratio of the solder material. And an electrical product comprising information on the material of the component mounting circuit forming body. A waste recycling method comprising the component mounting circuit formed body according to claim 1 ,
A waste recycling method comprising the step of identifying, from the waste of a component mounted circuit formed body, the waste of the component mounted circuit formed body that does not contain lead by the identification information. Further by classifying the component mounting circuit formed with a separate member containing no component mounted circuit forming body and lead including lead, claim characterized in that it comprises a step of performing a treatment of waste of the component mounting circuit forming body 3 Recycling method of the listed waste. A method for recycling waste containing the electrical product according to claim 2 ,
A waste recycling method characterized by identifying, from the waste of electrical products, the waste of electrical products not containing lead by the identification information. A method for recycling waste containing the electrical product according to claim 2 ,
According to the identification information provided in the component mounting circuit forming body, the lead-free component mounting circuit forming body and the lead-containing component mounting circuit forming body are separated,
The separated component mounting circuit formed bodies are separately collected, crushed and melted,
Sort the materials that make up the component mounting circuit forming body,
Recycle recyclable valuables from the materials,
A method for recycling electrical product waste, comprising: subjecting a component mounted circuit formed body to a shredder treatment and disposal by embedding, or disposal in a stable treatment plant or a management treatment plant. Before separating the component mounting circuit formed bodies, the collected waste is classified for each type of electrical product,
Identify the presence or absence of lead by the identification information provided for each electrical product, and separate lead-free products from lead-containing products,
7. The method for recycling electrical product waste according to claim 6, wherein each electrical product is disassembled to take out a component mounting circuit formed body.

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