JP3901109B2 - Manufacturing method of heat radiator, heat radiator, power module substrate and power module using the heat radiator - Google Patents

Manufacturing method of heat radiator, heat radiator, power module substrate and power module using the heat radiator Download PDF

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JP3901109B2
JP3901109B2 JP2003053116A JP2003053116A JP3901109B2 JP 3901109 B2 JP3901109 B2 JP 3901109B2 JP 2003053116 A JP2003053116 A JP 2003053116A JP 2003053116 A JP2003053116 A JP 2003053116A JP 3901109 B2 JP3901109 B2 JP 3901109B2
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body
radiator
thermal expansion
heat
plate
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JP2004266002A (en
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和明 久保
敏之 長瀬
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三菱マテリアル株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15Ceramic or glass substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a heat radiating body that radiates heat from a heat radiating body, a heat radiating body, a power module substrate using the heat radiating body, and a power module.
[0002]
[Prior art]
Generally, a power module as a semiconductor device has a semiconductor chip mounted on a power module substrate, and heat of the semiconductor chip is conducted to the power module substrate. Therefore, it is necessary to dissipate heat transmitted to the power module substrate. .
In such a power module substrate as a heat sink, a metal thin plate is directly laminated on an insulating substrate (ceramic substrate) made of a ceramic material, and a heat sink made of a heat sink is interposed on the metal thin plate with a plastic porous metal layer. Laminated and bonded (see, for example, Patent Document 1). The plastic porous metal layer is a porous sintered body of Cu having a porosity of 20 to 50%, and when the insulating substrate receives heat from the semiconductor chip mounted thereon, it absorbs the thermal deformation. Thus, it is possible to prevent warping and cracking of the insulating substrate and the heat radiating body, and the heat radiating body can also perform a good heat radiating action.
[0003]
[Patent Document 1]
JP-A-8-335652 (page 4-12, FIGS. 1 to 5)
[0004]
[Problems to be solved by the invention]
By the way, in the prior art, the plastic porous metal layer provided on the power module substrate as the heat radiating member absorbs thermal deformation of the insulating substrate and the heat radiating member, so that the thermal expansion coefficient between the insulating substrate and the heat radiating member is large. Although it is possible to prevent the insulating substrate and the heat sink from warping or cracking even if they are different, since the plastic porous metal layer is interposed between the insulating substrate and the heat sink, the heat is increased accordingly. The resistance is increased and the thermal conductivity is lowered, so that the heat dissipation effect of the radiator is deteriorated.
[0005]
In general, when the heat dissipating body is made of a material having a different thermal expansion coefficient from the heat radiating body, it is easy to match the thermal expansion coefficients of both in order to prevent warping due to the difference in thermal expansion coefficient between the two. Can be considered. In this case, the thermal expansion coefficient should be adjusted to the lower one (heat radiating body). However, if this is done, the warpage can be reduced. On the other hand, the thermal conductivity is reduced by that amount, resulting in a reduction in the heat dissipation effect. However, there was a problem that it was not possible to meet the demands of what had both good heat dissipation effects.
[0006]
This invention was made in consideration of such circumstances, and its purpose is to reduce warpage without regard to this even if there is a difference in thermal expansion coefficient between the heat radiating body and It is in providing the manufacturing method of a heat radiator and heat radiator which can also suppress decline in thermal conductivity, the board | substrate for power modules using this heat radiator, and a power module.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention proposes the following means.
The invention according to claim 1 is a method of manufacturing a radiator that dissipates the heat of a radiator, and is made of a material having a lower coefficient of thermal expansion than that of the plates, A low thermal expansion material provided with a communication opening that communicates with the thickness direction across the surface and the other surface and that is connected to each other in the direction intersecting with the thickness direction; In a state where the expansion material is held, a molten metal having a material different from that of the plate-like bodies is injected between the plate-like bodies, and the low thermal expansion material is cast.
[0008]
According to the method for manufacturing a radiator according to the present invention, when the low thermal expansion material is cast into the radiator body, the low thermal expansion material is held in advance by a plate-like body, and in this state, Since the molten metal is poured in between and the low thermal expansion material is cast into the heat radiating body, the low thermal expansion material is disposed with high accuracy in the thickness direction and the creeping direction of the heat radiating body. That is, when the low thermal expansion material is cast into the radiator body, the position of the low thermal expansion material relative to the radiator body is likely to shift due to the injection pressure of the molten metal acting on the low thermal expansion material. Since the expansion material is held by the plate-like body, the occurrence of a shift in the arrangement position of the low thermal expansion material due to the injection pressure is suppressed. Thereby, characteristics, such as a thermal expansion coefficient and heat conductivity, can be stabilized, a heat radiator can be formed, and mass production quality can be secured. In addition, since the exposure of the low thermal expansion material to the radiator (main body) surface due to the displacement of the low thermal expansion material is also suppressed, the surface of the radiator main body on which the radiator is placed becomes a smooth surface. The insulating substrate and the heat radiating body can be satisfactorily adhered, and the heat of the heat radiating body can be reliably conducted to the heat radiating body.
In addition, when the heat sink and a heat radiating body having a thermal expansion coefficient different from the thermal expansion coefficient of the heat sink are soldered together, the warpage in the opposite direction is substantially the same as the warp generated in the heat sink. It is possible to easily set the thickness of the plate-like body to be different from each other so as to be generated in the radiator when wrapping. In this way, by setting the thickness of the plate-like body separately, the warp generated in the heat sink when casting the low thermal expansion material and the heat sink when the heat sink and the heat sink are soldered together. The warpage to be generated cancels each other, and as a result, both the heat radiating body and the heat radiating body become flat, and the adhesion between the heat radiating body and the heat radiating body is secured. Can be reliably conducted to the radiator.
Furthermore, since a molten metal having a material different from that of the plate-like bodies is injected between the plate-like bodies, the thermal expansion coefficient and the thermal conductivity of the entire radiator are determined according to the thermal expansion coefficient, the amount of heat generated, etc. on the radiator side. The heat sink can be reliably suppressed from being warped when soldered between the heat sink and the heat sink and when used with the heat sink and the heat sink bonded. Is done.
[0009]
The invention according to claim 2 is a heat radiating body for radiating the heat of the heat radiating body, comprising a heat radiating body and a low thermal expansion material made of a material having a lower thermal expansion coefficient than the heat radiating body. The main body comprises a plate-like body and a laminated body including at least a cast body made of a material different from that of the plate-like body, and the plate-like body is disposed on each outermost layer of the heat radiating body. The low thermal expansion material communicates with the thickness direction across one surface and the other surface, and has a communication opening that is continuous with the thickness direction and in the crossing direction, and between the plate-like bodies, It is characterized by being disposed by being cast by the cast body through a communication opening.
[0010]
According to the radiator of the present invention, since the low thermal expansion material is disposed inside the radiator, the thermal expansion coefficient of the radiator is reduced as much as possible. When joined by solder or the like, it is possible to reliably prevent the heat sink from warping toward the heat sink. Further, since the heat dissipating body main body forms a laminated body, and the plate-like body is disposed in each outermost layer of the laminated body, the contact surface of the heat dissipating body with the heat radiating body becomes a smooth surface. As a result, the heat radiating body and the heat radiating body are in good contact with each other, and the heat from the heat radiating body is reliably conducted to the heat radiating body. Further, since the low thermal expansion material is cast and disposed inside the radiator body through the communication opening, the thickness of the radiator is also provided in the configuration in which the low thermal expansion material is provided inside the radiator. The heat radiating body main body communicates in the direction and the direction perpendicular to this direction, and the decrease in the thermal conductivity of the heat radiating body is suppressed.
As described above, the thermal expansion coefficient of the heat radiating body can be made as small as possible, the occurrence of the warpage of the heat radiating body can be suppressed, and even in such a configuration, the decrease in the thermal conductivity of the heat radiating body can be minimized. It becomes possible to suppress.
Furthermore, since the material of the cast body is different from that of the plate-like body, the thermal expansion coefficient and the thermal conductivity of the entire heat radiating body can be appropriately adjusted according to the thermal expansion coefficient, the amount of heat generated, etc. It is possible to reliably suppress warping of the heat sink when the heat sink and the heat sink are joined by soldering and when the heat sink and the heat sink are used in a joined state.
[0011]
The invention according to claim 3 is the heat dissipating body according to claim 2, wherein the plate-like body is made of pure Cu or a Cu alloy, and the cast body is made of pure Al or an Al alloy.
[0012]
According to the heat radiator according to the present invention, the plate-like body is made of pure Cu or a Cu alloy, and the cast body is made of pure Al or an Al alloy. The thermal expansion coefficient and thermal conductivity of the entire body can be adjusted as appropriate, and heat is dissipated when soldering the heat sink and the heat sink and when using the heat sink and the heat sink. Warping of the body is reliably suppressed. Moreover, since pure Al or Al alloy is excellent in castability, generation | occurrence | production of a casting defect is suppressed, Therefore, the fall of the thermal conductivity of the whole heat radiator is suppressed to the minimum.
[0013]
The invention according to claim 4 is the radiator according to claim 2 or 3, characterized in that the plate-like body is a rolled material.
[0014]
According to the heat radiator according to the present invention, since the plate-like body is a rolled material, the inclusion of internal defects such as voids in the plate-like body is suppressed to a minimum, and the thermal conductivity of the heat radiator is reduced. It is suppressed. That is, when the entire heat dissipating body is, for example, a cast body, internal defects such as nests may occur, and this internal defect obstructs heat conduction inside the heat dissipating body. May reduce overall thermal conductivity. However, as described above, when the plate-like body is a rolled material, the internal defects are rarely formed, so that the decrease in the thermal conductivity is minimized.
[0015]
According to a fifth aspect of the present invention, in the radiator according to any one of the second to fourth aspects, the thickness of each of the plate-like bodies is such that the thermal expansion coefficient on the radiator side is on the radiator side. When the coefficient of thermal expansion is smaller than the thickness of the radiator on the side of the radiator, the thickness of the radiator on the side of the radiator is larger than the coefficient of thermal expansion on the side of the radiator, The thickness of the plate-like body on the radiator side is formed to be thinner than the thickness of the plate-like body on the radiator side.
[0016]
According to the heat dissipating body according to the present invention, since the thickness of each plate-like body is set as described above, the warp generated in the heat dissipating body when forming the cast body, the heat dissipating body and the heat dissipating body And the warp that is to occur in the heat dissipating member when they are soldered to each other, and as a result, both the heat dissipating member and the heat dissipating member become flat. Accordingly, since the adhesion between the heat radiating body and the heat radiating body is ensured, the heat of the heat radiating body can be reliably conducted to the heat radiating body.
[0017]
The invention according to claim 6 is the heat radiating body according to any one of claims 2 to 5, wherein the low thermal expansion material is formed by assembling the band-like unit plate-like bodies to each other at the same position to form the communication opening. The chain-like body is formed in a continuous manner, and the chain-like body is provided in a plurality of rows on the same plane, and the position of the communication opening is shifted for each row adjacent to each other.
[0018]
According to the heat dissipating body according to the present invention, the band-like unit plate-like bodies are assembled to each other at the same row position to form a chain-like body having continuous connection openings, and the chain-like bodies are arranged in a plurality of rows on the same plane. Since the position of the connection opening is shifted for each adjacent row, a low thermal expansion material having connection openings that are continuous in the thickness direction across one surface and the other surface is reliably formed. it can.
[0019]
The invention according to claim 7 is a power module substrate comprising an insulating substrate and a radiator provided on one surface side of the insulating substrate, wherein the radiator is any one of claims 2 to 6. It is a heat radiator as described in any one item .
[0020]
According to the power module substrate of the present invention, since the radiator is the radiator according to any one of claims 2 to 6, the thermal expansion coefficient of the radiator can be made as small as possible. The occurrence of the warpage of the body can be suppressed, and even in such a configuration, since the decrease in the thermal conductivity of the heat radiating body can be suppressed to the minimum, the effect of suppressing the occurrence of warpage and the decrease in the thermal conductivity can be suppressed. It becomes possible to provide a power module substrate having both effects.
[0021]
According to an eighth aspect of the present invention, in the power module substrate according to the seventh aspect, a metal layer is provided on the one surface of the insulating substrate, and a circuit layer is provided on the other surface. It consists of pure Al, Al alloy, pure Cu, or Cu alloy.
[0022]
According to the power module substrate according to the present invention, the power module substrate having good thermal conductivity while suppressing the warpage of both as much as possible regardless of the difference in thermal expansion coefficient between the insulating substrate and the radiator. Is definitely obtained.
[0023]
The invention according to claim 9 is characterized in that a chip is mounted on the other surface side of the insulating substrate of the power module substrate according to claim 7 or 8.
[0024]
According to the power module of the present invention, it is possible to obtain a power module having good thermal conductivity while suppressing the warpage of both as much as possible regardless of the difference in thermal expansion coefficient between the insulating substrate and the radiator.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall view showing a power module to which a power module substrate according to an embodiment of the present invention is applied.
In the power module P of the present embodiment, the power module substrate 10 includes an insulating substrate 11 and a radiator 16 as shown in FIG.
The insulating substrate 11 is formed to have a desired size by, for example, AlN, Al2O3, Si3N4, SiC, or the like, and the circuit layer 12 is laminated on the upper surface of the insulating substrate 11 and the metal layer 13 is laminated on the lower surface. The circuit layer 12 and the metal layer 13 are formed of pure Al, Al alloy, pure Cu, Cu alloy or the like, and are laminated and bonded to the upper and lower surfaces of the insulating substrate 11 by soldering or brazing.
[0026]
The semiconductor chip 30 is mounted on the upper surface of the circuit layer 12 provided on the upper surface of the insulating substrate 11 by solder 14, while the lower surface of the metal layer 13 provided on the lower surface of the insulating substrate 11 is connected by solder 15 or brazing or diffusion bonding. The heat sink 16 is joined by, for example, and a cooling sink portion 31 is provided on the lower surface of the heat sink 16. In the power module P configured as described above, the heat conducted from the insulating substrate 11 side to the heat radiating body 16 is radiated to the outside by the cooling liquid (or cooling air) 32 in the cooling sink portion 31. ing. The radiator 16 is attached to the cooling sink portion 31 in close contact with the attachment screw 33.
[0027]
Here, the radiator 16 includes a radiator body 17 and a low thermal expansion material 18 made of a material lower than the thermal expansion coefficient of the radiator body 17.
As shown in FIG. 2, the heat dissipating body 17 is a laminate including a plate-like body 17a made of pure Cu or Cu alloy and a cast body 17b made of pure Al or Al alloy, and the plate-like body 17a. Are arranged on the outermost layers of the radiator body 17, that is, on the insulating substrate 11 side and the cooling sink portion 31 side. Here, the plate-like body 17a is formed of a rolled material.
[0028]
On the other hand, as shown in FIG. 3, the low thermal expansion material 18 is provided with a communication opening 40 that communicates with the thickness direction across one surface and the other surface and that is continuous with the thickness direction and the crossing direction. It has been. As shown in FIG. 2, the low thermal expansion material 18 is disposed in a cast body 17b in a substantially central portion in the thickness direction of the heat radiator body 17 (heat radiator 16) via a communication opening 40. Has been.
Specifically, as shown in FIG. 3, the low thermal expansion material 18 includes, for example, two band-shaped unit plate-like bodies 41 and 42 that are assembled along the thickness direction so that the communication opening 40 is continuously formed. Thus, the chain 43 is formed. The chain-like bodies 43 are provided in a plurality of rows on the same plane, and the connection openings 40 are alternately arranged in rows adjacent to each other.
[0029]
Here, the plate-like body 17a of the heat radiating body 17 is formed of pure Cu or a Cu alloy, preferably high purity Cu having a purity of 99.9% or more, as described above, and the cast body 17b is made of pure Al or It is made of an Al alloy, preferably an Al alloy having a purity of 99.5% or more. Therefore, the heat dissipating body 17 is made of a material having a small deformation resistance and a good thermal conductivity, that is, a so-called high heat conducting material. ing. The high thermal conductivity material has a thermal conductivity of, for example, 100 W / m · K or more, preferably 150 W / m · K or more.
On the other hand, the low thermal expansion material 18 is made of a material having a lower thermal expansion coefficient than that of the heat radiating body 17, and is embedded in the casting body 17 b, that is, embedded in the heat radiating body main body 17. The difference between the expansion coefficient and the thermal expansion coefficient of the insulating substrate 11 is as close as possible. The low thermal expansion material 18 is made of an Fe—Ni alloy, such as an Invar alloy, and has a thermal expansion coefficient of about 5 × 10 −6 / ° C. or less. Here, the Invar alloy is an alloy that hardly undergoes thermal expansion near room temperature, and has a composition ratio of 64.6 mol% Fe and 35.4 mol% Ni. However, Fe containing other inevitable impurities is also called an Invar alloy.
In the power module P configured as described above, the thermal expansion coefficient on the insulating substrate 11 side is smaller than the thermal expansion coefficient on the radiator 16 side. In this case, the thickness of the plate-like body 17a on the insulating substrate 11 side is small. Is formed thicker than the thickness of the plate-like body 17a on the cooling sink portion 31 side.
[0030]
A manufacturing method for forming the radiator 16 configured as described above will be described.
First, after arranging the low thermal expansion material 18 between the plate-like bodies 17a of the rolled material made of pure Cu or Cu alloy, the low thermal expansion material 18 is sandwiched between the plate-like bodies 17a. The molten metal which consists of pure Al or Al alloy is inject | poured from 18 side surface side. At this time, the molten metal first reaches the connection opening 40 of the low thermal expansion material 18. Here, as described above with reference to FIG. 3, the low thermal expansion material 18 has the communication opening 40 connected in the thickness direction, so that the molten metal reaching the communication opening 40 sandwiches the low thermal expansion material 18. Each plate-like body 17a reaches the contact surface with the low thermal expansion material 18. Then, the molten metal is cooled and hardened to join the plate-like bodies 17a constituting the outermost layer of the heat radiating body 16, and the cast body 17b for casting the low thermal expansion material 18 is formed. Is done.
[0031]
As described above, according to the power module substrate 10 according to the present embodiment, the radiator 16 includes the low thermal expansion material 18 made of a material lower than the thermal expansion coefficient of the radiator body 17. The overall thermal expansion coefficient can be reliably reduced, and the difference in thermal expansion coefficient between the insulating substrate 11 and the entire radiator 16 can be made as small as possible.
[0032]
For this reason, when the insulating substrate 11 and the heat radiating body 16 are joined by the solder 15 (or brazing, diffusion bonding, or the like), it is possible to reliably suppress the heat radiating body 16 from warping toward the insulating substrate 11. . As a result, even if the radiator 16 is attached to the cooling sink portion 31, it is possible to prevent a gap from being generated between the cooling sink portion 31 and the radiator 16 and to increase the height from the radiator 16 to the cooling sink portion 31. Heat can be conducted efficiently.
[0033]
Moreover, since the low thermal expansion material 18 is a metal and has a suitable thermal conductivity, the heat generated from the semiconductor chip 30 on the insulating substrate 11 is generated by the circuit layer 12, the insulating substrate 11, the metal layer 13, and the solder. 15, the heat is radiated well to the outside through the radiator 16 and the cooling sink 31. That is, it can suppress that the heat conductivity as the whole power module P falls, As a result, the temperature rise of the semiconductor chip 30 can also be suppressed.
[0034]
Here, since the thickness of the plate-like body 17a on the insulating substrate 11 side is thicker than the thickness of the plate-like body 17a on the cooling sink portion 31 side, when forming the cast body 17b, Warping toward the insulating substrate 11 occurs. Further, when the heat radiating body 16 is joined to the insulating substrate 11, the thermal expansion coefficient of the insulating substrate 11 is smaller than the thermal expansion coefficient of the heat radiating body 16, so that the heat radiating body 16 warps in the direction toward the insulating substrate 11. try to. At this time, since the heat sink 16 is warped in the direction away from the insulating substrate 11 when the cast body 17b is formed, these warpages cancel each other. As a result, the heat sink 16 and Both the insulating substrate 11 and the insulating substrate 11 can be made flat, and these can be satisfactorily adhered to each other.
That is, when the heat radiating body 16 and the insulating substrate 11 having a thermal expansion coefficient different from the thermal expansion coefficient of the heat radiating body 16 are solder-bonded, a warpage substantially equal to and opposite to the warpage generated in the heat radiating body 16 is low thermal expansion. The thickness of the plate-like body 17a can be easily set differently between the insulating substrate 11 side and the cooling sink portion 31 side so that the material 18 is formed in the entire heat radiating body 16 when the material 18 is cast into the cast body 17b. As a result, the heat dissipating body 16 and the insulating substrate 11 can be satisfactorily adhered to each other, and a configuration for reliably conducting the heat of the insulating substrate 11 to the heat dissipating body 16 can be easily formed.
[0035]
In addition, when the low thermal expansion material 18 is cast into the heat radiating body 17, the low thermal expansion material 18 is previously held by the plate-like body 17 a, and the molten metal is injected from the side surface side of the low thermal expansion material 18 in this state. The arrangement position of the low thermal expansion material 18 in the thickness direction and the creeping direction of the radiator 16 can be positioned with high accuracy. That is, when the low thermal expansion material 18 is cast into the heat radiating body 17, the placement position of the low thermal expansion material 18 with respect to the heat radiating body 17 is likely to be shifted due to the injection pressure of the molten metal acting on the low thermal expansion material 18. In this case, since the low thermal expansion material 18 is sandwiched by the plate-like body 17a, it is possible to suppress the occurrence of a shift in the arrangement position of the low thermal expansion material 18 due to the injection pressure. Thereby, characteristics, such as a thermal expansion coefficient and thermal conductivity, can be stabilized and the board | substrate 10 for power modules can be formed, and mass-production quality can be ensured.
[0036]
In addition, since the plate-like body 17a is disposed on each outermost layer of the heat radiating body 16 to be formed, the low thermal expansion material 18 can be suppressed from being exposed on the surface of the heat radiating body 16, and the insulating substrate 11 can be It is possible to easily realize the surface of the radiator 16 to be placed as a smooth surface. Here, as described above, since the plate-like body 17a is made of a rolled material, it is possible to more reliably realize that the contact surface of the radiator 16 with the insulating substrate 11 is a smooth surface. Accordingly, the contact surfaces of the radiator 16 and the insulating substrate 11 can be uniformly adhered to each other, and heat from the insulating substrate 11 can be reliably conducted to the radiator 16.
[0037]
Further, since the low thermal expansion material 18 is cast and disposed through the communication opening 40 by the casting body 17b, the heat radiation body 16 is also provided in the configuration in which the low thermal expansion material 18 is provided inside the heat radiation body 16. Accordingly, the heat dissipating body 17 communicates in the thickness direction and in the direction perpendicular to this direction, and a decrease in the thermal conductivity of the heat dissipating body 16 can be minimized. Therefore, both the reduction of the thermal expansion coefficient of the radiator 16 and the suppression of the reduction of the thermal conductivity can be achieved. Further, since the plate-like body 17a and the cast body 17b are made of different materials, respectively, the thermal expansion coefficient and heat conduction of the entire radiator 16 according to the thermal expansion coefficient, the amount of heat generated, etc. on the insulating substrate 11 side. The rate can be adjusted as appropriate, and the warp generated in the heat radiating body 16 when the heat radiating body 16 and the insulating substrate 11 are solder-bonded and when used as the power module P can be reliably suppressed. Further, pure Al or Al alloy forming the cast body 17b is excellent in castability such as realizing a good hot water flow, so that the occurrence of casting defects can be suppressed. A decrease in conductivity can be minimized.
[0038]
Furthermore, since the plate-like body 17a is a rolled material, the inclusion of internal defects such as voids in the plate-like body 17a can be suppressed to a minimum, and a decrease in the thermal conductivity of the radiator 16 can be suppressed. be able to. That is, if the entire radiator body 17 is, for example, a cast body, internal defects such as nests are likely to occur. In this case, when heat is conducted through the radiator 16, the internal defects conduct heat. Therefore, the heat conductivity of the entire radiator 16 is reduced. However, as described above, when the plate-like body 17a is a rolled material, the internal defects are rarely generated, so that a decrease in the thermal conductivity can be suppressed.
[0039]
Furthermore, the low thermal expansion material 18 forms the chain-like body 43 in the same plane by assembling the band-like unit plate-like bodies 41 and 42 to each other at the same row position and continuously forming the communication opening 40. Since a plurality of rows are provided above, and the positions of the connection openings 40 are shifted for each adjacent row, the low thermal expansion having the connection openings 40 connected to each other in the thickness direction over one surface and the other surface. The material 18 can be reliably formed.
[0040]
In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention. For example, although the example using the Fe-Ni type alloy was shown as the low thermal expansion material 18 provided in the radiator body 17, other low thermal expansion materials such as high carbon steel (Fe-C), 42 alloy, molybdenum Even if it is made of (Mo), tungsten (W) or the like, the same effect can be obtained.
[0041]
Moreover, although the structure which provided the cooling sink part 31 in the heat radiator 16 surface was shown, it is good also as a structure which provided not only this structure but a corrugated fin. That is, a joining portion joined to the surface of the heat radiating body 16 via a brazing material, a rising portion provided at one end of the joining portion and rising up perpendicular to the joining portion, and provided at an upper end of the rising portion and parallel to the joining portion and A projecting portion including a flat portion extending in a separating direction and a folded portion provided at one end of the flat portion and orthogonal to the flat portion and folded back toward the radiator 16 is continuously repeated along the creeping direction of the radiator 16. It is good also as a structure provided. In this configuration, the rising portion, the flat portion, the folded portion, and the surface of the radiator 16 form a space.
[0042]
Further, as the insulating substrate 11 to which the heat radiating body 16 is attached, an example in which the metal layer 13 is provided on the surface on the heat radiating body 16 side is shown, but the insulating substrate 11 is not provided with the metal layer 13 and the heat radiating body is interposed via the brazing material. Even if it is directly joined to 16, a similar effect can be obtained.
Further, in place of the low thermal expansion material 18, a so-called corrugate, corrugated louver, an expanded structure having a communication opening 40 having a rectangular cross section expanded in the thickness direction, or the so-called honeycomb structure shown in the above-described embodiment is further provided. It is good also as a structure which laminated | stacked two or more of things or said each structure.
[0043]
Furthermore, in the plate-like body 17a on the insulating substrate 11 side, the surface on the insulating substrate 11 side is a smooth surface. On this surface, a pedestal in which a region to which the insulating substrate 11 is bonded protrudes toward the insulating substrate 11 side. A part may be formed. In this case, the plate-like body 17a may be formed by casting instead of a rolled material. Further, on the surface on the low thermal expansion material 18 side of each plate-like body 17a, an arbitrary region may be formed in a concave shape, and a corrugated uneven shape may be added, and the surface is not limited to a smooth surface. .
Further, the molten metal was injected from the side surface of the low thermal expansion material 18 with the front and back surfaces of the low thermal expansion material 18 being sandwiched by the plate-like body 17a, but the low thermal expansion material 18 was placed on one plate-like body 17a. After placing, the low thermal expansion material 18 is embedded with silicon particles, and after placing the other plate-like body 17a on the low thermal expansion material 18, these are pressed through each plate-like body 17a, Alternatively, molten metal may be injected.
[0044]
【The invention's effect】
As described above, according to the first aspect of the present invention, the location of the low thermal expansion material relative to the thickness direction of the radiator can be positioned with high accuracy, and therefore characteristics such as thermal expansion coefficient and thermal conductivity can be obtained. The power module substrate can be formed while stabilizing the mass production quality. In addition, it is possible to easily and reliably realize a smooth surface on the surface of the heat sink on which the insulating substrate is placed, and the heat radiator and the insulating substrate can be uniformly adhered to each other. This heat can be reliably conducted to the heat radiating body. Further, when the heat sink and the insulating substrate having a thermal expansion coefficient different from the thermal expansion coefficient of the heat sink are soldered together, the warp substantially equal to and opposite to the warp generated in the heat sink casts the low thermal expansion material. In this case, the thickness of the plate-like body can be easily set differently so as to be generated in the radiator. Furthermore, since the material of the molten metal is different from that of the plate-like body, the thermal expansion coefficient and the thermal conductivity of the entire radiator can be appropriately adjusted according to the thermal expansion coefficient on the insulating substrate side, the heat generation amount, and the like. .
[0045]
According to the second aspect of the present invention, when the insulating substrate and the heat radiating body are joined by solder or the like, it is possible to reliably suppress the warping of the heat radiating body toward the insulating substrate. Moreover, the structure which makes the contact surface with the insulated substrate of a heat sink a smooth surface is reliably realizable. Furthermore, even in a configuration in which a low thermal expansion material is provided inside the radiator, the radiator body communicates in the thickness direction of the radiator and in a direction perpendicular to this direction, resulting in a decrease in the thermal conductivity of the radiator. Can be minimized. Therefore, it is possible to achieve both a reduction in the thermal expansion coefficient of the heat radiating body and a reduction in the thermal conductivity. Furthermore, since the heat dissipating body and the cast body are made of different materials, the heat expansion coefficient and the thermal conductivity of the entire heat dissipating body are appropriately adjusted according to the thermal expansion coefficient and heat generation on the insulating substrate side. can do.
[0046]
According to the invention of claim 3, since the plate-like body is made of pure Cu or a Cu alloy and the cast body is made of pure Al or an Al alloy, the heat dissipation is performed according to the thermal expansion coefficient, the heat generation amount, etc. on the insulating substrate side. The thermal expansion coefficient and the thermal conductivity of the entire body can be adjusted as appropriate, and the occurrence of a decrease in the thermal conductivity of the radiator itself can be suppressed to a minimum.
[0047]
According to the invention of claim 4, since the plate-like body is a rolled material, the inclusion of internal defects such as vacancies existing in the plate-like body can be minimized, and the thermal conductivity of the radiator. Can be suppressed.
[0048]
According to the invention which concerns on Claim 5, the curvature which generate | occur | produced in the heat sink when forming a casting and the curvature which is going to generate | occur | produce in a heat sink when this heat sink and a to-be-heat-dissipated body are soldered mutually. As a result, both the heat radiating body and the heat radiating body become flat. Therefore, since the adhesiveness between the heat radiating body and the heat radiating body is ensured, the heat of the heat radiating body can be reliably conducted to the heat radiating body.
[0049]
According to the invention of claim 6, the band-like unit plate-like bodies are assembled to each other at the same row position to form a chain-like body having continuous communication openings, and the chain-like bodies are arranged in a plurality of rows on the same plane. Since the position of the connection opening is shifted for each adjacent row, a low thermal expansion material having connection openings that are continuous in the thickness direction across one surface and the other surface is reliably formed. it can.
[0050]
According to the invention of claim 7, the thermal expansion coefficient of the heat radiating body can be made as small as possible, the occurrence of the warp of the heat radiating body can be suppressed, and even in such a configuration, the heat of the heat radiating body can be reduced. Since a decrease in conductivity can be suppressed to a minimum, a power module substrate having both a warp generation suppressing effect and a thermal conductivity decrease suppressing effect can be provided.
[0051]
According to the invention of claim 8, a power module substrate having a good thermal conductivity while suppressing the warpage of both as much as possible regardless of the difference in thermal expansion coefficient between the insulating substrate and the heat radiating member is ensured. Is obtained.
[0052]
According to the ninth aspect of the present invention, a power module having good thermal conductivity can be obtained while suppressing the warpage of both as much as possible, regardless of the difference in thermal expansion coefficient between the insulating substrate and the radiator.
[Brief description of the drawings]
FIG. 1 is an overall view showing a power module to which a heat radiator according to an embodiment of the present invention is applied.
FIG. 2 is a cross-sectional side view of the radiator shown in FIG.
3 is a perspective view showing a main part of the low thermal expansion material shown in FIG. 2. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Power module substrate 11 Insulating substrate 16 Heat radiating body 17 Heat radiating body main body 17a Plate-shaped body 17b Casting body 18 Low thermal expansion material 30 Semiconductor chip (chip)
40 communication openings 41, 42 unit plate-like body 43 chain-like body P power module

Claims (9)

  1. A method of manufacturing a radiator that dissipates heat from a radiator,
    Between the plate-like bodies, made of a material lower than the thermal expansion coefficient of the plate-like bodies, and communicated with the thickness direction over one surface and the other surface, and continuous with each other in the thickness direction and the crossing direction. After arranging the low thermal expansion material provided with an opening,
    In a state where the low thermal expansion material is sandwiched between the plate-like bodies, a molten metal having a material different from that of the plate-like bodies is injected between the plate-like bodies, and the low thermal expansion material is cast. A method for manufacturing a radiator.
  2. A radiator that dissipates the heat of the radiator,
    A radiator body and a low thermal expansion material made of a material lower than the thermal expansion coefficient of the radiator body;
    The heat dissipating body main body is a laminate including at least a plate-like body and a cast body made of a material different from that of the plate-like body, and the plate-like body is disposed on each outermost layer of the heat dissipating body main body. No configuration,
    The low thermal expansion material communicates with the thickness direction extending from one surface to the other surface, and has a communication opening that is continuous with the thickness direction in the cross direction, and the communication between the plate-like bodies. A heat dissipating body, wherein the heat dissipating body is disposed by being cast by the cast body through an opening.
  3. In the heat radiator according to claim 2,
    The radiator is characterized in that the plate-like body is made of pure Cu or Cu alloy, and the cast body is made of pure Al or Al alloy.
  4. In the heat radiator according to claim 2 or 3,
    The radiator is characterized in that the plate-like body is a rolled material.
  5. In the heat radiator as described in any one of Claim 2 to 4,
    The thickness of each plate-like body is such that when the thermal expansion coefficient on the radiator side is smaller than the thermal expansion coefficient on the radiator body, the thickness of the plate-like body on the radiator side is the thickness of the radiator body. While forming thicker than the thickness,
    When the thermal expansion coefficient on the radiator side is larger than the thermal expansion coefficient on the radiator side, the thickness of the plate on the radiator side is made thinner than the thickness of the plate on the radiator side.
  6. In the heat radiator according to any one of claims 2 to 5,
    The low thermal expansion material is formed in a chain-like body continuously having the connecting openings by assembling the band-like unit plate-like bodies at the same row position, and providing the chain-like body in a plurality of rows on the same plane, A heat dissipating body characterized in that the connecting openings are arranged so as to be shifted in rows adjacent to each other.
  7. A power module substrate comprising an insulating substrate and a heat dissipator provided on one surface side of the insulating substrate,
    The said heat radiator is a heat radiator as described in any one of Claim 2 to 6, The board | substrate for power modules characterized by the above-mentioned.
  8. The power module substrate according to claim 7,
    A metal layer is provided on the one surface of the insulating substrate, and a circuit layer is provided on the other surface, and the metal layer and the circuit layer are made of pure Al, Al alloy, pure Cu, or Cu alloy. Power module substrate.
  9. 9. A power module comprising a chip mounted on the other surface side of the insulating substrate of the power module substrate according to claim 7 or 8.
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