JP3863786B2 - 半導体製造装置および半導体装置の製造方法 - Google Patents

半導体製造装置および半導体装置の製造方法 Download PDF

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Publication number
JP3863786B2
JP3863786B2 JP2002014962A JP2002014962A JP3863786B2 JP 3863786 B2 JP3863786 B2 JP 3863786B2 JP 2002014962 A JP2002014962 A JP 2002014962A JP 2002014962 A JP2002014962 A JP 2002014962A JP 3863786 B2 JP3863786 B2 JP 3863786B2
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Japan
Prior art keywords
heater
cap
boat
manufacturing apparatus
wafer
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Expired - Lifetime
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JP2002014962A
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Japanese (ja)
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JP2003218040A5 (https=
JP2003218040A (ja
Inventor
真吾 横山
智司 渡辺
敏光 宮田
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Priority to JP2002014962A priority Critical patent/JP3863786B2/ja
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Publication of JP2003218040A5 publication Critical patent/JP2003218040A5/ja
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JP2002014962A 2002-01-24 2002-01-24 半導体製造装置および半導体装置の製造方法 Expired - Lifetime JP3863786B2 (ja)

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Application Number Priority Date Filing Date Title
JP2002014962A JP3863786B2 (ja) 2002-01-24 2002-01-24 半導体製造装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002014962A JP3863786B2 (ja) 2002-01-24 2002-01-24 半導体製造装置および半導体装置の製造方法

Publications (3)

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JP2003218040A JP2003218040A (ja) 2003-07-31
JP2003218040A5 JP2003218040A5 (https=) 2005-08-04
JP3863786B2 true JP3863786B2 (ja) 2006-12-27

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9018567B2 (en) * 2011-07-13 2015-04-28 Asm International N.V. Wafer processing apparatus with heated, rotating substrate support
JP6605398B2 (ja) * 2015-08-04 2019-11-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体の製造方法およびプログラム
TWI611043B (zh) 2015-08-04 2018-01-11 日立國際電氣股份有限公司 基板處理裝置、半導體裝置之製造方法及記錄媒體
KR102127130B1 (ko) * 2017-02-17 2020-06-26 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램
KR20190109216A (ko) * 2018-03-15 2019-09-25 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치 및 반도체 장치의 제조 방법
US10714362B2 (en) 2018-03-15 2020-07-14 Kokusai Electric Corporation Substrate processing apparatus and method of manufacturing semiconductor device
JP7463211B2 (ja) * 2020-06-26 2024-04-08 株式会社フェローテックマテリアルテクノロジーズ 角度調整装置および回転伝達機構
CN215925072U (zh) 2020-09-24 2022-03-01 株式会社国际电气 基板处理装置
US20250029848A1 (en) * 2021-12-02 2025-01-23 Acm Research (Shanghai), Inc. High-temperature tube furnace

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