JP3861552B2 - エポキシ樹脂組成物及び電気積層板 - Google Patents

エポキシ樹脂組成物及び電気積層板 Download PDF

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Publication number
JP3861552B2
JP3861552B2 JP2000061921A JP2000061921A JP3861552B2 JP 3861552 B2 JP3861552 B2 JP 3861552B2 JP 2000061921 A JP2000061921 A JP 2000061921A JP 2000061921 A JP2000061921 A JP 2000061921A JP 3861552 B2 JP3861552 B2 JP 3861552B2
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JP
Japan
Prior art keywords
epoxy resin
group
type epoxy
phenol
amino group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000061921A
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English (en)
Japanese (ja)
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JP2001247657A (ja
JP2001247657A5 (https=
Inventor
博 森山
正和 吉沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP2000061921A priority Critical patent/JP3861552B2/ja
Publication of JP2001247657A publication Critical patent/JP2001247657A/ja
Publication of JP2001247657A5 publication Critical patent/JP2001247657A5/ja
Application granted granted Critical
Publication of JP3861552B2 publication Critical patent/JP3861552B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
JP2000061921A 2000-03-07 2000-03-07 エポキシ樹脂組成物及び電気積層板 Expired - Fee Related JP3861552B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000061921A JP3861552B2 (ja) 2000-03-07 2000-03-07 エポキシ樹脂組成物及び電気積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000061921A JP3861552B2 (ja) 2000-03-07 2000-03-07 エポキシ樹脂組成物及び電気積層板

Publications (3)

Publication Number Publication Date
JP2001247657A JP2001247657A (ja) 2001-09-11
JP2001247657A5 JP2001247657A5 (https=) 2005-04-21
JP3861552B2 true JP3861552B2 (ja) 2006-12-20

Family

ID=18581995

Family Applications (1)

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JP2000061921A Expired - Fee Related JP3861552B2 (ja) 2000-03-07 2000-03-07 エポキシ樹脂組成物及び電気積層板

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JP (1) JP3861552B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101082729B1 (ko) 2003-02-18 2011-11-10 히다치 가세고교 가부시끼가이샤 절연 수지 조성물의 제조 방법, 절연 수지 조성물, 다층배선판 및 그의 제조 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4929634B2 (ja) * 2005-07-12 2012-05-09 日立化成工業株式会社 接着層付き金属箔及び金属張積層板
JP5782216B2 (ja) * 2008-10-14 2015-09-24 日立化成株式会社 絶縁体インクとそれを用いた印刷配線基板
US12313973B2 (en) * 2019-10-24 2025-05-27 Lg Chem, Ltd. Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101082729B1 (ko) 2003-02-18 2011-11-10 히다치 가세고교 가부시끼가이샤 절연 수지 조성물의 제조 방법, 절연 수지 조성물, 다층배선판 및 그의 제조 방법

Also Published As

Publication number Publication date
JP2001247657A (ja) 2001-09-11

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