JP3857624B2 - 導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法 - Google Patents

導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法 Download PDF

Info

Publication number
JP3857624B2
JP3857624B2 JP2002211670A JP2002211670A JP3857624B2 JP 3857624 B2 JP3857624 B2 JP 3857624B2 JP 2002211670 A JP2002211670 A JP 2002211670A JP 2002211670 A JP2002211670 A JP 2002211670A JP 3857624 B2 JP3857624 B2 JP 3857624B2
Authority
JP
Japan
Prior art keywords
thin film
conductive layer
pattern
forming
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002211670A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004052046A (ja
JP2004052046A5 (https=
Inventor
聡史 上島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2002211670A priority Critical patent/JP3857624B2/ja
Priority to US10/617,131 priority patent/US7018548B2/en
Publication of JP2004052046A publication Critical patent/JP2004052046A/ja
Publication of JP2004052046A5 publication Critical patent/JP2004052046A5/ja
Application granted granted Critical
Publication of JP3857624B2 publication Critical patent/JP3857624B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Magnetic Heads (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP2002211670A 2002-07-19 2002-07-19 導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法 Expired - Fee Related JP3857624B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002211670A JP3857624B2 (ja) 2002-07-19 2002-07-19 導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法
US10/617,131 US7018548B2 (en) 2002-07-19 2003-07-11 Conductive thin film pattern and method of forming the same, method of manufacturing thin film magnetic head, method of manufacturing thin film inductor, and method of manufacturing micro device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002211670A JP3857624B2 (ja) 2002-07-19 2002-07-19 導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2004052046A JP2004052046A (ja) 2004-02-19
JP2004052046A5 JP2004052046A5 (https=) 2005-02-03
JP3857624B2 true JP3857624B2 (ja) 2006-12-13

Family

ID=30437595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002211670A Expired - Fee Related JP3857624B2 (ja) 2002-07-19 2002-07-19 導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法

Country Status (2)

Country Link
US (1) US7018548B2 (https=)
JP (1) JP3857624B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103147069A (zh) * 2011-12-07 2013-06-12 周义才 金属有机物磊晶薄膜的制造方法
KR101508812B1 (ko) * 2012-05-08 2015-04-06 삼성전기주식회사 코일 부품 제조방법 및 코일 부품
KR101709810B1 (ko) * 2012-06-14 2017-03-08 삼성전기주식회사 고주파 인덕터의 제조방법
KR101994726B1 (ko) * 2013-12-18 2019-07-01 삼성전기주식회사 칩 전자부품 및 그 제조방법
KR101762027B1 (ko) * 2015-11-20 2017-07-26 삼성전기주식회사 코일 부품 및 그 제조 방법
CN106094445B (zh) * 2016-06-12 2018-11-20 中国科学院微电子研究所 大高宽比纳米级金属结构的制作方法
CN106435675B (zh) * 2016-11-30 2018-08-28 华侨大学 一种适用于分段电镀的屏蔽层取消设备及其取消方法
JP2019033282A (ja) * 2018-10-30 2019-02-28 Tdk株式会社 コイル部品およびその製造方法
JP6879355B2 (ja) * 2019-12-03 2021-06-02 Tdk株式会社 コイル部品の製造方法
US12382581B2 (en) * 2022-05-10 2025-08-05 International Business Machines Corporation Sidewall plating of circuit boards for layer transition connections

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3853715A (en) 1973-12-20 1974-12-10 Ibm Elimination of undercut in an anodically active metal during chemical etching
JPH08330736A (ja) 1995-06-01 1996-12-13 Toray Ind Inc 多層基板およびその製造方法
JPH0973608A (ja) * 1995-09-04 1997-03-18 Sanyo Electric Co Ltd 薄膜磁気ヘッドの製造方法
US6156487A (en) * 1998-10-23 2000-12-05 Matsushita-Kotobuki Electronics Industries, Ltd. Top surface imaging technique for top pole tip width control in magnetoresistive read/write head processing
JP3355175B2 (ja) * 2000-05-16 2002-12-09 ティーディーケイ株式会社 フレームめっき方法および薄膜磁気ヘッドの磁極の形成方法
JP2002123910A (ja) * 2000-10-16 2002-04-26 Alps Electric Co Ltd 薄膜磁気ヘッド及び薄膜磁気ヘッドの製造方法
JP3593497B2 (ja) * 2000-11-08 2004-11-24 アルプス電気株式会社 薄膜磁気ヘッドの製造方法
US6922316B2 (en) * 2000-11-10 2005-07-26 Tdk Corporation Thin-film magnetic head and method of manufacturing same
JP2003029415A (ja) 2001-07-06 2003-01-29 Internatl Business Mach Corp <Ibm> フォトレジスト加工方法及び段型金属体製造方法
JP2003317210A (ja) * 2002-04-25 2003-11-07 Tdk Corp パターン形成方法、マイクロデバイスの製造方法、薄膜磁気ヘッドの製造方法、磁気ヘッドスライダの製造方法、磁気ヘッド装置の製造方法、磁気記録再生装置の製造方法

Also Published As

Publication number Publication date
US20040013793A1 (en) 2004-01-22
JP2004052046A (ja) 2004-02-19
US7018548B2 (en) 2006-03-28

Similar Documents

Publication Publication Date Title
US6187513B1 (en) Process for forming mask pattern and process for producing thin film magnetic head
JPH0973611A (ja) 薄膜磁気ヘッドおよびその製造方法
JP3857624B2 (ja) 導電薄膜パターンの形成方法、薄膜磁気ヘッドの製造方法、薄膜インダクタの製造方法、およびマイクロデバイスの製造方法
JP2004152334A (ja) 磁気センサ及びその製造方法、並びにこれを搭載した磁気記録再生装置
US6771463B2 (en) Thin-film coil and thin-film magnetic head having two patterned conductor layers that are coil-shaped and stacked
JP2002269706A (ja) マルチチャンネル磁気抵抗効果型磁気ヘッド
JP2003317210A (ja) パターン形成方法、マイクロデバイスの製造方法、薄膜磁気ヘッドの製造方法、磁気ヘッドスライダの製造方法、磁気ヘッド装置の製造方法、磁気記録再生装置の製造方法
JP2003338014A (ja) 磁気抵抗効果装置およびその製造方法ならびに薄膜磁気ヘッドおよびその製造方法
KR20090065446A (ko) 자기 재생 헤드, 자기 헤드 및 자기 기억 장치
JP2004005899A (ja) 磁気抵抗効果装置およびその製造方法ならびに薄膜磁気ヘッドおよびその製造方法
JP2002094144A (ja) 磁気抵抗効果素子およびその製造方法
JP3474523B2 (ja) 薄膜磁気ヘッドおよびその製造方法
JP4108093B2 (ja) 薄膜パターンの形成方法、磁気抵抗効果素子の製造方法および薄膜磁気ヘッドの製造方法
JP4074789B2 (ja) 薄膜パターンの形成方法および磁気抵抗効果素子の形成方法
JP4001232B2 (ja) マスク形成方法、パターン化薄膜形成方法およびマイクロデバイスの製造方法
JP2003016608A (ja) 薄膜磁気ヘッドおよびその製造方法
JP2003272118A (ja) 薄膜磁気ヘッドの製造方法、磁気抵抗効果素子集合体の製造方法、及び磁気ヘッドスライダの製造方法
JP2004206822A (ja) 磁気抵抗効果素子を有する薄膜磁気ヘッドの製造方法
JP2003142754A (ja) 薄膜デバイス、薄膜磁気ヘッド集合体、磁気ヘッド及びそれらの製造方法
US20070072132A1 (en) Method of forming device structure, method of manufacturing magnetoresistive element, and method of manufacturing thin film magnetic head
JP3658491B2 (ja) 薄膜磁気ヘッドとその製造法及びそれを用いた磁気ディスク装置
JP4041062B2 (ja) 薄膜磁気ヘッドの製造方法
JP3832819B2 (ja) 薄膜磁気ヘッドおよびその製造方法ならびに磁気ディスク装置
EP1098203A2 (en) Magnetic tunnel junction element, tunneling magnetoresistive head, and production methods
JP2001256613A (ja) 薄膜磁気ヘッドおよびその製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040226

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20050209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060606

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20060802

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060912

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060914

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100922

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110922

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120922

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130922

Year of fee payment: 7

LAPS Cancellation because of no payment of annual fees