JP3831906B2 - Electronic component assembly method and electronic component assembled by the method - Google Patents

Description

  The present invention relates to a method of assembling an electronic component reinforced by a ceramic cylinder (insulator) and an electronic component assembled using this method.

  Conventionally, glass-enclosed thermistors are known for electronic components such as thermistors. A glass-enclosed thermistor is a thermistor element chip enclosed in a glass bead. The lead wire drawn from the glass bead is protected by a coated tube, and the whole is isolated from the thermistor sensor operating environment by a protective tube. And a waterproof structure (see Patent Document 1).

  However, in the thermistor sensor with the above structure, if the cyclic change of temperature is repeated constantly in a high humidity atmosphere, the adhesion between the filling resin inside the protective tube, the metal protective tube, the coated tube, and the glass beads deteriorates, and the moisture content is reduced. It has been pointed out that it is easy to get inside.

  In order to eliminate this drawback, as shown in FIG. 15, the lead portion of the thermistor element chip 41 and lead wire 42 is melted in a glass sealing body (glass bead) 43, and the glass sealing body 43, fine ceramics, tempered glass, etc. There has been proposed an attempt to prevent electric corrosion of the lead wire 42 due to moisture by fusing and integrating the ceramic body 44 made of (see Patent Document 1).

  In the above structure, the method for fusing and integrating the glass sealing body 43 and the ceramic body 44 is not clear, but perhaps the glass sealing body 43 is partially melted and pressed to press the ceramic body 44 to solidify it. However, a generally known method is a method of applying a glass paste between the glass sealing body 43 and the ceramic body 44 and bonding them. Although it is possible to attach molten glass to ceramics, it is not clear whether the adhesion of all the contact surfaces of the ceramic body is secured in the fused glass sealing body. I can't.

  If a gap is formed between the glass sealing body and the ceramic body, moisture enters and electric corrosion occurs, or lead wire breakage or lead wire short-circuit accidents occur.

  For example, even if the adhesion of the outer peripheral part of the ceramic body and the glass sealing body is secured, moisture may enter through the lead wire hole of the ceramic body, and if moisture can be prevented from entering from the outer peripheral part of both It's not good.

  In addition, when low melting point glass is used for thermistor element chip sealing glass used in a high humidity atmosphere such as steam, part of the glass sealing body dissolves in water, and the ceramic body and glass sealing If the contact with the body is peeled off, resulting in poor insulation, and if the thermistor lead wire used in the oil is not fully sealed, if the usage time is several hundred hours, sulfur in the oil will lead to lead wire The sulfur component reacts with the copper component and precipitates, which causes a poor insulation between the lead wires or a short circuit accident.

  The thermistor proposed to solve such problems has an element chip 52 sealed in a glass bead 51, a cylindrical body 54, and a coating resin 55 as shown in FIG. The cylindrical body 54 is a ceramic cylinder and has two holes 56 penetrating the entire length, and the two lead wires 53 of the element chip 52 drawn from the glass beads 51 are connected to the holes 56 of the cylindrical body 54. Each of the coating resins 55 is inserted between the glass beads 51 and the cylindrical body 54, and the entire surface of the glass beads 51 and the lead wires between the glass beads 51 and the cylindrical body 54 are inserted. It covers the portion and a part of the cylindrical body 54, and further penetrates and solidifies into the hole 56 through which the lead wire 53 is inserted.

  Such a thermistor is manufactured by an insertion process, an immersion process, and a curing process. The insertion process is a process in which the lead wire of the thermistor is inserted into the cylinder, and the two lead wires of the thermistor are individually inserted into each hole of the cylinder. The glass bead coating process includes a glass bead coating process and a cylindrical body coating process. The glass bead coating process is a process of immersing the glass beads in the molten resin to deposit the resin on the entire surface of the glass beads. Yes, the cylinder covering process involves immersing the cylinder together with the glass beads in the molten resin liquid, and covering the end face of the cylinder and a part of its outer periphery over a certain range in the length direction from the end face of the cylinder. The curing process is a process in which the glass beads and the resin deposited on a part of the cylindrical body are integrated and solidified in a state where the resin is filled between the glass beads and the cylindrical body (see Patent Document 3). ).

Since this thermistor is resin-coated over the entire surface of the glass beads for sealing the element chip and part of the cylindrical body, it is advantageous in terms of waterproofness and moisture resistance. A double coating process of a coating process and a resin coating process must be performed.
(Japanese Utility Model Publication No. 59-117930) (Japanese Utility Model Laid-Open No. 5-79902) (JP-A-9-178571)

  The problem to be solved is that as long as a glass-sealed element chip is used, means and a method for fixing the glass bead portion sealed with the element chip to the cylindrical body are necessarily required.

  The main feature of the present invention is that the element chip is sandwiched between a pair of lead wires inserted into the holes of the cylindrical body, and then glass coating is performed across the entire surface of the element chip and part of the cylindrical body. .

According to the method of manufacturing an electronic component according to the present invention, the element chip is sandwiched between the lead wires inserted into the holes of the cylindrical body, and is simply immersed in a glass melting tank, and the element chip is only coated with glass. In addition, the molten glass wraps around between the element chip and the cylinder, and a part of the molten glass may be provided with a gap as an inclined surface that expands on the opening side. It can be surely penetrated into the hole and solidified to improve waterproofness and moisture resistance, and the element chip can be stably fixed to the cylinder.

  The element chip size of the thermistor manufactured by the method of the present invention is, for example, □ 0.65 mm × thickness 0.25 mm or less, and the lead wire has a diameter of 0.2 mm and a length of 40.0 mm. The size of the cylinder (insulator) is 1.5 mm in diameter, 3 mm in length, and the diameter of the two holes is 0.4 mm. The operation of attaching a thin lead wire to such a small chip and further attaching a cylinder cannot be performed manually.

  The present invention has realized a method capable of mechanically performing a series of operations from spot welding of a lead wire to such a small element chip, fitting of a cylindrical body, and further glass coating. In the following examples, an example in which the method of the present invention is applied to the production of a thermistor will be described with reference to the drawings.

FIG. 1 shows the structure of a thermistor manufactured by the method of the present invention. A thermistor 1 manufactured by the method of the present invention is an assembly of an element chip 2, a ceramic cylinder 3, and a glass coat 4. The element chip 2 has a square shape, and lead wires 5 and 5 are connected to electrodes on both sides, respectively. The cylindrical body 3 is an insulator for holding the element chip, has a columnar shape, has a pair of holes opened at both end faces, and the pair of lead wires 5 and 5 of the element chip 2 are inserted into the pair of holes 6 and 6, respectively. The lead wires 5 and 5 inserted from one end of the cylindrical body 3 are drawn out from the other end. The material of the cylinder is forsterite, and its thermal characteristics are suitable for the thermistor's constituent conditions, and it has good denseness and is suitable for precision machining. In order to facilitate insertion of the cylindrical body 3 into the hole 6, it is desirable that the cut end surface of the lead wire 5 be processed into a smooth curved edge 7.

  The glass coat 4 seals the element chip 2 and adheres to the element chip 2 and a part of the cylindrical body 3 to bond the element chip 2 and the cylindrical body 3 together. Furthermore, while covering a part of the outer periphery of the cylindrical body 3, a part penetrates into the hole 6 of the cylindrical body 3 and solidifies, and covers the pair of lead wires 5, 5 of the element chip 2 to provide waterproofness and moisture resistance. Increases sex.

  An inclined surface 8 is formed at the opening edge of the hole 6 of the cylindrical body 3 so as to spread toward the opening side. The inclined surface 8 is for easily guiding the lead wire into the hole, and is also for facilitating acceptance of the molten glass in the dipping process described later.

  Note that one end of the lead wire 5 is flattened over a certain length, and a part of the flat surface 5a is attached in parallel to the two surfaces of the element chip by spot welding. The distance between the three pairs of holes 6 and 6 is determined by the thickness of the element chip 2.

  The thermistor shown in FIG. 1 includes (1) lead wire drawing processing, (2) crushing processing, (3) element chuck processing, (4) correction processing, (5) welding processing, and (6) tensioning. Processing, (7) loading check processing, (8) cutting processing, (9) cylinder insertion processing, (10) carrier mounting processing, (11) positioning processing, (12) dipping processing ( 13) The discharge process is assembled in order, but the essential processes for assembly are (5) welding process, (9) cylinder insertion process, and (12) immersion process, and other processes are these This is pre-processing or post-processing for performing the process.

  In this embodiment, an example in which the welding process, the cylinder insertion process, and the dipping process are performed in succession will be described. However, the embodiment describes the order of the processes, and each process is not necessarily a series. This is not to be done continuously.

  The assembly of the thermistor is obtained by performing processing at each station through each station (1) to (13) shown in FIG. In the station shown in FIG. 2, the first to eighth stations (1) to (8) are assigned to the periphery of the first index table 9, and (1) lead wire drawing processing to cutting processing ( 8), (9) the cylinder insertion process is set to the unique ninth station (9), and (10) the second index table 10 is set separately for the processes after the carrier mounting process. Performed at each station. Hereinafter, each process will be described in order.

(1) Lead Wire Drawing Process In FIG. 3, the lead wire drawing process is a process of drawing the lead wire 5 inserted into the pipe 11 from the pipe 11 to a certain length. The pipe 11 is used as a lead wire holder when the lead wire 5 is sequentially conveyed to each station. The pair of pipes 11 and 11 are respectively held by clamps (not shown), and the clamps are adjusted for each process by bringing the pair of pipes close to each other or by moving them apart from each other by a separate driving device. .

  In the first station (1), the pair of pipes 11 and 11 are held in a vertical posture at regular intervals, and the lead wires 5 respectively drawn from the pair of reels 12 shown in FIG. A certain length is drawn from the lower end. In the first process, the operation of inserting the lead wire 5 into the pipe 11 and pulling out the fixed length is performed manually or mechanically. However, after the second process, the “pulling process” and the “cutting process” described later are performed. The lead wire 5 having a predetermined length is automatically pulled out from the pipe 11.

  The first index table 9 turns at a certain angle, and the pair of pipes 11 is sent to the second station (2). Note that FIG. 2 shows an example in which a pair of reels 12 for supplying lead wires is installed for easy understanding of the configuration. Can be processed simultaneously.

(2) Crushing process The crushing process is a process of crushing a part of the lead wire 5 having a circular cross section to a flat surface. A press machine 13 is installed in the second station (2). In FIG. 4 (a), the press machine 13 has a combination of a fixed die 14 and movable dies 15 and 15 arranged so as to be movable forward and backward on both sides thereof, and is sent to the second station (2). The pair of lead wires 5 and 5 are inserted between the two dies with the fixed die 14 sandwiched therebetween, and the movable die 15 is pressed against the fixed die 14 to crush a part of the lead wire 5, as shown in FIG. As shown, a certain range of the lower end portion of the lead wire 5 is deformed into a flat portion 5a. The flat portion 5 a is a portion for attaching the lead wire 5 to the element chip 2. After the crushing process, the pair of lead wires 5 and 5 are fed into the third station (3).

(3) Element chucking process The element chucking process is a process of sandwiching the element chip 2 between the pair of lead wires 5 and 5. In FIG. 5, a parts feeder 16 is installed in the third station (3). The parts feeder 16 accommodates a number of element chips 2, 2,... A pair of lead wires 5 and 5 fed into the station (3) are fed one by one in the forward direction. The pair of lead wires 5 and 5 are sent to the third station (3) across a row of specific element chips in a state of being spaced apart from each other. One element chip 2 is sandwiched between the lines 5 and 5, lifted upward, and then sent to the fourth station (4). Since part of the lead wire 5 sandwiching the element chip is processed flat, the element chip is easily sandwiched.

(4) Correction process The correction process is a process of correcting the position of the element chip 2 sandwiched between the pair of lead wires 5 and 5 to a normal position. In FIG. 6A, a platen 17 is installed in the fourth station (4), and the pair of pipes 11 and 11 are pushed down to push the element chip 2 between the lead wires 5 and 5 against the platen 17 and lead. The positions of the lower edge of the line 5 and the element chip 2 are aligned on the same plane. When the element chip 2 is pinched between the pair of lead wires 5 and 5, the element chip 2 is usually protruded below the lower end edge of the lead wire 5 and the lead wire 5 is fixed on the surface plate. By pressing against 17, the lower surface of the element chip 2 is pushed up to the same position as the lower end edge of the lead wire as shown in FIG. 6B, and the lower end edge is adjusted to the same plane. Next, the pair of lead wires 5 and 5 are fed into the fifth station (5) with the element chip 2 sandwiched therebetween.

(5) Welding process The welding process is a process of welding the lead wires 5 and 5 to the electrode of the element chip 2. In FIG. 7, a spot welder 18 is installed in the fifth station (5), and a pair of lead wires 5 and 5 sandwiching the element chip 2 between the pair of electrodes of the spot welder 18 are carried in. After the pair of electrodes of the spot welder 18 are simultaneously pressed from the outer surface of the flat surface 5a, spot welding of a part of the lead wire 5 is performed on the double-sided electrode of the element chip 2, and the lead wire 5 is attached to the element chip 2. The thermistor material M is fed to the sixth station (6).

(6) Pulling process The pulling process is a process of drawing a necessary length as the lead wire 5 of the thermistor from the pipe 11. In this embodiment, a clamp 19a is installed in the sixth station (6) below the conveying line for the thermistor material M. The clamp 19a is driven upward by the motor 34, opens the clamp 19a to receive the element chip 2, and then closes and holds the element chip 2 as shown in FIG. The pair of lead wires 5 and 5 immediately above are sandwiched and pulled downward, and the lead wire 5 is pulled out to a predetermined length below the pipe 11. FIG. 8B shows a state in which the lead wire 5 is pulled out to the specified length below the pipe 11. After the lead wire 5 is pulled out to a predetermined length, the clamp 19a is opened and lowered to remove the thermistor material M from the clamp 19a, and then the thermistor material M is sent to the seventh station (7).

(7) Load Check Process The load check process is a process for confirming the joint strength between the spot-welded lead wires 5 and 5 and the element chip 2. If it can be confirmed that the lead wire 5 is not peeled off from the element chip 2 even if the distance between the pipes 11 and 11 into which the lead wires 5 and 5 are inserted is widened, this is judged as a non-defective product. In FIG. 9, in this embodiment, the light emitting device 20 and the light receiving device 21 of the photoelectric sensor are arranged facing each other in the seventh station (7), and the pipes 11 and 11 into which the lead wires 5 are inserted are arranged. A force is applied between the lead wire 5 and the element chip 2 by widening the interval, and it is confirmed by receiving the light beam irradiated from the projector 20 by the light receiver 21 that both the lead wires 5 and 5 are opened. If there is no abnormality in the welding between the lead wire 5 of the thermistor material M and the element chip 2, this is sent to the eighth station (8).

(8) Cutting process The cutting process is a process of cutting the lead wire 5 drawn from the pipe 11 into a predetermined length. In FIG. 10, in addition to the cutter 22, a clamp 19b is installed at the eighth station (8) as in the sixth station. The clamp 19b is pushed up by a motor (not shown) to the transfer line of the thermistor material M to chuck the lead wires 5 and 5 of the thermistor material M, and then the lead wires 5 and 5 of the thermistor material M are directly under the pipe 11. The lead wire 5 is cut into a specified length by the cutter 22. After cutting, the clamp 19b is moved to the ninth station (9) while the lead wire 5 is chucked by the clamp 19b.

(9) Cylindrical Insertion Process The ninth station (9) is a station dedicated to the cylindrical insertion process set between the first index table 9 and the second index table 10. The cylinder insertion process is a process of inserting the cylinder 3 into the lead wire 5 of the element chip 2 sent to the ninth station (9) while being chucked by the clamp 19b. In FIG. 11, a guide 23 and a cylindrical chute 24 are installed at the ninth station (9). Although the details of the guide 23 are omitted, the guide 23 is a split mold of two, is installed so as to be openable and closable in a horizontal posture, and includes a pair of lead wires 5 and 5 attached to the element chip 2 in the mold. A pair of guide holes 25 for regulating the interval to a constant interval are received, and the pair of lead wires 5, 5 of the thermistor material M chucked by the clamp 19b are received in the lower opening, and the lead wire 5, 5 is directly received by the clamp 19b. When 5 is pushed up, the pair of lead wires 5 and 5 are adjusted to a constant interval (interval between the holes of the cylindrical body) while being guided by the inclined surface of the guide hole 25. The chute 24 is combined with the upper part of the guide 23 and receives a part of the pair of lead wires 5 and 5 adjusted at a constant interval.

  The cylinder 3 is supplied into the chute 24 from above and falls in the chute 24, and the pair of lead wires 5 and 5 are inserted into the pair of holes 6 and 6 of the cylinder 3, respectively. In addition, when the cylinder 3 is dropped, if the chute 24 is rotated by blowing air or the like, the cylinder 3 is also rotated integrally by the frictional resistance of the inner surface of the chute 24 and the position of the hole 6 of the cylinder 3 is changed. The positions of the pair of lead wires 5 and 5 are matched and inserted into the lead wire 5 into the cylinder 3. Next, when the split mold of the guide 23 is opened to the left and right, the cylindrical body 3 falls to the position 3 ′ along the lead wire 5 and stops near the element chip 2. In order to stabilize the stop position, the compressor air is blown from above to perform positioning. After the cylindrical body 3 is inserted into the lead wire 5, the thermistor material M is transferred to the tenth station (10) of the second index table 10 while the lead wire 5 is continuously chucked by the clamp 19b.

(10) Carrier attachment processing The clamp 19b is removed from the lead wire 5 of the element chip 2 sent to the tenth station (10) of the second index table 10, and the lead wire 5 of the element chip 2 is transferred to the second index table 10. It is attached to the carrier 26 provided. In this embodiment, the carrier 26 is provided with a magnet 28 as a holder on the peripheral surface of the drum 27 as shown in FIG. 12, and a pair of lead wires of the thermistor material M that is unchucked by the clamp 19b. The vicinity of the upper ends of 5 and 5 is attracted to the magnet 28 and attached to the drum 27, and the thermistor material M is suspended with the element chip 2 facing downward.

  In this embodiment, an example is shown in which a drum 27 that can suspend four thermistor materials M, M,... In this example, each time the thermistor material M is affixed to the magnet 28 of the drum 27, the carrier 26 turns by a certain angle and waits for receiving the next thermistor material M, and after receiving the four thermistor materials M. The carrier 26 is fed into the eleventh station (11).

(11) Positioning process The positioning process is a process of adjusting the height of each element chip 2 of each thermistor material M attached to the drum 27 and suspended from the carrier 26 prior to the dipping process to the same height. . In FIG. 13, an abutting plate 29 is installed at the eleventh station (11), the carrier 26 is lowered immediately above the abutting plate 29, and each element chip 2 of each thermistor material M is abutted on the abutting plate 29. If the distance a between the lower surface of the drum 27 of the carrier 26 and the abutting plate 29 is lowered to, for example, 20 mm, the lead wire 5 is held by the drum 27. The positions of all the element chips 2 are adjusted to positions 20 mm below the lower surface of the drum 27. The carrier 26 is then transferred to the twelfth station (12).

(12) Immersion treatment The immersion treatment is a treatment in which the element chip 2 is immersed in molten glass and the element chip 2 is glass-coated. In the twelfth station (12), a crucible furnace 30 is installed, and the crucible furnace 30 is filled with molten glass of a glass ingot. In FIG. 14, the carrier 26 sent to the twelfth station (12) is stopped immediately above the crucible furnace 30, the carrier 26 is lowered into the crucible furnace 30, and the element chip 2 is immersed below the liquid surface of the molten glass. However, the molten glass in the crucible furnace 30 is pumped into the bucket 31, the height of the bucket 31 is adjusted, and each element chip 2 is immersed below the liquid surface of the molten glass in the bucket 31 to control the immersion depth. To do.

  In the present invention, the entire element chip 2 and a part of the cylindrical body 3 are immersed under the liquid surface of the molten glass, and the entire periphery of the element chip 2 and a part of the element chip 2 and the cylindrical body 3 are immersed. Then, the molten glass is applied to the element chip 2, the carrier 26 is pulled up, and the bucket 31 is lowered below the liquid level of the molten glass in the crucible furnace 30, whereby the element chip 2 is pulled up above the liquid level of the molten glass. The molten glass in the crucible furnace 30 is pumped by the bucket 31, and the element chip 2 is immersed under the liquid surface of the molten glass in the bucket 31, so that the immersion depth in the element chip 2 can be kept constant.

  The molten glass pulled up on the liquid surface begins to solidify immediately upon contact with air, the element chip 2 is sealed with the solidified glass, and the element chip 2 and the cylindrical body 3 are integrally bonded by the glass coat 4. The thermistor 1 shown in FIG. 1 is obtained. As described above, a part of the glass penetrates into the hole 6 of the cylindrical body 3 and is solidified, and the pair of lead wires 5 of the element chip 2 are covered with the glass in the hole 6 of the cylindrical body 3. Finally, the carrier 26 with the thermistor 1 attached is moved to the thirteenth station (13).

(13) Discharging Process The discharging process is a process for removing the thermistor 1 from the carrier 26. A shooter 32 and a tray 33 are installed in the thirteenth station (13). The shooter 32 slides down the thermistor 1 peeled off from the magnet 28 of the drum 27 toward the tray 33, and the tray 33 accommodates the thermistors 1, 1, 1,. It is. The carrier 26 from which the thermistor 1 has been removed is rotated by a fixed angle, returned to the tenth station (10), and then prepared for the attachment of the lead wire of the thermistor material M that is carried from the ninth station (9).

  In the above embodiment, eight processing steps from “lead wire drawing processing” to “cutting processing” are performed at each station on the first index table 9, and “tubular insertion processing” is performed at a dedicated station. Subsequently, an example in which the subsequent processing steps from “carrier attachment processing” to “discharge processing” are performed on the second index table 10 has been described. According to this example, on the first index table 9, while the element chip 2 is attached between the pair of lead wires 5, 5, the cylindrical body 3 is fitted to the lead wires 5, 5 after the element chip 2 is attached. Can be successively fed onto the second index table 10, and a plurality of thermistor materials M into which the cylindrical body 3 is inserted are attached to one drum, so that they are simultaneously immersed in a plurality of element chips. Processing can be performed, and processing efficiency can be improved.

  In short, the present invention includes a “welding process” in which an element chip is welded between a pair of lead wires, a “cylinder insertion process” in which a cylinder is fitted into a lead wire, and a glass seal including an element chip and a part of the cylinder. The process proceeds in the order of “immersion process”. However, the “welding process”, “cylinder insertion process”, and “immersion process” are not always performed continuously as a series of processes. When a pair of lead wires welded to the electrode of the element chip in advance is used as the thermistor material M, this material M is directly carried into the ninth station (9) and is performed from the “cylinder insertion process”. From this point of view, it can be said that the electronic component assembling method according to the present invention is characterized in that the “cylinder insertion process” and the “immersion process” are sequentially performed.

  Anyway, when performing the “welding process”, “cylinder insertion process”, and “immersion process” described in this embodiment in order, the processes other than these three processes are processes for preparing these processes, Alternatively, it is post-processing, and “lead wire drawing processing” prior to “welding processing” facilitates mechanical handling of thin lead wires, and “crushing processing” facilitates “welding processing” and “correction processing”. ”Makes the position of the element chip relative to the lead wire constant, eliminating variations among products.

  In addition, the post-processing “cutting process” secures a necessary length of the lead wires 5 and 5 as a product, and a predetermined length of the subsequent lead wire is pulled out from the pipe 11 to be the next “crushing processing process”. Can be provided. In the “tubular insertion process”, two split molds are used for the guide 23, and the cylindrical body 3 is supplied through the cylindrical chute 24 directly above the pair of lead wires 5 and 5 inserted into the split mold. Thus, the lead wire 5 and the cylinder 3 can be accurately aligned, and the rotational displacement between the hole 6 of the cylinder 3 and the lead wire 5 can be easily aligned by rotating the chute 24. be able to.

  In addition, since two or more thermistor materials are attached to the drum 27 of the carrier 26, two or more element chips can be simultaneously coated with glass by one “immersion process”. Furthermore, by using a magnet to attach the thermistor material M to the drum 27 of the carrier 26, the lead wires can be easily attached and detached. In the “positioning process” performed as a pre-process of the “immersion process”, each thermistor is simply used. By simply pressing the element chip of the material against the abutment plate, the attachment position to the magnet is shifted, the height of each element chip is adjusted, the immersion depth under the liquid surface of the molten glass is controlled, and each element chip Can be evenly aligned. In the above embodiment, the example applied to the production of the thermistor has been described. However, it goes without saying that the present invention is not limited to the thermistor and can be widely applied to the production of electronic components having glass-coated element chips.

  As the temperature sensor using thermistor, the miniaturization of the sensor and the higher accuracy are progressing, it becomes possible to mechanize the assembly of minute electronic components that can hardly be expected to be manually assembled, and to make the product quality uniform. Can be planned.

It is an expanded sectional view of the thermistor assembled by the method of the present invention. It is a figure which shows an example of the apparatus which implements the method of this invention. It is a figure which shows the lead wire extraction process point. (A) is a figure which shows the crushing process point, (b) is a figure which shows the lead wire processed flat. It is a figure which shows the element chuck | zipper process point. (A), (b) is a figure which shows the state before and behind a correction process. It is a figure which shows the welding processing point. (A), (b) is a figure which shows the state before and behind a tension process. It is a figure which shows the loading check process point. It is a figure which shows the cutting process point. It is a figure which shows the cylindrical body insertion process point. It is a figure which shows the carrier attachment processing point. It is a figure which shows the positioning processing point. It is a figure which shows the immersion process point. It is a figure which shows the prior art example of the thermistor by which the element chip | tip was glass-sealed. It is a figure which shows the prior art example of the thermistor by which the element chip was glass-sealed and was further covered with coating resin.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thermistor 2 Element chip 3 Cylindrical body 4 Glass coat 5 Lead wire 6 Hole 7 Curved edge 8 Inclined surface 9 First index table 10 Second index table 11 Pipe 12 Reel 13 Press machine 14 Fixed mold 15 Movable mold 16 Parts feeder 17 Fixed Panel 18 Spot welder 19a, 19b Clamp 20 Projector 21 Receiver 22 Cutter 23 Guide 24 Chute 25 Guide hole 26 Carrier 27 Drum 28 Magnet 29 Abutting plate 30 Crucible furnace 31 Bucket 32 Shooter 33 Tray 34 Motor

Claims (5)

An assembly method of an electronic component having a welding process, a cylindrical body insertion process, and an immersion process,
The welding process is a process of welding the lead wire to both electrodes of the element chip, the lead wire welded to both electrodes of the element chip is clamped and introduced into the cylindrical body insertion process,
The cylindrical body insertion process is performed by holding the pair of lead wires attached to the element chip with the element chip facing downward and dropping the cylinder body from above, so that each pair of lead wires is opened to the opening of the cylinder body. In this process, the element chip is held at one end of the cylinder, and the lead wire is the cylinder. Pulled out from the other end of the
The dipping process is a process of immersing the element chip held in the cylinder together with a part of the cylinder under the liquid surface of the molten glass and covering the element chip with a glass coat including a part of the cylinder. A method of assembling an electronic component.   The pair of lead wires are inserted into the pipe, and the welding process is performed on the lead wire drawn out from both pipes and the element chip held between the pair of lead wires while holding both pipes at regular intervals. The method of assembling an electronic component according to claim 1, wherein It has a straightening process as a pretreatment of the welding process,
2. The method of assembling an electronic component according to claim 1, wherein the correction process is a process of adjusting a relational position between the lead wire and the element chip by pressing the element chip sandwiched between the lead wires against the surface plate. As a post-processing of the welding process, it has a pulling process and a cutting process,
The pulling process is a process of chucking the lead wire and pulling it out through the pipe.
The cutting process is a process of cutting the drawn lead wire to a specified length, and performing a welding process with an element chip sandwiched between the lead wires left on the pipe side. Assembly method of electronic parts. An electronic component having an element chip of an electronic component, a cylinder, and a glass coat,
The element chip has a pair of lead wires,
The cylindrical body is for holding the element chip, has a columnar shape, and has a pair of holes that are open at both end faces.
The pair of holes is for inserting the lead wires of the element chip pair,
The lead wire inserted from one end of the cylinder into the hole is pulled out from the other end,
An inclined surface is formed at the opening edge of the hole on the side where the lead wire is inserted, and is expanded to the opening side.
The inclined surface is for easy guidance when inserting the lead wire into the hole.
The glass coat is applied across the element chip and a part of the cylinder to seal the element chip , covers a part of the outer periphery of the cylinder, and penetrates into the hole of the cylinder to form a pair of element chips. electronic component, characterized in that it is of even to cover the lead wire.

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