JP3800884B2 - Non-contact IC card and mobile object identification system - Google Patents

Non-contact IC card and mobile object identification system Download PDF

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Publication number
JP3800884B2
JP3800884B2 JP27240599A JP27240599A JP3800884B2 JP 3800884 B2 JP3800884 B2 JP 3800884B2 JP 27240599 A JP27240599 A JP 27240599A JP 27240599 A JP27240599 A JP 27240599A JP 3800884 B2 JP3800884 B2 JP 3800884B2
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JP
Japan
Prior art keywords
ground pattern
ic card
ic
formed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27240599A
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Japanese (ja)
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JP2001101365A (en
Inventor
潮 寒川
進一郎 植野
卓 藤田
Original Assignee
松下電器産業株式会社
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Publication date
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Priority to JP27240599A priority Critical patent/JP3800884B2/en
Priority claimed from EP06076750A external-priority patent/EP1734461A2/en
Publication of JP2001101365A publication Critical patent/JP2001101365A/en
Application granted granted Critical
Publication of JP3800884B2 publication Critical patent/JP3800884B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a contactless IC card and a mobile object identification system.
[0002]
[Prior art]
Conventionally, as a non-contact IC card, one described in Japanese Patent Application Laid-Open No. 8-252959 has been known.
[0003]
FIG. 9 shows the structure of a conventional non-contact IC card. The IC card includes an insulating spacer 904 having a circuit pattern 902 on the top surface and a substrate 901 on which an antenna pattern 903 as a transmission / reception function is formed, an opening 912 and a via hole 906, and a ground pattern 905 on the top surface 904a. Similar to the spacer 904, an opening 912 and a through-hole 906 are provided, a sheet adhesive film 911 for bonding the upper surface 901a of the substrate 901 and the lower surface 904b of the spacer 904, and an opening 912 of the spacer 904, and a bump 908 as a terminal. An anisotropic conductive adhesive 909 that electrically connects and bonds the bump 908 of the IC chip 907 and the circuit pattern 902 electrically connected to the circuit pattern 902, an opening 912 of the spacer 904, and the IC chip 907 Epoxy system that fills the gap between Consisting of field agent 910.
[0004]
[Problems to be solved by the invention]
Although this non-contact IC card can exchange data with the reader / writer unit regardless of which side of the card is facing, the communication performance deteriorates due to the influence of the usage state such as the presence of an object on the back side. Has a problem.
[0005]
The present invention is such a non-contact IC card that is thin and light, is not easily affected by the state of use, and allows data to be exchanged with a reader / writer unit even when facing the front or back of the card or sideways. For the purpose.
[0006]
[Means for Solving the Problems]
In order to solve this problem, the present invention forms a ground pattern having a slot on the front and back of a card, and uses the slot as an antenna by electromagnetically coupling the slot and the wiring inside the card. When there is an object on the side not facing the reader / writer unit, the sensitivity of the antenna on this surface is deteriorated so that it is not easily affected by the use state.
[0007]
Thus, a non-contact IC card that is thin and light, hardly affected by the use state, and capable of transferring data to and from the reader / writer unit regardless of whether the card is turned upside down can be configured.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, an IC that has a first slotted ground pattern formed on the back surface and a first wiring pattern formed on the front surface and performs signal processing is provided directly below the IC. to bare chip mounting using bumps, a first substrate having a via hole for connecting the ground pattern and the bumps immediately below the IC, which is formed on the back surface and a second slotted ground pattern formed on the surface A second substrate having a second wiring pattern and a hole for fitting the IC, wherein the first substrate and the second wiring pattern of the second substrate are formed; surface is obtained by the non-contact IC card that having a laminated structure and form a slotted ground pattern on the front and back of the IC card, by using this slot as an antenna, either the front and back faces Also can communicate with the reader writer unit, if the object to the back surface was present, degraded sensitivity by resonance characteristics of the back side of the antenna is changed, an effect that less susceptible to the rear surface of the impact.
[0009]
The invention according to claim 2 of the present invention includes a first wiring pattern formed on the first slotted ground pattern and a surface formed on the back surface, an IC for signal processing, the IC A first substrate on which a bare chip is mounted using a bump directly underneath and has a via hole connecting the bump directly under the IC and the ground pattern; and a sealing material applied on the first substrate; wherein the second slotted ground pattern formed on the upper surface of the sealing material connected to the back surface ground pattern of the IC, is obtained by the non-contact IC card having to seal the signal processing IC By using the sealing material used as the dielectric material, the process of bonding multiple substrates is reduced, and the ground pattern on the back of the IC and the ground pattern on the sealing material are connected to form a seal. The process of forming via holes that connect the grounding patterns inside is also reduced, and it is possible to communicate with the reader / writer unit regardless of whether it faces the front or back, realizing a non-contact IC card that is less affected by the back surface at low cost. Has the effect of being able to.
[0010]
The invention described in claim 3 of the present invention, first the first substrate having a first substrate having a wiring pattern formed on the first slotted ground pattern and a surface formed on the back A chip having a second slotted ground pattern formed on one side is bare-chip mounted using a bump directly below the IC, and the bump directly below the IC and the ground pattern are mounted. It is obtained by the non-contact IC card having a structure which have a via hole for connecting, by mounting the chip forming the antenna with the signal processing IC, easily respond to changes in antenna characteristics, either sides facing However, there is an effect that a non-contact IC card that can communicate with the reader / writer unit and is hardly affected by the back surface can be realized.
[0011]
The invention according to claim 4 of the present invention, Motomeko forming a first contrast without Re or gall the slotted ground pattern and the second slotted ground pattern, or both the dielectric film on the surface of the This is a non-contact IC card as described in 1 and 2. The antenna is miniaturized by pasting a dielectric film on the ground pattern with slots, and it can communicate with the reader / writer unit regardless of whether it is facing front or back. Thus, the non-contact IC card which is hardly affected by the back surface can be realized in a small size.
[0012]
According to a fifth aspect of the present invention, the second wiring pattern is formed by a coplanar line , and the ground pattern on the front surface or the ground pattern on the back surface is a slot formed in a lateral direction of the coplanar line. claims 1 to have a is obtained by the non-contact IC card according to any of the 4, towards the antenna directivity in the lateral direction of the IC card to an antenna slot formed in the ground pattern of the coplanar line Even when the card is turned sideways, it can communicate with the reader / writer unit, and has a function of realizing a non-contact IC card that is hardly affected by the back surface.
[0013]
The invention described in claim 6 of the present invention has a moving body identification system Ru using the contactless IC card according to any one of claims 1 to 5, in thin and light, the influence of use conditions It is difficult to have a non-contact IC card that can exchange data with the reader / writer unit even if it is facing the front or back of the card or sideways, and the card is used with this non-contact IC card and the reader / writer unit. Therefore, it is possible to realize a moving body identification system that is not easily affected by the above and that can obtain stable performance.
[0014]
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
[0015]
(Embodiment 1)
The first embodiment will be described below with reference to FIGS. 1 is a cross-sectional view of a non-contact IC card according to Embodiment 1 of the present invention, and FIG. 2 is a wiring diagram of a feeder line portion.
[0016]
In FIG. 1, 101 and 102 are two bonded wiring boards, 103 is a ground pattern formed on one side of the wiring boards 101 and 102, 104 is a feed line formed in the inner layer, and 106 is a wiring board. The signal processing IC 105 is inserted into the hole formed in the hole 102. The signal processing IC 105 is flip-chip mounted on the wiring substrate 101, and the electrodes of the IC 105 and the line 104 on the substrate are connected by bumps 107. A slot 109 is formed in each of the ground patterns 103 formed on the wiring boards 101 and 102, and serves as an antenna for receiving a signal from a device (not shown) such as a reader / writer unit and returning it to the reader / writer unit. Operate. The slot 109 and the inner-layer feed line 104 are electromagnetically coupled, thereby feeding power to the antenna. The ground patterns 103a and 103b are connected by a via hole.
[0017]
As a contactless IC card antenna using microwave radio waves, a linear antenna using wiring on a substrate, for example, a dipole antenna, a loop antenna, or a planar patch antenna with a ground plane is used. However, when it is built in an IC card, the communication performance deteriorates due to the influence of the back surface, for example, when the metal is close to the linear antenna, and the flat patch antenna with the ground plate is hardly affected by the back surface. When the face with the mark is directed to the reader / writer unit, communication cannot be performed, so there is a problem that the card orientation is limited.
[0018]
Therefore, if by a structure in which the feed from the inner layer of the line 104 to the slot antenna 109 formed in the ground pattern 103, which was attached when there is an object in the back of the card, for example, the wiring board 101 side to the article, the slot Since the impedance of 109b changes and is no longer coupled to the feed line 104, the antenna on this surface can no longer send and receive signals and can be regarded as a ground pattern. At this time, the slot 109a on the opposite side operates as an antenna, and communicates with the reader / writer unit.
[0019]
The feed line 104 to the slot 109 may be, for example, the embodiment shown in FIG. The feeder line 104 is branched by a two-branch line 201, and each of them is electromagnetically coupled to the slot 109 and operates as an antenna. For example, when an object is present on the slot 109b side of the IC card, the impedance and resonance frequency of the slot 109b change, and the two-branch line 201 is not coupled. At this time, since there is no change in the slot 109a, it can communicate as an antenna, and can transmit a transmission signal input from the IC 105 and receive a signal emitted from the reader / writer unit.
[0020]
At this time, the change in impedance of the slot 109b may be less likely to affect the slot 109a by setting the electrical length from the branch portion of the two-branch line 201 to the tip of the line to be about 180 degrees in electrical length or an integral multiple thereof.
[0021]
From the above, by using both the front and back sides of the IC card as a ground pattern, and forming a slot here to operate as an antenna, it is possible to realize a non-contact IC that can be used regardless of which side is facing. can get.
[0022]
(Embodiment 2)
The second embodiment will be described below with reference to FIG. FIG. 3 is a cross-sectional view of a non-contact IC card according to Embodiment 2 of the present invention.
[0023]
3, 304 is a sealing material for sealing the IC 105, 309 is a ground pattern formed on the sealing material 304, 302 is a slot formed in the ground pattern 309, and in FIG. The difference from the first embodiment is that the sealing material 304 is used as a dielectric instead of the wiring substrate 102, and the slot 309 is operated as an antenna so that the substrate to be used is one, and the IC card The other components and functions are the same as those described in the first embodiment.
[0024]
A ground pattern 103, a slot 109 b, and a feed line 104 are formed on the wiring substrate 101. An IC 105 for performing signal processing and the like is flip-chip mounted, sealed with a sealing material 304, and grounded pattern 309 on the sealing material 304. And a slot 302 is formed. In the case of mounting face-up, it is necessary to form and connect via holes in the wiring board 101 and the sealing material 304 in order to make the ground pattern 309 and the ground pattern 103 have the same potential. Since the ground pattern on the front and back surfaces of the IC 105 is utilized so that the ground pattern on the back surface of the IC 105 and the ground pattern 309 of the sealing material 304 are in contact with each other, it is necessary to form a via hole in the sealing material 304. Absent.
[0025]
As described above, a thin and low-cost non-contact IC card can be realized by using the sealing material 304 when flip-chip mounting the IC 105 on the wiring substrate 101 as a dielectric and forming the ground pattern 309 on the top. The advantageous effect that it can be obtained is obtained.
[0026]
(Embodiment 3)
The third embodiment will be described below with reference to FIG. FIG. 4 is a cross-sectional view of a non-contact IC card according to Embodiment 3 of the present invention.
[0027]
In FIG. 4, reference numeral 401 denotes an antenna chip, which has a slot 402 and a feed line 403, and is mounted on the wiring board 101 using bumps 107. The third embodiment differs from the first embodiment in that an antenna using a slot is formed and mounted on the antenna chip 401, and the other configurations and functions are the same as those in the first embodiment. This is the same as described in the embodiment.
[0028]
As described above, it is possible to realize a non-contact IC card that can be easily and inexpensively changed to an antenna having different characteristics by forming the antenna on the antenna chip 401 and separately mounting the antenna. An advantageous effect is obtained.
[0029]
(Embodiment 4)
Hereinafter, the fourth embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view of a non-contact IC card according to Embodiment 4 of the present invention.
[0030]
In FIG. 5, reference numeral 501 denotes a dielectric film. In the fourth embodiment, the difference from the first embodiment is that a dielectric film 501 is attached on the ground pattern 103 to thereby provide an antenna. The slot 109 used as a point is reduced in size. Other configurations and functions are the same as those described in the first embodiment.
[0031]
Shape Luz lot 109 used as an antenna is dependent on the dielectric constant of the substrate formed with the wavelength of the frequency used for communication. For example, when a slot antenna for a 2.45 GHz band non-contact IC card is formed on a polyimide substrate having a dielectric constant of 3.4, the length of the slot is about 40 mm. If a polyimide dielectric film 501 having a thickness of several tens of μm is attached here, the slot length can be reduced to about 30 mm.
[0032]
As described above, an advantageous effect that the size of the non-contact IC card can be realized by affixing the dielectric film 501 on the ground pattern 103 to reduce the antenna element is obtained.
[0033]
(Embodiment 5)
The fifth embodiment will be described below with reference to FIG. FIG. 6 is a schematic block diagram of a mobile object identification system according to Embodiment 5 of the present invention.
[0034]
In FIG. 6, 601 is a non-contact IC card, 602 is an article on which the IC card is affixed, and 603 is a reader / writer unit. The IC card has the same configuration and function as the contactless IC card described in the first, second, third, and fourth embodiments of FIG.
[0035]
Reference numeral 604 denotes a transmission / reception antenna that communicates with the IC card 601; 607, a circulator connected to the transmission / reception antenna 604; 606, a transmission unit that outputs a transmission signal to the transmission / reception antenna 604; and 605, a transmission unit 606 configured by a VCO or the like. A synthesizer unit that generates a signal according to the carrier frequency, 608 is a demodulator that demodulates a signal from the IC card 601 connected to the circulator 607, and 609 is a reader that is connected to the transmitter 606, demodulator 608, and synthesizer unit 605. A writer unit controller.
[0036]
The operation of the above configuration will be described below. The IC card 601 is attached to the article 602. The IC card 601 stores information on the article 602 in advance in an internal IC. The reader / writer unit 603 is installed in a stationary manner. For example, when the reader / writer unit 603 is started up, the reader / writer unit control unit 609 controls the synthesizer unit 605 and outputs a signal of a predetermined frequency from the synthesizer unit 605. Upon receiving this signal, the transmission unit 606 radiates a microwave band signal amplified to a predetermined output from the transmission / reception antenna 604 via the circulator 607.
[0037]
The IC card 601 that has moved in the vicinity of the transmission / reception antenna 604 receives a signal from the reader / writer unit 603 with the antenna on the side not attached to the article 602. As described in the first embodiment, the IC card 601 does not deteriorate the communication characteristics depending on the direction of attachment to the article 602. Therefore, the IC card 601 is attached with attention to the direction of the IC card 601 and the direction of the article 602 is adjusted. There is no need to do.
[0038]
Communication with the reader / writer unit 603 is possible regardless of the attachment direction of the IC card 601 by configuring the moving body identification system by the contactless IC card 601 described in the first to fourth embodiments and the reader / writer unit 603. Advantageous effect that a mobile identification system can be realized.
[0039]
(Embodiment 6)
The sixth embodiment will be described below with reference to FIGS. 7 is a top view and a cross-sectional view of a non-contact IC card according to Embodiment 6 of the present invention, and FIG. 8 is a schematic block diagram of a mobile object identification system using the non-contact IC card shown in FIG.
[0040]
In FIG. 7, reference numeral 703 denotes a ground pattern on the surface of the IC card 701, and a feeding line 705 having a coplanar line structure from the IC 105 to the antenna is formed. Reference numeral 704 denotes a slot formed in the ground pattern 703, which serves as an antenna by coupling the feed line 705 and the slot 704. Reference numeral 706 denotes a ground pattern removal unit. By using the coplanar line structure, the characteristic change of the feed line 705 and the slot 704 serving as the antenna element when the IC card is attached to the article is suppressed.
[0041]
In FIG. 8, reference numeral 801 denotes a non-contact IC card, and reference numeral 802 denotes an article to which the IC card is attached. The reader / writer unit 603 has the same configuration and function as the reader / writer unit described in the fifth embodiment of FIG.
[0042]
The operation will be described below. The IC card 801 is attached to the article 802. In this IC card 801, information on the article 802 is stored in advance in an internal IC. Reader writer unit 603 have been installed in stationary, IC card 801 is attached to the article 802 has been moved in the vicinity of the transmitting and receiving antenna 604 in the arrow direction, a signal transmitted from a reader writer unit 603, the antenna slot 704 Receive. Since the directivity of the slot antenna of the IC card 801 is in the horizontal direction of the IC card 801, there is no need to adjust the article 802 so that the surface of the IC card 801 faces the transmission / reception antenna 604 of the reader / writer unit 603. It is a card suitable for a non-contact IC card system that is attached to a postal item, for example, a postal matter and receives the information.
[0043]
As described above, the contactless IC card according to the present embodiment uses the antenna element having the structure in which the slot 704 is provided in the feeder line 705 having a coplanar line structure, thereby enabling lateral communication and reading a thin article. An advantageous effect that a suitable mobile object identification system can be realized is obtained.
[0044]
In the above description, the single slot 704 is described as being configured. However, a plurality of slots 704 may be provided to widen the communication area.
[0045]
【The invention's effect】
As described above, according to the present invention, the mobile object identification device system is thin and light, hardly affected by the usage state, and can exchange data with the reader / writer unit even when facing the card or the side of the card. The advantageous effect that can be realized is obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a contactless IC card according to Embodiment 1 of the present invention. FIG. 2 is a plan view of an antenna feed line of the contactless IC card according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view of a non-contact IC card according to Embodiment 3 of the present invention. FIG. 5 is a cross-sectional view of a non-contact IC card according to Embodiment 4 of the present invention. 6 is a block diagram of a mobile object identification system according to a fifth embodiment of the present invention. FIG. 7 is a plan view and a cross-sectional view of a non-contact IC card according to a sixth embodiment of the present invention. Block diagram of mobile object identification system using card [Fig. 9] Cross-sectional view of conventional non-contact IC card [Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 Wiring board 102 Wiring boards 103a and 103b Ground pattern 104 Feeding line 105 IC
106 hole 107 bump 108 via hole 109a, 109b slot 201 bifurcated line 302 slot 304 sealing material 309 ground pattern 401 antenna chip 402 slot 403 feed line 404 ground pattern 501 dielectric film 601 IC card 602 article 603 reader / writer unit 604 transmission / reception Antenna 605 synthesizer 606 transmitter 607 circulator 608 demodulator 609 reader / writer unit controller 703 ground pattern 704 slot 705 feed line 706 ground pattern remover 801 IC card 802 article

Claims (6)

  1. An IC that has a first slotted ground pattern formed on the back surface and a first wiring pattern formed on the front surface and that performs signal processing is mounted on a bare chip using a bump directly below the IC, and directly under the IC. A first substrate having via holes connecting the bumps and the ground pattern ;
    A second substrate having a second slotted ground pattern formed on the front surface, a second wiring pattern formed on the back surface, and a hole for fitting the IC;
    The first substrate and the second substrate of the first wiring pattern and the non-contact IC card that the second wiring pattern, having a bonded to the formed surface structures.
  2. And a first wiring pattern formed on the first slotted ground pattern and a surface formed on the back surface, an IC for signal processing, and bare chip mounting using bumps immediately below the IC, the IC A first substrate mounted with a bare chip having via holes connecting the bumps directly below and the ground pattern ;
    Contactless IC card having a second slotted ground pattern connected to the backside ground pattern of the first of the IC be formed sealing material painted onto the substrate and the upper surface of the sealing member .
  3. Having a first substrate having a first wiring pattern formed on the first slotted ground pattern and a surface formed on the back surface, and an IC for performing signal processing on the first substrate,
    A chip with a second slotted ground pattern formed on one side is mounted as a bare chip ,
    Contactless IC card having a structure that is bare-chip mounting using a bump, to have a via hole for connecting the ground pattern and the bumps immediately below the IC directly below the IC.
  4. First slotted ground pattern and the second slotted ground whereas if Re not gall the pattern or both Motomeko 1,2 contactless IC card according forming a dielectric film on the surface of the.
  5. Said second wiring pattern is formed by coplanar line, the ground pattern of the ground pattern or the back surface of the surface, according to any one of claims 1 to 4 have the above formed transversely of the coplanar line slot non-contact IC card.
  6. Moving body identification system Ru using the contactless IC card according to any one of claims 1 to 5.
JP27240599A 1999-09-27 1999-09-27 Non-contact IC card and mobile object identification system Expired - Lifetime JP3800884B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27240599A JP3800884B2 (en) 1999-09-27 1999-09-27 Non-contact IC card and mobile object identification system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP27240599A JP3800884B2 (en) 1999-09-27 1999-09-27 Non-contact IC card and mobile object identification system
EP06076750A EP1734461A2 (en) 1999-07-12 2000-07-11 Mobile body discrimination apparatus for rapidly acquiring respective data sets transmitted through modulation of reflected radio waves by transponders which are within a communication region of an interrogator apparatus
EP00305828A EP1069526A3 (en) 1999-07-12 2000-07-11 Mobile body discrimination apparatus for rapidly acquiring respective data sets transmitted through modulation of reflected radio waves by transponders which are within a communication region of an interrogator apparatus
US09/615,045 US6946950B1 (en) 1999-07-12 2000-07-12 Mobile body discrimination apparatus for rapidly acquiring respective data sets transmitted through modulation of reflected radio waves by transponders which are within a communication region of an interrogator apparatus

Publications (2)

Publication Number Publication Date
JP2001101365A JP2001101365A (en) 2001-04-13
JP3800884B2 true JP3800884B2 (en) 2006-07-26

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1720216B1 (en) 2004-02-27 2012-12-19 Fujitsu Ltd. Radio tag
KR100761991B1 (en) 2006-11-06 2007-09-28 (주) 한맥 Eng Rfid tag for sealing using slot antenna
JP4618459B2 (en) * 2008-09-05 2011-01-26 オムロン株式会社 RFID tag, RFID tag set and RFID system

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